CN106455351A - Adhesive removing effect evaluation method - Google Patents
Adhesive removing effect evaluation method Download PDFInfo
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- CN106455351A CN106455351A CN201610937114.8A CN201610937114A CN106455351A CN 106455351 A CN106455351 A CN 106455351A CN 201610937114 A CN201610937114 A CN 201610937114A CN 106455351 A CN106455351 A CN 106455351A
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- length
- pcb
- removing glue
- standard
- liquid medicine
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
Abstract
The invention discloses an adhesive removing effect evaluation method. The adhesive removing effect is evaluated according to the length of a halo, and the length of the halo obtained after adhesive removing is measured; the larger the length of the halo is, the poorer the adhesive removing effect is; the smaller the length of the halo is, the better the adhesive removing effect is. According to the adhesive removing effect evaluation method, the adhesive removing effect can be effectively evaluated, and the CAF resistance of a PCB obtained after adhesive removing is achieved.
Description
Technical field
The present invention relates to printed-board technology field, more particularly to a kind of removing glue effect evaluation method.
Background technology
Printed circuit board (PCB) (Printed Circuit Board, PCB) is important electronic unit, is electronic devices and components
Supporter, is the carrier of electronic devices and components electrical connection.As it is made using electron printing, therefore it is referred to as printing electricity
Road plate.
Conductive anodic silk (Conductive Anodic Filasentation, CAF) be can cause electric short circuit or
The by-product of the electrochemical corrosion course of open circuit.The anode being usually expressed as from circuit dissipates out, along glass and epoxy
Between interface surface towards cathode direction migrate, formed electric conductivity filament thing.The generation of CAF can cause two adjacent conductors
Between decreasing insulating even cause short circuit, so that PCB product is failed.PCB resists the performance of CAF generation and is called PCB's
Resistance to CAF.
Except glue process is the one procedure of removal hole wall glue residue in PCB manufacture process, except glue process mainly adopts removing glue medicine
Resin glue residue on PCB is removed by water.Except glue process is except removing the glue residue on PCB, long and narrow swooning can be also left on PCB
Circle, destroys the internal structure of PCB.Through the PCB of removing glue, its resistance to CAF often reduces.In industry, removing glue effect is evaluated at present
Leading indicator be that removing glue stings erosion amount, i.e. the quality of the resin glue residue that liquid medicine is removed.Before and after removing glue, the quality difference value of PCB is exactly this
The removing glue of liquid medicine stings erosion amount.It is generally believed that removing glue is stung, the big removing glue effect of erosion amount is all right, and its resistance to CAF is just poor.
But in actual production process, the resistance to CAF difference that removing glue stings erosion amount two pieces of PCB of identical is frequently found, is had
When removing glue even occurs, and to sting the little PCB of erosion amount poorer than the resistance to CAF that removing glue stings the big PCB of erosion amount.Accordingly, it would be desirable to seek again one
The method for evaluating removing glue effect is planted, to embody the relatedness of removing glue effect and resistance to CAF.
Content of the invention
It is an object of the present invention to：A kind of removing glue effect evaluation method is provided, which can effectively assess removing glue effect
Really, the relatedness of removing glue effect and the resistance to CAF of PCB is embodied.
For reaching this purpose, the present invention is employed the following technical solutions：
A kind of removing glue effect evaluation method, after removing glue is carried out to PCB, using the haloing length assessment removing glue effect on PCB
Really.
Specifically, except glue process is while except desmear, liquid medicine can be also saturated with the sheet material of PCB along organdy,
Damage sheet material and haloing is formed on sheet material.In process of production, it is found that the size of haloing is direct with the resistance to CAF of PCB product
Correlation, assesses the important indicator of PCB quality before can becoming PCB shipment.According to the appraisal procedure for stinging erosion amount at present to removing glue,
Can assess liquid medicine remove glue quantity number, it is impossible to the power of the resistance to CAF of PCB after accurate evaluation removing glue.Therefore, traditional
In removing glue effect evaluation method, only erosion amount is stung as the evaluation index of removing glue effect using removing glue, this lose biased because removing
Erosion amount of glue stinging can only embody removing glue or the quality of glue residue is how many, can not embody the resistance to CAF performance of PCB after removing glue.Institute
Removing glue effect except glue process is evaluated with the technical program by haloing length, simple direct, moreover it is possible to after assessing PCB removing glue
The power of resistance to CAF, fully demonstrates the relatedness of removing glue effect and the resistance to CAF of PCB.
As one kind preferred embodiment, the haloing length after removing glue is measured；The haloing length is longer, its removing glue effect
Fruit is poorer；The haloing length is shorter, and its removing glue effect is better.
Specifically, comprise the following steps：
Haloing length after measurement removing glue；
Judge the haloing length whether less than the limiting length being pre-designed：
If so, then judge that removing glue effect is qualified；
If it is not, then judging that removing glue effect is unqualified.
Wherein, limiting length is length of the PCB in corresponding PCB haloing length under the lower limit state of value of its resistance to CAF performance
Angle value.
As one kind preferred embodiment, the removing glue after also including to measure removing glue stings erosion amount；The removing glue is stung erosion amount and is got over
Little, its removing glue effect is poorer, and the removing glue stings that erosion amount is bigger, and its removing glue effect is better.
Erosion amount is stung by measurement haloing length and removing glue respectively, it is possible to which respectively obtain assessment removing glue effect two are most heavy
Want index：Resistance to CAF and adhesive removing amount.Haloing length is shorter, removing glue stings that erosion amount is bigger, its resistance to CAF is better, adhesive removing amount more
Greatly, overall removing glue effect is better.Haloing length is longer, removing glue stings that erosion amount is less, its resistance to CAF is poorer, adhesive removing amount more
Few, overall removing glue effect is poorer.
Preferred embodiment using identical standard liquid medicine, removing glue is carried out to different PCB to be measured as a kind of, according to
Haloing length per block on PCB to be measured evaluates removing glue adaptability of each piece of PCB to be measured to the standard liquid medicine；
Further, the PCB to be measured after removing glue is ranked up from long to short according to haloing length, sorts preceding to be measured
The removing glue bad adaptability of PCB, the removing glue adaptability of the posterior PCB to be measured that sorts is good；
Or, the PCB to be measured after removing glue is ranked up from length is short to according to haloing length, sort preceding PCB to be measured
Removing glue adaptability good, the removing glue bad adaptability of the posterior PCB to be measured of sorting.
Removing glue is carried out using the identical standard liquid medicine PCB to be measured different to polylith, according to the haloing on the PCB to be measured per block
Length is conducive to quickly picking out removing glue from polylith PCB to be measured and fits carrying out removing glue adaptability sequence to each piece of PCB to be measured
Answering property is preferably or worst PCB to be measured.
Removing glue being carried out preferred embodiment to the first standard PCB using standard liquid medicine as a kind of, measures the first standard
Haloing length on PCB, is designated as full-length；Removing glue is carried out to PCB to be checked using standard liquid medicine, measure dizzy on PCB to be checked
Circle length, is designated as the first length to be checked；Standard of comparison length and the length of the first length to be checked, if the first length to be checked compares standard
Length is long, then the removing glue adaptability of PCB to be checked is poorer than the first standard PCB；If the first length to be checked is shorter than full-length, to be checked
The removing glue adaptability of PCB is stronger than the first standard PCB.
First measurement standard liquid medicine carries out the haloing length that removing glue is obtained to standard PCB, using this as full-length.Then will
Subsequent production or sampling PCB to be checked out carries out removing glue with the effect of standard liquid medicine, measures its haloing length, obtains first and treat
Inspection length, the first length to be checked is compared with full-length, quickly judges whether PCB to be checked is qualified products.
Preferred embodiment using different liquid medicine to be measured, removing glue is carried out to identical standard PCB as a kind of, according to
Removing glue performance of each liquid medicine to be measured to standard PCB is evaluated per the haloing length in block standard PCB.
Further, standard PCB after removing glue is ranked up from long to short according to haloing length, sort preceding standard
The removing glue poor performance of the corresponding liquid medicine to be measured of PCB, the removing glue performance of the corresponding liquid medicine to be measured of posterior standard PCB that sorts is good；
Or, standard PCB after removing glue is ranked up from length is short to according to haloing length, sort preceding standard PCB
The removing glue performance of corresponding liquid medicine to be measured is good, the removing glue poor performance of the corresponding liquid medicine to be measured of posterior standard PCB that sorts.
Removing glue is carried out to polylith identical standard PCB using different liquid medicine to be measured, every kind of liquid medicine to be measured is all marked with one piece
Quasi- PCB effect.Removing glue performance ranking being carried out according to per the haloing length in block standard PCB to each liquid medicine to be measured, is conducive to fast
Fast picks out removing glue performance preferably or worst liquid medicine to be measured from multiple liquid medicine to be measured.
Removing glue being carried out preferred embodiment to the first standard PCB using standard liquid medicine as a kind of, measures the first standard
Haloing length on PCB, is designated as full-length；Carried out with first the second standard PCB of standard PCB identical using liquid medicine pair to be checked
Removing glue, measures the haloing length in the second standard PCB, is designated as the second length to be checked；Standard of comparison length and the second length to be checked
Length, if the second length to be checked is longer than full-length, the removing glue performance of liquid medicine to be checked is poorer than standard liquid medicine；If second is to be checked
Length is shorter than full-length, then the removing glue performance of liquid medicine to be checked is stronger than standard liquid medicine.
First measurement standard liquid medicine carries out the haloing length that removing glue is obtained to standard PCB, using this as full-length.Then will
Subsequent production or sampling liquid medicine to be checked out carries out removing glue with the effect of standard PCB, measures its haloing length, obtains second and treat
Inspection length, the second length to be checked is compared with full-length, quickly judges whether liquid medicine to be checked is qualified products.
As one kind preferred embodiment, adhesive process being removed by first, using standard liquid medicine, the first standard PCB is carried out
Removing glue, measures the haloing length in the first standard PCB, is designated as full-length；Adhesive process is removed by second, using standard liquid medicine pair
Removing glue is carried out with first the second standard PCB of standard PCB identical, the haloing length in the second standard PCB is measured, is designated as the 3rd and treats
Inspection length；Standard of comparison length and the length of the 3rd length to be checked, if the 3rd length to be checked is longer than full-length, the second removing glue
The removing glue effect of technique is than first except adhesive process is poor；If the 3rd length to be checked is shorter than full-length, the second removing except adhesive process
Glue effect is than first except adhesive process is strong.
First measurement removes adhesive process by first, carries out, with standard liquid medicine, the haloing length that removing glue is obtained to standard PCB, by this
As full-length.Then measurement removes adhesive process by second, carries out the haloing that removing glue obtains to standard PCB with standard liquid medicine long
Degree, using this as the 3rd length to be checked, the 3rd length to be checked is compared with full-length, quickly judges that first removes adhesive process and the
Two except the quality of adhesive process.
Beneficial effects of the present invention are：A kind of appraisal procedure of removing glue effect is provided, is removed by using the assessment of haloing length
Glue effect, measures the haloing length after removing glue, and the haloing length is longer, and its removing glue effect is poorer, and the haloing length is shorter,
Its removing glue effect is better, and effectively assessment removing glue effect, embodies the resistance to CAF after PCB removing glue.
Description of the drawings
Below according to drawings and Examples, the present invention is described in further detail.
Fig. 1 is the appraisal procedure block diagram described in embodiment one；
Fig. 2 is the appraisal procedure block diagram described in embodiment two；
Fig. 3 is the appraisal procedure block diagram described in embodiment three；
Fig. 4 is the appraisal procedure block diagram described in example IV；
Fig. 5 is the appraisal procedure block diagram described in embodiment five.
Specific embodiment
Technical scheme is further illustrated below in conjunction with the accompanying drawings and by specific embodiment.
Embodiment one
In the present embodiment, there are three pieces of PCB to be measured, the respectively first PCB to be measured, the second PCB to be measured and the 3rd PCB to be measured,
A kind of existing standard liquid medicine, needs to consider removing glue adaptability power of three pieces of PCB to be measured to the standard liquid medicine.
Respectively the effect of the first PCB to be measured, the second PCB to be measured and the 3rd PCB to be measured and standard liquid medicine is carried out removing glue, removing glue
Afterwards, the haloing length that is observed on the first PCB to be measured of measurement, the second PCB to be measured and the 3rd PCB to be measured by Sectioning, is remembered respectively
For a PCB haloing length, the 2nd PCB haloing length and the 3rd PCB haloing length.A relatively PCB haloing length, second
PCB haloing length and the length of the 3rd PCB haloing length, obtain a PCB haloing length more than the 2nd PCB haloing length, the
Two PCB haloing length be more than the 3rd PCB haloing length, then can it is concluded that：Adaptation of first PCB to be measured to the standard liquid medicine
Property is worst, and resistance to CAF is worst；Second PCB to be measured is medium to the adaptability of the standard liquid medicine, and resistance to CAF is medium；3rd is to be measured
PCB is best to the adaptability of the standard liquid medicine, and resistance to CAF is best.The 3rd PCB to be measured should be selected as required product.
It is appreciated that this method can be applicable to compare two pieces, even four pieces the removing glue adaptabilities of more PCB to be measured
Strong and weak and resistance to CAF power.
By above appraisal procedure, removing glue adaptability that can quickly to multiple PCB to be measured and resistance to CAF carry out contrast and comment
Estimate sequence, quickness and high efficiency.
Embodiment two
There are three pieces of PCB to be checked, now need the removing glue adaptability of the PCB to be checked per block is estimated, investigate per block PCB to be checked
Whether qualified.First take standard liquid medicine to act in qualified standard PCB, carry out except glue process.After removing glue, on measurement standard PCB
Haloing length, be designated as full-length.
Then the first PCB to be checked is taken from PCB to be checked, standard liquid medicine is acted on first PCB to be checked, carries out removing glue
Operation.The haloing length of first PCB to be checked after removing glue, is measured, is designated as the first length to be checked.
If the first length to be checked is longer than full-length, the removing glue adaptability of the first PCB to be checked does not reach standard, be not
Qualified PCB；If the first length to be checked is shorter than full-length, the removing glue conformability of the first PCB to be checked reaches standard,
For qualified PCB.
Then, the second PCB to be checked is taken from PCB to be checked, repeats operation and the appraisal procedure of above PCB to be checked to first,
Until three pieces of PCB assessments to be checked are finished.
By above appraisal procedure, qualified products can be made whether successively to each PCB product or whether be to reach
Mark product is judged, simple and convenient quick.
Embodiment three
In the present embodiment, there are three kinds of liquid medicine to be measured, the respectively first liquid medicine to be measured, the second liquid medicine to be measured and the 3rd medicine to be measured
Water, a kind of existing standard PCB, need to consider removing glue performance power of the three kinds of liquid medicine to be measured of contrast to standard PCB.
Respectively the first liquid medicine to be measured, the second liquid medicine to be measured and the 3rd liquid medicine to be measured are respectively carried out with one piece of standard PCB effect
Removing glue.After removing glue, the first liquid medicine to be measured of measurement, the second liquid medicine to be measured and the corresponding mark of the 3rd liquid medicine to be measured are observed by Sectioning
Haloing length on quasi- PCB, is designated as the first liquid medicine haloing length, the second liquid medicine haloing length and the 3rd liquid medicine haloing long respectively
Degree.Compare the length of the first liquid medicine haloing length, the second liquid medicine haloing length and the 3rd liquid medicine haloing length, obtain the first liquid medicine
Haloing length is more than the second liquid medicine haloing length, and the second liquid medicine haloing length is more than the 3rd liquid medicine haloing length, then can obtain
Conclusion：First liquid medicine to be measured is worst to the removing glue performance of standard PCB, and the resistance to CAF of the PCB for obtaining after removing glue is worst；Second
Liquid medicine to be measured is medium to the removing glue performance of standard PCB, and the resistance to CAF of the PCB for obtaining after removing glue is medium；3rd liquid medicine pair to be measured
The removing glue performance of standard PCB is best, and the resistance to CAF of the PCB for obtaining after removing glue is best.The 3rd liquid medicine conduct to be measured should be selected
Required product.
It is appreciated that this method can be applicable to compare two kinds, four kinds, even more liquid medicine to be measured is mutual removes
Colloidality can be strong and weak.
Additionally, the present embodiment can also be corresponded in the first liquid medicine to be measured of contrast, the second liquid medicine to be measured and the 3rd liquid medicine to be measured
Standard PCB haloing length after, continue removing glue of corresponding standard PCB of three kinds of glue of contrast before and after removing glue and sting erosion amount, note
Sting for the first removing glue that erosion amount, the second removing glue sting erosion amount and the 3rd removing glue stings erosion amount.Relatively obtaining the 3rd removing glue erosion amount is stung more than the
Two removing glues sting erosion amount, and the second removing glue is stung erosion amount and stings erosion amount more than the first removing glue, then the adhesive removing amount of the 3rd liquid medicine to be measured of explanation is more than
The adhesive removing amount of the second liquid medicine to be measured, the adhesive removing amount of the second liquid medicine to be measured is more than the adhesive removing amount of the first liquid medicine to be measured.In conjunction with right above
The comparison of the first haloing length, the second haloing length and the 3rd haloing length, it should select the 3rd liquid medicine to be measured as required product
Product.
By the appraisal procedure of the present embodiment, quickly the removing glue performance of multiple liquid medicine to be measured can be carried out comparative evaluation and
Sequence, quickness and high efficiency.
Example IV
There are three kinds of liquid medicine to be checked, now need the removing glue effect of every kind of liquid medicine to be checked is estimated, see various liquid medicine to be checked
Whether qualified.First take qualified standard liquid medicine to act in standard PCB, carry out except glue process.After removing glue, on measurement standard PCB
Haloing length, be designated as full-length.
Then take the first liquid medicine to be checked to act in another piece of standard PCB, carry out except glue process.After removing glue, the mark is measured
The haloing length of quasi- PCB, is designated as the second length to be checked.
If the second length to be checked is longer than full-length, the removing glue effect of the first liquid medicine to be checked does not reach standard, be not
Qualified liquid medicine；If the second length to be checked is shorter than full-length, the removing glue effect of the first liquid medicine to be checked can reach standard, be conjunction
Lattice liquid medicine.
Then, the second liquid medicine to be checked is taken, repeats above operation and appraisal procedure to the first liquid medicine to be checked, until three kinds
Liquid medicine assessment to be checked is finished.
By above appraisal procedure, qualified products can be made whether successively to each liquid medicine to be checked or whether be to reach
Mark product is judged, simple and convenient quick.
Embodiment five
Existing first removes adhesive process except adhesive process and second, needs to contrast the removing glue effect quality of two techniques.
First is first passed through except adhesive process, carry out removing glue to the first standard PCB using standard liquid medicine, measure the first standard PCB
On haloing length, be designated as full-length；Then by second, adhesive process is removed, using standard liquid medicine pair and the first standard PCB phase
The second same standard PCB carries out removing glue, measures the haloing length in the second standard PCB, is designated as the 3rd length to be checked；
Standard of comparison length and the length of the 3rd length to be checked, if the 3rd length to be checked is longer than full-length, second removes
The removing glue effect of adhesive process is than first except adhesive process is poor；If the 3rd length to be checked is shorter than full-length, second except adhesive process
Removing glue effect is than first except adhesive process is strong.
It is appreciated that such appraisal procedure is readily adaptable for use in three kinds, four kinds even more removing to enter between adhesive process
The comparative evaluation of row removing glue effect.
By the assessment control methods of the present embodiment, can be with various after the multiple qualities except adhesive process of rapid comparison and removing glue
Resistance to CAF power except the corresponding PCB of adhesive process.
" first ", " second ", " 3rd " herein is just for the sake of being distinguish between in description, and not special contains
Justice.
It is to be understood that, above-mentioned specific embodiment is only presently preferred embodiments of the present invention and institute's application technology original
Reason, in technical scope disclosed in this invention, change that any those familiar with the art is readily apparent that or
Replace, should all cover within the scope of the present invention.
Claims (10)
1. a kind of removing glue effect evaluation method, it is characterised in that after removing glue is carried out to PCB, commented using the haloing length on PCB
Estimate removing glue effect.
2. removing glue effect evaluation method according to claim 1, it is characterised in that：
Haloing length after measurement removing glue；
The haloing length is longer, and its removing glue effect is poorer；
The haloing length is shorter, and its removing glue effect is better.
3. removing glue effect evaluation method according to claim 1, it is characterised in that the removing glue after also including to measure removing glue is stung
Erosion amount；The removing glue stings that erosion amount is less, and its removing glue effect is poorer, and the removing glue stings that erosion amount is bigger, and its removing glue effect is better.
4. the removing glue effect evaluation method according to claim 1 or 3, it is characterised in that：
Using identical standard liquid medicine, removing glue is carried out to different PCB to be measured, according to the haloing per block on PCB to be measured after removing glue
Length evaluates removing glue adaptability of each piece of PCB to be measured to the standard liquid medicine.
5. removing glue effect evaluation method according to claim 4, it is characterised in that by the PCB to be measured after removing glue according to dizzy
Circle length is ranked up from long to short, the removing glue bad adaptability of the preceding PCB to be measured that sorts, and the posterior PCB to be measured that sorts is removed
Glue adaptability is good；
Or, the PCB to be measured after removing glue is ranked up from length is short to according to haloing length, the preceding PCB to be measured that sorts is removed
Glue adaptability is good, the removing glue bad adaptability of the posterior PCB to be measured that sorts.
6. removing glue effect evaluation method according to claim 1, it is characterised in that：
Removing glue is carried out to the first standard PCB using standard liquid medicine, the haloing length in the first standard PCB is measured, is designated as standard long
Degree；
Removing glue is carried out to PCB to be checked using standard liquid medicine, the haloing length on PCB to be checked is measured, is designated as the first length to be checked；
Standard of comparison length and the length of the first length to be checked, if the first length to be checked is longer than full-length, PCB to be checked is removed
Glue adaptability is poorer than the first standard PCB；If the first length to be checked is shorter than full-length, the removing glue adaptability of PCB to be checked compares
One standard PCB is strong.
7. the removing glue effect evaluation method according to claim 1 or 3, it is characterised in that：
Using different liquid medicine to be measured, removing glue is carried out to identical standard PCB, according to per the haloing in block standard PCB after removing glue
Length evaluates removing glue performance of each liquid medicine to be measured to standard PCB.
8. removing glue effect evaluation method according to claim 7, it is characterised in that by standard PCB after removing glue according to dizzy
Circle length is ranked up from long to short, the removing glue poor performance of the corresponding liquid medicine to be measured of preceding standard PCB that sorts, and is sorted posterior
The removing glue performance of the corresponding liquid medicine to be measured of standard PCB is good；
Or, standard PCB after removing glue is ranked up from length is short to according to haloing length, preceding standard PCB that sorts is corresponded to
Liquid medicine to be measured removing glue performance good, the removing glue poor performance of the corresponding liquid medicine to be measured of posterior standard PCB of sorting.
9. removing glue effect evaluation method according to claim 1, it is characterised in that
Removing glue is carried out to the first standard PCB using standard liquid medicine, the haloing length in the first standard PCB is measured, is designated as standard long
Degree；
Removing glue is carried out using liquid medicine pair to be checked and first the second standard PCB of standard PCB identical, in the second standard PCB of measurement
Haloing length, is designated as the second length to be checked；
Standard of comparison length and the length of the second length to be checked, if the second length to be checked is longer than full-length, liquid medicine to be checked
Removing glue performance is poorer than standard liquid medicine；If the second length to be checked is shorter than full-length, the removing glue performance of liquid medicine to be checked is than standard medicine
Water is strong.
10. removing glue effect evaluation method according to claim 1, it is characterised in that
Adhesive process is removed by first, carry out removing glue to the first standard PCB using standard liquid medicine, measure dizzy in the first standard PCB
Circle length, is designated as full-length；
Adhesive process being removed by second, removing glue is carried out using standard liquid medicine pair and first the second standard PCB of standard PCB identical, surveys
Haloing length in two standard PCB of flow control, is designated as the 3rd length to be checked；
Standard of comparison length and the length of the 3rd length to be checked, if the 3rd length to be checked is longer than full-length, the second removing glue work
The removing glue effect of skill is than first except adhesive process is poor；If the 3rd length to be checked is shorter than full-length, second except the removing glue of adhesive process
Effect is than first except adhesive process is strong.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610937114.8A CN106455351A (en) | 2016-11-01 | 2016-11-01 | Adhesive removing effect evaluation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610937114.8A CN106455351A (en) | 2016-11-01 | 2016-11-01 | Adhesive removing effect evaluation method |
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| Publication Number | Publication Date |
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| CN106455351A true CN106455351A (en) | 2017-02-22 |
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| CN201610937114.8A Pending CN106455351A (en) | 2016-11-01 | 2016-11-01 | Adhesive removing effect evaluation method |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120231154A1 (en) * | 2011-03-11 | 2012-09-13 | Wen-Hsiung Liao | Ceramic device and method for fabricating the same |
| CN103118485A (en) * | 2013-01-25 | 2013-05-22 | 广东生益科技股份有限公司 | Printed circuit board for testing electric-resistant chemical migration performances |
| CN105823704A (en) * | 2016-03-21 | 2016-08-03 | 东莞美维电路有限公司 | Method for testing PCB adhesive removing uniformity |
-
2016
- 2016-11-01 CN CN201610937114.8A patent/CN106455351A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120231154A1 (en) * | 2011-03-11 | 2012-09-13 | Wen-Hsiung Liao | Ceramic device and method for fabricating the same |
| CN103118485A (en) * | 2013-01-25 | 2013-05-22 | 广东生益科技股份有限公司 | Printed circuit board for testing electric-resistant chemical migration performances |
| CN105823704A (en) * | 2016-03-21 | 2016-08-03 | 东莞美维电路有限公司 | Method for testing PCB adhesive removing uniformity |
Non-Patent Citations (1)
| Title |
|---|
| 杨乐 等: "PCB"晕圈"影响因素", 《第十五届中国覆铜板技术•市场研讨会暨覆铜板产业协同创新国际论坛论文集》 * |
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