CN106433016A - Modified reinforced heat insulation and sound insulation phenolic foam plate and production method thereof - Google Patents
Modified reinforced heat insulation and sound insulation phenolic foam plate and production method thereof Download PDFInfo
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- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
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- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/04—N2 releasing, ex azodicarbonamide or nitroso compound
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- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
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- C08J2361/14—Modified phenol-aldehyde condensates
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2471/02—Polyalkylene oxides
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- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
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- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C08L2203/00—Applications
- C08L2203/14—Applications used for foams
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The invention discloses a modified reinforced heat insulation and sound insulation phenolic foam plate and a production method thereof. The modified reinforced heat insulation and sound insulation phenolic foam plate comprises, by mass, 100 parts of modified phenolic resin, 10-30 parts of modified clay, 1-10 parts of a flexibilizer, 1-5 parts of a stabilizer, 10-20 parts of a foaming agent, 2-10 parts of a surfactant, 5-10 parts of a fire retardant and 5-20 parts of a curing agent. The production method of the modified reinforced heat insulation and sound insulation phenolic foam plate comprises the following steps: 1, preparing the modified phenolic resin; 2, conveying the modified phenolic resin, the modified clay and the flexibilizer into a mixing head of a casting and foaming machine by using a metering pump, sequentially adding the stabilizer, the foaming agent, the surfactant and the fire retardant, uniformly stirring above substances, adding the curing agent, and stirring all above substances; and 3, foaming and curing the above obtained mixture in a cavity. A composite production technology is improved, so the toughness, the fire resistance and the sound insulation performance of phenolic foam are greatly improved.
Description
Technical field
The present invention relates to a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board and preparation method thereof, belong to building heat preservation every
Sound field of material preparation.
Background technology
Phenol formaldehyde foam is compared with polyurethane foam board with traditional polyethylene, phenol formaldehyde foam except heat conductivity low with
Outward, the flame retardancy also not possessed with both foams, and its burning grade has reached B1 level, with excellent fire resistance
Can, it is a kind of preferable fire proofing, is now widely used in being incubated back-fire relief occasion.Meanwhile, phenolic foam board is used as light foam
Plate, due to its distinctive foam structure so that this material is all suitable in terms of heat-insulating property and sound insulation property.Therefore, by phenol
The heat insulating and sound insulating fire resistance of aldehyde cystosepiment is applied to construction wall, is promoted in floor, has good market prospect.
Also have the sound-proof foam plate that performance increases on the market, but general foam sound insulating plate is merely by aluminium foil
The decorative pattern on surface combines to form groove with phenolic foam board and carries out sound insulation, or is carried out by the phenolic foam board for having prepared
Secondary operations form the groove of wave and carry out sound insulation, and the more simple abscess sound insulation of this soundproof effect is compared and improved to some extent, but
It is also very big room for promotion.And its fragility of phenolic foam board and Cost Problems also limit which as insulation material
Popularization and application.
In order on the basis of phenol formaldehyde foam excellent fire-retardancy is kept, improve the toughness of foam, impact resistance, sound insulation effect
Really, cheap, the phenol formaldehyde foam of excellent combination property is prepared, herein from different modifying agent and production technology to phenolic aldehyde
Foam has carried out study on the modification.
Content of the invention
The poor toughness of phenolic foam board in existing market, cohesive energy are low, rate of slag falling is high, mechanical strength in order to overcome for the present invention
The general defect of low, defening effect provides one kind and carries out improved process is simple, processing ease in original production technology, can
Improve defening effect, anti-flammability, impact resistance, a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board of anti-slag-falling rate and its system
Preparation Method.
The present invention is achieved by the following technical solutions:
A kind of component of modification enhancement mode heat insulating and sound insulating phenolic foam board and mass fraction are:100 parts of phenol-formaldehyde resin modified, modified
Clay 10-30 part, toughener 1-10 part, stabilizer 1-5 part, foaming agent 10-20 part, surfactant 2-10 part, fire retardant 5-
10, firming agent 5-20 part.
A kind of modification enhancement mode heat insulating and sound insulating phenolic foam board preparation method comprises the steps:
1)Prepare phenol-formaldehyde resin modified:Prepare phenol, paraformaldehyde, NaOH, ammonia, phenol, the ratio of paraformaldehyde are 1:
(1.5-2.0), the consumption of NaOH is the 3%-6% of phenol, and the consumption of ammonia is the 1%-3% of phenol;First NaOH and ammonia are mixed
Closing, in phenol, modifying agent, adding NaOH, the 80% of ammonia mixed solution total amount to be mixed, 20- is incubated at 40-60 DEG C
40min, adds the 80% of paraformaldehyde total amount, is incubated 20-40min at 60-70 DEG C, is subsequently adding remaining NaOH and ammonia is mixed
Liquid is closed, 10-20min is incubated, remaining paraformaldehyde is added, regulation pH value is 8-9, modifying agent is added, is warmed up to 70-80 DEG C
Insulation 10-20min, in the 85-95 DEG C of 30-60min that flows back, decompression dehydration discharges;Step 1)In modifying agent be epoxy resin
E51;
2)By step 1)The phenol-formaldehyde resin modified made, modified clay, toughener metering are pumped into mixing for pouring foaming machine
In syncephalon, stabilizer, foaming agent, surfactant, fire retardant is sequentially added, firming agent is added after stirring to be carried out
Stirring;Step 2)Used in toughener be ethylene glycol, dioctyl phthalate, any one in tricresyl phosphate;
3)Material after stirring is cast in rapidly inside from pouring foaming machine top be covered with the mould membrane cavity of protective layer, passes through
Die cover upper cover plate is molded by mechanical hand, and the bottom of the cover plate is provided with the column type boss of regular arrangement, by mould
Tool sends into laminating conveyor together with cover plate, foamed solidification shaping between bottom facestock and cover plate of upper layer of the material in mould,
And as laminating conveyor is fed forward, the temperature control in course of conveying in mould is at 65-70 DEG C, and conveying duration 15-20 divides
Clock, the depth of the mould is 20mm-30mm, the high 3-4mm of the boss on mould, and the bottom facestock in the mould is high intensity
Non-woven fabrics;
4)By the phenolic foam board cooling and demolding after solidification.
Further improvement of the present invention is, the foaming agent is floride-free foaming agent dinitrosopentamethlyene tetramine.
Further improvement of the present invention is, described surfactant is aliphatic alcohol polyethenoxy, polyethenoxy ether, nonyl
The addition product of phenol and oxirane, or the block copolymer of polysiloxanes, polyoxyethylene, polyoxypropylene.
Further improvement of the present invention is, firming agent is that the mixture of mineral acid and organic acid adds the concentration that makes to be
The aqueous solution of 40-60%, the mineral acid can select sulphuric acid, hydrochloric acid, the one kind in phosphoric acid, and the organic acid is oxalic acid, two
Acid, benzene nitric acid, phenol nitric acid, toluenesulfonic acid, the one kind in benzenesulfonic acid, mahogany acid.
Further improvement of the present invention is, the stabilizer is the mixture of tween 80 and methyl-silicone oil.
Further improvement of the present invention is, the fire retardant is inorganic combustion inhibitor Firebrake ZB.
The invention has the advantages that:
Frock improvement is carried out to traditional phenolic foam heat insulation plate production line, makes phenolic resin carry out in the membrane cavity of mould sending out
Bubble, makes the one face composite protection film of phenolic foam board of production, and another side forms circular cavity after the cover plate mould on mould, multiple
The protecting film of conjunction reduces the rate of slag falling of phenolic foam board, improves the tensile property of phenolic foam board, and aldehyde foam plate surface
Circular cavity, compared with conventional embossing and wave groove damping type sound insulation, sound insulation property is greatly improved;
Cystosepiment processing thickness is that 30 mm and 20 mm, cavity depth is only 3 ~ 4 mm, will not be to the load-bearing resistance to compression energy of phenolic foam board
Power produces any impact.
Phenol-formaldehyde resin modified adds modifying agent before backflow, is conducive to the dissolving of epoxy, is fully contacted with reaction system, instead
Completely solution should be made uniform, epoxy resin and reactive modified phenolic resin, it is grafted in phenolic resin molecule, makes product cladodification, molecule
Amount increases, and tensile-sbear strength increases, and improves wilfulness;What surfactant was selected is aliphatic alcohol polyethenoxy, polyethenoxy ether, nonyl
The addition product of base phenol and oxirane, or the one kind in the block copolymer of polysiloxanes, polyoxyethylene, polyoxypropylene, not only
There is good foam stabilization performance, and have extremely strong emulsification.The compound and production technology by material of the present invention
Improvement, phenolic foam board abscess exquisiteness, even density, intensity and heat-proof quality reliability, greatly improve phenol formaldehyde foam
Toughness, anti-flammability, sound insulation property.
Specific embodiment
With reference to example, the present invention will be further described.
Embodiment 1
A kind of modification enhancement mode heat insulating and sound insulating phenolic foam board preparation method comprises the steps:
1)Prepare phenol-formaldehyde resin modified:Prepare phenol, paraformaldehyde, NaOH, ammonia, phenol, the ratio of paraformaldehyde are 1:
(1.5-2.0), the consumption of NaOH is the 3%-6% of phenol, and the consumption of ammonia is the 1%-3% of phenol;First NaOH and ammonia are mixed
Closing, in phenol, modifying agent, adding NaOH, the 80% of ammonia mixed solution total amount to be mixed, 20- is incubated at 40-60 DEG C
40min, adds the 80% of paraformaldehyde total amount, is incubated 20-40min at 60-70 DEG C, is subsequently adding remaining NaOH and ammonia is mixed
Liquid is closed, 10-20min is incubated, remaining paraformaldehyde is added, regulation pH value is 8-9, modifying agent is added, is warmed up to 70-80 DEG C
Insulation 10-20min, in the 85-95 DEG C of 30-60min that flows back, decompression dehydration discharges;Step 1)In modifying agent be epoxy resin
E51;
2)By step 1)The phenol-formaldehyde resin modified made, modified clay, toughener metering are pumped into mixing for pouring foaming machine
In syncephalon, stabilizer, foaming agent, surfactant, fire retardant is sequentially added, firming agent is added after stirring to be carried out
Stirring;Step 2)Used in toughener be ethylene glycol, dioctyl phthalate, any one in tricresyl phosphate;
3)Material after stirring is cast in rapidly inside from pouring foaming machine top be covered with the mould membrane cavity of protective layer, passes through
Die cover upper cover plate is molded by mechanical hand, and the bottom of the cover plate is provided with the column type boss of regular arrangement, by mould
Tool sends into laminating conveyor together with cover plate, foamed solidification shaping between bottom facestock and cover plate of upper layer of the material in mould,
And as laminating conveyor is fed forward, the temperature control in course of conveying in mould is at 65-70 DEG C, and conveying duration 15-20 divides
Clock, the depth of the mould is 20mm-30mm, the high 3-4mm of the boss on mould, and the bottom facestock in the mould is high intensity
Non-woven fabrics;
4)By the phenolic foam board cooling and demolding after solidification.
Raw materials quality fraction in above-mentioned steps is as follows:
100 parts of the phenol-formaldehyde resin modified that step 1 is made, 10 parts of modified clay, 1 part of toughener, 1 part of stabilizer, 10 parts of foaming agent,
2 parts of surfactant, fire retardant 5,5 parts of firming agent.
Embodiment 2
Preparation method such as embodiment 1, each constituent mass number is as follows:100 parts of phenol-formaldehyde resin modified, 30 parts of modified clay, toughness reinforcing
10 parts of agent, 5 parts of stabilizer, 20 parts of foaming agent, 10 parts of surfactant, fire retardant 10,20 parts of firming agent.
Embodiment 3
Preparation method such as embodiment 1, each constituent mass number is as follows:100 parts of phenol-formaldehyde resin modified, 20 parts of modified clay, toughness reinforcing
1 part of agent, 5 parts of stabilizer, 10 parts of foaming agent, 2 parts of surfactant, fire retardant 10,5 parts of firming agent.
Embodiment 4
Preparation method such as embodiment 1, each constituent mass number is as follows:100 parts of phenol-formaldehyde resin modified, 15 parts of modified clay, toughness reinforcing
10 parts of agent, 1 part of stabilizer, 20 parts of foaming agent, 10 parts of surfactant, fire retardant 5,10 parts of firming agent.
Embodiment 5
Preparation method such as embodiment 1, each constituent mass number is as follows:100 parts of phenol-formaldehyde resin modified, 25 parts of modified clay, toughness reinforcing
7 parts of agent, 3 parts of stabilizer, 15 parts of foaming agent, 5 parts of surfactant, fire retardant 7,18 parts of firming agent.
Embodiment 6
Preparation method such as embodiment 1, each constituent mass number is as follows:100 parts of phenol-formaldehyde resin modified, 20 parts of modified clay, toughness reinforcing
3 parts of agent, 5 parts of stabilizer, 15 parts of foaming agent, 10 parts of surfactant, fire retardant 6,15 parts of firming agent.
The performance of the modified enhancement mode heat insulating and sound insulating phenolic foam board of 1 ~ 6 gained of embodiment is shown in Table 1.
The performance of 1 phenolic foam board of table
Example | General phenolic foam board | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 |
Rate of slag falling(%) | 4.35 | 2.59 | 2.55 | 2.91 | 2.76 | 2.66 | 2.56 |
Compressive strength(MPa) | 0.20 | 0.33 | 0.22 | 0.24 | 0.31 | 0.36 | 0.42 |
Tensile strength(MPa) | 0.15 | 0.15 | 0.20 | 0.17 | 0.18 | 0.25 | 0.23 |
As can be seen from Table 1, the modified enhancement mode heat insulating and sound insulating phenolic foam board that prepared by the present invention, insulation and resistance to compression effect are all very
Good, toughness also improves a lot.By the detection of defening effect, body structure surface, the noise reduction of the present invention also has significantly
Improve.
Explanation embodiments of the present invention are the foregoing is only, the present invention is not limited to, for the technology of this area
For personnel, all any modification, equivalent substitution and improvement that within the spirit and principles in the present invention, is made etc., should be included in
Within protection scope of the present invention.
Claims (7)
1. a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board, it is characterised in that described modified enhancement mode heat insulating and sound insulating phenol
The component of aldehyde cystosepiment and mass fraction are:100 parts of phenol-formaldehyde resin modified, modified clay 10-30 part, toughener 1-10 part, surely
Determine agent 1-5 part, foaming agent 10-20 part, surfactant 2-10 part, fire retardant 5-10, firming agent 5-20 part.
2. according to claim 1 a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board preparation method, it is characterised in that
Methods described comprises the steps:
1)Prepare phenol-formaldehyde resin modified:Prepare phenol, paraformaldehyde, NaOH, ammonia, phenol, the ratio of paraformaldehyde are 1:
(1.5-2.0), the consumption of NaOH is the 3%-6% of phenol, and the consumption of ammonia is the 1%-3% of phenol;First NaOH and ammonia are mixed
Closing, in phenol, modifying agent, adding NaOH, the 80% of ammonia mixed solution total amount to be mixed, 20- is incubated at 40-60 DEG C
40min, adds the 80% of paraformaldehyde total amount, is incubated 20-40min at 60-70 DEG C, is subsequently adding remaining NaOH and ammonia is mixed
Liquid is closed, 10-20min is incubated, remaining paraformaldehyde is added, regulation pH value is 8-9, modifying agent is added, is warmed up to 70-80 DEG C
Insulation 10-20min, in the 85-95 DEG C of 30-60min that flows back, decompression dehydration discharges;Step 1)In modifying agent be epoxy resin
E51;
2)By step 1)The phenol-formaldehyde resin modified made, modified clay, toughener metering are pumped into mixing for pouring foaming machine
In syncephalon, stabilizer, foaming agent, surfactant, fire retardant is sequentially added, firming agent is added after stirring to be carried out
Stirring;Step 2)Used in toughener be ethylene glycol, dioctyl phthalate, any one in tricresyl phosphate;
3)Material after stirring is cast in rapidly inside from pouring foaming machine top be covered with the mould membrane cavity of protective layer, passes through
Die cover upper cover plate is molded by mechanical hand, and the bottom of the cover plate is provided with the column type boss of regular arrangement, by mould
Tool sends into laminating conveyor together with cover plate, foamed solidification shaping between bottom facestock and cover plate of upper layer of the material in mould,
And as laminating conveyor is fed forward, the temperature control in course of conveying in mould is at 65-70 DEG C, and conveying duration 15-20 divides
Clock, the depth of the mould is 20mm-30mm, the high 3-4mm of the boss on mould, and the bottom facestock in the mould is high intensity
Non-woven fabrics;
4)By the phenolic foam board cooling and demolding after solidification.
3. according to claim 1 a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board, it is characterised in that the foaming
Agent is floride-free foaming agent dinitrosopentamethlyene tetramine.
4. according to claim 1 a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board, it is characterised in that the surface
Activating agent is the addition product of aliphatic alcohol polyethenoxy, polyethenoxy ether, nonyl phenol and oxirane, or polysiloxanes, polyoxy second
Alkene, the block copolymerization of polyoxypropylene.
5. a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board according to claim 1, it is characterised in that firming agent is
The mixture of mineral acid and organic acid adds the aqueous solution that the concentration that makes is 40-60%, and the mineral acid can select sulphuric acid, salt
One kind in acid, phosphoric acid, the organic acid is oxalic acid, adipic acid, benzene nitric acid, phenol nitric acid, toluenesulfonic acid, benzenesulfonic acid, oil sulphur
One kind in acid.
6. according to claim 1 a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board, it is characterised in that described stable
Agent is the mixture of tween 80 and methyl-silicone oil.
7. according to claim 1 a kind of modification enhancement mode heat insulating and sound insulating phenolic foam board, the fire retardant be inorganic resistance
Combustion agent Firebrake ZB.
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Cited By (5)
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CN107325482A (en) * | 2017-08-04 | 2017-11-07 | 国网山东省电力公司临沂供电公司 | The method that integrated type foaming prepares the prefabricated nacelle of high intensity |
CN109486096A (en) * | 2018-09-04 | 2019-03-19 | 徐州市华天塑业有限公司 | A kind of novel sound insulating high temperature resistant foam board |
CN110894271A (en) * | 2019-11-28 | 2020-03-20 | 上海应用技术大学 | Method for preparing water-soluble phenolic resin by using composite catalyst |
CN110916945A (en) * | 2019-11-04 | 2020-03-27 | 厦门市妇幼保健院(厦门市计划生育服务中心) | Intelligent temperature-control baby incubator |
CN114752103A (en) * | 2022-05-06 | 2022-07-15 | 杭州艺焓饰材有限公司 | Formula and process for manufacturing phenolic resin plate |
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CN110894271B (en) * | 2019-11-28 | 2022-10-14 | 上海应用技术大学 | Method for preparing water-soluble phenolic resin by using composite catalyst |
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