CN106457299A - 印刷纵横比高的图案 - Google Patents
印刷纵横比高的图案 Download PDFInfo
- Publication number
- CN106457299A CN106457299A CN201580009162.4A CN201580009162A CN106457299A CN 106457299 A CN106457299 A CN 106457299A CN 201580009162 A CN201580009162 A CN 201580009162A CN 106457299 A CN106457299 A CN 106457299A
- Authority
- CN
- China
- Prior art keywords
- printing
- slurry
- impression
- pattern
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007639 printing Methods 0.000 title claims abstract description 183
- 238000000034 method Methods 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000002002 slurry Substances 0.000 claims description 150
- 238000005516 engineering process Methods 0.000 claims description 65
- 239000004020 conductor Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 16
- 238000009826 distribution Methods 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000007634 remodeling Methods 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 229920001940 conductive polymer Polymers 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000002322 conducting polymer Substances 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 238000003825 pressing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000008187 granular material Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000411 inducer Substances 0.000 description 1
- 239000003049 inorganic solvent Substances 0.000 description 1
- 229910001867 inorganic solvent Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D17/00—Pigment pastes, e.g. for mixing in paints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/008—Sequential or multiple printing, e.g. on previously printed background; Mirror printing; Recto-verso printing; using a combination of different printing techniques; Printing of patterns visible in reflection and by transparency; by superposing printed artifacts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Dispersion Chemistry (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Methods (AREA)
Abstract
Description
Claims (43)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461955374P | 2014-03-19 | 2014-03-19 | |
US61/955,374 | 2014-03-19 | ||
PCT/IL2015/000013 WO2015140775A1 (en) | 2014-03-19 | 2015-03-11 | Printing high aspect ratio patterns |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106457299A true CN106457299A (zh) | 2017-02-22 |
CN106457299B CN106457299B (zh) | 2020-01-03 |
Family
ID=54143831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580009162.4A Active CN106457299B (zh) | 2014-03-19 | 2015-03-11 | 印刷纵横比高的图案 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9750141B2 (zh) |
EP (1) | EP3119531A4 (zh) |
CN (1) | CN106457299B (zh) |
IL (1) | IL247202B (zh) |
WO (1) | WO2015140775A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110444335A (zh) * | 2018-05-03 | 2019-11-12 | 深圳光启尖端技术有限责任公司 | 非均匀电损耗超材料及其制备方法 |
CN113130672A (zh) * | 2021-02-24 | 2021-07-16 | 泰州隆基乐叶光伏科技有限公司 | 一种太阳能电池及其制造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112018004186T8 (de) | 2017-08-17 | 2020-07-02 | California Institute Of Technology | Fertigungsprozesse für effektiv transparente Kontakte |
US11227964B2 (en) | 2017-08-25 | 2022-01-18 | California Institute Of Technology | Luminescent solar concentrators and related methods of manufacturing |
US11362229B2 (en) | 2018-04-04 | 2022-06-14 | California Institute Of Technology | Epitaxy-free nanowire cell process for the manufacture of photovoltaics |
US11041338B2 (en) | 2018-08-21 | 2021-06-22 | California Institute Of Technology | Windows implementing effectively transparent conductors and related methods of manufacturing |
WO2020205800A1 (en) | 2019-03-29 | 2020-10-08 | California Institute Of Technology | Apparatus and systems for incorporating effective transparent catalyst for photoelectrochemical application |
US12089343B2 (en) * | 2022-09-01 | 2024-09-10 | Reophotonics, Ltd. | Methods for printing a conductive pillar with high precision |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5362513A (en) * | 1990-05-10 | 1994-11-08 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a pattern of conductive fine-line films and setting ink used for the same |
US20010029665A1 (en) * | 2000-03-16 | 2001-10-18 | Akira Hashimoto | Method of manufacturing ceramic thick-film printed circuit board |
CN1791472A (zh) * | 2003-05-19 | 2006-06-21 | 太阳油墨股份有限公司 | 浮凸图像的形成方法及其图案形成物 |
CN101193499A (zh) * | 2006-11-29 | 2008-06-04 | 精工爱普生株式会社 | 图案形成方法、液滴喷出装置及电路基板 |
CN101370358A (zh) * | 2007-08-17 | 2009-02-18 | 富士通株式会社 | 电路板、形成布线图案的方法及制造电路板的方法 |
US20090104383A1 (en) * | 2006-03-28 | 2009-04-23 | Art Inc. | Transfer Paper for Dry Transfer Printing and Method of Dry Transfer Printing with the Same |
CN101755237A (zh) * | 2006-12-05 | 2010-06-23 | 纳诺泰拉公司 | 使表面形成图案的方法 |
US20110151665A1 (en) * | 2008-06-24 | 2011-06-23 | Hanan Gothati | Method for non-contact materials deposition |
US20130176699A1 (en) * | 2010-06-11 | 2013-07-11 | Dzp Technologies Limited | Method and apparatus for deposition |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2231614C3 (de) | 1972-06-28 | 1981-02-12 | Du Pont De Nemours (Deutschland) Gmbh, 4000 Duesseldorf | Verfahren zur Herstellung gedruckter Schaltungen unter Verwendung eines Photopolymers als Maske sowie einer leitfähigen Paste als Stromleiter und Vorrichtungen zur Durchführung des Verfahrens |
US7765949B2 (en) | 2005-11-17 | 2010-08-03 | Palo Alto Research Center Incorporated | Extrusion/dispensing systems and methods |
EP3290522A1 (en) * | 2007-10-31 | 2018-03-07 | Roche Diabetes Care GmbH | Electrical patterns for biosensor and method of making |
-
2015
- 2015-03-11 CN CN201580009162.4A patent/CN106457299B/zh active Active
- 2015-03-11 EP EP15764869.2A patent/EP3119531A4/en not_active Withdrawn
- 2015-03-11 WO PCT/IL2015/000013 patent/WO2015140775A1/en active Application Filing
- 2015-03-11 US US15/122,922 patent/US9750141B2/en active Active
-
2016
- 2016-08-10 IL IL247202A patent/IL247202B/en unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5362513A (en) * | 1990-05-10 | 1994-11-08 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a pattern of conductive fine-line films and setting ink used for the same |
US20010029665A1 (en) * | 2000-03-16 | 2001-10-18 | Akira Hashimoto | Method of manufacturing ceramic thick-film printed circuit board |
CN1791472A (zh) * | 2003-05-19 | 2006-06-21 | 太阳油墨股份有限公司 | 浮凸图像的形成方法及其图案形成物 |
US20090104383A1 (en) * | 2006-03-28 | 2009-04-23 | Art Inc. | Transfer Paper for Dry Transfer Printing and Method of Dry Transfer Printing with the Same |
CN101193499A (zh) * | 2006-11-29 | 2008-06-04 | 精工爱普生株式会社 | 图案形成方法、液滴喷出装置及电路基板 |
CN101755237A (zh) * | 2006-12-05 | 2010-06-23 | 纳诺泰拉公司 | 使表面形成图案的方法 |
CN101370358A (zh) * | 2007-08-17 | 2009-02-18 | 富士通株式会社 | 电路板、形成布线图案的方法及制造电路板的方法 |
US20110151665A1 (en) * | 2008-06-24 | 2011-06-23 | Hanan Gothati | Method for non-contact materials deposition |
US20130176699A1 (en) * | 2010-06-11 | 2013-07-11 | Dzp Technologies Limited | Method and apparatus for deposition |
Non-Patent Citations (1)
Title |
---|
JIWEN WANG: "Three-Dimensional Printing of Interconnects by Laser Direct-Write of siliver Nanopastes", 《ADVANCED MATERIALS》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110444335A (zh) * | 2018-05-03 | 2019-11-12 | 深圳光启尖端技术有限责任公司 | 非均匀电损耗超材料及其制备方法 |
CN113130672A (zh) * | 2021-02-24 | 2021-07-16 | 泰州隆基乐叶光伏科技有限公司 | 一种太阳能电池及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20170071062A1 (en) | 2017-03-09 |
US9750141B2 (en) | 2017-08-29 |
WO2015140775A1 (en) | 2015-09-24 |
EP3119531A1 (en) | 2017-01-25 |
IL247202A0 (en) | 2016-09-29 |
CN106457299B (zh) | 2020-01-03 |
EP3119531A4 (en) | 2018-01-17 |
IL247202B (en) | 2022-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200813 Address after: No.3 workshop, optical storage Park, Wuhan High Tech State Holding Group Co., Ltd., No.5, huashiyuan 2nd Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: WUHAN DR LASER TECHNOLOGY Co.,Ltd. Address before: Israel javne Patentee before: UTILIGHT Ltd. |
|
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 88 Jiulonghu Street, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430000 Patentee after: WUHAN DR LASER TECHNOLOGY Co.,Ltd. Address before: 430223 No.3 Factory building, optical storage Park, Wuhan Hi Tech State Holding Group Co., Ltd., No.5, huashiyuan 2nd Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee before: WUHAN DR LASER TECHNOLOGY Co.,Ltd. |