CN106480433A - A kind of high viscosity glue spray site colloid amount method for improving and point glue equipment - Google Patents

A kind of high viscosity glue spray site colloid amount method for improving and point glue equipment Download PDF

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Publication number
CN106480433A
CN106480433A CN201611094570.7A CN201611094570A CN106480433A CN 106480433 A CN106480433 A CN 106480433A CN 201611094570 A CN201611094570 A CN 201611094570A CN 106480433 A CN106480433 A CN 106480433A
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China
Prior art keywords
valve body
glue
described valve
high viscosity
inwall
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Granted
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CN201611094570.7A
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Chinese (zh)
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CN106480433B (en
Inventor
陈云
苏振欣
施达创
麦锡全
陈新
高健
张昱
王晓初
杨志军
杨海东
汤晖
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Guangdong University of Technology
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Guangdong University of Technology
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

Abstract

The invention provides a kind of high viscosity glue spray site colloid amount method for improving：The inwall of the nozzle chambers of valve seat and valve body is carried out；Plate cupric micron layer in the inwall of nozzle cavity wall and valve body；The micro-nano layer of cupric carries out electrochemical plating, obtains copper sulphide nano layer；Copper sulphide nano layer is carried out super thinization process, improve the architectural characteristic of copper sulphide nano layer.When high viscosity glue occurs relative motion with cavity wall, have the driving force on flow direction and the viscosity resistance hindering its flowing.Wellability by copper sulphide nano structural change high viscosity glue and cavity wall, reduce both contacts area, under conditions of driving force is constant, the driving increasing on flow direction is made a concerted effort, so that the force direction acting on high viscosity glue points to jet more consistently, high viscosity glue is easier with high speed and stable state ejects.The present invention also provides a kind of point glue equipment, achievable identical technique effect.

Description

A kind of high viscosity glue spray site colloid amount method for improving and point glue equipment
Technical field
The present invention relates to microelectronic packaging technology field, further relate to a kind of high viscosity glue spray site colloid amount Method for improving and point glue equipment.
Background technology
Liquid dispensing technology is a key technology in microelectronics Packaging field, and convection cell enters this technology in a particular manner Row is accurate to be distributed, and position suitable in the fluid transfer of desirable amount to workpiece can be constructed the forms such as point, line, surface Various patterns, realize the mechanical connection between components and parts or electrical connection.
Injection dispensing is not against gravity or surface tension separation fluid, but sufficiently large by applying one on fluid Power, makes fluid be automatically separated injection, and speed for dispensing glue greatly improves.Due to having untouchable and high efficiency, spray dispensing skill Art has obtained increasingly being widely applied.Because theoretical research and practical application are deep not enough, in actual production operating process In also there are many problems.Subject matter is：The viscosity scope of application is little, connects work process medium-high viscosity gelatin jet and is stranded Difficult, jet velocity is unstable.
High-viscosity glue interior molecules adhesion is big, is difficult to be pulled off separation, and high viscosity glue and injection cavity Surface is fully contacted, and under the effect of larger pressure, can produce larger and complicated frictional resistance during relative motion, is unfavorable for high viscous Degree glue flows in cavity, and the adhesion of high viscosity glue, viscosity resistance are than larger and complicated so that the speed of gelatin jet Not only it is difficult to parametric control, being also highly prone to impact becomes unstable, as shown in Figure 6A, arrow represents traditional Glue dripping head Moving direction, size for dispensing glue and quality are unstable.Glue is not only difficult to separate, and is also easy to block injection cavity, cleaning inconvenience, Increased maintenance clean cost, inefficiency.
Therefore, for a person skilled in the art, how to design a kind of method that can improve spray site colloid amount, It is the current technical issues that need to address.
Content of the invention
The present invention provides a kind of high viscosity glue spray site colloid amount method for improving and point glue equipment, effectively increases drive The external force that dynamic high-viscosity glue liquor stream is moved is so that the force direction acting on high viscosity glue points to jet more consistently, high Viscosity glue is easier with high speed and stable state ejects, and solves the difficult difficulty of technology high viscosity gelatin jet at this stage Topic, improves simultaneously and sprays efficiency for dispensing glue.Concrete scheme is as follows：
A kind of high viscosity glue spray site colloid amount method for improving, including：
The inwall of the nozzle chambers of valve seat and valve body is carried out；
Plate cupric micron layer in the inwall of described nozzle cavity wall and described valve body；
The micro-nano layer of described cupric carries out electrochemical plating, obtains copper sulphide nano layer；
Described copper sulphide nano layer is carried out super thinization process.
Alternatively, described cleaning process includes：
Under 500 DEG C of environment, with the H of 0.3-0.5mol/L2SO4Solution enters to the inwall of described nozzle chambers and described valve body Row cleaning.
Alternatively, described plating cupric micron layer process includes：
Under room temperature environment, chemical reaction will be carried out in the inwall immersion copper liquid of described nozzle chambers and described valve body.
Alternatively, described electrochemical plating process includes：
The described cupric micron of setting on described valve seat and described valve body is placed in 150 DEG C of sulfur-bearing steam ambient 10min, is electrochemically reacted and obtains copper sulphide nano layer.
Alternatively, described super thinization processing procedure includes：
At ambient temperature, copper sulphide nano layer being placed on flow is 0.6cm3The ozonation system of/min processes 30min, Afterwards the surface handled well is placed in silicon fluoride solution 30min, uses ethane and each cleaning of ethanol after taking-up once；In 120 DEG C of ring The polymerization process of a length of 20min when carrying out in border.
Additionally, the present invention also provides a kind of point glue equipment, drive reciprocating valve rod including by driving means, described Valve rod stretches in valve body and by the spacing slip of described valve body；The end of described valve body detachably arranges valve seat, and described valve seat is opened If being used for spraying gelatin jet mouth, setting on the side wall of described valve body provides the confession Jiao Kou of glue by glue feeder；Described valve Seat with described valve rod formed nozzle chambers inwall on and described valve body be provided on the inwall of described nozzle chambers and The copper sulphide nano layer of glue contact.
Alternatively, described valve rod is the stair-stepping cylinder of size reduction from top to bottom, and described body cavity is and institute State the stepped cylinder cavity of valve rod cooperation.
Alternatively, the porch of described jet blower is taper seat, and taper is 100～130 degree.
Alternatively, described valve body is adopted with described valve seat and threadeds, and described valve seat arranges female thread, on described valve body Setting external screw thread.
Alternatively, described valve body and described valve seat are stainless steel structure.
The invention provides a kind of high viscosity glue spray site colloid amount method for improving includes：Cleaning, plating cupric micron layer, The process such as electrochemical plating and the process of super thinization.The inwall of the nozzle chambers of valve seat and valve body is carried out, obtains good processing Substrate；Plate cupric micron layer in the inwall of nozzle cavity wall and valve body；The micro-nano layer of cupric carries out electrochemical plating, obtains sulfur Change copper nanometer layer；Copper sulphide nano layer is carried out super thinization process, improve the architectural characteristic of copper sulphide nano layer, improve copper sulfide Nanometer layer and the binding ability of underlying structure, improve the viscosity resistance with high viscosity glue by nano coating.
When high viscosity glue occurs relative motion with cavity wall, have the driving force on flow direction and hinder its flowing Viscosity resistance, and the Vertical Square of flow direction upwards pressure generation.By special copper sulphide nano structure, utilize it Super thinning property to high viscosity glue, changes the wellability of high viscosity glue and cavity wall, reduces both contacts area, permissible It is effectively reduced glue drop viscosity resistance in the flowing direction, thus under conditions of driving force is constant, increase flowing side Driving upwards is made a concerted effort, and effectively increases and drives the dynamic external force of high-viscosity glue liquor stream so that acting on the work of high viscosity glue Power thrusts point to jet more consistently, and high viscosity glue is easier with high speed and stable state ejects, and solve existing The difficult difficult problem of stage technique high viscosity gelatin jet, improves simultaneously and sprays efficiency for dispensing glue.
The present invention also provides a kind of point glue equipment, drives reciprocating valve rod including by driving means, and valve rod stretches into In valve body and by the spacing slip of valve body；The end of valve body detachably arranges valve seat, and valve seat opens up for spraying gelatin jet Mouth, setting on the side wall of valve body provides the confession Jiao Kou of glue by glue feeder；The inwall of the nozzle chambers that valve seat is formed with valve rod Upper and valve body is provided for the copper sulphide nano layer contacting with glue on the inwall of nozzle chambers.Identical skill can be realized Art effect.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing Have technology description in required use accompanying drawing be briefly described it should be apparent that, drawings in the following description be only this Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, acceptable Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the flow chart of high viscosity glue spray site colloid amount method for improving provided by the present invention；
The sectional structure chart of the point glue equipment that Fig. 2 provides for the present invention；
Fig. 3 A is the contact situation schematic diagram with inwall for the high viscosity glue in traditional Glue dripping head；
The contact situation schematic diagram with inwall for the high viscosity glue in the point glue equipment that Fig. 3 B provides for the present invention；
Fig. 4 A is stressing conditions schematic diagram on cavity wall for the traditional structure high viscosity glue；
Mechanical characteristic schematic diagram on cavity wall for the point glue equipment that Fig. 4 B provides for the present invention；
Fig. 5 A is high viscosity glue in traditional Glue dripping head macroscopic view mechanical characteristic schematic diagram；
The point glue equipment macroscopic view mechanical characteristic schematic diagram that Fig. 5 B provides in the present invention for high viscosity glue；
Fig. 6 A is traditional Glue dripping head dispensing molding effect schematic diagram；
The point glue equipment dispensing molding effect schematic diagram that Fig. 6 B provides for the present invention.
Including：
Valve rod 1, valve body 2, for glue mouth 21, valve seat 3, nozzle chambers 31, jet blower 32, copper sulphide nano layer 4, driving means 5, Glue feeder 6.
Specific embodiment
The core of the present invention is to provide a kind of high viscosity glue spray site colloid amount method for improving and point glue equipment, passes through The copper sulphide nano structure of inner wall surface effectively increases driving high-viscosity glue liquor stream and moves to the super thinning property of high viscosity glue External force so that the force direction acting on high viscosity glue points to jet more consistently, high viscosity glue be easier with At a high speed and stable state ejects, solve the difficult difficult problem of technology high viscosity gelatin jet at this stage, improve injection simultaneously Efficiency for dispensing glue.
In order that those skilled in the art more fully understands technical scheme, below in conjunction with accompanying drawing and specifically Embodiment, the high viscosity glue spray site colloid amount method for improving and point glue equipment of the application is described in detail Bright.
As shown in figure 1, the flow chart for high viscosity glue spray site colloid amount method for improving provided by the present invention.This Bright provided high viscosity glue spray site colloid amount method for improving, including cleaning, plating cupric micron layer, electrochemical plating copper sulfide The processes such as nanometer layer 4, the process of super thinization.The targeted structure of this method includes nozzle chambers 31 and the valve body 2 of valve seat 3, so divides The structure of body is a kind of concrete set-up mode of dispensing mouth, if integral structure only needs to process on a cavity wall wherein.
First carry out step S1：The inwall of the nozzle chambers 31 of valve seat 3 and valve body 2 is carried out, obtains good processing table Face.Then carry out step S2：Plate cupric micron layer in the inwall of nozzle chambers 31 inwall cleaning and valve body 2.Carry out step again S3：Cupric micron layer carries out electrochemical plating, obtains copper sulphide nano layer 4.Finally carry out step S4：By copper sulphide nano layer 4 carry out super thinization is processed, and improves the binding ability of copper sulphide nano layer 4 and substrate.
When high viscosity glue occurs relative motion with cavity wall, have the driving force on flow direction and hinder its flowing Viscosity resistance, and the Vertical Square of flow direction upwards pressure generation.By special copper sulphide nano structure, utilize it Super thinning property to high viscosity glue, changes the wellability of high viscosity glue and cavity wall, reduces both contacts area, permissible It is effectively reduced glue drop viscosity resistance in the flowing direction, thus under conditions of driving force is constant, increase flowing side Driving upwards is made a concerted effort, and effectively increases and drives the dynamic external force of high-viscosity glue liquor stream so that acting on the work of high viscosity glue Power thrusts point to jet more consistently, and high viscosity glue is easier with high speed and stable state ejects, and solve existing The difficult difficult problem of stage technique high viscosity gelatin jet, improves simultaneously and sprays efficiency for dispensing glue.
On the basis of the above, the cleaning process of the present invention includes：Under 500 DEG C of environment, with the H of 0.3-0.5mol/L2SO4 Solution is carried out to the inwall of nozzle chambers 31 and valve body 2.Through high temperature pickling, cleaning effect is more thorough.
Further, plating cupric micron layer process includes：Under room temperature environment, by the inwall immersion of nozzle chambers 31 and valve body 2 Carry out chemical reaction in copper liquid.With nozzle chambers 31 and valve body 2 as substrate, carry out the micrometer structure that non-electrochemical plating obtains cupric. When the response time is identical, by controlling Cu2+Ratio control copper coating thickness.
Carry out electrochemical plating after plating cupric micron layer process, its process includes：Valve seat 3 and valve body 2 are placed in sulfur-bearing The cupric micron of setting is specifically placed on 10min in 150 DEG C of sulfur-bearing steam ambient, through inducing it by steam ambient It is electrochemically reacted and obtain copper sulphide nano layer 4.The time of evaporation is longer, and the surface roughness of copper sulphide nano layer 4 is bigger, Control the roughness of copper sulphide nano layer 4 by controlling the duration being deposited with.
Further, super thinization processing procedure includes：At ambient temperature, copper sulphide nano layer 4 being placed on flow is 0.6cm3The ozonation system of/min processes 30min, then the surface handled well is placed in silicon fluoride solution 30min, uses after taking-up Ethane and each cleaning of ethanol are once；The polymerization process of a length of 20min when finally carrying out in 120 DEG C of environment.By super thinization Process the architectural characteristic improving copper sulphide nano layer 4, improve the binding ability of copper sulphide nano layer 4 and substrate.
As shown in Fig. 2 the present invention also provides a kind of point glue equipment, including structures such as valve rod 1, valve body 2, valve seats 3.Valve rod 1 Driven by driving means 5 and do reciprocating linear motion, one end of valve rod 1 is stretched in valve body 2 and passed through the spacing slip of valve body 2；Valve The end of body 2 detachably arranges valve seat 3, and one end of valve seat 3 opens up the jet blower 32 for spraying glue.On the side wall of valve body 2 Setting supplies glue mouth 21, by glue feeder 6 to for providing glue in glue mouth 21.The nozzle chambers 31 that valve seat 3 is formed with valve rod 1 interior On wall and valve body 2 is provided for the copper sulphide nano layer 4 that contacts with glue on the inwall of nozzle chambers 31, glue is in valve rod It is squeezed between 1 and copper sulphide nano layer 4, outwards spray from jet blower 32.As shown in Fig. 3 A and Fig. 3 B, represent tradition respectively The state diagram of point glue equipment inwall that provides of Glue dripping head inwall and the present invention, wherein copper sulphide nano layer 4 is with dentalation table Show.
On the basis of the above, valve rod 1 is the stair-stepping cylinder of size reduction from top to bottom, and valve body 2 inner chamber is and valve The stepped cylinder cavity of bar 1 cooperation.Valve body 2 does not result in obstruction to the motion of valve rod 1.
The porch of jet blower 32 is taper seat, and taper is 100～130 degree, is more preferably set to 120 degree.Valve rod 1 end Portion is sphere, during extruding and conical surface contact, glue is blocked.This fit form adaptation is good, and processing is simple, its adaptation It is not easily susceptible to the impact of valve rod angle.
Valve body 2 is adopted with valve seat 3 threadeds, and valve seat 3 arranges female thread, and valve body 2 arranges external screw thread.Valve body 2 with The outer wall of valve seat 3 and inwall all flush, and smooth in appearance is consistent.This split type structure is a kind of preferred scheme, Ke Yigeng Change valve seat 3 to adjust the size of jet blower 32, if valve body 2 is also possible with the structure that valve seat 3 is integral type.
Valve body 2 and described valve seat 3 are stainless steel structure, are easy to the evaporation of copper sulphide nano body structure surface and obtain preferably Binding ability.
Point glue equipment provided by the present invention is provided with copper sulphide nano structure, and the distance between surface is very little, nanometer Space between structure is difficult to be entered by high-viscosity glue immersion, and contact angle reaches more than 160 °, and has relatively low delayed contact angle, There is sufficiently stable super thinning property, drag-reduction effect is very excellent.And good with the binding ability of cavity, mechanical stability is high, This nanostructured processing technique is simple, and machining accuracy is high, and controllability is good.
The present invention provides point glue equipment to include three phases when using, and respectively supplies glue stage, injection phase and closing Stage.
1) supply the glue stage：The end of valve rod 1 and the taper-face contact of valve seat 3, jet blower 32 is closed, glue feeder 6 pass through to carry out filler action for glue mouth 21, make the gap uniformity between valve rod 1 and valve seat 3, valve rod 1 and valve body 2 be full of high viscosity Glue, and produce certain pressure, make glue be in state suitably to be sprayed.
2) injection phase：Valve rod 1, under the driving of driving means 5, does the linear motion of set a distance, now jet blower upwards 32 are opened, and glue goes out jet blower 32 under suitable pressure acts on, and under the guiding of jet blower 32, form one section and have surely The stream of constant speed degree is penetrated.
3) dwell period：Jet blower 32 is opened after a period of time, and valve rod 1, under driving means 5 driving, drops to and supplies glue Stage location, jet blower 32 is closed, and stream is penetrated and is cut off immediately, at injection on last stage stream penetrate with certain speed and Volume flies away from jet blower 32 and reaches substrate.
Repeat 1)～3) three phases are continuously sprayed dispensing operation.
The process that nanostructured changes high-viscosity glue liquid movement characteristic occurs in above-mentioned injection phase 2), specifically valve rod 1 driven device 5 drives and rises, high viscosity glue under the effect of the pressure, during being flowed by the gap of valve rod 1, its As shown in Figure 4 A and 4 B shown in FIG., respectively traditional structure and the point glue equipment of present invention offer are on cavity wall for microcosmic effect principle Mechanical characteristic schematic diagram.When there is relative motion in high viscosity glue and cavity wall, have driving force on flow direction and Hinder the viscosity resistance of its flowing, and the Vertical Square of flow direction upwards pressure generation.By copper sulphide nano structure, profit With its super thinning property to high viscosity glue, change the wellability of high viscosity glue and cavity wall, reduce both contacts area, Under conditions of pressure F1 is constant, glue drop viscosity resistance in the flowing direction can be effectively reduced, thus drive Under conditions of power is constant, the driving increasing on flow direction is made a concerted effort F2, is in particular in the driving on always make a concerted effort F and flow direction The angle of F2 diminishes with joint efforts, i.e. α shown in Fig. 4 A and Fig. 4 B>β, can be obtained by the sine formula of triangle, flow direction On F2 (α)<F2 (β), effectively increases the external force driving high-viscosity glue liquor stream to move, its macroscopical action effect such as Fig. 5 A and figure Shown in 5B, the point glue equipment macroscopic view mechanical characteristic schematic diagram that respectively traditional Glue dripping head is provided with the present invention.The point of the present invention The force direction that adhesive dispenser acts on high viscosity glue points to jet so that high viscosity glue is easier with one more consistently Plant at a high speed and speed stable state ejects, solve the difficult difficult problem of technology high viscosity gelatin jet at this stage, carry simultaneously High injection efficiency for dispensing glue.As shown in figs. 6 a and 6b, represent the point glue equipment that traditional Glue dripping head is provided with the present invention respectively Molding effect schematic diagram.It is capable of the dispensing effect of uniformity using the point glue equipment of the present invention.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses the present invention. Multiple modifications to these embodiments will be apparent from for those skilled in the art, as defined herein General Principle, can realize without departing from the spirit or scope of the present invention in other embodiments.Therefore, this Bright be not intended to be limited to the embodiments shown herein, and be to fit to and principles disclosed herein and features of novelty phase Consistent scope the widest.

Claims (10)

1. a kind of high viscosity glue spray site colloid amount method for improving is it is characterised in that include：
The inwall of the nozzle chambers (31) of valve seat (3) and valve body (2) is carried out；
Plate cupric micron layer in the inwall of described nozzle chambers (31) inwall and described valve body (2)；
The micro-nano layer of described cupric carries out electrochemical plating, obtains copper sulphide nano layer (4)；
Described copper sulphide nano layer (4) is carried out super thinization process.
2. high viscosity glue spray site colloid amount method for improving according to claim 1 was it is characterised in that described cleaned Journey includes：
Under 500 DEG C of environment, with the H of 0.3-0.5mol/L2SO4The inwall to described nozzle chambers (31) and described valve body (2) for the solution It is carried out.
3. high viscosity glue spray site colloid amount method for improving according to claim 1 is it is characterised in that described plating cupric Micron layer process includes：
Under room temperature environment, chemical reaction will be carried out in the inwall immersion copper liquid of described nozzle chambers (31) and described valve body (2).
4. high viscosity glue spray site colloid amount method for improving according to claim 1 is it is characterised in that described electrochemistry Plated journey includes：
The described cupric micron of described valve seat (3) and the upper setting of described valve body (2) is placed in 150 DEG C of sulfur-bearing steam ambient 10min, is electrochemically reacted and obtains copper sulphide nano layer (4).
5. high viscosity glue spray site colloid amount method for improving according to claim 1 is it is characterised in that described super thinization Processing procedure includes：
At ambient temperature, copper sulphide nano layer (4) being placed on flow is 0.6cm3The ozonation system of/min processes 30min, after The surface handled well is placed in silicon fluoride solution 30min, uses ethane and each cleaning of ethanol after taking-up once；In 120 DEG C of environment In when carrying out a length of 20min polymerization process.
6. a kind of point glue equipment is it is characterised in that include driving reciprocating valve rod (1), described valve by driving means (5) Bar (1) stretches in valve body (2) and by the spacing slip of described valve body (2)；The end of described valve body (2) detachably arranges valve seat (3), described valve seat (3) opens up for spraying gelatin jet mouth (32), and glue feeder is passed through in setting on the side wall of described valve body (2) (6) the confession Jiao Kou (21) of glue is provided；On the inwall of nozzle chambers (31) that described valve seat (3) and described valve rod (1) are formed and Described valve body (2) is provided for the copper sulphide nano layer (4) contacting with glue on the inwall of described nozzle chambers (31).
7. point glue equipment according to claim 6 is it is characterised in that described valve rod (1) is size reduction from top to bottom Stair-stepping cylinder, described valve body (2) inner chamber is the stepped cylinder cavity coordinating with described valve rod (1).
8. point glue equipment according to claim 6 it is characterised in that described jet blower (32) porch be taper seat, Taper is 100～130 degree.
9. the point glue equipment according to any one of claim 6 to 8 is it is characterised in that described valve body (2) and described valve seat (3) adopt threaded, described valve seat (3) upper setting female thread, described valve body (2) is upper to arrange external screw thread.
10. point glue equipment according to claim 9 is it is characterised in that described valve body (2) and described valve seat (3) are not Rust steel construction.
CN201611094570.7A 2016-12-01 2016-12-01 A kind of high viscosity glue spray site colloid amount method for improving and point glue equipment Active CN106480433B (en)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN107081907A (en) * 2017-06-12 2017-08-22 贵州大学 Piezoelectricity striker printing head system
CN110743754A (en) * 2019-11-06 2020-02-04 惠州欣旺达智能工业有限公司 Glue dispensing device

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