CN104558669A - Preparation method of phenolic foam board - Google Patents
Preparation method of phenolic foam board Download PDFInfo
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- CN104558669A CN104558669A CN201410434091.XA CN201410434091A CN104558669A CN 104558669 A CN104558669 A CN 104558669A CN 201410434091 A CN201410434091 A CN 201410434091A CN 104558669 A CN104558669 A CN 104558669A
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Abstract
The invention relates to a preparation method of a phenolic foam board. The preparation method comprises the following steps: uniformly mixing a component A which comprises 100 parts of expandable phenolic resin, 2-5 parts of a stabilizer, 8-15 parts of a curing agent and 15-22 parts of a fire retardant; stirring the component A at 35-42 DEG C for 1 at a stirring speed of 300-350 r/min; adding a component B which comprises 5-15 parts of a foaming agent and 0.2-2 parts of a catalyst to continue to stir; gradually heating to 62-65 DEG C to carry out foam. The preparation method of phenolic foam board is simple in process; the used foaming agent is N,N-dinitroso pentamethylene tetramine; the catalyst is used for catalysis, so that the foaming efficiency of the phenolic resin is greatly improved, the foaming uniformity is improved and the sound insulation effect of the phenolic foam board is improved.
Description
Technical field
The invention belongs to chemical field, be specifically related to a kind of preparation method of phenolic foam board.
Background technology
Phenol formaldehyde foam is a kind of heat insulating material the most rising in the building ranks of generally acknowledging in the world, because this novel material and common macromolecule resin rely on and add the material that fire retardant obtains and have the different of essence, do not burn in fire, non-fusible, also toxic smog can not be distributed, and there is light weight, nontoxic, corrosion-free, insulation, energy-conservation, sound insulation, the advantage such as inexpensive, and foam without freonll-11, non-environmental-pollution, processibility are good, easy construction, and its over-all properties is that current various lagging material is incomparable.Be common to the insulation of the senior and central air-conditioning system of high-rise building such as hotel, apartment, hospital.
But phenolic foam board often foams uneven when foaming, and frothing percentage is lower, causes the heat insulation effect of phenolic foam board poor.
Summary of the invention
The object of this invention is to provide a kind of preparation method of phenolic foam board, improve the homogeneity of cystose frothing percentage and foaming.
The present invention is achieved through the following technical solutions:
A preparation method for phenolic foam board, comprises the following steps: by component A: expandable phenolic resin 100 parts, stablizer 2-5 part, solidifying agent 8-15 part, fire retardant 6-10 part mix;
B component: whipping agent 5-15 part, catalyzer 0.2-2 part;
Component A is stirred 1h at 35-42 DEG C, and stirring velocity is 300-350r/min, then adds B component, continues to stir, and is warming up to 62-65 DEG C gradually and foams;
Whipping agent is N, N-dinitrosopentamethlyene tetramine;
Catalyzer is the compound of oxalic acid, hydrochloric acid, Phenylsulfonic acid 3:1:2 by weight;
Stablizer is one or several in dibutyl tin dilaurate, ricinoleate acid barium, Bis(lauroyloxy)dioctyltin;
Solidifying agent is Witco 1298 Soft Acid;
Fire retardant is one in ANTIMONY TRIOXIDE SB 203 99.8 PCT, magnesium hydroxide or two kinds, can also use aluminium hydroxide.
Described phenolic foam board also adds 12-18 part toughner when making, and with B component reacts after being mixed by toughner with component A again.
Described toughner is polyoxyethylene glycol, and polyethylene glycol polymeric degree is 800-1000.
Above-mentioned number is parts by weight.
Beneficial effect of the present invention: the making method technique of phenolic foam board provided by the invention is simple, employing whipping agent is N, N-dinitrosopentamethlyene tetramine, and use catalyzer to carry out catalysis, substantially increase the bubbling efficiency of resol, also improve the homogeneity of foaming, improve the effect of heat insulation of phenolic foam board.
Embodiment
Embodiment 1
A preparation method for phenolic foam board, to comprise the following steps weight be expandable phenolic resin 100 parts, dibutyl tin dilaurate 3 parts, Witco 1298 Soft Acid 12 parts, magnesium hydroxide 9 parts stir 1h at 35 DEG C, and stirring velocity is 320r/min; Then add N, N-dinitrosopentamethlyene tetramine 9 parts, catalyzer 1 part, continue to stir, be warming up to 62 DEG C gradually and foam;
Catalyzer is the compound of oxalic acid, hydrochloric acid, Phenylsulfonic acid 3:1:2 by weight.
Embodiment 2
A preparation method for phenolic foam board, to comprise the following steps weight be expandable phenolic resin 100 parts, ricinoleate acid barium 3 parts, Witco 1298 Soft Acid 12 parts, magnesium hydroxide 10 parts stir 1h at 35 DEG C, and stirring velocity is 300r/min; Then add N, N-dinitrosopentamethlyene tetramine 12 parts, catalyzer 1.2 parts, continue to stir, be warming up to 63 DEG C gradually and foam;
Catalyzer is the compound of oxalic acid, hydrochloric acid, Phenylsulfonic acid 3:1:2 by weight.
Embodiment 3
A kind of preparation method of phenolic foam board, to comprise the following steps weight be expandable phenolic resin 100 parts, dibutyl tin dilaurate 4 parts, Witco 1298 Soft Acid 15 parts, polyoxyethylene glycol 12 parts, ANTIMONY TRIOXIDE SB 203 99.8 PCT 6 parts stir 1h at 39 DEG C, and stirring velocity is 350r/min; Then add N, N-dinitrosopentamethlyene tetramine 13 parts, catalyzer 0.8 part, continue to stir, be warming up to 62 DEG C gradually and foam;
Catalyzer is the compound of oxalic acid, hydrochloric acid, Phenylsulfonic acid 3:1:2 by weight.
Embodiment 4
A kind of preparation method of phenolic foam board, to comprise the following steps weight be expandable phenolic resin 100 parts, Bis(lauroyloxy)dioctyltin 2 parts, Witco 1298 Soft Acid 8 parts, polyoxyethylene glycol 16 parts, magnesium hydroxide 8 parts stir 1h at 40 DEG C, and stirring velocity is 350r/min; Then add N, N-dinitrosopentamethlyene tetramine 12 parts, catalyzer 1.5 parts, continue to stir, be warming up to 65 DEG C gradually and foam;
Catalyzer is the compound of oxalic acid, hydrochloric acid, Phenylsulfonic acid 3:1:2 by weight.
Embodiment 5
A preparation method for phenolic foam board, to comprise the following steps weight be expandable phenolic resin 100 parts, dibutyl tin dilaurate 3.5 parts, Witco 1298 Soft Acid 10.5 parts, magnesium hydroxide 7 parts stir 1h at 38 DEG C, and stirring velocity is 315r/min; Then add N, N-dinitrosopentamethlyene tetramine 12 parts, catalyzer 1.5 parts, continue to stir, be warming up to 64.5 DEG C gradually and foam;
Catalyzer is the compound of oxalic acid, hydrochloric acid, Phenylsulfonic acid 3:1:2 by weight.
Embodiment 6
A preparation method for phenolic foam board, to comprise the following steps weight be expandable phenolic resin 100 parts, dibutyl tin dilaurate 3 parts, Witco 1298 Soft Acid 10 parts, ANTIMONY TRIOXIDE SB 203 99.8 PCT 10 parts stir 1h at 38 DEG C, and stirring velocity is 350r/min; Then add N, N-dinitrosopentamethlyene tetramine 7 parts, catalyzer 0.8 part, continue to stir, be warming up to 64 DEG C gradually and foam;
Catalyzer is the compound of oxalic acid, hydrochloric acid, Phenylsulfonic acid 3:1:2 by weight.
The phenol formaldehyde foam board parameter that table 1 obtains for above-described embodiment:
| Rate of closed hole (/ %) | Thermal conductivity (W/mK) | |
| Embodiment 1 | 91.35 | 0.0213 |
| Embodiment 2 | 91.21 | 0.0216 |
| Embodiment 3 | 92.23 | 0.0206 |
| Embodiment 4 | 90.35 | 0.0289 |
| Embodiment 5 | 89.65 | 0.0281 |
| Embodiment 6 | 92.01 | 0.0218 |
Table 1
As shown in Table 1, phenolic foam board rate of closed hole can reach more than 90%, and thermal conductivity is lower, is applicable to be used as lagging material.
Claims (3)
1. a preparation method for phenolic foam board, is characterized in that: comprise the following steps component A: expandable phenolic resin 100 parts, stablizer 2-5 part, solidifying agent 8-15 part, fire retardant 6-10 part mix;
B component: whipping agent 5-15 part, catalyzer 0.2-2 part;
Component A is stirred 1h at 35-42 DEG C, and stirring velocity is 300-350r/min, then adds B component, continues to stir, and is warming up to 62-65 DEG C gradually and foams;
Whipping agent is N, N-dinitrosopentamethlyene tetramine;
Catalyzer is the compound of oxalic acid, hydrochloric acid, Phenylsulfonic acid 3:1:2 by weight;
Stablizer is one or several in dibutyl tin dilaurate, ricinoleate acid barium, Bis(lauroyloxy)dioctyltin;
Solidifying agent is Witco 1298 Soft Acid;
Fire retardant is one in ANTIMONY TRIOXIDE SB 203 99.8 PCT, magnesium hydroxide or two kinds.
2. the preparation method of a kind of phenolic foam board according to claim 1, is characterized in that: also add 12-18 part toughner when described phenolic foam board makes, with B component react after being mixed by toughner with component A again.
3. the preparation method of a kind of phenolic foam board according to claim 2, is characterized in that: described toughner is polyoxyethylene glycol, and polyethylene glycol polymeric degree is 800-1000.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410434091.XA CN104558669A (en) | 2014-08-29 | 2014-08-29 | Preparation method of phenolic foam board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410434091.XA CN104558669A (en) | 2014-08-29 | 2014-08-29 | Preparation method of phenolic foam board |
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| CN104558669A true CN104558669A (en) | 2015-04-29 |
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| CN201410434091.XA Pending CN104558669A (en) | 2014-08-29 | 2014-08-29 | Preparation method of phenolic foam board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106084636A (en) * | 2016-07-01 | 2016-11-09 | 南宁可煜能源科技有限公司 | A kind of novel flat-plate solar thermal collector phenolic aldehyde foam thermal insulation material |
| CN106084637A (en) * | 2016-07-01 | 2016-11-09 | 南宁可煜能源科技有限公司 | A kind of flat-plate solar collector phenol formaldehyde foam organic insulation material |
| CN106433016A (en) * | 2016-08-30 | 2017-02-22 | 江苏德明新材料有限公司 | Modified reinforced heat insulation and sound insulation phenolic foam plate and production method thereof |
| CN109486096A (en) * | 2018-09-04 | 2019-03-19 | 徐州市华天塑业有限公司 | A kind of novel sound insulating high temperature resistant foam board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102336880A (en) * | 2011-07-15 | 2012-02-01 | 安徽建筑工业学院 | Method for preparing humic acid modified phenolic aldehyde foamed material |
| CN102838770A (en) * | 2012-09-10 | 2012-12-26 | 山东圣泉化工股份有限公司 | Preparation method of phenolic foam boards |
| CN103613904A (en) * | 2013-11-27 | 2014-03-05 | 山东圣泉化工股份有限公司 | Low-density low-acidicity phenol formaldehyde foam board and preparation technique thereof |
-
2014
- 2014-08-29 CN CN201410434091.XA patent/CN104558669A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102336880A (en) * | 2011-07-15 | 2012-02-01 | 安徽建筑工业学院 | Method for preparing humic acid modified phenolic aldehyde foamed material |
| CN102838770A (en) * | 2012-09-10 | 2012-12-26 | 山东圣泉化工股份有限公司 | Preparation method of phenolic foam boards |
| CN103613904A (en) * | 2013-11-27 | 2014-03-05 | 山东圣泉化工股份有限公司 | Low-density low-acidicity phenol formaldehyde foam board and preparation technique thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106084636A (en) * | 2016-07-01 | 2016-11-09 | 南宁可煜能源科技有限公司 | A kind of novel flat-plate solar thermal collector phenolic aldehyde foam thermal insulation material |
| CN106084637A (en) * | 2016-07-01 | 2016-11-09 | 南宁可煜能源科技有限公司 | A kind of flat-plate solar collector phenol formaldehyde foam organic insulation material |
| CN106433016A (en) * | 2016-08-30 | 2017-02-22 | 江苏德明新材料有限公司 | Modified reinforced heat insulation and sound insulation phenolic foam plate and production method thereof |
| CN106433016B (en) * | 2016-08-30 | 2020-08-14 | 南通中保节能科技有限公司 | Preparation method of modified enhanced heat-preservation sound-insulation phenolic foam board |
| CN109486096A (en) * | 2018-09-04 | 2019-03-19 | 徐州市华天塑业有限公司 | A kind of novel sound insulating high temperature resistant foam board |
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Application publication date: 20150429 |
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