CN106449479A - Unit package body die and precise forming die for chip region exposed package - Google Patents
Unit package body die and precise forming die for chip region exposed package Download PDFInfo
- Publication number
- CN106449479A CN106449479A CN201610873674.1A CN201610873674A CN106449479A CN 106449479 A CN106449479 A CN 106449479A CN 201610873674 A CN201610873674 A CN 201610873674A CN 106449479 A CN106449479 A CN 106449479A
- Authority
- CN
- China
- Prior art keywords
- mould
- unit
- molding assembly
- fixed support
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims description 60
- 238000005538 encapsulation Methods 0.000 claims description 28
- 239000010409 thin film Substances 0.000 claims description 17
- 230000000694 effects Effects 0.000 claims description 14
- 238000010276 construction Methods 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 8
- 239000005022 packaging material Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/34—Auxiliary operations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a unit package body die and precise forming die for chip region exposed package. The unit package body die comprises a fixed support body, wherein a movable forming assembly is embedded into a setting position of the fixed support body, a boss is arranged at one end part of the forming assembly and is used for pressing a chip, and the other end part of the forming assembly is in contact matching with a movable component so that the forming assembly moves in the fixed support body. In the forming die, a plurality of unit package body dies are arranged and are spliced with one another to form a whole, and package and forming of a plurality of exposed chips can be achieved; and each unit package body die is arranged in a split mode, the fixed support body is a support and positioning part for the whole unit package body die, the forming assembly is matched with the chip, the processing difficulty of the unit package body die can be reduced very well, and the processing accuracy is ensured.
Description
Technical field
The invention belongs to technical field of semiconductor chip encapsulation, and in particular to a kind of list for the exposed encapsulation of chip area
Unit's encapsulation mould and accurate mould.
Background technology
For realizing specific function, some chips need regional area exposed, and carry out special handling to exposed region, so as to
Make the exposed region that processed directly with use environment in associated media directly contact, occur various physical and chemical reactions to reach
To specific effect, therefore exposed region need not be protected using plastic packaging material, and other regions remain a need for carrying out using plastic packaging material
Protection, the exposed region after plastic packaging will occur in the form of a groove with respect to other regions, and bottom portion of groove is chip exposed region,
And side wall is called windowing encapsulation then for protecting the plastic packaging material in other regions in this kind of form of encapsulation field, it is to realize opening for local
Window, according to the corresponding relation of shape of product and mould, it is necessary to design boss, the size root of boss in encapsulating mould corresponding position
Determine according to the size of windowing.
There is no excessive glue to ensure chip exposed region completely exposed, must assure that during plastic packaging boss on mould with
It is fitted close between chip exposed region, gapless, once there is gap between the two, plastic packaging material enters in the presence of injection pressure
Enter between the two, so as to form flash.Due to the fact that, can not be fitted close between the two, reason one：Each chip thickness
Degree is different, all there is certain error.Reason two：Have one as upper piece glue thickness is different during chip upper piece
Fixed error, after causing piece, each chip is highly different.Reason three：Die top boss is had in process
Certain mismachining tolerance, so as to cause the highly different of each boss itself.
After mould matched moulds, cause between mould part boss and chip, the presence of showing for fit clearance for above-mentioned reasons
As the phenomenon of interference fit partly occurs.Cooperation there is gap in both, will result in chip exposed region in encapsulation process
There is flash in top, so as to affect the function of chip exposed region, and both interference fit, as chip bears incessantly mould
, there is the risk being subject to crushing in the pressure of top boss.
Content of the invention
The purpose of the present invention is for overcoming above-mentioned the deficiencies in the prior art, provides a kind of for the exposed encapsulation of chip area
Unit encapsulates mould, boss is arranged on the molding assembly of activity, it is possible to achieve to precisely joining for the chip of different-thickness
Close.
A kind of accurate mould for chip area exposed encapsulation is also provided, and whole mould is encapsulated by multiple units
Mould is spliced into by the arrangement mode for setting, and can be effectively reduced difficulty of processing, it is ensured that mismachining tolerance, and solves modeling
Excessive glue in envelope forming process and chip crushing phenomenon.
For achieving the above object, the present invention adopts following technical proposals：
A kind of unit for the exposed encapsulation of chip area encapsulates mould, including fixed support body, the fixing support
The internal molding assembly for being embedded activity in setting position, the molding assembly one end arranges the boss of compression chip, molding
Component the other end is engaged with moving element so that molding assembly is moved in fixed support body.Will be exposed corresponding to chip
The boss in region is arranged on molding assembly, and molding assembly activity is embedded in fixed support body, with moving element
Molding assembly can be caused to drive boss movable in fixed support body, boss can protrude fixed support body different length,
The accurate cooperation of the chip to different-thickness can be just realized, excessive glue or chip crushing phenomenon will not occur.
Preferably, the one end that the molding assembly is coordinated with moving element is connected radial stop, the fixed support body
It is provided with the bathtub construction for matching with radial stop.Arrange radial stop molding assembly to be had necessarily join with fixed support body
Close, both ensured that molding assembly had certain activity space, and ensured that molding assembly does not fall out fixed support body again.
The fixed support body is provided with least one through hole, and the molding assembly is embedded in through hole.Molding assembly is embedding
In the through hole of fixed support body, fixed support body can both give molding assembly necessarily to fix holding power, will not also give into
Type component is excessively limited, and allows molding assembly along the smooth movement of through hole.
The moving element is the flexible member being connected with molding assembly, and the flexible member bottom is connected to pressing plate
On.Flexible member is set, coordinating with chip for boss elasticity is allow, both can guarantee that boss is precisely coordinated with chip, again will not
Excessive pressure is brought to chip.
Or, the moving element is the piston body being connected with molding assembly, and the piston body is matched with driving means
Close.By the setting of piston body, boss is when coordinating with chip, if chip height is higher, with extrusion piston body, and then can cause
Boss will not cause excessive pressure to chip to retraction in fixed support body；If chip height is relatively low, can be made by driving means
Obtain boss to overhang to fixed support body, so that chip and boss more precise match.
The piston body is equipped with piston/cylinder, and the piston/cylinder is connected with fixed support body.Piston body
Along piston/cylinder activity, so as to drive the flexible of boss.
Potted component is equipped between the piston body and piston/cylinder.The gas of air pressure offer device is avoided to let out
Dew, and causes the air pressure to piston body meet requirement, make air pressure offer device preferably with piston mates.
Preferably, the molding assembly is coated outside boss and arranges thin film.Thin film is set boss can be aided in chip
More precise match.
Preferably, the end of the boss arranges escape groove.Escape groove is set thin film can be avoided to overall plastic packaging molding
Impact.
A kind of accurate mould for the exposed encapsulation of chip area, including multiple unit packaging body moulds as above
Tool, multiple unit encapsulation moulds are arranged as row and lay, and adjacent unit encapsulation mould splices and combines integral.To be many
Individual unit encapsulation mould is arranged as row and splices and combines integral, can match with multiple exposed dies, to realize comprising many
The encapsulated moulding of individual exposed die.
Beneficial effects of the present invention are：
The mould of the present invention arranges multiple units and encapsulates mould, and multiple units encapsulation mould mutually splicing group
Integrator, it is possible to achieve to the encapsulated moulding containing multiple exposed dies.
Each unit encapsulation mould is arranged to split type by the present invention, and fixed support body encapsulates mould for whole unit
Support positioning element, molding assembly matched with chip, be can be very good to reduce the difficulty of processing that unit encapsulates mould, is protected
Card machining accuracy.
Molding assembly one end of the present invention arranges the boss for coordinating with chip exposed region, and the other end arranges moving element,
So that molding assembly can be slided along fixed support body, and then causes the length that boss protrudes fixed support body to change, more preferably
With windowing segment chip precisely coordinate, be not in excessive glue or chip crushing phenomenon.
Description of the drawings
Fig. 1 is the schematic diagram that plastic packaging molding front unit encapsulates mould；
Fig. 2 is partial enlarged drawing at A in Fig. 1；
Fig. 3 is the schematic diagram of unit encapsulation mould after plastic packaging molding；
Fig. 4 encapsulates the generalized section of mould for unit；
Fig. 5 is the structural representation of mould of the present invention；
Fig. 6 is B-B profile in Fig. 5；
Fig. 7 implements structural representation for a kind of of moving element；
Fig. 8 implements structural representation for the another kind of of moving element；
In figure, 1 encapsulates mould for unit, and 2 is boss, and 3 is thin film, and 4 is chip, and 5 is escape groove, and 6 is the part that opens a window,
7 is support plate, 8 be gold thread, 9 be upper piece glue, 10 be fixed support body, 11 be molding assembly, 12 be radial stop, 13 be flute profile
Structure, 14 for fluting, 15 be spring, 16 be spring groove, 17 be pressing plate, 18 be connector, 19 be piston body, 20 for sealing unit
Part, 21 piston/cylinders.
Specific embodiment
The present invention is further described with reference to the accompanying drawings and examples.
As shown in Fig. 5-Fig. 6, a kind of accurate mould for the exposed encapsulation of chip area, including many of mutual splicing
Individual unit encapsulates mould 1, and multiple unit encapsulation moulds 1 are in a row laid in column, and adjacent unit encapsulates 1 splicing group of mould
Integrator.Multiple units encapsulation mould 1 is in a row spliced and combined in column integral, can match with multiple exposed dies
Close, to realize the encapsulated moulding comprising multiple exposed dies.
As Figure 1-Figure 4, unit encapsulation mould 1 includes fixed support body 10, is setting position in fixed support body 10
The place of putting is embedded the molding assembly 11 of activity, and 11 one end of molding assembly arranges boss 2,11 the other end of molding assembly and activity unit
Part coordinates to realize boss 2 with different length protrusion fixed support body 10.Boss corresponding to chip exposed region is arranged at
On molding assembly, and molding assembly activity is embedded in fixed support body, can cause molding assembly with moving element
Drive boss movable in fixed support body, boss can protrude fixed support body different length, also just can realize to difference
The accurate cooperation of the chip of thickness, will not occur excessive glue or chip crushing phenomenon.
As shown in Figure 1-Figure 3, molding assembly 11 is coated outside boss 2 and arranges thin film 3, and thickness is determined according to product.Modeling
Thin film during envelope between boss 2 and chip plays a part of cushion, and after there is gap between the two, pressurized thin film can recover
Partial deformation is filling the gap for producing between the two.Thin film outside boss 2 can prevent plastic packaging material from entering windowing part.Due to
Thin film has compressibility in thickness direction, has filled up difference in height between the two, between plays a part of cushion, energy
Enough by changing the thickness of itself, gap between the two is adjusted.Arranging thin film can aid in boss more accurately to join with chip
Close.
The end of boss 2 arranges escape groove 5.Arranging escape groove can avoid thin film from impacting overall plastic packaging molding.
Arrange escape groove effect be：Thin film is after the pressure for being subject to mould and chip, and thickness direction can be thinning, due to thin film herein
Constancy of volume, pressurized rear film is thinning in thickness direction, and length direction increases, and the thin film after deformation will certainly be to mould and chip
Wherein side deformation, for prevent thin film to chip Direction distortion affect chip functions, mould ends arrange escape groove, allow thin
Film deforms into escape groove.
Being encapsulated on support plate 7 with 9 pasting chip 4 of a glue of chip, chip 4 is by gold thread 8 and electric external terminal
It is connected.It is windowing part 6 needing exposed chip area then corresponding, cell cube encapsulating mould 1 is corresponding to windowing part 6
Boss 2 is set, can be movable by boss 2, boss 2 can precisely be coordinated with chip 4, will not occur excessive glue and chip crushing existing
As.After boss 2 and chip 4 precisely coordinate, the windowing part 6 at chip exposed region is molded by plastic packaging.The position of boss 2
Put and can be changed according to the requirement of chip exposed region with shape.
The one end that molding assembly 11 is coordinated with moving element is connected radial stop 12, and fixed support body 10 is provided with and footpath
To the bathtub construction 13 that block 12 matches.Molding assembly 11 arranges fluting 14 in the end for coordinating with moving element, in fluting
Moving element is fixedly mounted at 14.Arranging radial stop causes molding assembly to have certain cooperation with fixed support body, both ensures into
Type component has certain activity space, ensures that molding assembly does not fall out fixed support body again.
Fixed support body 10 is provided with least one through hole, and molding assembly 11 is embedded in through hole.Molding assembly is embedded at
In the through hole of fixed support body, fixed support body can both give molding assembly necessarily to fix holding power, also will not be to molding group
Part is excessively limited, and allows molding assembly along the smooth movement of through hole.
Moving element can adopt two ways, and one is as shown in fig. 7, moving element includes to be connected with molding assembly 11
Flexible member, the present embodiment elastic element adopts spring 15, and 15 bottom of spring is connected on pressing plate 17, and molding assembly 11 sets
Spring groove 16 is put, spring 15 is embedded in spring groove 16.Flexible member is set, coordinating with chip for boss elasticity is allow, both
Can guarantee that boss is precisely coordinated with chip, excessive pressure will not be brought to chip again.
Moving element can adopt two ways, and which is two as shown in figure 8, moving element includes to be connected with molding assembly 11
Piston body 19, piston body 19 matched with driving means, and in the present embodiment, driving means adopt air pressure offer device, it is also possible to
Using hydraulic pressure offer device, piston body 19 is connected by connector 18 with molding assembly 11.By the setting of piston body, boss exists
When coordinating with chip, if chip height is higher, with extrusion piston body, and then boss can be caused to retraction in fixed support body, no
Excessive pressure can be caused to chip；If chip height is relatively low, boss can be caused to outside fixed support body by air pressure offer device
Stretch out, so that chip and boss more precise match.
Piston body 19 is equipped with piston/cylinder 21, and piston/cylinder 21 is connected with fixed support body 10.Piston body
Along piston/cylinder activity, so as to drive the flexible of boss.Gas is provided by outside air pump, the gas deficiency in piston/cylinder
When, outside air pump can suppress make-up gas in time.Principle is as follows：When injection pressure is more than gas pressure, molding assembly is subject to
The effect of injection pressure, moves to the direction of piston cylinder.Conversely, then to boss side shifting.If both are identical, do not move.
Potted component 20 is equipped between piston body 19 and piston/cylinder 21.The gas of air pressure offer device is avoided to occur
Reveal, and cause the air pressure to piston body meet requirement, make air pressure offer device preferably with piston mates.
The mould of the present invention can apply to the exposed encapsulation of single chip, the exposed encapsulation of multiple chips and many cores
Single in piece assembled package, multiple chips exposed.
Although the above-mentioned accompanying drawing that combines is described to the specific embodiment of the present invention, not model is protected to the present invention
The restriction that encloses, one of ordinary skill in the art are should be understood that on the basis of technical scheme, and those skilled in the art are not
The various modifications that makes by needing to pay creative work or deformation are still within protection scope of the present invention.
Claims (10)
1. a kind of unit for the exposed encapsulation of chip area encapsulates mould, it is characterized in that, including fixed support body, described solid
Determine in supporter, to be embedded the molding assembly of activity in setting position, the molding assembly one end arranges the convex of compression chip
Platform, molding assembly the other end is engaged with moving element so that molding assembly is moved in fixed support body.
2. unit as claimed in claim 1 encapsulates mould, it is characterized in that, the molding assembly coordinate with moving element one
End connects radial stop, and the fixed support body is provided with the bathtub construction for matching with radial stop.
3. unit as claimed in claim 1 encapsulates mould, it is characterized in that, the fixed support body is provided with least one and leads to
Hole, the molding assembly is embedded in through hole.
4. unit as claimed in claim 1 or 2 encapsulates mould, it is characterized in that, the moving element is and molding assembly phase
The flexible member of connection, the flexible member bottom is connected on pressing plate.
5. unit as claimed in claim 1 or 2 encapsulates mould, it is characterized in that, the moving element is and molding assembly phase
The piston body of connection, the piston body is matched with driving means.
6. unit as claimed in claim 5 encapsulates mould, it is characterized in that, the piston body is equipped with piston/cylinder
Interior, the piston/cylinder is connected with fixed support body.
7. unit as claimed in claim 6 encapsulates mould, it is characterized in that, coordinates and set between the piston body and piston/cylinder
Put potted component.
8. unit as claimed in claim 1 encapsulates mould, it is characterized in that, the molding assembly is coated outside boss and arranged
Thin film.
9. unit as claimed in claim 8 encapsulates mould, it is characterized in that, the end of the boss arranges escape groove.
10. a kind of accurate mould for the exposed encapsulation of chip area, is characterized in that, including multiple as claim 1-9
Unit encapsulation mould described in any one, multiple unit encapsulation moulds are arranged as row and lay, and adjacent unit is encapsulated
Mould splices and combines integral.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610873674.1A CN106449479A (en) | 2016-09-30 | 2016-09-30 | Unit package body die and precise forming die for chip region exposed package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610873674.1A CN106449479A (en) | 2016-09-30 | 2016-09-30 | Unit package body die and precise forming die for chip region exposed package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106449479A true CN106449479A (en) | 2017-02-22 |
Family
ID=58172695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610873674.1A Pending CN106449479A (en) | 2016-09-30 | 2016-09-30 | Unit package body die and precise forming die for chip region exposed package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449479A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106881826A (en) * | 2017-02-24 | 2017-06-23 | 日月光封装测试(上海)有限公司 | Encapsulating mould and the injection moulding process using the encapsulating mould |
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|---|---|---|---|---|
| KR20130075389A (en) * | 2011-12-27 | 2013-07-05 | 티에스테크놀로지 주식회사 | Molding apparatus for manufacturing semi-conductor package |
| CN103700635A (en) * | 2013-12-25 | 2014-04-02 | 北京必创科技有限公司 | Chip packaging structure with cavity and packaging method thereof |
| WO2014101780A1 (en) * | 2012-12-28 | 2014-07-03 | 武汉电信器件有限公司 | Silica-on-silicon-based hybrid integrated optoelectronic chip and manufacturing method therefor |
| CN104752237A (en) * | 2015-03-19 | 2015-07-01 | 鞍山市联达电子有限公司 | SCR (silicon controlled rectifier) encapsulation method and mold |
| CN206040605U (en) * | 2016-09-30 | 2017-03-22 | 山东盛品电子技术有限公司 | A unit packaging body mould and accurate forming die for exposed encapsulation in chip area territory |
-
2016
- 2016-09-30 CN CN201610873674.1A patent/CN106449479A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130075389A (en) * | 2011-12-27 | 2013-07-05 | 티에스테크놀로지 주식회사 | Molding apparatus for manufacturing semi-conductor package |
| WO2014101780A1 (en) * | 2012-12-28 | 2014-07-03 | 武汉电信器件有限公司 | Silica-on-silicon-based hybrid integrated optoelectronic chip and manufacturing method therefor |
| CN103700635A (en) * | 2013-12-25 | 2014-04-02 | 北京必创科技有限公司 | Chip packaging structure with cavity and packaging method thereof |
| CN104752237A (en) * | 2015-03-19 | 2015-07-01 | 鞍山市联达电子有限公司 | SCR (silicon controlled rectifier) encapsulation method and mold |
| CN206040605U (en) * | 2016-09-30 | 2017-03-22 | 山东盛品电子技术有限公司 | A unit packaging body mould and accurate forming die for exposed encapsulation in chip area territory |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106881826A (en) * | 2017-02-24 | 2017-06-23 | 日月光封装测试(上海)有限公司 | Encapsulating mould and the injection moulding process using the encapsulating mould |
| CN106881826B (en) * | 2017-02-24 | 2022-11-11 | 日荣半导体(上海)有限公司 | Packaging mold and injection molding method using same |
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