CN106486254A - Chip coil part, the fixing body of chip coil part and installation method - Google Patents
Chip coil part, the fixing body of chip coil part and installation method Download PDFInfo
- Publication number
- CN106486254A CN106486254A CN201610643212.0A CN201610643212A CN106486254A CN 106486254 A CN106486254 A CN 106486254A CN 201610643212 A CN201610643212 A CN 201610643212A CN 106486254 A CN106486254 A CN 106486254A
- Authority
- CN
- China
- Prior art keywords
- conductor
- coil
- conductor layer
- heat
- chip coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009434 installation Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000004020 conductor Substances 0.000 claims abstract description 275
- 239000011159 matrix material Substances 0.000 claims abstract description 28
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 238000013007 heat curing Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 79
- 238000002372 labelling Methods 0.000 claims description 42
- 238000009413 insulation Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- 239000011889 copper foil Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000004615 ingredient Substances 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 description 13
- 238000011049 filling Methods 0.000 description 11
- 239000012212 insulator Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000007731 hot pressing Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2876—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The present invention provides a kind of chip coil part that improve the transmission efficiency to thickness direction for the heat, the fixing body of chip coil part and installation method.By multiple insulating bodies stacking and thermal bonding and form laminate structure (2).Laminate structure (2) forms the coil-conductor layer (21,22,23,24) of level (C1, C2, C3, C4) and forms coil case by being formed at each coil.In the inner side of coil case, formed the heat-conducting part (30a, 30b) of through-thickness extension by heat conduction conductor layer and bonded conductor.Using this heat-conducting part (30a, 30b), make heat become good to the transmission efficiency of thickness direction, and easily make Thermocurable adhesive phase heat cure and installing matrix between for the chip coil part (1).
Description
Technical field
The present invention relates to by the coil-conductor layer being formed at the differing heights position of the inside of the duplexer of insulating properties
And form the chip coil part of coil case, especially relate to be configured to easily to make to be clipped in chip coil part and installing matrix it
Between the chip coil part of structure of binding agent solidification of Thermocurable, the fixing body of chip coil part and chip coil
The installation method of part.
Background technology
It is related to the invention of multilayer coil unit described in patent documentation 1.
This multilayer coil unit is formed with plane air core coil on the surface of multiple insulated substrates.On insulated substrate
It is formed with the through hole of the end leading to plane air core coil.Multiple insulated substrates are laminated, and make upper and lower overlap via through hole
The conducting of plane air core coil, thus, it is possible to constitute multilayer coil unit that is slim and improve transmission efficiency.
Patent documentation 1：Japanese Unexamined Patent Publication 2008-205215 publication
Content of the invention
In Fig. 3 of patent documentation 1, illustrate multilayer coil unit is configured at the structure of the framework of portable phone.
In order to multilayer coil unit is securely arranged in described framework etc., preferably use Thermocurable binding agent.But,
Multilayer coil unit is constituted based on insulated substrate, and heat conductivity is low, accordingly, it is difficult to make heat via multilayer coil unit
Curing adhesive solidifies effectively.Therefore, in the period till applying heat and making Thermocurable binding agent solidify, in advance
The multilayer coil unit having good positioning can be moved, thus being difficult to for multilayer coil unit to be firmly secured to accurate position
Put.
The present invention is used for solving above-mentioned existing problem and proposes, it is intended that providing one kind easily to make heat in stacking
The inside of body carries out transmitting, so as to be fixed on installing matrix reliably in a short time by the binding agent of Thermocurable
The installation method of chip coil part, the fixing body of chip coil part and chip coil part.
The chip coil part of the present invention has：The insulating substrate of stacked multiple lamellars；Coil-conductor layer, its formation
Conductor in described insulating substrate forms face；First through hole, it is formed at adjacent described coil-conductor on thickness direction
On described insulating substrate between layer；And first bonded conductor, it is arranged at described first through hole and by phase on thickness direction
Adjacent described coil-conductor layer is engaged with each other, and forms coil case by described coil-conductor layer and described first bonded conductor,
Described chip coil part is provided with the portion of terminal with the conducting of described coil case, described chip coil part is characterised by,
In the inner side of described coil case, it is provided with the heat conduction that the high material of the heat conductivity of insulating substrate described in thermal conductivity ratio is formed
Portion, described heat-conducting part is to insulate with described coil case and to be formed in the way of passing through multiple described insulating substrates.
The chip coil part of the present invention is internally formed with the heat-conducting part of through-thickness extension, therefore, easily to thickness
Degree direction transmission heat.Therefore, by making Thermocurable adhesive clip from lamellar between chip coil part and installing matrix
The upper surface part of coil component gives heat, thus, it is possible to make Thermocurable binding agent solidify at short notice.
The chip coil part of the present invention can be to be formed with and institute on the described conductor formation face of described insulating substrate
State the heat conduction conductor layer of coil-conductor layer insulation, by the second bonded conductor being arranged in the second through hole of described insulating substrate
Adjacent described heat conduction conductor layer on thickness direction is engaged with each other, thus forming described heat-conducting part, described coil-conductor layer and
Described heat conduction conductor layer is formed by identical conductive material, and described first bonded conductor and described second bonded conductor are by identical
Conductive material is formed.
In said structure, heat conduction conductor layer and coil-conductor layer can be formed by identical operation, and can be by
Identical material forms the first bonded conductor and the second bonded conductor, therefore, it is possible to simplify manufacturing process.
The chip coil part of the present invention is preferably, and the described insulating substrate of the superiors is located furthest from as installation surface side
The position of lower surface portion at, the described conductor of the described insulating substrate of the superiors is formed facing to top, is formed in this conductor
Described coil-conductor layer and described heat conduction conductor layer are formed with face.
As described above, when when heat conduction conductor layer, the upper surface part of the described insulating substrate in the superiors is exposed, by making to add
Hot component is connected to the upper surface of chip coil part, thus, it is possible to effectively by the heat transfer of heater to chip coil portion
The lower surface portion of part.
The chip coil part of the present invention can be, positioned at the institute of the undermost described insulating substrate of described lower surface portion
State conductor to be formed facing to lower section, this conductor formation face is formed with opposed with described heat conduction conductor layer and does not lead with this heat conduction
The labelling conductor layer that body layer connects, is formed with primary importance identification labelling in described labelling conductor layer.
In said structure, the labelling that exposed using the lower surface portion in the laminate structure being laminated with multiple insulating substrates
Conductor layer come to be formed primary importance identification labelling, therefore, it is possible to the lower surface portion in laminate structure with optically noticeable
Mode formed primary importance identification labelling.
Additionally, the chip coil part of the present invention is configured to, in the described conductor of the described insulating substrate of the superiors
Second position identification labelling is formed with formation face, the upper surface part of the described insulating substrate of the superiors is by the insulating barrier of light transmission
Cover.
In said structure, second position identification labelling is formed with the upper surface part of laminate structure, therefore, easily
Confirm the position of chip coil part from upper surface part side.Further, since upper surface part is covered by the insulating barrier of light transmission, therefore
The coil-conductor layer exposing in upper surface part, second position identification labelling can be protected.
The chip coil part of the present invention is preferably, the inner side of described coil case be provided with multiple by described heat conduction conductor
Layer and the described heat-conducting part of described second bonded conductor composition.
In said structure, by having multiple heat-conducting parts, it is possible to increase the biography of the thickness direction to laminate structure for the heat
Pass effect.
The chip coil part of the present invention is preferably, and described heat conduction conductor layer is formed by Copper Foil, described second bonded conductor
It is made up of the solidfied material of the conductive paste comprising metal ingredient.
As described above, by by heat-conducting part, by metal or the material that comprises metal ingredient is formed, thus easily transmitting heat.
Then, the fixing body of the chip coil part of the present invention is characterised by, by by the chip coil of either a program
At least corresponding with described heat-conducting part part in the lower surface portion of the part adhesive phase by heat cure is fixed on installation
Matrix forms.
For the fixing body of described chip coil part, due to accompanying profit between chip coil part and installing matrix
With the heat transmitted by heat-conducting part and the adhesive phase of heat cure, therefore, it is possible to chip coil part is firmly fixed at peace
Dress matrix.
Additionally, the installation method of the chip coil part of the present invention is characterised by, including：Make the binding agent of Thermocurable
It is clipped at least corresponding with described heat-conducting part part and the installing matrix in the lower surface portion of chip coil part of either a program
Between operation；Part corresponding with described heat-conducting part in the upper surface part of described chip coil part is heated, and
Make the operation of described adhesive heat cure using the heat transmitted along described heat-conducting part；And by described portion of terminal and described peace
The operation of the conducting portion electrical connection of dress matrix.
In described installation method, heat can be transmitted using the heat-conducting part of the inside of chip coil part, therefore, it is possible to
Make adhesive phase heat cure at short notice such that it is able to chip coil part is firmly secured to installing matrix.
In said structure, the operation that described portion of terminal is electrically connected with the conducting portion of described installing matrix is, for example, soldering
Operation.
Invention effect
The present invention in the inside of the laminate structure being laminated with multiple insulating substrates and coil case Winding Central portion setting
There is the heat-conducting part that through-thickness extends, therefore, easily partly come to transmit heat to thickness direction using this.Therefore, by making heat
The adhesive clip of curable between chip coil part and installing matrix, and to the upper surface part of chip coil part with lead
The corresponding part in hot portion is heated makes binding agent heat cure at short notice such that it is able to guide this heat to binding agent.
In addition, by by constitute the heat conduction conductor layer of heat-conducting part and the second bonded conductor by with coil-conductor layer and the
One bonded conductor identical conductive material is constituted, therefore without adding especially new operation it becomes possible to stacking in insulating properties
The heat-conducting part being internally formed through-thickness extension of body.
Brief description
Fig. 1 is the top view of the chip coil part illustrating embodiments of the present invention.
Fig. 2 is the upward view of the chip coil part illustrating embodiments of the present invention.
Fig. 3 is the sectional view of the III-III line of the chip coil part shown in Fig. 1.
Fig. 4 is the sectional view of the stepped construction illustrating multiple insulating substrates.
Fig. 5 is to illustrate that coil-conductor layer is engaged with second with the engagement relationship of the first bonded conductor and heat conduction conductor layer
The top perspective view of the engagement relationship of conductor.
Fig. 6 is to illustrate that coil-conductor layer is engaged with second with the engagement relationship of the first bonded conductor and heat conduction conductor layer
The exploded perspective view of the engagement relationship of conductor.
Fig. 7 is to illustrate that coil-conductor layer is engaged with second with the engagement relationship of the first bonded conductor and heat conduction conductor layer
The face upwarding stereogram of the engagement relationship of conductor.
Fig. 8 is the operation that the installation method of the chip coil part to embodiments of the present invention and fixing body illustrate
Explanatory diagram.
Drawing reference numeral explanation：
C1 first coil forms level
C2 second coil forms level
C3 tertiary coil forms level
C4 the 4th coil forms level
I1 first insulation level
I2 second insulation level
I3 the 3rd insulation level
1 chip coil part
1a upper surface part
1b lower surface portion
2 laminate structures
2a upper surface part
2b lower surface portion
3 top cap layer
10 insulators
11 first insulating substrates
11a, 11b through hole
11d conductor forms face
12 second insulating substrates
12a, 12b, 12c through hole
12d conductor forms face
13 the 3rd insulating substrates
13a, 13b, 13c through hole
13d conductor forms face
14 the 4th insulating substrates
14a, 14b, 14c through hole
14d conductor forms face
20 coil cases
21st, 22,23,24 coil-conductor layer
28a, 28b portion of terminal
29a, 29b relay conductor layer
30a first heat-conducting part
30b second heat-conducting part
31st, 32a, 32b, 33a, 33b, 34a, 34b heat conduction conductor layer
35 labelling conductor layers
35a primary importance identifies labelling
The 36a second position identifies labelling
41st, 42,43 first bonded conductor
44th, 45a, 45b, 46a, 46b second bonded conductor
48a, 48b, 48c the 3rd bonded conductor
50 installing matrixes
65 heaters
Specific embodiment
The chip coil part 1 of embodiments of the present invention is recorded in Fig. 1 to Fig. 3.Fig. 1 is chip coil part 1
Top view, Fig. 2 is the upward view of chip coil part 1, Fig. 3 be by chip coil part 1 in Fig. 1 shown in III-III line at
The sectional view of cutting gained.
As shown in figure 3, chip coil part 1 has upper surface part 1a and lower surface portion 1b.Lower surface portion 1b is to installation
The installed surface that matrix is installed.
The installing matrix installed for lamellar coil component 1 is printed circuit board or resin moulded parts etc., is in being embedded in
Installing matrix that the conductor in portion exposes on the surface of moulded parts etc..
As shown in figure 3, chip coil part 1 has laminate structure 2, in upper surface part 1a of chip coil part 1, layer
Upper surface part 2a of lamination structural body 2 is covered by the top cap layer 3 of the insulating barrier of the light transmission as polyimide resin etc..Stacking
The bottom cap layer 4 that lower surface portion 2b of structure 2 is configured the epoxy resin of solder mask etc. covers.
The inside of the laminate structure 2 shown in the sectional view of Fig. 3 from lower surface portion 2b towards upper surface part 2a according to first
Coil formation level C1, the first insulation level I1, the second coil formation level C2, the second insulation level I2, tertiary coil are formed
Level C3, the 3rd insulation level I3, the 4th coil formed level C4 be sequentially formed with each level.
Form level C1, the second coil formation level C2, tertiary coil formation level C3 and the 4th line in first coil
Circle is formed in level C4, is formed with the conductive pattern (21,22 etc.) being made up of Copper Foil.In the first insulation level I1, the second insulation
In level 12 and the 3rd insulation level I3, it is embedded with bonded conductor (41 etc.) in the insulator 10 as resin component element.To the greatest extent
Manage these conductive patterns and bonded conductor occurs in the sectional view of Fig. 3, but in Fig. 5 to Fig. 7, omit insulator further
10th, top cap layer 3 and bottom cap layer 4 and illustrate described conductive pattern and bonded conductor.Fig. 5 is viewed from above standing
Body figure, Fig. 6 is exploded perspective view viewed from above, and Fig. 7 is the axonometric chart observed from below.It should be noted that Fig. 5
Shown III-III cutting line illustrates and the cutting portion at the III-III cutting line identical position shown in Fig. 1.
The do not formed conductive pattern and the region of bonded conductor of laminate structure 2 are the insulators 10 being made up of resin.Make
For constituting the resin material of insulator 10, it is possible to use PEEK (polyether-ether-ketone), PEI (Polyetherimide), PPS (polyphenylene sulfide
Ether), thermoplasticity PI (polyimides), liquid crystal polymer etc..
As shown in Fig. 3 and Fig. 5 to Fig. 7, formed in level C1 in first coil, as the conductor figure being formed by Copper Foil
Case, is formed with coil-conductor layer 21, heat conduction conductor layer 31, labelling conductor layer 35 and portion of terminal 28a, 28b.Need explanation
It is that portion of terminal 28a and portion of terminal 28b do not appear in Fig. 3, and shown in Fig. 5 to Fig. 7.Heat conduction conductor layer 31 and labelling are led
Body layer 35 is formed in mode detached with coil-conductor layer 21.
Formed in level C2 in the second coil, as the conductive pattern being formed by Copper Foil, be formed with coil-conductor layer 22 He
Two heat conduction conductor layers 32a, 32b, and it is formed with relaying conductor layer 29a.It should be noted that relaying conductor layer 29a does not go out
Now in figure 3, and shown in Fig. 5 to Fig. 7.Heat conduction conductor layer 32a, 32b and relaying conductor layer 29a with coil-conductor layer 22
Detached mode is formed.
Formed in level C3 in tertiary coil, as the conductive pattern being formed by Copper Foil, be formed with coil-conductor layer 23 He
Two heat conduction conductor layers 33a, 33b, and it is formed with relaying conductor layer 29b.Relaying conductor layer 29b does not appear in Fig. 3, and
Shown in Fig. 5 to Fig. 7.Heat conduction conductor layer 33a, 33b and relaying conductor layer 29b are with mode shape detached with coil-conductor layer 23
Become.
Formed in level C4 in the 4th coil, as the conductive pattern being formed by Copper Foil, be formed with coil-conductor layer 24 He
Two heat conduction conductor layers 34a, 34b.Heat conduction conductor layer 34a, 34b is formed in mode detached with coil-conductor layer 24.Need
Bright, each coil-conductor layer 21,22,23,24 is formed as swirl shape.
It is embedded with the first bonded conductor 41, the second bonded conductor 44 and the 3rd bonded conductor in the first insulation level I1
48a.3rd bonded conductor 48a is shown in Fig. 5 to Fig. 7.It is embedded with the first bonded conductor 42, second in the second insulation level I2
Bonded conductor 45a, 45b and the 3rd bonded conductor 48b.3rd bonded conductor 48b is shown in Fig. 5 to Fig. 7.In the 3rd insulation
Level I3 is embedded with the first bonded conductor 43, the second bonded conductor 46a, 46b and the 3rd bonded conductor 48c.3rd joint is led
Body 48c illustrates in fig. 5 and fig..
It should be noted that as described later, the first insulation level I1 is formed by the first insulating substrate 11, the 3rd insulation
Level I3 is formed by the 4th insulating substrate 14.In addition, the second insulation level 12 is exhausted by the second insulating substrate 12 and the 3rd
Edge base material 13 and formed.
First bonded conductor the 41,42,43, second bonded conductor 44,45a, 45b, 46a, 46b and the 3rd bonded conductor
48a, 48b, 48c are formed by identical conductive material, and by comprising the conductive paste (conductive adhesive) of metal ingredient
Solidfied material (body containing metal-resin) after solidification is constituted.As metal ingredient, for example, can use the metal of the electric conductivity such as argentum powder
Filler.
By be formed at each coil formed level C1, C2, the conductive pattern of C3, C4 and be embedded in each insulation level I1, I2,
Three-dimensional connected structure shown in Inner Constitution Fig. 5 to Fig. 7 of laminate structure 2 for the bonded conductor of I3.
On closing line L1 shown in Fig. 6, the line of portion of terminal 28b, two relaying conductor layers 29a, 29b and topmost
Circle conductor layer 24 turns on via the 3rd bonded conductor 48a, 48b, 48c.On closing line L2, the coil-conductor layer 21 of foot
Coil-conductor layer 22 above turns on via the first bonded conductor 41, on closing line L3, coil-conductor layer 22 He
Coil-conductor layer 23 engages via the first bonded conductor 42, on closing line L4, the coil of coil-conductor layer 23 and topmost
Conductor layer 24 engages via the first bonded conductor 43.
By the joint of above-mentioned closing line L1, L2, L3, L4, it is formed between portion of terminal 28a and portion of terminal 28b up and down
The coil case 20 of coiled multiple times (in embodiments 4 rewindings around).It should be noted that portion of terminal 28a and portion of terminal 28b are in layer
Lower surface portion 2b of lamination structural body 2 is exposed.
On closing line L5 and L6 shown in Fig. 6, heat conduction conductor layer 32a, 33a, 34a via the second bonded conductor 45a,
46a and engage, as shown in Figure 3 and Figure 5, formed the first heat-conducting part 30a.On closing line L7, L8, L9 shown in Fig. 6, heat conduction is led
Body layer 31,32b, 33b, 34b engage via the second bonded conductor 44,45b, 46b, form the second heat conduction shown in Fig. 3 and Fig. 5
Portion 30b.
As shown in figure 5, the peristome of the first heat-conducting part 30a and the second heat-conducting part 30b inner side in coil case 20 is (in winding
Centre portion) in formed side by side.As shown in figure 3, the first heat-conducting part 30a and the second heat-conducting part 30b is with the inside in laminate structure 2
The inner side through-thickness of the multiple coil-conductor layers 21,22,23,24 being formed in each level passes through each insulating substrate 11～14
Mode, forms towards thickness direction in chip coil part 1.In addition, the first heat-conducting part 30a and the second heat-conducting part 30b with
Formed with the mode of coil case 20 insulation.
As shown in the sectional view of Fig. 3, the thickness of upper and lower the second insulation level I2 of central part is more than the first insulation
The thickness of level I1, and the thickness more than the 3rd insulation level I3.And, first coil forms level C1 in stacking
Lower surface portion 2b of structure 2 is exposed, and the 4th coil forms level C4 and exposes in upper surface part 2a of laminate structure 2.
As shown in Figure 6 and Figure 7, undermost first coil formed level C1 on, by with coil-conductor layer 21 identical
Conductive material is that Copper Foil forms labelling conductor layer 35.As shown in the sectional view of Fig. 3, labelling conductor layer 35 is with other conductor layers not even
Connect but be separately formed.Primary importance identification labelling 35a is formed with labelling conductor layer 35.As shown in Figure 2 and Figure 7,
One position recognition mark 35a is the cross bore running through labelling conductor layer 35 in a thickness direction.As shown in figure 3, labelling conductor layer
35 expose in lower surface portion 2b of laminate structure 2, and are formed by Copper Foil, and therefore, the cross bore in central authorities becomes optically to be held
Easily noticeable hole.
As shown in figure 3, being not provided with the second bonded conductor on labelling conductor layer 35, the layer on labelling conductor layer 35 by
Insulator 10 is formed, therefore, it is possible to prevent the labelling conductor layer when vertically giving compression stress to form laminate structure 2
35 situations deforming, and easily primary importance identification labelling 35a is formed as plane.
As shown in figure 3, lower surface portion 2b of laminate structure 2 is covered by bottom cap layer 4, if the area in labelling conductor layer 35
Form hole 4a in bottom cap layer 4 in domain, then easily optically observe labelling conductor layer 35 from downside.It is additionally, since labelling to lead
Part beyond body layer 35 and portion of terminal 28a, 28b is covered by bottom cap layer 4, therefore, it is possible to protect coil conductor layer 21.
It should be noted that in the present embodiment, it is made up of bottom cap layer 4 solder mask, but by transparent resinous wood
In the case that material forms bottom cap layer 4, if utilizing bottom cap layer 4 overlay marks conductor layer 35, first can be observed from downside
Position recognition mark 35a, and labelling conductor layer 35 can be protected.But, in this case, portion of terminal 28a, 28b or structure
Become and do not covered by bottom cap layer 4.
As shown in figure 3, heat conduction conductor layer 34a is exposed in upper surface part 2a of laminate structure 2, but in this heat conduction conductor layer
It is formed with the resin bed 36 being colored, the above-mentioned top cap layer 3 that its surface is had light transmission covers on 34a.As Fig. 1 institute
Show, constitute resin bed 36 resin material at central part be in cross shape be removed, the part of this cross shape becomes the
Two position recognition mark 36a.Heat conduction conductor layer 34a being formed by Copper Foil is located under this second position identification labelling 36a, because
This, when viewed from above, can observe through top cap layer 3 that the second position identifies the Copper Foil in labelling 36a, thus holding
Easily optically the identification second position identifies labelling 36a.
Fig. 4 is the figure that the manufacture method of laminate structure 2 shown in Fig. 3 is described.
Laminate structure 2 is by the insulating substrate 11,12,13,14 of the multiple lamellars being formed by liquid crystal polymer of stacking
Constitute.
As shown in figure 4, being formed by liquid crystal polymer for forming the first insulating substrate 11 of the first insulation level I1
Film, and conductor forms face 11d downward.Formed on the 11d of face in this conductor, form leading of level C1 as constituting first coil
Electrical pattern and be formed with coil-conductor layer 21, portion of terminal 28a, 28b, heat conduction conductor layer 31 and labelling conductor layer 35.In labelling
The primary importance identification labelling 35a of cross shape is formed with conductor layer 35.These conductor layers are passed through to be formed to being laminated in conductor
The Copper Foil of face 11d is etched and is formed.
First insulating substrate 11 is formed with through hole 11a, 11b, is filled with the first bonded conductor 41 in through hole 11a,
It is filled with the second bonded conductor 44 in through hole 11b.First bonded conductor 41 is engaged with coil-conductor layer 21, the second bonded conductor
44 are engaged with heat conduction conductor layer 31.Equally, it is filled with the 3rd shown in Fig. 6 etc. in other through holes being formed at insulating substrate 11
Bonded conductor 48a, the 3rd bonded conductor 48a is turned on portion of terminal 28b.
First bonded conductor 41, the second bonded conductor 44 and the 3rd bonded conductor 48a are passed through to be mixed into metal packing
Conductive paste (conductive adhesive) be filled in through hole and formed.
It should be noted that can also be configured to, it is formed at the through hole 11a thorough coil conductor layer of the first insulating substrate 11
21 and formed, to through hole 11a and be formed at coil-conductor layer 21 this two side of hole filling formed the first bonded conductor 41 conduction
Property paste.Equally, through hole 11b can also run through heat conduction conductor layer 31 and be formed, to through hole 11b and be formed at heat conduction conductor layer 31
This two side of hole fill the second bonded conductor 44.Additionally, through hole can also penetrating terminal portion 28b and formed, to through hole and formation
Fill the 3rd bonded conductor 48a in the inside in the hole of portion of terminal 28b.
Form hole in coil conductor layer, heat conduction conductor layer as described above and fill bonded conductor to the inside in hole
Structure similarly can be implemented in each insulating substrate 12,13,14 of following explanation.
The second insulation level I2 shown in Fig. 3 is formed by overlapping second insulating substrate 12 and the 3rd insulating substrate 13.
Lower surface for forming the second insulating substrate 12 of the lower half of the second insulation level I2 forms face for conductor
12d, this conductor formed face 12d on be formed with should be formed at second coil formed level C2 22, two, coil-conductor layer lead
Relaying conductor layer 29a shown in heating conductor layer 32a, 32b and Fig. 6 etc..As shown in figure 4, being formed on the second insulating substrate 12
There are through hole 12a, 12b, 12c.In through hole 12a, filling constitutes the first bonded conductor 42 that should be formed at the second insulation level I2
The conductive paste of lower half 42-1 and turn on coil-conductor layer 22.In through hole 12b, filling constitutes the second bonded conductor 45a
The conductive paste of lower half 45a-1 and engage with heat conduction conductor layer 32a.In through hole 12c, filling constitutes the second joint and leads
The conductive paste of lower half 45b-1 of body 45b and engage with heat conduction conductor layer 32b.
Additionally, the 3rd joint shown in filling composition Fig. 6 etc. is led in other through holes being formed at the second insulating substrate 12
The conductive paste of the lower half of body 48b and with relaying conductor layer 29a engage.
Upper surface for forming the 3rd insulating substrate 13 of the first half of the second insulation level 12 forms face for conductor
13d, this conductor formed face 13d on be formed with should be formed at tertiary coil formed level C3 23, two, coil-conductor layer lead
Relaying conductor layer 29b shown in heating conductor layer 33a, 33b and Fig. 6 etc..As shown in figure 4, being formed on the 3rd insulating substrate 13
There are through hole 13a, 13b, 13c.In through hole 13a, filling constitutes the first bonded conductor 42 that should be formed at the 3rd insulation level I3
The conductive paste of first half 42-2 and turn on coil-conductor layer 23.In through hole 13b, filling constitutes the second bonded conductor 45a
The conductive paste of first half 45a-2 and engage with heat conduction conductor layer 33a.In through hole 13c, filling constitutes the second joint and leads
The conductive paste of first half 45b-2 of body 45b and engage with heat conduction conductor layer 33b.
Additionally, the 3rd joint shown in filling composition Fig. 6 etc. is led in other through holes being formed at the 3rd insulating substrate 13
The conductive paste of the first half of body 48b and with relaying conductor layer 29b engage.
For formed shown in Fig. 3 the 3rd insulation level I3 the 4th insulating substrate 14 conductor formed face 14d towards
Side.This conductor formed be formed with the 14d of face should be formed at the 4th coil form the coil-conductor layer 24 of level C4 and two lead
Heating conductor layer 34a, 34b.4th insulating substrate 14 is formed with through hole 14a, 14b, 14c.Filling composition the in through hole 14a
The conductive paste of one bonded conductor 43 and engage with coil-conductor layer 24.In through hole 14b, 14c, filling constitutes the second joint
The conductive paste of conductor 46a, 46b and engage with heat conduction conductor layer 34a, 34b.
In this embodiment, through hole 11a, 12a, 13a, 14a constitute first through hole, through hole 11b, 12b, 12c, 13b,
13c, 14b, 14c constitute the second through hole.
By will be exhausted to the first insulating substrate 11 shown in Fig. 4, the second insulating substrate 12, the 3rd insulating substrate 13 and the 4th
Edge base material 14 is overlapping and carries out hot pressing, thus makes the insulator 10 of the liquid crystal polymer of each insulating substrate of composition 11,12,13,14
Engage, thus constituting the laminate structure 2 shown in Fig. 3.It should be noted that being filled in the conductive paste of each through hole by
One insulating substrate 11 is solidified by heating to this duplexer to after the 4th insulating substrate 14 stacking.This duplexer
Heating carried out before described hot pressing but it is also possible to carry out with hot pressing or carry out after hot-pressing simultaneously.Additionally, in stacking
It is also possible to make conductive paste semi-solid preparation in advance by each insulating substrate before insulating substrate 11～14.
As shown in figure 4, constituting multiple (being two panels in embodiment) insulation of the diagram downside half part of laminate structure 2
The conductor of tomb material 11,12 forms face 11d, 12d downward, and constitute laminate structure 2 illustrates the multiple (real of upside half part
Apply in mode is two panels) conductor of insulating substrate 13,14 forms face 13d, 14d upward, in this case insulating substrate 11,
12nd, 13,14 it is engaged.
Therefore, in the laminate structure 2 shown in Fig. 3, first coil can be made to form level C1 in laminate structure 2
Lower surface portion 2b is exposed, and the 4th coil can be made to form level C4 and expose in upper surface part 2a of laminate structure 2.And, by
Formed by two insulating substrates 12,13 in the second insulation level I2, therefore thickness is bigger than other insulation levels I1, I3.Need
If it is noted that making the conductor of the first insulating substrate 11 of foot form face 11d downward, making the 4th exhausted of topmost
The conductor of edge base material 14 forms face 14d upward, then the conductor of internal insulating substrate form face can also be towards appointing up and down
One direction.In addition, the piece number of insulating substrate is not limited to four or more than five, can also be three.
It should be noted that in said embodiment, first bonded conductor the 41,42,43, second bonded conductor 44,
45a, 45b, 46a, 46b and the 3rd bonded conductor 48a, 48b, 48c are by the solidfied material of the conductive paste comprising metal ingredient
Constitute, but these bonded conductor can also be formed from the metal levels such as coating in each through hole, solder layer and constitute.
Then, with reference to Fig. 8, to illustrate for described chip coil part 1 to be installed on the installation method of installing matrix and to pass through
The fixing body of lamellar coil component 1 is installed on installing matrix.
In (A) of Fig. 8, shoot the peace of the installing matrix 50 that should install lamellar coil component 1 from top using camera 61
Dress face 51, real-time image processing, and the datum mark for installing lamellar coil component 1 is determined on described installed surface 51.
In (B) of Fig. 8, the adsorption section 63 using the anterior setting in the assembling arm 62 located at automatic assembling device is inhaled
Upper surface part 1a of Radix Aconiti Lateralis Preparata shape coil component 1.In this condition, the lower surface of lamellar coil component 1 is shot using camera 64
Portion 1b, and the primary importance exposed as shown in Figure 2 is determined in lower surface portion 1b of chip coil part 1 by image procossing
The position of identification labelling 35a.
In (C) of Fig. 8, the position of adjustment assembly arm 62, so that identify labelling 35a by the primary importance that image obtains
Decussation point consistent with the datum mark on the installed surface 51 being determined by the image from camera 61, thus by chip coil portion
Part 1 positions and is arranged at installing matrix 50.
Now, in the area that at least first heat-conducting part 30a comprising with chip coil part 1 and the second heat-conducting part 30b is opposed
Domain, in interior scope, applies thermosetting between the installed surface 51 of installing matrix 50 and lower surface portion 1b of chip coil part 1
The property changed binding agent (not shown).In arbitrary operation before and after the working procedure of coating of this binding agent, use in the connection of installing matrix 50
Conductor portion and coating setting soldering paste (not shown) between portion of terminal 28a, 28b of chip coil part 1.
In (D) of Fig. 8, in upper surface part 1a of chip coil part 1 including at least the first heat-conducting part 30a and
Abut with heater (heater) 65 in the range of two heat-conducting part 30b and chip coil part 1 is heated.Need explanation
Although, simplified illustration in (D) of Fig. 8, now, preferably kept using adsorption section 63 or other holding members
So that heater 65 is touched in the state of chip coil part 1 and be butted on upper surface part 1a.But it is also possible to by adsorption section 63 from upper surface
Portion 1a makes heater 65 touch and is butted on upper surface part 1a after pulling down.
As shown in figure 3, the first heat-conducting part 30a passes through heat conduction conductor layer 32a, the second bonded conductor 45a, heat conduction conductor layer
33a, the second bonded conductor 46a and heat conduction conductor layer 34a engage and constitute, multiple to cross in the inside of laminate structure 2
Coil forms the mode that level is multiple insulating substrates and is formed.Second heat-conducting part 30b similarly, by by heat conduction conductor layer 31,
Second bonded conductor 44, heat conduction conductor layer 32b, the second bonded conductor 45b, heat conduction conductor layer 33b, the second bonded conductor 46b, with
And heat conduction conductor layer 34b engages and constitutes, it is multiple insulation in the inside of laminate structure 2 cross multiple coils to form levels
The mode of base material is formed.
In each heat-conducting part 30a, 30b, heat conduction conductor layer is formed by Copper Foil, and bonded conductor is by the electric conductivity comprising filler
The solidfied material of paste is formed, the thermal conductivity ratio insulator 10 of heat conduction conductor layer and bonded conductor be each insulating substrate 11,12,
13rd, 14 is high.Therefore, the heat of heater 65 is transferred to the lower surface portion of chip coil part 1 readily along heat-conducting part 30a, 30b
1b is such that it is able to effectively being heated to Thermocurable binding agent at short notice and being made its heat cure.
This two heat-conducting parts of first heat-conducting part 30a and the second heat-conducting part 30b are formed with chip coil part 1, at least
One heat-conducting part 30b is formed continuously to lower surface portion 2b from upper surface part 2a of laminate structure 2.Therefore, it is possible to effectively
By the heat transfer of heater 65 to Thermocurable binding agent.
In (E) of Fig. 8, after Thermocurable binding agent solidifies, shoot lamellar line using camera 61 from top
The image of coil component 1, and confirm the second position shown in Fig. 1 identify the decussation point of labelling 36a whether with installing matrix 50
Datum mark consistent.
In (F) of Fig. 8, after above-mentioned confirmation, installing matrix 50 and chip coil part 1 are supplied to heating furnace
66, in Reflow Soldering operation, make paste melts and solidify, and portion of terminal 28a, 28b of chip coil part 1 is brazed in installation
The connection conductor portion of matrix 50, thus complete to realize the fixing body of electrical connection.
It should be noted that in above-mentioned embodiments of the present invention, illustrating as through multiple insulating substrates simultaneously
It is provided with the first heat-conducting part 30a and second and leads along the heat-conducting part of the thickness direction extension of insulating substrate (chip coil part 1)
The chip coil part 1 of hot this two heat-conducting parts of portion 30b.However, the invention is not limited in this, the quantity of heat-conducting part can also
For one.In this case, this unique heat-conducting part is not limited to be formed continuously to from upper surface part 2a of laminate structure 2
Lower surface portion 2b it is also possible to as the first heat-conducting part 30a, in the form of lower surface portion 2b not reaching laminate structure 2.
In addition, in the above-described embodiment, illustrate by being laminated and hot pressing the insulating substrate 11～14 of four lamellars
And make the mode that adjacent insulating substrate touches each other, but the invention is not limited in enforcement hot pressing.For example, it is also possible to by viscous
Mixture makes the insulating substrate integration of multiple lamellars.
Claims (12)
1. a kind of chip coil part, it has：
The insulating substrate of stacked multiple lamellars；
Coil-conductor layer, it is formed at the conductor of described insulating substrate and forms face；
First through hole, it is formed on the described insulating substrate between adjacent described coil-conductor layer on thickness direction；
And
First bonded conductor, it is arranged at described first through hole and connects adjacent described coil-conductor layer on thickness direction each other
Close,
Coil case is formed by described coil-conductor layer and described first bonded conductor, is provided with described chip coil part
The portion of terminal turning on described coil case,
Described chip coil part is characterised by,
In the inner side of described coil case, it is provided with what the high material of the heat conductivity of insulating substrate described in thermal conductivity ratio was formed
Heat-conducting part, described heat-conducting part is to insulate with described coil case and to be formed in the way of passing through multiple described insulating substrates.
2. chip coil part according to claim 1, wherein,
Heat conduction conductor layer with the insulation of described coil-conductor layer is formed with the described conductor formation face of described insulating substrate, leads to
Cross the second bonded conductor in the second through hole being arranged on described insulating substrate by adjacent described heat conduction conductor on thickness direction
Layer is engaged with each other, thus forming described heat-conducting part,
Described coil-conductor layer and described heat conduction conductor layer are formed by identical conductive material, described first bonded conductor and described
Second bonded conductor is formed by identical conductive material.
3. chip coil part according to claim 2, wherein,
The described insulating substrate of the superiors be located furthest from as install surface side lower surface portion position at, the superiors described
The described conductor of insulating substrate is formed facing to top, is formed with described coil-conductor layer and described leads on this conductor formation face
Heating conductor layer.
4. chip coil part according to claim 3, wherein,
Described conductor positioned at the undermost described insulating substrate of described lower surface portion is formed facing to lower section, in this conductor shape
Labelling conductor layer that is opposed with described heat conduction conductor layer and not being connected with this heat conduction conductor layer is formed with one-tenth face, in described labelling
Primary importance identification labelling is formed with conductor layer.
5. chip coil part according to claim 3, wherein,
Second position identification labelling, the institute of the superiors are formed with the described conductor formation face of the described insulating substrate of the superiors
The upper surface part stating insulating substrate is covered by the insulating barrier of light transmission.
6. chip coil part according to claim 4, wherein,
Second position identification labelling, the institute of the superiors are formed with the described conductor formation face of the described insulating substrate of the superiors
The upper surface part stating insulating substrate is covered by the insulating barrier of light transmission.
7. the chip coil part according to any one of claim 2 to 6, wherein,
The inner side of described coil case be provided with multiple described in described heat conduction conductor layer and described second bonded conductor are constituted
Heat-conducting part.
8. the chip coil part according to any one of claim 2 to 6, wherein,
Described heat conduction conductor layer is formed by Copper Foil, and described second bonded conductor is by the solidification of the conductive paste comprising metal ingredient
Thing is constituted.
9. chip coil part according to claim 7, wherein,
Described heat conduction conductor layer is formed by Copper Foil, and described second bonded conductor is by the solidification of the conductive paste comprising metal ingredient
Thing is constituted.
10. a kind of fixing body of chip coil part it is characterised in that
The fixing body of described chip coil part passes through under the chip coil part any one of claim 1 to 9
At least corresponding with described heat-conducting part part in the surface element adhesive phase by heat cure is fixed on installing matrix and forms.
A kind of 11. installation methods of chip coil part are it is characterised in that include：
Make in the adhesive clip of the Thermocurable lower surface portion of chip coil part any one of in claim 1 to 9
At least corresponding with described heat-conducting part part and installing matrix between operation；
Part corresponding with described heat-conducting part in the upper surface part of described chip coil part is heated, and using along
The heat of described heat-conducting part transmission and make the operation of described adhesive heat cure；And
The operation that described portion of terminal is electrically connected with the conducting portion of described installing matrix.
The installation method of 12. chip coil parts according to claim 11, wherein,
The operation that described portion of terminal is electrically connected with the conducting portion of described installing matrix is soldering operation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015170290A JP6525319B2 (en) | 2015-08-31 | 2015-08-31 | Sheet-like coil component and mounted body of sheet-like coil component and method of mounting sheet-like coil component |
| JP2015-170290 | 2015-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106486254A true CN106486254A (en) | 2017-03-08 |
| CN106486254B CN106486254B (en) | 2018-11-02 |
Family
ID=58273169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610643212.0A Active CN106486254B (en) | 2015-08-31 | 2016-08-08 | The fixing body and installation method of chip coil component, chip coil component |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6525319B2 (en) |
| CN (1) | CN106486254B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109036831A (en) * | 2017-06-08 | 2018-12-18 | Tdk株式会社 | Coil component and its manufacturing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6452473B1 (en) * | 1999-09-17 | 2002-09-17 | Fdk Corporation | Multilayer inductor and method of manufacturing the same |
| JP2004140063A (en) * | 2002-10-16 | 2004-05-13 | O K Print:Kk | Wiring board |
| JP2004186637A (en) * | 2002-12-06 | 2004-07-02 | Toko Inc | Stacked electronic component |
| CN1247053C (en) * | 2001-07-06 | 2006-03-22 | 株式会社电装 | Multilayer circuit board and method for manufacturing multilayer circuit board |
| JP2008205353A (en) * | 2007-02-22 | 2008-09-04 | Kyocera Corp | Substrate incorporating coil |
| CN101821822A (en) * | 2008-09-24 | 2010-09-01 | 株式会社村田制作所 | Multilayer coil component |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57104565U (en) * | 1980-12-18 | 1982-06-28 | ||
| JP2001230142A (en) * | 2000-02-16 | 2001-08-24 | Toko Inc | Method of manufacturing laminate inductor |
| JP2004158541A (en) * | 2002-11-05 | 2004-06-03 | Tdk Corp | Laminated electronic part and its manufacturing method |
| JP5046720B2 (en) * | 2006-12-22 | 2012-10-10 | 京セラ株式会社 | Coil built-in board |
| JP5110068B2 (en) * | 2009-10-27 | 2012-12-26 | Ｔｄｋ株式会社 | Multilayer electronic components |
| JP5890148B2 (en) * | 2011-10-31 | 2016-03-22 | 京セラ株式会社 | Coil-embedded substrate and electronic device |
| JP6602022B2 (en) * | 2015-02-19 | 2019-11-06 | 東レエンジニアリング株式会社 | Mounting apparatus and mounting method |
-
2015
- 2015-08-31 JP JP2015170290A patent/JP6525319B2/en active Active
-
2016
- 2016-08-08 CN CN201610643212.0A patent/CN106486254B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6452473B1 (en) * | 1999-09-17 | 2002-09-17 | Fdk Corporation | Multilayer inductor and method of manufacturing the same |
| CN1247053C (en) * | 2001-07-06 | 2006-03-22 | 株式会社电装 | Multilayer circuit board and method for manufacturing multilayer circuit board |
| JP2004140063A (en) * | 2002-10-16 | 2004-05-13 | O K Print:Kk | Wiring board |
| JP2004186637A (en) * | 2002-12-06 | 2004-07-02 | Toko Inc | Stacked electronic component |
| JP2008205353A (en) * | 2007-02-22 | 2008-09-04 | Kyocera Corp | Substrate incorporating coil |
| CN101821822A (en) * | 2008-09-24 | 2010-09-01 | 株式会社村田制作所 | Multilayer coil component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109036831A (en) * | 2017-06-08 | 2018-12-18 | Tdk株式会社 | Coil component and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106486254B (en) | 2018-11-02 |
| JP6525319B2 (en) | 2019-06-05 |
| JP2017050311A (en) | 2017-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8238109B2 (en) | Flex-rigid wiring board and electronic device | |
| KR101652534B1 (en) | Method for integrating at least one electronic component into a printed circuit board and printed circuit board | |
| CN100444374C (en) | Printed circuit board and electronic apparatus including printed circuit board | |
| US8302299B2 (en) | Method of manufacturing a multilayer printed circuit board with a built-in electronic device | |
| US20090101400A1 (en) | Method for manufacturing component-embedded substrate and component-embedded substrate | |
| CN103120041B (en) | Radiant heat circuit board and manufacture method thereof | |
| US20190088404A1 (en) | Embedded magnetic component device | |
| TW201207871A (en) | Electronics parts to embed in a printed board and a printed board with an electronics parts | |
| RU2013128431A (en) | ELECTRONIC DEVICE, METHOD OF ITS MANUFACTURE AND PRINTED BOARD CONTAINING AN ELECTRONIC DEVICE | |
| WO2022007272A1 (en) | Embedded circuit board and manufacturing method therefor | |
| WO2015166588A1 (en) | Rigid-flex substrate with embedded component | |
| JP7207383B2 (en) | multilayer board | |
| JP2011243870A (en) | Coil mounting board | |
| CN102119588A (en) | Method for manufacturing module with built-in component, and module with built-in component | |
| JPWO2010103695A1 (en) | Manufacturing method of component built-in module and component built-in module | |
| CN106486254A (en) | Chip coil part, the fixing body of chip coil part and installation method | |
| TW201501600A (en) | Printed circuit board and method for manufacturing same | |
| JP4609435B2 (en) | Component-embedded substrate, electronic device using the same, and manufacturing method used therefor | |
| TWI508635B (en) | Circuit board with electronic element embeded and method for manufacturing same | |
| JP2010272563A (en) | Wiring board with built-in component and method of manufacturing the same | |
| TW200830498A (en) | Manufacturing method for integrating passive component within substrate | |
| JP2015002227A (en) | Multilayer wiring board and method for manufacturing the same | |
| CN210157483U (en) | Multilayer substrate | |
| JP2007250619A5 (en) | ||
| CN208047004U (en) | resin substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Co-patentee after: Murata Manufacturing Co., Ltd. Patentee after: Alpine Alpine Company Address before: Tokyo, Japan, Japan Co-patentee before: Murata Manufacturing Co., Ltd. Patentee before: Alps Electric Co., Ltd. |