CN106433016A - Modified reinforced heat insulation and sound insulation phenolic foam plate and production method thereof - Google Patents

Modified reinforced heat insulation and sound insulation phenolic foam plate and production method thereof Download PDF

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Publication number
CN106433016A
CN106433016A CN201610759888.6A CN201610759888A CN106433016A CN 106433016 A CN106433016 A CN 106433016A CN 201610759888 A CN201610759888 A CN 201610759888A CN 106433016 A CN106433016 A CN 106433016A
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phenol
phenolic foam
agent
parts
acid
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CN106433016B (en
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范平
范平一
郑新宇
张圣华
张明芬
吴丹
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NANTONG ZHONGBAO ENERGY SAVING TECHNOLOGY Co.,Ltd.
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JIANGSU DEMING NEW MATERIAL Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14Modified phenol-aldehyde condensates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28Chemically modified polycondensates
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C08J9/10Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
    • C08J9/107Nitroso compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00Foams characterized by the expanding agent
    • C08J2203/04N2 releasing, ex azodicarbonamide or nitroso compound
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2361/04Condensation polymers of aldehydes or ketones with phenols only
    • C08J2361/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08J2361/14Modified phenol-aldehyde condensates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2471/00Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2471/02Polyalkylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04Polysiloxanes
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/14Applications used for foams
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
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Abstract

The invention discloses a modified reinforced heat insulation and sound insulation phenolic foam plate and a production method thereof. The modified reinforced heat insulation and sound insulation phenolic foam plate comprises, by mass, 100 parts of modified phenolic resin, 10-30 parts of modified clay, 1-10 parts of a flexibilizer, 1-5 parts of a stabilizer, 10-20 parts of a foaming agent, 2-10 parts of a surfactant, 5-10 parts of a fire retardant and 5-20 parts of a curing agent. The production method of the modified reinforced heat insulation and sound insulation phenolic foam plate comprises the following steps: 1, preparing the modified phenolic resin; 2, conveying the modified phenolic resin, the modified clay and the flexibilizer into a mixing head of a casting and foaming machine by using a metering pump, sequentially adding the stabilizer, the foaming agent, the surfactant and the fire retardant, uniformly stirring above substances, adding the curing agent, and stirring all above substances; and 3, foaming and curing the above obtained mixture in a cavity. A composite production technology is improved, so the toughness, the fire resistance and the sound insulation performance of phenolic foam are greatly improved.

Description

A kind of modification enhancement mode heat insulating and sound insulating phenolic foam board and preparation method thereof
Technical field
The present invention relates to a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board and preparation method thereof, belong to building heat preservation every Sound field of material preparation.
Background technology
Phenol formaldehyde foam is compared with polyurethane foam board with traditional polyethylene, phenol formaldehyde foam except heat conductivity low with Outward, the flame retardancy also not possessed with both foams, and its burning grade has reached B1 level, with excellent fire resistance Can, it is a kind of preferable fire proofing, is now widely used in being incubated back-fire relief occasion.Meanwhile, phenolic foam board is used as light foam Plate, due to its distinctive foam structure so that this material is all suitable in terms of heat-insulating property and sound insulation property.Therefore, by phenol The heat insulating and sound insulating fire resistance of aldehyde cystosepiment is applied to construction wall, is promoted in floor, has good market prospect.
Also have the sound-proof foam plate that performance increases on the market, but general foam sound insulating plate is merely by aluminium foil The decorative pattern on surface combines to form groove with phenolic foam board and carries out sound insulation, or is carried out by the phenolic foam board for having prepared Secondary operations form the groove of wave and carry out sound insulation, and the more simple abscess sound insulation of this soundproof effect is compared and improved to some extent, but It is also very big room for promotion.And its fragility of phenolic foam board and Cost Problems also limit which as insulation material Popularization and application.
In order on the basis of phenol formaldehyde foam excellent fire-retardancy is kept, improve the toughness of foam, impact resistance, sound insulation effect Really, cheap, the phenol formaldehyde foam of excellent combination property is prepared, herein from different modifying agent and production technology to phenolic aldehyde Foam has carried out study on the modification.
Content of the invention
The poor toughness of phenolic foam board in existing market, cohesive energy are low, rate of slag falling is high, mechanical strength in order to overcome for the present invention The general defect of low, defening effect provides one kind and carries out improved process is simple, processing ease in original production technology, can Improve defening effect, anti-flammability, impact resistance, a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board of anti-slag-falling rate and its system Preparation Method.
The present invention is achieved by the following technical solutions:
A kind of component of modification enhancement mode heat insulating and sound insulating phenolic foam board and mass fraction are:100 parts of phenol-formaldehyde resin modified, modified Clay 10-30 part, toughener 1-10 part, stabilizer 1-5 part, foaming agent 10-20 part, surfactant 2-10 part, fire retardant 5- 10, firming agent 5-20 part.
A kind of modification enhancement mode heat insulating and sound insulating phenolic foam board preparation method comprises the steps:
1)Prepare phenol-formaldehyde resin modified:Prepare phenol, paraformaldehyde, NaOH, ammonia, phenol, the ratio of paraformaldehyde are 1: (1.5-2.0), the consumption of NaOH is the 3%-6% of phenol, and the consumption of ammonia is the 1%-3% of phenol;First NaOH and ammonia are mixed Closing, in phenol, modifying agent, adding NaOH, the 80% of ammonia mixed solution total amount to be mixed, 20- is incubated at 40-60 DEG C 40min, adds the 80% of paraformaldehyde total amount, is incubated 20-40min at 60-70 DEG C, is subsequently adding remaining NaOH and ammonia is mixed Liquid is closed, 10-20min is incubated, remaining paraformaldehyde is added, regulation pH value is 8-9, modifying agent is added, is warmed up to 70-80 DEG C Insulation 10-20min, in the 85-95 DEG C of 30-60min that flows back, decompression dehydration discharges;Step 1)In modifying agent be epoxy resin E51;
2)By step 1)The phenol-formaldehyde resin modified made, modified clay, toughener metering are pumped into mixing for pouring foaming machine In syncephalon, stabilizer, foaming agent, surfactant, fire retardant is sequentially added, firming agent is added after stirring to be carried out Stirring;Step 2)Used in toughener be ethylene glycol, dioctyl phthalate, any one in tricresyl phosphate;
3)Material after stirring is cast in rapidly inside from pouring foaming machine top be covered with the mould membrane cavity of protective layer, passes through Die cover upper cover plate is molded by mechanical hand, and the bottom of the cover plate is provided with the column type boss of regular arrangement, by mould Tool sends into laminating conveyor together with cover plate, foamed solidification shaping between bottom facestock and cover plate of upper layer of the material in mould, And as laminating conveyor is fed forward, the temperature control in course of conveying in mould is at 65-70 DEG C, and conveying duration 15-20 divides Clock, the depth of the mould is 20mm-30mm, the high 3-4mm of the boss on mould, and the bottom facestock in the mould is high intensity Non-woven fabrics;
4)By the phenolic foam board cooling and demolding after solidification.
Further improvement of the present invention is, the foaming agent is floride-free foaming agent dinitrosopentamethlyene tetramine.
Further improvement of the present invention is, described surfactant is aliphatic alcohol polyethenoxy, polyethenoxy ether, nonyl The addition product of phenol and oxirane, or the block copolymer of polysiloxanes, polyoxyethylene, polyoxypropylene.
Further improvement of the present invention is, firming agent is that the mixture of mineral acid and organic acid adds the concentration that makes to be The aqueous solution of 40-60%, the mineral acid can select sulphuric acid, hydrochloric acid, the one kind in phosphoric acid, and the organic acid is oxalic acid, two Acid, benzene nitric acid, phenol nitric acid, toluenesulfonic acid, the one kind in benzenesulfonic acid, mahogany acid.
Further improvement of the present invention is, the stabilizer is the mixture of tween 80 and methyl-silicone oil.
Further improvement of the present invention is, the fire retardant is inorganic combustion inhibitor Firebrake ZB.
The invention has the advantages that:
Frock improvement is carried out to traditional phenolic foam heat insulation plate production line, makes phenolic resin carry out in the membrane cavity of mould sending out Bubble, makes the one face composite protection film of phenolic foam board of production, and another side forms circular cavity after the cover plate mould on mould, multiple The protecting film of conjunction reduces the rate of slag falling of phenolic foam board, improves the tensile property of phenolic foam board, and aldehyde foam plate surface Circular cavity, compared with conventional embossing and wave groove damping type sound insulation, sound insulation property is greatly improved; Cystosepiment processing thickness is that 30 mm and 20 mm, cavity depth is only 3 ~ 4 mm, will not be to the load-bearing resistance to compression energy of phenolic foam board Power produces any impact.
Phenol-formaldehyde resin modified adds modifying agent before backflow, is conducive to the dissolving of epoxy, is fully contacted with reaction system, instead Completely solution should be made uniform, epoxy resin and reactive modified phenolic resin, it is grafted in phenolic resin molecule, makes product cladodification, molecule Amount increases, and tensile-sbear strength increases, and improves wilfulness;What surfactant was selected is aliphatic alcohol polyethenoxy, polyethenoxy ether, nonyl The addition product of base phenol and oxirane, or the one kind in the block copolymer of polysiloxanes, polyoxyethylene, polyoxypropylene, not only There is good foam stabilization performance, and have extremely strong emulsification.The compound and production technology by material of the present invention Improvement, phenolic foam board abscess exquisiteness, even density, intensity and heat-proof quality reliability, greatly improve phenol formaldehyde foam Toughness, anti-flammability, sound insulation property.
Specific embodiment
With reference to example, the present invention will be further described.
Embodiment 1
A kind of modification enhancement mode heat insulating and sound insulating phenolic foam board preparation method comprises the steps:
1)Prepare phenol-formaldehyde resin modified:Prepare phenol, paraformaldehyde, NaOH, ammonia, phenol, the ratio of paraformaldehyde are 1: (1.5-2.0), the consumption of NaOH is the 3%-6% of phenol, and the consumption of ammonia is the 1%-3% of phenol;First NaOH and ammonia are mixed Closing, in phenol, modifying agent, adding NaOH, the 80% of ammonia mixed solution total amount to be mixed, 20- is incubated at 40-60 DEG C 40min, adds the 80% of paraformaldehyde total amount, is incubated 20-40min at 60-70 DEG C, is subsequently adding remaining NaOH and ammonia is mixed Liquid is closed, 10-20min is incubated, remaining paraformaldehyde is added, regulation pH value is 8-9, modifying agent is added, is warmed up to 70-80 DEG C Insulation 10-20min, in the 85-95 DEG C of 30-60min that flows back, decompression dehydration discharges;Step 1)In modifying agent be epoxy resin E51;
2)By step 1)The phenol-formaldehyde resin modified made, modified clay, toughener metering are pumped into mixing for pouring foaming machine In syncephalon, stabilizer, foaming agent, surfactant, fire retardant is sequentially added, firming agent is added after stirring to be carried out Stirring;Step 2)Used in toughener be ethylene glycol, dioctyl phthalate, any one in tricresyl phosphate;
3)Material after stirring is cast in rapidly inside from pouring foaming machine top be covered with the mould membrane cavity of protective layer, passes through Die cover upper cover plate is molded by mechanical hand, and the bottom of the cover plate is provided with the column type boss of regular arrangement, by mould Tool sends into laminating conveyor together with cover plate, foamed solidification shaping between bottom facestock and cover plate of upper layer of the material in mould, And as laminating conveyor is fed forward, the temperature control in course of conveying in mould is at 65-70 DEG C, and conveying duration 15-20 divides Clock, the depth of the mould is 20mm-30mm, the high 3-4mm of the boss on mould, and the bottom facestock in the mould is high intensity Non-woven fabrics;
4)By the phenolic foam board cooling and demolding after solidification.
Raw materials quality fraction in above-mentioned steps is as follows:
100 parts of the phenol-formaldehyde resin modified that step 1 is made, 10 parts of modified clay, 1 part of toughener, 1 part of stabilizer, 10 parts of foaming agent, 2 parts of surfactant, fire retardant 5,5 parts of firming agent.
Embodiment 2
Preparation method such as embodiment 1, each constituent mass number is as follows:100 parts of phenol-formaldehyde resin modified, 30 parts of modified clay, toughness reinforcing 10 parts of agent, 5 parts of stabilizer, 20 parts of foaming agent, 10 parts of surfactant, fire retardant 10,20 parts of firming agent.
Embodiment 3
Preparation method such as embodiment 1, each constituent mass number is as follows:100 parts of phenol-formaldehyde resin modified, 20 parts of modified clay, toughness reinforcing 1 part of agent, 5 parts of stabilizer, 10 parts of foaming agent, 2 parts of surfactant, fire retardant 10,5 parts of firming agent.
Embodiment 4
Preparation method such as embodiment 1, each constituent mass number is as follows:100 parts of phenol-formaldehyde resin modified, 15 parts of modified clay, toughness reinforcing 10 parts of agent, 1 part of stabilizer, 20 parts of foaming agent, 10 parts of surfactant, fire retardant 5,10 parts of firming agent.
Embodiment 5
Preparation method such as embodiment 1, each constituent mass number is as follows:100 parts of phenol-formaldehyde resin modified, 25 parts of modified clay, toughness reinforcing 7 parts of agent, 3 parts of stabilizer, 15 parts of foaming agent, 5 parts of surfactant, fire retardant 7,18 parts of firming agent.
Embodiment 6
Preparation method such as embodiment 1, each constituent mass number is as follows:100 parts of phenol-formaldehyde resin modified, 20 parts of modified clay, toughness reinforcing 3 parts of agent, 5 parts of stabilizer, 15 parts of foaming agent, 10 parts of surfactant, fire retardant 6,15 parts of firming agent.
The performance of the modified enhancement mode heat insulating and sound insulating phenolic foam board of 1 ~ 6 gained of embodiment is shown in Table 1.
The performance of 1 phenolic foam board of table
Example General phenolic foam board Example 1 Example 2 Example 3 Example 4 Example 5 Example 6
Rate of slag falling(%) 4.35 2.59 2.55 2.91 2.76 2.66 2.56
Compressive strength(MPa) 0.20 0.33 0.22 0.24 0.31 0.36 0.42
Tensile strength(MPa) 0.15 0.15 0.20 0.17 0.18 0.25 0.23
As can be seen from Table 1, the modified enhancement mode heat insulating and sound insulating phenolic foam board that prepared by the present invention, insulation and resistance to compression effect are all very Good, toughness also improves a lot.By the detection of defening effect, body structure surface, the noise reduction of the present invention also has significantly Improve.
Explanation embodiments of the present invention are the foregoing is only, the present invention is not limited to, for the technology of this area For personnel, all any modification, equivalent substitution and improvement that within the spirit and principles in the present invention, is made etc., should be included in Within protection scope of the present invention.

Claims (7)

1. a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board, it is characterised in that described modified enhancement mode heat insulating and sound insulating phenol The component of aldehyde cystosepiment and mass fraction are:100 parts of phenol-formaldehyde resin modified, modified clay 10-30 part, toughener 1-10 part, surely Determine agent 1-5 part, foaming agent 10-20 part, surfactant 2-10 part, fire retardant 5-10, firming agent 5-20 part.
2. according to claim 1 a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board preparation method, it is characterised in that Methods described comprises the steps:
1)Prepare phenol-formaldehyde resin modified:Prepare phenol, paraformaldehyde, NaOH, ammonia, phenol, the ratio of paraformaldehyde are 1: (1.5-2.0), the consumption of NaOH is the 3%-6% of phenol, and the consumption of ammonia is the 1%-3% of phenol;First NaOH and ammonia are mixed Closing, in phenol, modifying agent, adding NaOH, the 80% of ammonia mixed solution total amount to be mixed, 20- is incubated at 40-60 DEG C 40min, adds the 80% of paraformaldehyde total amount, is incubated 20-40min at 60-70 DEG C, is subsequently adding remaining NaOH and ammonia is mixed Liquid is closed, 10-20min is incubated, remaining paraformaldehyde is added, regulation pH value is 8-9, modifying agent is added, is warmed up to 70-80 DEG C Insulation 10-20min, in the 85-95 DEG C of 30-60min that flows back, decompression dehydration discharges;Step 1)In modifying agent be epoxy resin E51;
2)By step 1)The phenol-formaldehyde resin modified made, modified clay, toughener metering are pumped into mixing for pouring foaming machine In syncephalon, stabilizer, foaming agent, surfactant, fire retardant is sequentially added, firming agent is added after stirring to be carried out Stirring;Step 2)Used in toughener be ethylene glycol, dioctyl phthalate, any one in tricresyl phosphate;
3)Material after stirring is cast in rapidly inside from pouring foaming machine top be covered with the mould membrane cavity of protective layer, passes through Die cover upper cover plate is molded by mechanical hand, and the bottom of the cover plate is provided with the column type boss of regular arrangement, by mould Tool sends into laminating conveyor together with cover plate, foamed solidification shaping between bottom facestock and cover plate of upper layer of the material in mould, And as laminating conveyor is fed forward, the temperature control in course of conveying in mould is at 65-70 DEG C, and conveying duration 15-20 divides Clock, the depth of the mould is 20mm-30mm, the high 3-4mm of the boss on mould, and the bottom facestock in the mould is high intensity Non-woven fabrics;
4)By the phenolic foam board cooling and demolding after solidification.
3. according to claim 1 a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board, it is characterised in that the foaming Agent is floride-free foaming agent dinitrosopentamethlyene tetramine.
4. according to claim 1 a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board, it is characterised in that the surface Activating agent is the addition product of aliphatic alcohol polyethenoxy, polyethenoxy ether, nonyl phenol and oxirane, or polysiloxanes, polyoxy second Alkene, the block copolymerization of polyoxypropylene.
5. a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board according to claim 1, it is characterised in that firming agent is The mixture of mineral acid and organic acid adds the aqueous solution that the concentration that makes is 40-60%, and the mineral acid can select sulphuric acid, salt One kind in acid, phosphoric acid, the organic acid is oxalic acid, adipic acid, benzene nitric acid, phenol nitric acid, toluenesulfonic acid, benzenesulfonic acid, oil sulphur One kind in acid.
6. according to claim 1 a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board, it is characterised in that described stable Agent is the mixture of tween 80 and methyl-silicone oil.
7. according to claim 1 a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board, the fire retardant be inorganic resistance Combustion agent Firebrake ZB.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107325482A (en) * 2017-08-04 2017-11-07 国网山东省电力公司临沂供电公司 The method that integrated type foaming prepares the prefabricated nacelle of high intensity
CN109486096A (en) * 2018-09-04 2019-03-19 徐州市华天塑业有限公司 A kind of novel sound insulating high temperature resistant foam board
CN110894271A (en) * 2019-11-28 2020-03-20 上海应用技术大学 Method for preparing water-soluble phenolic resin by using composite catalyst
CN110916945A (en) * 2019-11-04 2020-03-27 厦门市妇幼保健院(厦门市计划生育服务中心) Intelligent temperature-control baby incubator
CN114752103A (en) * 2022-05-06 2022-07-15 杭州艺焓饰材有限公司 Formula and process for manufacturing phenolic resin plate

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952177A1 (en) * 1997-01-08 1999-10-27 Daikin Industries, Ltd. Process for preparing phenol resin foam
CN1428372A (en) * 2001-12-26 2003-07-09 广州擎天新材料研究开发有限公司 Phenolic foam plastic composite product and its production and forming process
CN1834152A (en) * 2006-03-21 2006-09-20 上海胜星树脂涂料有限公司 Method of preparing phenolic foam insulation material via foaming at normal temp
CN102061059A (en) * 2010-12-22 2011-05-18 中国林业科学研究院林产化学工业研究所 Wood fiber reinforced inflaming retarding foam material and machining method thereof
KR101116238B1 (en) * 2006-09-21 2012-03-07 (주)엘지하우시스 Interfloor noise proofing material and floor execution method using the same
CN103450630A (en) * 2013-08-09 2013-12-18 江苏德明新材料有限公司 Preparation method of environment-friendly phenol aldehyde-inorganic composite heat insulating material
CN203594119U (en) * 2013-11-06 2014-05-14 营口象圆新材料工程技术有限公司 Modified phenolic foam insulation board for building
CN104558669A (en) * 2014-08-29 2015-04-29 霍山捷成科技发展有限公司 Preparation method of phenolic foam board
CN205242664U (en) * 2015-12-16 2016-05-18 南阳理工学院 Heat preservation for building sound insulation prefab

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952177A1 (en) * 1997-01-08 1999-10-27 Daikin Industries, Ltd. Process for preparing phenol resin foam
CN1428372A (en) * 2001-12-26 2003-07-09 广州擎天新材料研究开发有限公司 Phenolic foam plastic composite product and its production and forming process
CN1834152A (en) * 2006-03-21 2006-09-20 上海胜星树脂涂料有限公司 Method of preparing phenolic foam insulation material via foaming at normal temp
KR101116238B1 (en) * 2006-09-21 2012-03-07 (주)엘지하우시스 Interfloor noise proofing material and floor execution method using the same
CN102061059A (en) * 2010-12-22 2011-05-18 中国林业科学研究院林产化学工业研究所 Wood fiber reinforced inflaming retarding foam material and machining method thereof
CN103450630A (en) * 2013-08-09 2013-12-18 江苏德明新材料有限公司 Preparation method of environment-friendly phenol aldehyde-inorganic composite heat insulating material
CN203594119U (en) * 2013-11-06 2014-05-14 营口象圆新材料工程技术有限公司 Modified phenolic foam insulation board for building
CN104558669A (en) * 2014-08-29 2015-04-29 霍山捷成科技发展有限公司 Preparation method of phenolic foam board
CN205242664U (en) * 2015-12-16 2016-05-18 南阳理工学院 Heat preservation for building sound insulation prefab

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
卓昌明: "《塑料应用技术手册》", 31 May 2013, 机械工业出版社 *
谢圣英: "《塑料材料》", 31 January 2010, 中国轻工业出版社 *
锦州市好为尔保温材料有限公司编著: "《酚醛泡沫建筑防火保温施工》", 31 January 2015, 中国建材工业出版社 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107325482A (en) * 2017-08-04 2017-11-07 国网山东省电力公司临沂供电公司 The method that integrated type foaming prepares the prefabricated nacelle of high intensity
CN107325482B (en) * 2017-08-04 2019-04-09 国网山东省电力公司临沂供电公司 The method of the high-intensitive prefabricated cabin of integrated type foaming preparation
CN109486096A (en) * 2018-09-04 2019-03-19 徐州市华天塑业有限公司 A kind of novel sound insulating high temperature resistant foam board
CN110916945A (en) * 2019-11-04 2020-03-27 厦门市妇幼保健院(厦门市计划生育服务中心) Intelligent temperature-control baby incubator
CN110894271A (en) * 2019-11-28 2020-03-20 上海应用技术大学 Method for preparing water-soluble phenolic resin by using composite catalyst
CN110894271B (en) * 2019-11-28 2022-10-14 上海应用技术大学 Method for preparing water-soluble phenolic resin by using composite catalyst
CN114752103A (en) * 2022-05-06 2022-07-15 杭州艺焓饰材有限公司 Formula and process for manufacturing phenolic resin plate

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