CN106449557B - Semiconductor heat-dissipating sheet devices and the encapsulating structure for using the cooling fin - Google Patents
Semiconductor heat-dissipating sheet devices and the encapsulating structure for using the cooling fin Download PDFInfo
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- CN106449557B CN106449557B CN201510491875.0A CN201510491875A CN106449557B CN 106449557 B CN106449557 B CN 106449557B CN 201510491875 A CN201510491875 A CN 201510491875A CN 106449557 B CN106449557 B CN 106449557B
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- cooling fin
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- semiconductor substrate
- ontology
- encapsulating structure
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Abstract
It suitable for being arranged on the semiconductor substrate that one has plural locating piece, and include complex cooling fin and a positioning framework the invention discloses a kind of semiconductor heat-dissipating sheet devices and using the encapsulating structure of the cooling fin.Each cooling fin is generally in quadrangle and arranges at array, and the Cutting Road of the ontology periphery is enclosed including an ontology and a frame, has plural first through hole on the Cutting Road, and first through hole of plural number is set on four corners of the ontology of corresponding cooling fin.The positioning framework encloses the complex cooling fin and the plural number Cutting Road frame in interior, and including plural number location hole corresponding with the locating piece.
Description
Technical field
The present invention particularly relates to one kind and sets in relation to a kind of semiconductor heat-dissipating sheet devices and using the encapsulating structure of the cooling fin
Set the radiator fin device and encapsulating structure on the semiconductor substrate that there is plural locating piece one.
Background technique
With the continuous advancement of manufacture of semiconductor, semiconductor chip be widely used in laptop, tablet computer,
On the electronic products such as digital camera and smartphone, consumer is more and more harsh for the promotion of efficiency in recent years, leads to electricity
Calorific value caused by sub-component and opposite heat flow are also higher and higher, on the other hand, for the appearance also direction of electronic device
Gently, thin, short, small designer trends, the design direction of such extreme compression space, the heat dissipation for the semiconductor that more seems it is important
Property.
Since generated high fever will have a direct impact on the finger of the semiconductor chip to the semiconductor chip in calculating process
The period is enabled, therefore, industry is covered in the top surface of the semiconductor chip usually with a cooling fin, and is incorporated on circuit board and fixes,
It is in contact using the cooling fin with the semiconductor chip, generated heat source is scattered using increasing when which is operated
The mode of heat area conducts, and as the excessive problem of the semiconductor chip calorific value is alleviated, on the one hand allows the semiconductor core
Piece can operation at normal working temperature, on the other hand, can also reduce high temperature to damage caused by the semiconductor chip.
In addition, the volume when electronic product is more and more small, cooling fin made of used semiconductor chip and the metal
Volume also need more to contract it is smaller, in this way, which the semiconductor chip and the cooling fin is not only caused to weld in the scolding tin of packaging operation
Degree of difficulty in conjunction or chimeric operation, the gap between the semiconductor chip and the cooling fin is also more and more small, careless slightly, just
Meeting causes so that cooling fin made of metal and the semiconductor chip generate improper contact and short-circuit or exterior static interference
The semiconductor chip breaks down, and reduces the encapsulation yield of the semiconductor chip.
Furthermore since general cooling fin processing procedure is usually after continuous punch forming, then cut into blocks of independent
Cooling fin, and during cutting, because cooling fin made of metal material has ductility, so can be generated during cutting
Flash, and the flash is to comply with the direction cut to generate, and the cooling fin can be made not meet factory specifications and lead if not repairing Burr removal
It causes to return goods, therefore the flash of each cooling fin periphery must be repaired and removed using one of integer formality, in this way, will make to add
Work process is more many and diverse, improves production cost.
Therefore, how in the case of the cooling fin and the semiconductor chip gradually microminiaturization, the semiconductor still can be improved
The factory yield of cooling fin, and increase the effect in conjunction with semiconductor chip simultaneously, it is produced into reaching raising efficiency with reduction
This double goal, it is quite worth to be expected to for the semiconductor industry for time preciousness of seizing every minute and second.
Summary of the invention
In view of this, a purpose of the invention, is to provide a kind of semiconductor heat-dissipating sheet devices, have suitable for being arranged one
It on the semiconductor substrate of plural locating piece, and include complex cooling fin and a positioning framework.
Another object of the present invention is to provide a kind of encapsulating structure, which leads comprising semiconductor substrate, half
Body chip, a cooling fin and a packing colloid.
In order to achieve the above object, the present invention provides a kind of semiconductor heat-dissipating sheet devices, have suitable for being arranged one
On the semiconductor substrate of a plurality of locating pieces, and Bao Han ︰
A plurality of cooling fins, each cooling fin is generally in quadrangle and arranges at array, and encloses this including an ontology and a frame
The Cutting Road of ontology periphery has a plurality of first through holes on the Cutting Road, and respectively first through hole be set to pair
It answers on four corners of the ontology of cooling fin；And
One positioning framework encloses the respectively cooling fin and the respectively Cutting Road frame in interior, and including a plurality of with the locating piece pair
The location hole answered.
Further, wherein each cooling fin further includes a upper surface and an opposite lower surface, which has one
The coat of metal, and the lower surface has an insulation adhesion layer.
Further, wherein be formed with a recessed portion at the upper surface center, which corresponds to the recessed portion and be formed with
One protrusion.
Further, wherein it is around ontology periphery setting and prominent toward the direction of the upper surface that the cooling fin further includes one
The prominent wall stretched.
Further, wherein the material of the coat of metal is nickel, chromium or combinations thereof, and the material of the insulation adhesion layer is
Epoxy resin.
Further, wherein the shape of first through hole is cross aspect.
Further, wherein the positioning framework has further included a plurality of second through holes, and second through hole is also and respectively
The cooling fin connects and is T font aspect.
The present invention also provides a kind of encapsulating structures, are used in above-described semiconductor heat-dissipating piece , Bao Han ︰
Semiconductor substrate；
Semiconductor chip is set on the semiconductor substrate；
One cooling fin, including the opposite lower surface in a upper surface and one, which has a coat of metal, and the following table
Face has an insulation adhesion layer, is formed with a recessed portion at the upper surface center, which corresponds to the recessed portion and be formed with one
Protrusion, and the aspect of a central concave peripheral projection is formed, and the cooling fin matches with the semiconductor substrate and defines one
Encapsulated space；And
One packing colloid is filled in the encapsulated space, to stick together the semiconductor chip, the semiconductor substrate and this dissipate
The insulation adhesion layer of backing.
Further, wherein the encapsulating structure further includes a plurality of connection semiconductor substrates and the semiconductor chip
Metal contact wires.
Further, wherein it is around ontology periphery setting and prominent toward the direction of the upper surface that the cooling fin further includes one
The prominent wall stretched, and the semiconductor chip is to be located in the encapsulated space and be located at below the protrusion.
Beneficial functional of the invention is that the cooling fin forms the state of a central concave peripheral projection by the upper surface
Sample, so that the height of the cooling fin periphery improves, and then reaches and the packing colloid is avoided to overflow and cover the fin surface, and
The encapsulating structure forms a layer structure by the cooling fin, the packing colloid and semiconductor substrate three, can improve and cut
When generated flash phenomenon, and extra flash can be accommodated in the packing colloid layer, to reach simplified processing flow, reduction
The effect of production cost.
Detailed description of the invention
Fig. 1 is a side view diagrammatic cross-section, illustrates the first preferred embodiment of semiconductor heat-dissipating sheet devices of the present invention；
Fig. 2 is a upper schematic diagram, illustrates another visual angle aspect of first preferred embodiment；
Fig. 3 is a side view diagrammatic cross-section, illustrates when the encapsulating structure of semiconductor heat-dissipating sheet devices of the present invention is cut it
Upper and lower cut direction；
Fig. 4 is a side view diagrammatic cross-section, illustrates the preferable implementation of the encapsulating structure of semiconductor heat-dissipating sheet devices of the present invention
Example；And
Fig. 5 is a side view diagrammatic cross-section, illustrates the second preferred embodiment of semiconductor heat-dissipating sheet devices of the present invention.
In figure, 3 semiconductor substrates
31 locating pieces
4 cooling fins
40 encapsulated spaces
41 ontologies
42 Cutting Roads
421 first through holes
43 upper surfaces
431 coats of metal
432 recessed portions
44 lower surfaces
441 insulation adhesion layers
442 protrusions
45 prominent walls
5 positioning frameworks
51 location holes
52 second through holes
6 semiconductor chips
7 packing colloids
8 metal contact wires.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, so that those skilled in the art can be with
It better understands the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
Before being described in detail, it is noted that similar component is indicated with being identically numbered.
Refering to fig. 1,2, first for semiconductor heat-dissipating sheet devices of the present invention and the encapsulating structure for using the cooling fin is preferable
Embodiment, the semiconductor heat-dissipating piece are suitable for being arranged on the semiconductor substrate 3 that one has plural locating piece 31, and include multiple
Number cooling fin 4 and a positioning framework 5.
The difference of the semiconductor substrate 3 according to processing procedure, can be semiconductor package substrate, lead frame or nail frame, no
It should be as limit, since this is to be familiar with well known to related art techniques personage in correlative technology field, therefore be no longer directed to this in this and partly lead
The form of structure base board 3 is added to repeat with aspect.
Each cooling fin 4 is generally arranged in quadrangle and at array, and encloses 41 periphery of ontology including an ontology 41 and a frame
Cutting Road 42, there is plural first through hole 421, and first through hole of plural number 421 is to be set to institute on the Cutting Road 42
On four corners of the ontology 41 of corresponding cooling fin 4.
In the preferred embodiment, which interconnects in a sheet, which is
41 periphery of ontology around the complex cooling fin 4 is arranged, and by the setting of the plural number Cutting Road 42, is cut as with cutter
When baseline, promote the convenience cut.
Each cooling fin 4 further includes a upper surface 43 and an opposite lower surface 44, which has a metal-plated
Layer 431, and the lower surface 44 has an insulation adhesion layer 441.Wherein, it is formed with a recessed portion 432 at 43 center of upper surface,
The corresponding recessed portion 432 in the lower surface 44 is formed with a protrusion 442.
In first preferred embodiment, the material of the complex cooling fin 4 be selected from copper, aluminium, iron, stainless steel or this
Deng combination, the material of the coat of metal 431 is and the material of the insulation adhesion layer 441 selected from nickel, chromium or these combination
It is epoxy resin (epoxy), which is a kind of thermosetting plastics, while having adhesive, the functionality such as coating.
It is noted that the shape of first through hole of plural number 421 is cross aspect, in addition to that can save the heat dissipation
Except the materials'use of piece 4, and can be by the setting of first through hole of plural number 421, to shorten length when cutting.Many institutes are all
Know ground, the longer then stress influence of cutoff length is bigger, and the present invention can shorten cutoff length really, avoid the cooling fin of metal material
4 affected by force and deform.
The positioning framework 5 enclosing the complex cooling fin 4 and 42 frame of plural number Cutting Road in interior, and including plural number with should
The corresponding location hole 51 of locating piece 31 of semiconductor substrate 3, it is fixed to achieve the purpose that, in the preferred embodiment, the plural number
Location hole 51 designs for round hole, and when actual implementation, the shape of the location hole 51 can have many different variations from quantity, no
It should be limited with disclosed in first preferred embodiment.
In addition, the positioning framework 5 has further included plural second through hole 52, and second through hole 52 is also dissipated with the plural number
Backing 4 connects and is T font aspect.In first preferred embodiment, which is to be set to be located to be somebody's turn to do
By the ontology 41 of outermost cooling fin 4, the plural number Cutting Road 42 can be corresponded to using the second through hole of plural number 52 of T font aspect
Cut direction, can equally shorten length when cutting, avoid 4 affected by force of cooling fin of metal material and deform.
Refering to Fig. 3,4, in addition which provides a kind of encapsulation knot using above-mentioned semiconductor heat-dissipating piece 4
Structure, and with QFN(Quad Flat No-leadPackage, leadless packages) for encapsulating structure, to explain.The encapsulation knot
Structure includes semiconductor substrate 3, a cooling fin 4, semiconductor chip 6, a packing colloid 7, and plural metal contact wires 8.
The cooling fin 4 is matched with the semiconductor substrate 3 defines an encapsulated space 40, and including the ontology 41, this cuts
The 42, upper surface 43 and the lower surface 44 are cut, design as shown in earlier figures 1-2, just repeats no more various pieces in this
Detailing.
The semiconductor chip 6 is set on the semiconductor substrate 3, and the semiconductor chip 6 is to be located at the encapsulated space 40
In and be located at 442 lower section of the protrusion.And the plural number metal contact wires 8 are to connect the semiconductor substrate 3 and the semiconductor core
Piece 6.
The assembling flow path of the encapsulating structure under Suo Shu ︰ firstly, the semiconductor chip 6 is connect with the semiconductor substrate 3.
Then, then by 4 positioned at intervals of complex cooling fin in the top of the semiconductor substrate 3.Then, which is filled in
In the encapsulated space 40, so that the packing colloid 7 sticks together the semiconductor chip 6, the semiconductor substrate 3, it is exhausted with the cooling fin 4
Edge adhesion layer 441.Finally, being cut on the basis of the plural number Cutting Road 42 after to the packing colloid 7 completely fixation, cut out
It is the downward partial application in upper surface 43 by the cooling fin 4 when cutting, then from the semiconductor substrate 3 toward the 4 direction partial application of cooling fin
(direction as indicated by the arrows in fig. 3), and then obtain plural encapsulating structure.
It illustrates, during cutting, when cutter is cut, occasional makes cooling fin 4 made by metal material
A little flash is generated with the semiconductor substrate 3, and the direction that cuts for complying with the cutting tool shapes, due to upper and lower direction each one
Knife, so being not necessary to additionally carry out integer and rejecting flash if can be also accommodated in the packing colloid 7 when having the generation of metal flash
Formality, and it is more smooth to make to cut operation, promotes product yield, shortens the overall process time.
Refering to Fig. 5, second for semiconductor heat-dissipating sheet devices of the present invention and the encapsulating structure for using the cooling fin is preferably real
Example is applied, second preferred embodiment is roughly the same with first preferred embodiment, and something in common is repeated no more in this, difference
It is, which further includes a prominent wall 45 around 41 periphery of ontology setting and the direction projection toward the upper surface 43.
Protrusion in second preferred embodiment, by the recessed portion 432 of the upper surface 43, with the lower surface 44
442 is corresponding, formed a central concave and periphery protuberance aspect, while with more one around 41 periphery of ontology be arranged and it is past
The prominent wall 45 of the direction projection of the upper surface 43 designs, and the packing colloid 7 (being not shown in Fig. 5) can be avoided to be spilled over to this really
The upper surface 43 of cooling fin 4, and then the effect of reach adhesive-spill-preventing.
Via above description it is found that semiconductor heat-dissipating sheet devices of the invention and true using the encapsulating structure of the cooling fin 4
It is real to have effects that following enhancement place:
One, avoids the cooling fin 4 from deforming: by the setting of first and second through hole of plural number 421,52, dissipating in addition to saving this
Except the materials'use of backing 4, it can more shorten the length when cooling fin 4 is cut, be answered to avoid the cooling fin 4 of metal material
Power is influenced and is deformed.
Two, prevent excessive glue: the recessed portion 432 of the upper surface 43, corresponding with the protrusion 442 of the lower surface 44, are formed
The aspect of one central concave and periphery protuberance, and the prominent wall 45 is arranged around 41 periphery of ontology, keeps away so can achieve really
Exempt from the packing colloid 7 to overflow and cover the effect to the upper surface 43 of the cooling fin 4.
Three, simple flows shorten processing time: general cooling fin 4 is after the program cut, it is necessary to using together
The flash of 41 periphery of ontology of each cooling fin 4 is repaired and is removed, complies with factory specifications, encapsulation of the invention by integer formality
Structure then passes through the cooling fin 4, the packing colloid 7 and 3 three of the semiconductor substrate and forms a layer structure, and utilization is past back and forth
The secondary mode cut returned, extra a little flash is accommodated in 7 layers of the packing colloid, generated when being cut with improving
Flash phenomenon, and reach simplified processing flow, reduce the effect of production cost.
In conclusion cooling fin 4 of the invention forms the aspect of a central concave peripheral projection by the upper surface 43,
And the prominent wall 45 is arranged around 41 periphery of ontology, so that the height of 4 periphery of cooling fin improves, and then reaches and avoids the encapsulation
Colloid 7 overflows and covers the upper surface 43 of the cooling fin 4, in addition, by the setting of first and second through hole of plural number 421,52,
The length when cooling fin 4 is cut can be shortened, to avoid metal material 4 affected by force of cooling fin and deform, generally speaking,
The encapsulating structure forms a layer structure by the cooling fin 4, the packing colloid 7 and 3 three of the semiconductor substrate, can improve
Generated flash phenomenon when cutting, and extra flash being accommodated in the packing colloid layer, with reach simplified processing flow,
The effect of reducing production cost, therefore can achieve the purpose of the present invention really.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
It encloses without being limited thereto.Those skilled in the art's made equivalent substitute or transformation on the basis of the present invention, in the present invention
Protection scope within.Protection scope of the present invention is subject to claims.
Claims (6)
1. a kind of semiconductor heat-dissipating sheet devices, special suitable for being arranged on a semiconductor substrate with a plurality of locating pieces
Sign is, and Bao Han ︰
A plurality of cooling fins, each cooling fin include a upper surface and an opposite lower surface and are generally in quadrangle and arrange at array
Column further include the Cutting Road that an ontology and a frame enclose the ontology periphery, and having shape on the Cutting Road is answering for cross aspect
Several first through holes, and respectively first through hole is set on four corners of the ontology of corresponding cooling fin；Table on this
A recessed portion is formed at the center of face, and the lower surface corresponds to the recessed portion and is formed with a protrusion；
The cooling fin further includes a prominent wall around ontology periphery setting and the direction projection toward the upper surface；And
One positioning framework encloses the respectively cooling fin and the respectively Cutting Road frame in interior, and including a plurality of corresponding with the locating piece
Location hole, which has further included a plurality of second through holes, and second through hole is also connect simultaneously with the respectively cooling fin
For T font aspect.
2. semiconductor heat-dissipating sheet devices according to claim 1, which is characterized in that wherein, which has a metal
Coating, and the lower surface has an insulation adhesion layer.
3. semiconductor heat-dissipating sheet devices according to claim 2, which is characterized in that wherein, the material of the coat of metal is
Nickel, chromium or combinations thereof, and the material of the insulation adhesion layer is epoxy resin.
4. a kind of encapsulating structure is used in semiconductor heat-dissipating piece of any of claims 1-3, which is characterized in that packet
Han ︰
Semiconductor substrate；
Semiconductor chip is set on the semiconductor substrate；
One cooling fin, including the opposite lower surface in a upper surface and one, which has a coat of metal, and the following table mask
There is an insulation adhesion layer, is formed with a recessed portion at the upper surface center, which corresponds to the recessed portion and be formed with a protrusion
Portion, and the aspect of a central concave peripheral projection is formed, and the cooling fin matches with the semiconductor substrate and defines an encapsulation
Space；And
One packing colloid is filled in the encapsulated space, to stick together the semiconductor chip, the semiconductor substrate and the cooling fin
Insulation adhesion layer.
5. encapsulating structure according to claim 4, which is characterized in that wherein, which further includes a plurality of connections
The metal contact wires of the semiconductor substrate and the semiconductor chip.
6. encapsulating structure according to claim 5, which is characterized in that wherein, which further includes one around the ontology
Periphery is arranged and the prominent wall of the direction projection toward the upper surface, and the semiconductor chip is to be located in the encapsulated space and be located to be somebody's turn to do
Below protrusion.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510491875.0A CN106449557B (en) | 2015-08-12 | 2015-08-12 | Semiconductor heat-dissipating sheet devices and the encapsulating structure for using the cooling fin |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510491875.0A CN106449557B (en) | 2015-08-12 | 2015-08-12 | Semiconductor heat-dissipating sheet devices and the encapsulating structure for using the cooling fin |
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| Publication Number | Publication Date |
|---|---|
| CN106449557A CN106449557A (en) | 2017-02-22 |
| CN106449557B true CN106449557B (en) | 2019-05-31 |
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| US6400014B1 (en) * | 2001-01-13 | 2002-06-04 | Siliconware Precision Industries Co., Ltd. | Semiconductor package with a heat sink |
| CN1549337A (en) * | 2003-05-09 | 2004-11-24 | 华泰电子股份有限公司 | Radiating fin device for preventing radiating fin glue spilling in semi conductor packaging parts |
| CN101211872A (en) * | 2006-12-26 | 2008-07-02 | 矽品精密工业股份有限公司 | Radiation-type semiconductor package member and its used radiation structure |
| CN102064118A (en) * | 2010-11-16 | 2011-05-18 | 日月光半导体制造股份有限公司 | Method and packaging mould for manufacturing semiconductor packaging piece |
| CN103390596A (en) * | 2012-05-09 | 2013-11-13 | 旭宏科技有限公司 | Insulation packaging device of semiconductor and manufacturing method of insulation packaging device |
| TW201431015A (en) * | 2013-01-22 | 2014-08-01 | Uunup Technology Co Ltd | A heat sink for semiconductor wafer device |
-
2015
- 2015-08-12 CN CN201510491875.0A patent/CN106449557B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6400014B1 (en) * | 2001-01-13 | 2002-06-04 | Siliconware Precision Industries Co., Ltd. | Semiconductor package with a heat sink |
| CN1549337A (en) * | 2003-05-09 | 2004-11-24 | 华泰电子股份有限公司 | Radiating fin device for preventing radiating fin glue spilling in semi conductor packaging parts |
| CN101211872A (en) * | 2006-12-26 | 2008-07-02 | 矽品精密工业股份有限公司 | Radiation-type semiconductor package member and its used radiation structure |
| CN102064118A (en) * | 2010-11-16 | 2011-05-18 | 日月光半导体制造股份有限公司 | Method and packaging mould for manufacturing semiconductor packaging piece |
| CN103390596A (en) * | 2012-05-09 | 2013-11-13 | 旭宏科技有限公司 | Insulation packaging device of semiconductor and manufacturing method of insulation packaging device |
| TW201431015A (en) * | 2013-01-22 | 2014-08-01 | Uunup Technology Co Ltd | A heat sink for semiconductor wafer device |
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| CN106449557A (en) | 2017-02-22 |
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