CN103613904A - Low-density low-acidicity phenol formaldehyde foam board and preparation technique thereof - Google Patents
Low-density low-acidicity phenol formaldehyde foam board and preparation technique thereof Download PDFInfo
- Publication number
- CN103613904A CN103613904A CN201310610424.5A CN201310610424A CN103613904A CN 103613904 A CN103613904 A CN 103613904A CN 201310610424 A CN201310610424 A CN 201310610424A CN 103613904 A CN103613904 A CN 103613904A
- Authority
- CN
- China
- Prior art keywords
- acid
- low
- foam board
- phenolic foam
- low density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention relates to the technical field of foam thermal-insulation materials, particularly a low-density low-acidicity phenol formaldehyde foam board which is composed of the following components in parts by weight: 100 parts of phenol aldehyde resin, 1-10 parts of emulsifier, 1-10 parts of toughener, 7-12 parts of foaming agent, 3-10 parts of inorganic filler, 3-10 parts of flame retardant and 15-25 parts of organic acid curing agent. The organic acid curing agent is composed of more than one of p-toluenesulfonic acid, dimethyl benzenesulfonic acid, sulfocarbolic acid and benzenesulfonic acid. The high-proportion resin is combined with organic mixed acid into which an inorganic filler is added, and two surfaces are respectively coated with a glass fiber felt layer. The density of the prepared phenol formaldehyde foam board is 25-40 kg/m<3>, the pull strength is higher than 0.1 MPa, the close-pore ratio is higher than 90%, the heat conductivity coefficient is 0.023W/(m.k), and the pH value is higher than 4.5.
Description
technical field
The present invention relates to cellular insulant technical field, the particularly low acid phenolic foam board of a kind of low density, also relates to the preparation technology of the low acid phenolic foam board of described low density.
background technology
Phenolic foam board is because its excellent phenol formaldehyde foam is a kind of porous plastics being obtained by foaming by resol, and LSZH, meets fire without dropping, and flame retardant properties is excellent, and good stability of the dimension, has become one of kind with fastest developing speed in porous plastics.
The development of phenol formaldehyde foam is now at the early-stage, aspect a lot of, exists defect, and density is compared with polyurethane plate with styrofoam, and density is large, intensity is low, fragility is large, pH value is low perishable.Especially pH value, because if pH value is too low, sheet material is met water and is just easily caused and cement-bonded mortar generation acid-base reaction, affects bonding force.Therefore, on the basis of phenol formaldehyde foam excellent flame retardancy, reducing panel density, improving timber intensity, improve sheet material pH value is a very important job.
summary of the invention
In order to solve, above existing phenol formaldehyde foam density is large, intensity is low, the low corrosion-prone problem of pH value, the invention provides the low acid phenolic foam board of low density that a kind of density is little, intensity is high, pH value is high.
The present invention also provides the preparation technology of the low acid phenolic foam board of described low density.
The present invention is achieved by the following measures:
The low acid phenolic foam board of low density, raw material weight proportioning is as follows:
Resol, emulsifying agent, toughner, whipping agent, mineral filler, fire retardant and organic acid solidifying agent weight proportion are 100:(1-10): (1-10): (7-12): (3-10): (3-10): (15-25);
Described organic acid solidifying agent is more than one in tosic acid, acid dimethyl, sulfocarbolic acid and Phenylsulfonic acid.
The low acid phenolic foam board of described low density, in described organic acid solidifying agent, tosic acid and Phenylsulfonic acid weight ratio 1-4:1, be preferably 1:1,7:3 or 6:4.
The low acid phenolic foam board of described low density, described mineral filler is more than one in calcium carbonate, magnesium hydroxide, aluminium hydroxide, calcium oxide, barium sulfate and silicon-dioxide.
The low acid phenolic foam board of described low density, described whipping agent is more than one in methylene dichloride, propylene dichloride, methyl chloride and isopropyl bromide tertiary butyl chloride.
The low acid phenolic foam board of described low density, toughner is selected from one or more in ethylene glycol, Macrogol 200, poly(oxyethylene glycol) 400, polyoxyethylene glycol 800, cetomacrogol 1000, polyvinyl alcohol, paracril.
The low acid phenolic foam board of described low density, emulsifying agent is one or more in polysiloxane, Soxylat A 25-7, polyoxypropylene, Pluronic F68, polyethylene sorbitan-fatty acid ester and polysorbate, tween series, preferably wherein two or morely carries out assembly.
The low acid phenolic foam board of described low density, fire retardant is antimonous oxide, magnesium hydroxide, phosphoric acid ester, halogenated phosphate, triphenylphosphate, TDE, decabromodiphynly oxide, zinc borate, one or more in ammonium polyphosphate and calcium carbonate are composited.
The low acid phenolic foam board of described low density, the mol ratio of formaldehyde and phenol is 1.8-2.3:1, resin viscosity is 9000-20000mpa.s in the time of 25 ℃.
The low acid phenolic foam board of described low density, upper and lower surface is spread glass mat.
The low acid phenolic foam board of described low density, the area density of glass mat is 40-150g/m
2.
The preparation technology of the described low acid phenolic foam board of low density, upper and lower surface at mould is spread glass mat in advance, after resol, toughner, emulsifying agent, mineral filler and fire retardant are fully mixed, adds whipping agent, solidifying agent, after mixing, pour in mould curing molding into.
Beneficial effect of the present invention:
By using high mixture ratio resin, in conjunction with organic mixing acid, in hybrid resin, be added with mineral filler, two surfaces are respectively covered with layer of glass felt, and the phenolic foam board density making is at 25-40kg/m
3, pull strength is more than 0.1Mpa, and rate of closed hole is more than 90%, and below thermal conductivity 0.023W/ (m.k), pH value is more than 4.5.
Embodiment
For a better understanding of the present invention, below in conjunction with specific embodiment, further illustrate.
embodiment 1
5g ethylene glycol (toughner), 5g polysiloxane (emulsifying agent), 5g calcium carbonate (mineral filler), 5g zinc borate are joined in 100g resol, fully stir, add again the propylene dichloride (whipping agent) of 10g and organic mixed curing agent of 20g (tosic acid and Phenylsulfonic acid weight ratio 1:1, concentration is 80%) stir, then on the carrier bar of temperature 60 C, carry out cloth, solidify 10min, plate forming cuts, and obtains finished product.
The resol using the in the preparation mol ratio of formaldehyde and phenol is 2:1, and resin viscosity is 15000mpa.s in the time of 25 ℃.
embodiment 2
2g Macrogol 200 (toughner), 2g Soxylat A 25-7 (emulsifying agent), 5g magnesium hydroxide (mineral filler), 2g antimonous oxide are joined in 100g resol, fully stir, the methylene dichloride (whipping agent) and tosic acid and the Phenylsulfonic acid solidifying agent 15g that 7:3 obtains by weight that add again 10g, stir, then on the carrier bar of temperature 60 C, carry out cloth, cloth density is 35kg/m
3, solidifying 10min, plate forming cuts, and obtains finished product.
The resol using the in the preparation mol ratio of formaldehyde and phenol is 2.3:1, and resin viscosity is 9000mpa.s in the time of 25 ℃.
embodiment 3
10g cetomacrogol 1000 (toughner), 10g polyethylene sorbitan-fatty acid ester (emulsifying agent), 5g calcium oxide (mineral filler), 10g TDE are joined in 100g resol, fully stir, the isopropyl bromide tertiary butyl chloride (whipping agent) and the 22g organic acid solidifying agent (tosic acid: Phenylsulfonic acid weight ratio 6:4 that add again 12g, concentration is 80%), stir, then on the carrier bar of temperature 60 C, carry out cloth, mould upper and lower surface spread glass mat, cloth density is 35kg/m
3, solidifying 10min, plate forming cuts, and obtains finished product.
The resol using the in the preparation mol ratio of formaldehyde and phenol is 2.3:1, and resin viscosity is 20000mpa.s in the time of 25 ℃.
embodiment 4
Compare with embodiment 1, do not add mineral filler, all the other techniques are in full accord with embodiment 1.
embodiment 5
Compare with embodiment 1, whipping agent replaces with iso-pentane, and all the other techniques are in full accord with embodiment 1.
embodiment 6
Compare with embodiment 1, resol replaces with resol, wherein formaldehyde: the mol ratio 1:1.5 of phenol, resin viscosity 6000mpa.s.
, all the other techniques are in full accord with embodiment 1.
embodiment 7
Compare with embodiment 1, solidifying agent replaces with tosic acid and sulfuric acid mass ratio is 5:1, and all the other techniques are in full accord with embodiment 1.
embodiment 8
Compare with embodiment 1, do not add mineral filler, whipping agent replaces with iso-pentane, resol replaces with conventional resol, formaldehyde: the mol ratio 1:1.5 of phenol, resin viscosity 6000mpa.s, solidifying agent replaces with tosic acid and sulfuric acid mass ratio is 5:1, and all the other techniques are in full accord with embodiment 1.
performance Detection
Performance Detection detects according to standard Q-0100SQH 003-2010 performance detection method completely.Rate of closed hole adopts the rate of closed hole instrument that model is ULTRAPY31200e to test.PH value detection method is: use pulverizing mill to pulverize phenol formaldehyde foam, take 2g powder and add 25g distilled water, fully mix and blend 24h, is used pH Meter to detect the pH value of solution.Detected result sees the following form.
The performance index of table 1 above-described embodiment sheet material
| ? | Density kg/m3 | Rate of closed hole/% | Pull strength/MPa | Thermal conductivity w/ (mk) | PH value | Dimensional stability % |
| Embodiment 1 | 33 | 91 | 0.102 | 0.02265 | 4.8 | 1.2 |
| Embodiment 2 | 32 | 92 | 0.1255 | 0.02122 | 4.9 | 1.3 |
| Embodiment 3 | 33 | 95 | 0.1279 | 0.02141 | 4.8 | 0.5 |
| Embodiment 4 | 33 | 60 | 0.0862 | 0.02634 | 1.3 | 2.2 |
| Embodiment 5 | 33 | 63 | 0.0783 | 0.02952 | 2.2 | 1.8 |
| Embodiment 6 | 34 | 42 | 0.0796 | 0.02862 | 2.1 | 2.6 |
| Embodiment 7 | 34 | 31 | 0.0567 | 0.03141 | 1.7 | 1.9 |
| Embodiment 8 | 35 | 49 | 0.0523 | 0.03042 | 1.4 | 1.6 |
From above-mentioned detected result, can find out, the preparation technology who uses the present invention to announce, sheet material is in low-density situation, and intensity is high, pH value is high, thermal conductivity is low, good stability of the dimension.When the high mixture ratio resol that the present invention announces is made sheet material, in the situation that not using glass mat to do surface layer, dimensional stability is used glass mat poor.Integrated using high mixture ratio resin, organic acid solidifying agent, mineral filler and glass mat can significantly improve intensity, the pH value of sheet material and reduce thermal conductivity, the dimensional stability of sheet material.
Above-described embodiment is preferably embodiment of the present invention; but embodiments of the present invention are not subject to the restriction of embodiment; other is any does not deviate from change, modification, the combination made under spirit of the present invention and principle, substitute, simplify and all should be equivalent substitute mode, within being included in protection scope of the present invention.
Claims (10)
1. the low acid phenolic foam board of low density, is characterized in that raw material weight proportioning is as follows:
Resol, emulsifying agent, toughner, whipping agent, mineral filler, fire retardant and organic acid solidifying agent weight proportion are 100:(1-10): (1-10): (7-12): (3-10): (3-10): (15-25);
Described organic acid solidifying agent is more than one in tosic acid, acid dimethyl, sulfuric acid, sulfocarbolic acid and Phenylsulfonic acid.
2. the low acid phenolic foam board of low density according to claim 1, is characterized in that tosic acid and Phenylsulfonic acid weight ratio (1-4) in described organic acid solidifying agent: 1.
3. the low acid phenolic foam board of low density according to claim 1, is characterized in that described mineral filler is more than one in calcium carbonate, magnesium hydroxide, aluminium hydroxide, calcium oxide, barium sulfate and silicon-dioxide.
4. the low acid phenolic foam board of low density according to claim 1, is characterized in that described whipping agent is more than one in methylene dichloride, propylene dichloride, methyl chloride and isopropyl bromide tertiary butyl chloride.
5. the low acid phenolic foam board of low density according to claim 1, is characterized in that toughner is selected from one or more in ethylene glycol, Macrogol 200, poly(oxyethylene glycol) 400, polyoxyethylene glycol 800, cetomacrogol 1000, polyvinyl alcohol, paracril.
6. the low acid phenolic foam board of low density according to claim 1, it is characterized in that emulsifying agent is one or more in polysiloxane, Soxylat A 25-7, polyoxypropylene, Pluronic F68, polyethylene sorbitan-fatty acid ester and polysorbate, tween series, preferably wherein two or morely carry out assembly.
7. the low acid phenolic foam board of low density according to claim 1, it is characterized in that fire retardant is antimonous oxide, magnesium hydroxide, phosphoric acid ester, halogenated phosphate, triphenylphosphate, TDE, decabromodiphynly oxide, zinc borate, one or more in ammonium polyphosphate and calcium carbonate are composited.
8. the low acid phenolic foam board of low density according to claim 1, the mol ratio that it is characterized in that formaldehyde and phenol is 1.8-2.3:1, resin viscosity is 9000-20000mpa.s in the time of 25 ℃.
9. the low acid phenolic foam board of low density according to claim 1, is characterized in that upper and lower surface spreads glass mat, and the area density of glass mat is 40-150g/m
2.
10. the preparation technology of the low acid phenolic foam board of low density described in any one in a claim 1-9, after it is characterized in that resol, toughner, emulsifying agent, mineral filler and fire retardant fully to mix, add whipping agent, solidifying agent, after mixing, pour in mould curing molding into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310610424.5A CN103613904B (en) | 2013-11-27 | 2013-11-27 | A kind of Low-density low-acidicity phenol formaldehyde foam board and preparation technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310610424.5A CN103613904B (en) | 2013-11-27 | 2013-11-27 | A kind of Low-density low-acidicity phenol formaldehyde foam board and preparation technology thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103613904A true CN103613904A (en) | 2014-03-05 |
| CN103613904B CN103613904B (en) | 2016-03-02 |
Family
ID=50164626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310610424.5A Active CN103613904B (en) | 2013-11-27 | 2013-11-27 | A kind of Low-density low-acidicity phenol formaldehyde foam board and preparation technology thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103613904B (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103834137A (en) * | 2014-03-10 | 2014-06-04 | 安飞 | Embedded polyethylene glycol foam board and preparation method thereof |
| CN103865097A (en) * | 2014-03-06 | 2014-06-18 | 山东圣泉化工股份有限公司 | Phenolic foam plate containing nanometer aerogel and production method of phenolic foam plate |
| CN104072941A (en) * | 2014-07-18 | 2014-10-01 | 锦州市好为尔保温材料有限公司 | Nano modified phenolic aldehyde foam insulation board and preparation method thereof |
| CN104327452A (en) * | 2014-11-17 | 2015-02-04 | 锦州市好为尔保温材料有限公司 | Flame-retardant phenolic foam plate |
| CN104558669A (en) * | 2014-08-29 | 2015-04-29 | 霍山捷成科技发展有限公司 | Preparation method of phenolic foam board |
| CN105086357A (en) * | 2015-08-12 | 2015-11-25 | 廊坊厚德科技有限公司 | Pouring-type modified urea resin foaming thermal-insulation material |
| CN105085972A (en) * | 2015-08-31 | 2015-11-25 | 沈阳化工大学 | Method for preparing foamable phenolic resin through acidity reducing phenolic vacuum foaming |
| CN105199312A (en) * | 2015-11-05 | 2015-12-30 | 北京莱恩斯高新技术有限公司 | Neutral phenolic foam plastic and preparation method thereof |
| CN105733173A (en) * | 2014-12-11 | 2016-07-06 | 苏州美克思科技发展有限公司 | Preparation method of high efficient and energy saving phenolic foam board |
| CN106147119A (en) * | 2016-07-01 | 2016-11-23 | 南宁可煜能源科技有限公司 | A kind of flat-plate solar collector phenol formaldehyde foam inorganic heat insulation material |
| CN106432653A (en) * | 2016-08-30 | 2017-02-22 | 江苏德明新材料有限公司 | Environment-friendly phenolic foam insulation board and preparation method thereof |
| CN106592797A (en) * | 2016-11-29 | 2017-04-26 | 怀宁县信宁新型建材有限公司 | External wall insulation board for building |
| CN107286568A (en) * | 2017-08-01 | 2017-10-24 | 方碧水 | A kind of phenol formaldehyde foam and preparation method thereof |
| CN107312292A (en) * | 2017-07-18 | 2017-11-03 | 合肥广能新材料科技有限公司 | Toughening modifying phenolic foam heat insulation plate and preparation method thereof |
| CN107446305A (en) * | 2017-07-18 | 2017-12-08 | 合肥广能新材料科技有限公司 | Phenolic resin warming plate and preparation method thereof |
| CN108841135A (en) * | 2018-06-01 | 2018-11-20 | 山东圣泉新材料股份有限公司 | A kind of resin combination, SMC composite material and preparation method and application |
| CN113956608A (en) * | 2021-10-22 | 2022-01-21 | 山东北理华海复合材料有限公司 | Neutral low-thermal-conductivity phenolic foam material for building thermal insulation and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101475728A (en) * | 2009-01-20 | 2009-07-08 | 江苏丰彩新型建材有限公司 | Phenolic foam for exterior wall heat preservation and preparation thereof |
| CN102604321A (en) * | 2012-03-06 | 2012-07-25 | 张龙 | Flame retardant thermal insulation material and preparation method thereof |
| CN102838770A (en) * | 2012-09-10 | 2012-12-26 | 山东圣泉化工股份有限公司 | Preparation method of phenolic foam boards |
-
2013
- 2013-11-27 CN CN201310610424.5A patent/CN103613904B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101475728A (en) * | 2009-01-20 | 2009-07-08 | 江苏丰彩新型建材有限公司 | Phenolic foam for exterior wall heat preservation and preparation thereof |
| CN102604321A (en) * | 2012-03-06 | 2012-07-25 | 张龙 | Flame retardant thermal insulation material and preparation method thereof |
| CN102838770A (en) * | 2012-09-10 | 2012-12-26 | 山东圣泉化工股份有限公司 | Preparation method of phenolic foam boards |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103865097A (en) * | 2014-03-06 | 2014-06-18 | 山东圣泉化工股份有限公司 | Phenolic foam plate containing nanometer aerogel and production method of phenolic foam plate |
| CN103865097B (en) * | 2014-03-06 | 2016-06-22 | 山东圣泉新材料股份有限公司 | A kind of phenolic foam board comprising nanoporous aerogel and preparation method |
| CN103834137A (en) * | 2014-03-10 | 2014-06-04 | 安飞 | Embedded polyethylene glycol foam board and preparation method thereof |
| CN103834137B (en) * | 2014-03-10 | 2016-08-17 | 沈阳齐民农业科技有限公司 | Embedded Polyethylene Glycol cystosepiment and preparation method thereof |
| CN104072941A (en) * | 2014-07-18 | 2014-10-01 | 锦州市好为尔保温材料有限公司 | Nano modified phenolic aldehyde foam insulation board and preparation method thereof |
| CN104558669A (en) * | 2014-08-29 | 2015-04-29 | 霍山捷成科技发展有限公司 | Preparation method of phenolic foam board |
| CN104327452A (en) * | 2014-11-17 | 2015-02-04 | 锦州市好为尔保温材料有限公司 | Flame-retardant phenolic foam plate |
| CN104327452B (en) * | 2014-11-17 | 2016-06-29 | 锦州市好为尔保温材料有限公司 | A kind of flame retardant type phenolic foam board |
| CN105733173A (en) * | 2014-12-11 | 2016-07-06 | 苏州美克思科技发展有限公司 | Preparation method of high efficient and energy saving phenolic foam board |
| CN105733173B (en) * | 2014-12-11 | 2018-11-13 | 苏州美克思科技发展有限公司 | A kind of preparation method of energy-efficient phenolic foam board |
| CN105086357A (en) * | 2015-08-12 | 2015-11-25 | 廊坊厚德科技有限公司 | Pouring-type modified urea resin foaming thermal-insulation material |
| CN105085972B (en) * | 2015-08-31 | 2017-11-14 | 沈阳化工大学 | One kind reduces acid phenolic aldehyde vacuum foam and prepares expandable phenolic resin method |
| CN105085972A (en) * | 2015-08-31 | 2015-11-25 | 沈阳化工大学 | Method for preparing foamable phenolic resin through acidity reducing phenolic vacuum foaming |
| CN105199312A (en) * | 2015-11-05 | 2015-12-30 | 北京莱恩斯高新技术有限公司 | Neutral phenolic foam plastic and preparation method thereof |
| CN106147119A (en) * | 2016-07-01 | 2016-11-23 | 南宁可煜能源科技有限公司 | A kind of flat-plate solar collector phenol formaldehyde foam inorganic heat insulation material |
| CN106432653A (en) * | 2016-08-30 | 2017-02-22 | 江苏德明新材料有限公司 | Environment-friendly phenolic foam insulation board and preparation method thereof |
| CN106592797A (en) * | 2016-11-29 | 2017-04-26 | 怀宁县信宁新型建材有限公司 | External wall insulation board for building |
| CN107312292A (en) * | 2017-07-18 | 2017-11-03 | 合肥广能新材料科技有限公司 | Toughening modifying phenolic foam heat insulation plate and preparation method thereof |
| CN107446305A (en) * | 2017-07-18 | 2017-12-08 | 合肥广能新材料科技有限公司 | Phenolic resin warming plate and preparation method thereof |
| CN107286568A (en) * | 2017-08-01 | 2017-10-24 | 方碧水 | A kind of phenol formaldehyde foam and preparation method thereof |
| CN108841135A (en) * | 2018-06-01 | 2018-11-20 | 山东圣泉新材料股份有限公司 | A kind of resin combination, SMC composite material and preparation method and application |
| CN108841135B (en) * | 2018-06-01 | 2021-07-09 | 山东圣泉新材料股份有限公司 | Resin composition, SMC composite material, and preparation method and application thereof |
| CN113956608A (en) * | 2021-10-22 | 2022-01-21 | 山东北理华海复合材料有限公司 | Neutral low-thermal-conductivity phenolic foam material for building thermal insulation and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103613904B (en) | 2016-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103613904B (en) | A kind of Low-density low-acidicity phenol formaldehyde foam board and preparation technology thereof | |
| JP5878252B2 (en) | Phenol resin foam and method for producing the same | |
| KR101937118B1 (en) | Phenolic resin foam laminated sheet and method for manufacturing the same | |
| CN107207759B (en) | Phenolic resin foam and method for producing same | |
| TWI655237B (en) | Phenol resin foam and manufacturing method thereof | |
| JP2006335868A (en) | Expandable molding material of resol type phenol resin and phenol resin foam | |
| CN103154106A (en) | Phenol resin foamed plate | |
| TWI764561B (en) | Phenolic Resin Foamed Volume Laminate | |
| CN102382386A (en) | Expandable polystyrene resin board | |
| AU2021208850A1 (en) | Phenolic resin foam laminate board and composite board | |
| WO2019208811A1 (en) | Flame-retardant phenol resin foam | |
| JP7026468B2 (en) | Phenol resin foam laminated board and its manufacturing method | |
| JP6302867B2 (en) | Phenol resin foam laminate and method for producing the same | |
| JP5795410B1 (en) | Phenol resin foam laminate and method for producing the same | |
| WO2023204283A1 (en) | Foamed phenolic-resin object and laminate thereof | |
| JP2020139088A (en) | Method for producing phenolic resin foam | |
| JP2018171885A (en) | Phenol resin foam laminated plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 250204 Shandong city of Ji'nan province Zhangqiu City Diao Town Industrial Development Zone Applicant after: SHANDONG SHENGQUAN NEW MATERIAL CO., LTD. Address before: 250204 Shandong city of Ji'nan province Zhangqiu City Diao Zhen Quan Chemical Industrial Park Applicant before: Shandong Shengquan Chemical Industry Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SHANDONG SHENGQUAN CHEMICAL INDUSTRY CO., LTD. TO: SHANDONG SHENGQUAN NEW MATERIALS CO., LTD. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |