CN106480433B - A kind of high viscosity glue spray site colloid amount method for improving and point glue equipment - Google Patents
A kind of high viscosity glue spray site colloid amount method for improving and point glue equipment Download PDFInfo
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- CN106480433B CN106480433B CN201611094570.7A CN201611094570A CN106480433B CN 106480433 B CN106480433 B CN 106480433B CN 201611094570 A CN201611094570 A CN 201611094570A CN 106480433 B CN106480433 B CN 106480433B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
Abstract
The present invention provides a kind of high viscosity glue spray site colloid amount method for improving: the inner wall of the nozzle chambers of valve seat and valve body is cleaned；Cupric micron layer is plated in the inner wall of nozzle cavity wall and valve body；Electrochemical plating is carried out on the micro-nano layer of cupric, obtains copper sulphide nano layer；Copper sulphide nano layer is subjected to super thinization processing, improves the architectural characteristic of copper sulphide nano layer.When relative motion occurs for high viscosity glue and cavity wall, has the driving force on flow direction and hinder the viscosity resistance of its flowing.Change the wellability of high viscosity glue and cavity wall by copper sulphide nano structure, reduce the contact area of the two, under conditions of driving force is constant, increase the driving resultant force on flow direction, so that the force direction for acting on high viscosity glue is directed toward jet port more consistently, high viscosity glue is easier with high speed and stable state ejects.The present invention also provides a kind of point glue equipment, it can be achieved that identical technical effect.
Description
Technical field
The present invention relates to microelectronic packaging technology fields, further relate to a kind of high viscosity glue spray site colloid amount
Method for improving and point glue equipment.
Background technique
Liquid dispensing technology is a key technology in microelectronics Packaging field, the technology in a particular manner to fluid into
The fluid of desirable amount, can be transferred to suitable position on workpiece, construct the forms such as point, line, surface by the accurate distribution of row
Various patterns, realize component between mechanical connection or electrical connection.
It sprays dispensing and separates fluid not against gravity or surface tension, but it is sufficiently large by applying one on fluid
Power, makes fluid be automatically separated injection, and speed for dispensing glue greatly improves.Due to spraying dispensing skill with untouchable and high efficiency
Art is more and more widely used.Since theoretical research and practical application are deep not enough, in actual production operating process
In there is also many problems.Main problem is: the viscosity scope of application is small, and connection course of work medium-high viscosity gelatin jet is tired
Hardly possible, jet velocity are unstable.
Highly viscous glue interior molecules binding force is big, is not easy to be pulled off separation, and high viscosity glue and injection cavity
Surface comes into full contact with, and under the effect of larger pressure, when relative motion can generate larger and complicated frictional resistance, is unfavorable for high viscous
Degree glue flows in the cavity, and binding force, the viscosity resistance of high viscosity glue are bigger and complicated, so that the speed of gelatin jet
It is not only difficult to parametric control, is also highly prone to influence to become unstable, as shown in Figure 6A, arrow indicates traditional Glue dripping head
Moving direction, size and unstable quality for dispensing glue.Glue is not only difficult to separate, and is also easy to obstruction injection cavity, cleaning inconvenience,
Increase maintenance clean cost, inefficiency.
Therefore, for those skilled in the art, a kind of method that can be improved spray site colloid amount how is designed,
It is the current technical issues that need to address.
Summary of the invention
The present invention provides a kind of high viscosity glue spray site colloid amount method for improving and point glue equipment, effectively increases drive
The dynamic external force of dynamic high-viscosity glue liquid stream, so that the force direction for acting on high viscosity glue is directed toward jet port more consistently, it is high
Viscosity glue is easier with high speed and stable state ejects, and solves the difficulty of technology high viscosity gelatin jet difficulty at this stage
Topic, while improving injection efficiency for dispensing glue.Concrete scheme is as follows:
A kind of high viscosity glue spray site colloid amount method for improving, comprising:
The inner wall of the nozzle chambers of valve seat and valve body is cleaned；
Cupric micron layer is plated in the inner wall of the nozzle cavity wall and the valve body；
Electrochemical plating is carried out on the micro-nano layer of the cupric, obtains copper sulphide nano layer；
The copper sulphide nano layer is subjected to super thinization processing.
Optionally, the cleaning process includes:
Under 500 DEG C of environment, with the H2SO4 solution of 0.3-0.5mol/L to the inner walls of the nozzle chambers and the valve body into
Row cleaning.
Optionally, the plating cupric micron layer process includes:
Under room temperature environment, the inner wall of the nozzle chambers and the valve body is immersed in copper liquid and is chemically reacted.
Optionally, the electrochemical plating process includes:
The cupric micron being arranged on the valve seat and the valve body is placed in 150 DEG C of sulfur-bearing steam ambient
10min is electrochemically reacted to obtain copper sulphide nano layer.
Optionally, the super thinization treatment process includes:
At room temperature, copper sulphide nano layer is placed on the ozonation system that flow is 0.6cm3/min and handles 30min,
The surface handled well is placed in silicon fluoride solution 30min afterwards, is respectively cleaned once after taking-up with ethane and ethyl alcohol；In 120 DEG C of ring
The polymerization process of a length of 20min when being carried out in border.
In addition, the present invention also provides a kind of point glue equipment, it is described including driving the valve rod moved back and forth by driving device
Valve rod protrudes into valve body and by valve body limit sliding；Valve seat is detachably arranged in the end of the valve body, and the valve seat is opened
If setting is by glue feeder offer glue for Jiao Kou on the side wall of the valve body for spraying gelatin jet mouth；The valve
Seat with the valve rod formation nozzle chambers inner wall on and the valve body be arranged on the inner wall of the nozzle chambers for
The copper sulphide nano layer of glue contact.
Optionally, the valve rod is the stair-stepping cylindrical body of size reduction from top to bottom, the body cavity for institute
State the stepped cylinder cavity of valve rod cooperation.
Optionally, the inlet of the jet blower is circular conical surface, and taper is 100~130 degree.
Optionally, the valve body and the valve seat be using being threadedly coupled, and is arranged internal screw thread on the valve seat, on the valve body
External screw thread is set.
Optionally, the valve body and the valve seat are stainless steel structure.
The present invention provides a kind of high viscosity glue spray site colloid amount method for improving include: cleaning, plating cupric micron layer,
The processes such as electrochemical plating and the processing of super thinization.The inner wall of the nozzle chambers of valve seat and valve body is cleaned, good processing is obtained
Substrate；Cupric micron layer is plated in the inner wall of nozzle cavity wall and valve body；Electrochemical plating is carried out on the micro-nano layer of cupric, obtains sulphur
Change copper nanometer layer；Copper sulphide nano layer is subjected to super thinization processing, improves the architectural characteristic of copper sulphide nano layer, improves copper sulfide
The binding performance of nanometer layer and underlying structure improves the viscosity resistance with high viscosity glue by nano coating.
When relative motion occurs for high viscosity glue and cavity wall, has the driving force on flow direction and hinder its flowing
Viscosity resistance and the Vertical Square of flow direction upward pressure generation.By special copper sulphide nano structure, it is utilized
To the super thinning property of high viscosity glue, change the wellability of high viscosity glue and cavity wall, the contact area both reduced can be with
It is effectively reduced the viscosity resistance of glue drop in the flowing direction, thus under conditions of driving force is constant, increase flowing side
Upward driving resultant force effectively increases the dynamic external force of driving high-viscosity glue liquid stream, so that acting on the work of high viscosity glue
Power thrusts are directed toward jet port more consistently, and high viscosity glue is easier with high speed and stable state ejects, and solve existing
The problem of stage technique high viscosity gelatin jet difficulty, while improving injection efficiency for dispensing glue.
The present invention also provides a kind of point glue equipments, and including driving the valve rod moved back and forth by driving device, valve rod is protruded into
It is limited in valve body and by valve body and is slided；Valve seat is detachably arranged in the end of valve body, and valve seat is opened up for spraying gelatin jet
Mouth, setting is by glue feeder offer glue for Jiao Kou on the side wall of valve body；The inner wall for the nozzle chambers that valve seat and valve rod are formed
The copper sulphide nano layer for contacting with glue is arranged in upper and valve body on the inner wall of nozzle chambers.Identical skill may be implemented
Art effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the flow chart of high viscosity glue spray site colloid amount method for improving provided by the present invention；
Fig. 2 is the sectional structure chart of point glue equipment provided by the invention；
Fig. 3 A is contact situation schematic diagram of the high viscosity glue with inner wall in traditional Glue dripping head；
Fig. 3 B is contact situation schematic diagram of the high viscosity glue with inner wall in point glue equipment provided by the invention；
Fig. 4 A is stress condition schematic diagram of the traditional structure high viscosity glue on cavity wall；
Fig. 4 B is mechanical characteristic schematic diagram of the point glue equipment provided by the invention on cavity wall；
Fig. 5 A is high viscosity glue in traditional Glue dripping head macroscopic view mechanical characteristic schematic diagram；
Fig. 5 B is high viscosity glue in point glue equipment macroscopic view mechanical characteristic schematic diagram provided by the invention；
Fig. 6 A is traditional Glue dripping head dispensing molding effect schematic diagram；
Fig. 6 B is point glue equipment dispensing molding effect schematic diagram provided by the invention.
Including:
Valve rod 1, valve body 2, for glue mouth 21, valve seat 3, nozzle chambers 31, jet blower 32, copper sulphide nano layer 4, driving device 5,
Glue feeder 6.
Specific embodiment
Core of the invention is to provide a kind of high viscosity glue spray site colloid amount method for improving and point glue equipment, passes through
It is dynamic that the copper sulphide nano structure of inner wall surface effectively increases driving high-viscosity glue liquid stream to the super thinning property of high viscosity glue
External force so that the force direction for acting on high viscosity glue is directed toward jet port more consistently, high viscosity glue be easier with
At a high speed and stable state ejects, and solves the problems, such as that technology high viscosity gelatin jet is difficult at this stage, while improving injection
Efficiency for dispensing glue.
In order to make those skilled in the art more fully understand technical solution of the present invention, below in conjunction with attached drawing and specifically
Embodiment, the high viscosity glue spray site colloid amount method for improving and point glue equipment of the application are described in detail
It is bright.
As shown in Figure 1, being the flow chart of high viscosity glue spray site colloid amount method for improving provided by the present invention.This hair
High viscosity glue spray site colloid amount method for improving provided by bright, including clean, plate cupric micron layer, electrochemical plating copper sulfide
The processes such as nanometer layer 4, the processing of super thinization.The targeted structure of this method includes the nozzle chambers 31 and valve body 2 of valve seat 3, is divided in this way
The structure of body is a kind of specific set-up mode of dispensing mouth, if being an integral structure only needs to handle on a cavity wall wherein.
It first carries out step S1: the inner wall of the nozzle chambers 31 of valve seat 3 and valve body 2 being cleaned, good processing table is obtained
Face.Then it carries out step S2: plating cupric micron layer in the inner wall of 31 inner wall of nozzle chambers and valve body 2 cleaned.Step is carried out again
S3: carrying out electrochemical plating on cupric micron layer, obtains copper sulphide nano layer 4.Finally carry out step S4: by copper sulphide nano layer
4 carry out super thinization processing, improve the binding performance of copper sulphide nano layer 4 and substrate.
When relative motion occurs for high viscosity glue and cavity wall, has the driving force on flow direction and hinder its flowing
Viscosity resistance and the Vertical Square of flow direction upward pressure generation.By special copper sulphide nano structure, it is utilized
To the super thinning property of high viscosity glue, change the wellability of high viscosity glue and cavity wall, the contact area both reduced can be with
It is effectively reduced the viscosity resistance of glue drop in the flowing direction, thus under conditions of driving force is constant, increase flowing side
Upward driving resultant force effectively increases the dynamic external force of driving high-viscosity glue liquid stream, so that acting on the work of high viscosity glue
Power thrusts are directed toward jet port more consistently, and high viscosity glue is easier with high speed and stable state ejects, and solve existing
The problem of stage technique high viscosity gelatin jet difficulty, while improving injection efficiency for dispensing glue.
On the basis of the above, cleaning process of the invention includes: under 500 DEG C of environment, with the H2SO4 of 0.3-0.5mol/L
Solution cleans the inner wall of nozzle chambers 31 and valve body 2.By high temperature pickling, cleaning effect is more thorough.
Further, plating cupric micron layer process includes: and immerses the inner wall of nozzle chambers 31 and valve body 2 under room temperature environment
It is chemically reacted in copper liquid.It is substrate with nozzle chambers 31 and valve body 2, carries out the micrometer structure that non-electrochemical plating obtains cupric.
When the reaction time is identical, the ratio by controlling Cu2+ controls the thickness of copper coating.
Electrochemical plating is carried out after plating cupric micron layer process, process includes: that valve seat 3 and valve body 2 are placed in sulfur-bearing
The cupric micron of setting is specifically placed on 10min in 150 DEG C of sulfur-bearing steam ambient, by inducing it by steam ambient
It is electrochemically reacted to obtain copper sulphide nano layer 4.The time of vapor deposition is longer, and the surface roughness of copper sulphide nano layer 4 is bigger,
The roughness of copper sulphide nano layer 4 is controlled by the duration of control vapor deposition.
Further, super thinization treatment process includes: at room temperature, copper sulphide nano layer 4 is placed on flow is
The ozonation system of 0.6cm3/min handles 30min, and the surface handled well is then placed in silicon fluoride solution 30min, is used after taking-up
Ethane and ethyl alcohol respectively clean once；The polymerization process of a length of 20min when finally being carried out in 120 DEG C of environment.Pass through super thinization
Processing improves the architectural characteristic of copper sulphide nano layer 4, improves the binding performance of copper sulphide nano layer 4 and substrate.
As shown in Fig. 2, the present invention also provides a kind of point glue equipment, including the structures such as valve rod 1, valve body 2, valve seat 3.Valve rod 1
It is done reciprocating linear motion by the drive of driving device 5, one end of valve rod 1 is protruded into valve body 2 and by the limit sliding of valve body 2；Valve
Valve seat 3 is detachably arranged in the end of body 2, and one end of valve seat 3 opens up the jet blower 32 for spraying glue.On the side wall of valve body 2
It is arranged for glue mouth 21, provides glue in for glue mouth 21 by glue feeder 6.The nozzle chambers 31 that valve seat 3 is formed with valve rod 1 it is interior
On wall and the copper sulphide nano layer 4 for contacting with glue is arranged in valve body 2 on the inner wall of nozzle chambers 31, and glue is in valve rod
It is squeezed between 1 and copper sulphide nano layer 4, is sprayed outward from jet blower 32.As shown in Fig. 3 A and Fig. 3 B, tradition is respectively indicated
Glue dripping head inner wall and point glue equipment inner wall provided by the invention state diagram, wherein copper sulphide nano layer 4 is with dentalation table
Show.
On the basis of the above, valve rod 1 is the stair-stepping cylindrical body of size reduction from top to bottom, and 2 inner cavity of valve body is and valve
The stepped cylinder cavity that bar 1 cooperates.Valve body 2 not will cause obstruction to the movement of valve rod 1.
The inlet of jet blower 32 is circular conical surface, and taper is 100~130 degree, is more preferably set as 120 degree.1 end of valve rod
Portion is spherical surface, and when extruding and conical surface contact, glue is truncated.The fit form adaptation is good, and the processing is simple, adaptation
It is not easily susceptible to the influence of valve rod angle.
Valve body 2, using being threadedly coupled, is arranged internal screw thread, external screw thread is arranged on valve body 2 with valve seat 3 on valve seat 3.Valve body 2 with
The outer wall and inner wall of valve seat 3 flush, and smooth in appearance is consistent.This split type structure is a kind of preferred scheme, Ke Yigeng
Valve seat 3 is changed to adjust the size of jet blower 32, if valve body 2 and the structure that valve seat 3 is integral type are also possible.
Valve body 2 and the valve seat 3 are stainless steel structure, preferable convenient for the vapor deposition and acquisition of copper sulphide nano body structure surface
Binding performance.
Point glue equipment provided by the present invention is provided with copper sulphide nano structure, and the distance between surface is very small, nanometer
Gap between structure is difficult to be immersed by high viscosity glue, and contact angle is reached more than 160 °, and has lower lag contact angle,
With sufficiently stable super thinning property, drag-reduction effect is very excellent.And it is good with the binding performance of cavity, mechanical stability is high,
The nanostructure processing technology is simple, and machining accuracy is high, and controllability is good.
It includes three phases that the present invention provides point glue equipment when in use, respectively for glue stage, injection phase and closing
Stage.
1) for the glue stage: the end of valve rod 1 and the taper-face contact of valve seat 3, jet blower 32 are in close state, glue feeder
6, by carrying out filler movement for glue mouth 21, make the gap between valve rod 1 and valve seat 3, valve rod 1 and valve body 2 be uniformly filled in high viscosity
Glue, and certain pressure is generated, so that glue is in suitable state to be sprayed.
2) injection phase: valve rod 1 does the linear motion of set a distance, at this time jet blower under the driving of driving device 5 upwards
32 are opened, and glue goes out jet blower 32 under the effect of suitable pressure, and under the guidance of jet blower 32, forming one section has surely
The stream of constant speed degree is penetrated.
3) closed stage: jet blower 32 was opened after a period of time, and valve rod 1 drops under the driving of driving device 5 for glue
The location of stage, jet blower 32 are closed, and stream emitter following is cut off, at injection on last stage stream penetrate with certain speed and
Volume flies away from jet blower 32 and reaches substrate.
Repeat 1)~3) the continuous injection dispensing operation of three phases progress.
The process that nanostructure changes high-viscosity glue liquid movement characteristic occurs in above-mentioned injection phase 2), specifically valve rod
The driving of 1 driven device 5 rises, high viscosity glue under the effect of the pressure, during being flowed by the gap of valve rod 1,
Microcosmic effect principle is as shown in Figure 4 A and 4 B shown in FIG., and respectively traditional structure is with point glue equipment provided by the invention on cavity wall
Mechanical characteristic schematic diagram.When relative motion occurs for high viscosity glue and cavity wall, have driving force on flow direction and
The Vertical Square of the viscosity resistance and flow direction that hinder it to flow upwards pressure generation.Pass through copper sulphide nano structure, benefit
With its super thinning property to high viscosity glue, change the wellability of high viscosity glue and cavity wall, reduce the contact area of the two,
Under conditions of pressure F1 is constant, it can be effectively reduced the viscosity resistance of glue drop in the flowing direction, thus driven
Under conditions of power is constant, increase the driving resultant force F2 on flow direction, the driving being in particular on total resultant force F and flow direction
The angle of resultant force F2 becomes smaller, i.e. α > β shown in Fig. 4 A and Fig. 4 B, flow direction available by the sine formula of triangle
On F2 (α) < F2 (β), effectively increase the dynamic external force of driving high-viscosity glue liquid stream, macroscopic view function and effect such as Fig. 5 A with scheme
Shown in 5B, respectively traditional Glue dripping head and point glue equipment macroscopic view mechanical characteristic schematic diagram provided by the invention.Point of the invention
The force direction that adhesive dispenser acts on high viscosity glue is directed toward jet port more consistently, so that high viscosity glue is easier with one
Kind is at a high speed and speed stable state ejects, and solves the problems, such as that technology high viscosity gelatin jet is difficult at this stage, mentions simultaneously
Height sprays efficiency for dispensing glue.As shown in figs. 6 a and 6b, traditional Glue dripping head and point glue equipment provided by the invention are respectively indicated
Molding effect schematic diagram.Uniform dispensing effect can be realized using point glue equipment of the invention.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, this hair
It is bright to be not intended to be limited to the embodiments shown herein, and be to fit to and the principles and novel features disclosed herein phase
Consistent widest scope.
Claims (10)
1. a kind of high viscosity glue spray site colloid amount method for improving characterized by comprising
The inner wall of the nozzle chambers (31) of valve seat (3) and valve body (2) is cleaned；
Cupric micron layer is plated in the inner wall of the nozzle chambers (31) inner wall and the valve body (2)；
Electrochemical plating is carried out on the micro-nano layer of the cupric, obtains copper sulphide nano layer (4)；
The copper sulphide nano layer (4) is subjected to super thinization processing.
2. high viscosity glue spray site colloid amount method for improving according to claim 1, which is characterized in that described to clean
Journey includes:
Under 500 DEG C of environment, with the H of 0.3-0.5mol/L2SO4H2SO4 solution is to the nozzle chambers (31) and the valve body (2)
Inner wall cleaned.
3. high viscosity glue spray site colloid amount method for improving according to claim 1, which is characterized in that the plating cupric
Micron layer process includes:
Under room temperature environment, the inner wall of the nozzle chambers (31) and the valve body (2) is immersed in copper liquid and is chemically reacted.
4. high viscosity glue spray site colloid amount method for improving according to claim 1, which is characterized in that the electrochemistry
Plating process includes:
The cupric micron being arranged on the valve seat (3) and the valve body (2) is placed in 150 DEG C of sulfur-bearing steam ambient
10min is electrochemically reacted to obtain copper sulphide nano layer (4).
5. high viscosity glue spray site colloid amount method for improving according to claim 1, which is characterized in that super thinization
Treatment process includes:
At room temperature, copper sulphide nano layer (4) is placed on flow is 0.6cm3 The ozonation system of 3/min handles 30min,
The surface handled well is placed in silicon fluoride solution 30min afterwards, is respectively cleaned once after taking-up with ethane and ethyl alcohol；In 120 DEG C of ring
The polymerization process of a length of 20min when being carried out in border.
6. a kind of point glue equipment, which is characterized in that including driving the valve rod (1) moved back and forth, the valve by driving device (5)
Bar (1) protrudes into valve body (2) and by the valve body (2) limit sliding；Valve seat is detachably arranged in the end of the valve body (2)
(3), the valve seat (3) opens up for spraying gelatin jet mouth (32), and setting passes through glue feeder on the side wall of the valve body (2)
(6) provide glue for Jiao Kou (21)；On the inner wall for the nozzle chambers (31) that the valve seat (3) and the valve rod (1) are formed and
The copper sulphide nano layer (4) for contacting with glue is arranged in the valve body (2) on the inner wall of the nozzle chambers (31).
7. point glue equipment according to claim 6, which is characterized in that the valve rod (1) is size reduction from top to bottom
Stair-stepping cylindrical body, valve body (2) inner cavity are the stepped cylinder cavity cooperated with the valve rod (1).
8. point glue equipment according to claim 6, which is characterized in that the inlet of the jet blower (32) is circular conical surface,
Taper is 100~130 degree.
9. according to the described in any item point glue equipments of claim 6 to 8, which is characterized in that the valve body (2) and the valve seat
(3) using being threadedly coupled, internal screw thread is set on the valve seat (3), external screw thread is set on the valve body (2).
10. point glue equipment according to claim 9, which is characterized in that the valve body (2) and the valve seat (3) are not
Become rusty steel construction.
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| CN201611094570.7A CN106480433B (en) | 2016-12-01 | 2016-12-01 | A kind of high viscosity glue spray site colloid amount method for improving and point glue equipment |
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| CN201611094570.7A CN106480433B (en) | 2016-12-01 | 2016-12-01 | A kind of high viscosity glue spray site colloid amount method for improving and point glue equipment |
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| CN110743754B (en) * | 2019-11-06 | 2021-07-02 | 惠州欣旺达智能工业有限公司 | Glue dispensing device |
Citations (4)
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| CN103464342A (en) * | 2013-08-30 | 2013-12-25 | 中南大学 | Jetting glue dispensing valve device and jetting glue dispensing method |
| CN205361845U (en) * | 2015-12-16 | 2016-07-06 | 河南理工大学 | Glue dispersing device |
| CN106000778A (en) * | 2016-07-30 | 2016-10-12 | 南京拓益森精密电子有限公司 | Self-limiting impact type jetting glue-dispensing device |
| CN206467289U (en) * | 2016-12-01 | 2017-09-05 | 广东工业大学 | A kind of high viscosity glue spray site colloid amount lifts point glue equipment |
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| US8753713B2 (en) * | 2010-06-05 | 2014-06-17 | Nordson Corporation | Jetting dispenser and method of jetting highly cohesive adhesives |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103464342A (en) * | 2013-08-30 | 2013-12-25 | 中南大学 | Jetting glue dispensing valve device and jetting glue dispensing method |
| CN205361845U (en) * | 2015-12-16 | 2016-07-06 | 河南理工大学 | Glue dispersing device |
| CN106000778A (en) * | 2016-07-30 | 2016-10-12 | 南京拓益森精密电子有限公司 | Self-limiting impact type jetting glue-dispensing device |
| CN206467289U (en) * | 2016-12-01 | 2017-09-05 | 广东工业大学 | A kind of high viscosity glue spray site colloid amount lifts point glue equipment |
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