CN107459766A - Phenol formaldehyde foam thermal insulating composite panel and preparation method thereof - Google Patents

Phenol formaldehyde foam thermal insulating composite panel and preparation method thereof Download PDF

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Publication number
CN107459766A
CN107459766A CN201710657955.8A CN201710657955A CN107459766A CN 107459766 A CN107459766 A CN 107459766A CN 201710657955 A CN201710657955 A CN 201710657955A CN 107459766 A CN107459766 A CN 107459766A
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parts
composite panel
thermal insulating
phenol formaldehyde
insulating composite
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汪琦
汪泽维
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Hefei Hong Ding Technology Co Ltd
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Hefei Hong Ding Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0014—Use of organic additives
    • C08J9/0042—Use of organic additives containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0014—Use of organic additives
    • C08J9/0052—Organo-metallic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0066—Use of inorganic compounding ingredients
    • C08J9/0071—Nanosized fillers, i.e. having at least one dimension below 100 nanometers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/12—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
    • C08J9/14—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
    • C08J9/141—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/14—Saturated hydrocarbons, e.g. butane; Unspecified hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2471/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2475/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/14—Applications used for foams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/06—Polymer mixtures characterised by other features having improved processability or containing aids for moulding methods

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

The present invention proposes a kind of phenol formaldehyde foam thermal insulating composite panel and preparation method thereof, in parts by weight, including following raw material：3~6 parts of 80~90 parts of phenolic resin, 10~15 parts of polyurethane, 4~6 parts of nano diatomite, 3~6 parts of tween, 5~10 parts of foaming agent, 10~15 parts of acid curing agent and toughener, the toughener is mainly prepared by waterglass, sodium metaaluminate and polyethylene glycol.Preparation method：1) phenolic resin, polyurethane, nano diatomite, acid curing agent and toughener are well mixed under the conditions of 60~80 DEG C, obtain mixture A；2) mixture A, tween and foaming agent are mixed evenly, are quickly poured into the mould of preheating and foam, solidification.The warming plate intensity and oxygen index (OI) are high, and thermal conductivity factor is low.

Description

Phenol formaldehyde foam thermal insulating composite panel and preparation method thereof
Technical field
The invention belongs to building exterior wall material technical field, and in particular to a kind of phenol formaldehyde foam thermal insulating composite panel and its preparation Method.
Background technology
At present, about 80% building thermal insulation material is combustable organic material, makes a general survey of market, and existing organic insulation material is difficult To reach requirement of the country to fire protecting performance, and inorganic material because water absorption rate is big, easily " condensation ", do not reach wanting for heat preservation energy-saving Ask, therefore with the progressively promulgation and implementation of national policy, it is outside following exterior wall that research and development, which have insulation and the product of fire-proof function concurrently, It is incubated the irreversible development trend in market.It is " double with being incubated that fire prevention can be played with inorganic material-modified organic insulation material Insurance " effect.The material that phenolic aldehyde foam thermal insulation material obtains with common macromolecule resin by addition fire retardant has essence Difference, phenolic foam board fire prevention, naked light does not burn chance, flame resistant penetrates, non-fusible, will not also distribute toxic smog, without dripping off, And with light, corrosion-free, insulation, energy-conservation, sound insulation, it is inexpensive, use temperature range is wide the characteristics of, be preferable heat preservation energy-saving material Material.
The phenolic-aldehyde heat-insulation board of phenolic resin production, possesses the main principal advantages of Polyurethane Thermal Insulation Building Materials, but fire line It can be protruded than hard polyurethane foam, fire resisting combustion penetrates, high temperature resistant, low cigarette, and oxygen index (OI) is up to 50%, but phenolic-aldehyde heat-insulation board and polyurethane Hard bubble compares, and is that fragility is big, acid big the shortcomings that phenolic-aldehyde heat-insulation board maximum.Because the fragility of phenolic-aldehyde heat-insulation board is big, phenolic aldehyde heat preserving There is the problems such as dry linting, elasticity is low, compressive strength is low, and thermal conductivity factor is not up to standard in plate, intrinsic excellent fire protecting performance does not have when in use It can very well be utilized, therefore, influence the extension of the products application technology, while many inconvenience are brought to transport, construction.Especially Pull strength is low, is not easy to meet relevant criterion requirement.Due to acid big so that phenolic-aldehyde heat-insulation board connects with metal, cement-based material Touch and have certain corrosivity.
The content of the invention
In order to solve the problems, such as that the thermal conductivity factor of above phenolic foam board is higher, toughness is bad, the present invention proposes a kind of phenol Aldehyde foam insulation composite board, the warming plate intensity and oxygen index (OI) are high, and thermal conductivity factor is low.
The technical proposal of the invention is realized in this way：
A kind of phenol formaldehyde foam thermal insulating composite panel, in parts by weight, including following raw material：
80~90 parts of phenolic resin, 10~15 parts of polyurethane, 4~6 parts of nano diatomite, 3~6 parts of tween, foaming agent 5~ 3~6 parts of 10 parts, 10~15 parts of acid curing agent and toughener, the toughener is mainly by waterglass, sodium metaaluminate and poly- second two Alcohol is prepared.
Further, the preparation method of the toughener is：
By waterglass with sodium metaaluminate is soluble in water is prepared into solution, surfactant is then added into solution, is stirred Uniformly, after being warming up to 70~80 DEG C, after adding 2~4h of polyethylene glycol reaction, the solid matter for carrying out rotary evaporation acquisition is Toughener.
Further, the surfactant is lauryl sodium sulfate or sodium cetanesulfonate.
Further, the foaming agent is pentamethylene or pentane.
Further, the acid curing agent is phosphoric acid, p-methyl benzenesulfonic acid or phenolsulfonic acid.
It is a further object to provide a kind of preparation method of phenol formaldehyde foam thermal insulating composite panel, including following step Suddenly：
1) phenolic resin, polyurethane, nano diatomite, acid curing agent and toughener are entered under the conditions of 60~80 DEG C Row is well mixed, obtains mixture A；
2) mixture A, tween and foaming agent are mixed evenly, are quickly poured into the mould of preheating and foam, solidified .
Further, the preheating temperature of the step 2) preheated mold is 50~60 DEG C.
Beneficial effect of the present invention：
1st, its toughener of the phenol formaldehyde foam thermal insulating composite panel of the present invention is mainly by waterglass, sodium metaaluminate and polyethylene glycol system Standby to obtain, it not only has toughening effect, improve the intensity and toughness of phenolic foam board, solve the fragility of phenolic foam board with Dusting problems, and have fire resistance concurrently.Although a small amount of polyurethane, which is added, can strengthen its toughness, phenolic aldehyde bubble is reduced The efflorescence degree of foam, but compatibility issue be present with phenolic resin, there is harmful effect to mechanical property.Inventor sends out in surprise The compatibility issue of polyurethane and phenolic resin can be now improved using the toughener of the present invention.
2nd, the thermal conductivity factor of phenol formaldehyde foam thermal insulating composite panel of the invention is 0.020~0.024W/mK, and compressive strength is 0.211~0.228MPa, oxygen index (OI) are 45~50.
Embodiment
Embodiment 1
The preparation method of toughener is：
5 parts by weight waterglass and 5 parts by weight sodium metaaluminates are dissolved in 100 parts by weight water and are prepared into solution, then to molten The lauryl sodium sulfate of 0.5 parts by weight is added in liquid, is stirred, after being warming up to 70 DEG C, adds the poly- second two of 10 parts by weight After alcohol reaction 2h, the solid matter for carrying out rotary evaporation acquisition is toughener.
Embodiment 2
The preparation method of toughener is：
8 parts by weight waterglass and 8 parts by weight sodium metaaluminates are dissolved in 100 parts by weight water and are prepared into solution, then to molten The sodium cetanesulfonate of 1 parts by weight is added in liquid, is stirred, after being warming up to 80 DEG C, adds the polyethylene glycol of 20 parts by weight After reacting 4h, the solid matter for carrying out rotary evaporation acquisition is toughener.
Embodiment 3
A kind of phenol formaldehyde foam thermal insulating composite panel, in parts by weight, including following raw material：
85 parts of phenolic resin, 13 parts of polyurethane, 5 parts, 4 parts Tween 80s of nano diatomite, 7 parts of pentamethylene, p-methyl benzenesulfonic acid 12 parts with 4 parts of the toughener of embodiment 1.
Preparation method：
1) toughener of phenolic resin, polyurethane, nano diatomite, phosphoric acid and embodiment 1 is entered under the conditions of 70 DEG C Row is well mixed, obtains mixture A；
2) mixture A, Tween 80 and pentamethylene are mixed evenly, are quickly poured into the mould of 55 DEG C of preheatings and send out Bubble, solidification.
Embodiment 4
A kind of phenol formaldehyde foam thermal insulating composite panel, in parts by weight, including following raw material：
80 parts of phenolic resin, 10 parts of polyurethane, 4 parts, 3 parts Tween 80s of nano diatomite, 5 parts of pentane, phenolsulfonic acid 11 Part and 3 parts of the toughener of embodiment 2.
Preparation method, comprise the following steps：
1) by the toughener of phenolic resin, phenolsulfonic acid, polyurethane, nano diatomite and embodiment 2 in 60 DEG C of conditions Under be well mixed, obtain mixture A；
2) mixture A, Tween 80 and pentane are mixed evenly, are quickly poured into the mould of 50 DEG C of preheatings and send out Bubble, solidification.
Embodiment 5
A kind of phenol formaldehyde foam thermal insulating composite panel, in parts by weight, including following raw material：
84 parts of phenolic resin, 12 parts of polyurethane, 6 parts, 5 parts Tween 80s of nano diatomite, 8 parts of pentane, 0 part of phosphatase 11 with 5 parts of the toughener of embodiment 1.
Preparation method：
1) by the mixed acid of phenolic resin, polyurethane, nano diatomite, phosphoric acid and p-methyl benzenesulfonic acid and embodiment 1 Toughener is well mixed under the conditions of 62 DEG C, obtains mixture A；
2) mixture A, Tween 80 and pentane are mixed evenly, are quickly poured into the mould of 53 DEG C of preheatings and send out Bubble, solidification.
Embodiment 6
A kind of phenol formaldehyde foam thermal insulating composite panel, in parts by weight, including following raw material：
90 parts of phenolic resin, 15 parts of polyurethane, 4 parts, 6 parts Tween 80s of nano diatomite, 10 parts of pentamethylene, phenolsulfonic acid 15 Part and 6 parts of the toughener of embodiment 2.
Preparation method, comprise the following steps：
1) by the toughener of phenolic resin, polyurethane, nano diatomite, phenolsulfonic acid and embodiment 2 in 80 DEG C of conditions Under be well mixed, obtain mixture A；
2) mixture A, Tween 80 and pentamethylene are mixed evenly, are quickly poured into the mould of 60 DEG C of preheatings and send out Bubble, solidification.
Test example
The warming plate that embodiment 3~6 is prepared carries out performance detection, the results are shown in Table 1.
The warming plate performance test results of 1 embodiment of table 3~6
Thermal conductivity factor (W/mK) Compressive strength (MPa) Oxygen index (OI) (%)
Embodiment 3 0.020 0.228 50
Embodiment 4 0.022 0.223 46
Embodiment 5 0.021 0.216 48
Embodiment 6 0.024 0.211 45
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.

Claims (7)

  1. A kind of 1. phenol formaldehyde foam thermal insulating composite panel, it is characterised in that in parts by weight, including following raw material：
    80~90 parts of phenolic resin, 10~15 parts of polyurethane, 4~6 parts of nano diatomite, 3~6 parts of tween, foaming agent 5~10 3~6 parts of part, 10~15 parts of acid curing agent and toughener, the toughener is mainly by waterglass, sodium metaaluminate and polyethylene glycol It is prepared.
  2. 2. phenol formaldehyde foam thermal insulating composite panel according to claim 1, it is characterised in that the preparation method of the toughener For：
    By waterglass with sodium metaaluminate is soluble in water is prepared into solution, surfactant is then added into solution, is stirred, After being warming up to 70~80 DEG C, after adding 2~4h of polyethylene glycol reaction, the solid matter for carrying out rotary evaporation acquisition is toughness reinforcing Agent.
  3. 3. phenol formaldehyde foam thermal insulating composite panel according to claim 2, it is characterised in that the surfactant is dodecane Base sodium sulphate or sodium cetanesulfonate.
  4. 4. phenol formaldehyde foam thermal insulating composite panel according to claim 1, it is characterised in that the foaming agent is for pentamethylene or just Pentane.
  5. 5. phenol formaldehyde foam thermal insulating composite panel according to claim 1, it is characterised in that the acid curing agent be phosphoric acid, P-methyl benzenesulfonic acid or phenolsulfonic acid.
  6. 6. the preparation method of phenol formaldehyde foam thermal insulating composite panel as claimed in claim 1, it is characterised in that comprise the following steps：
    1) phenolic resin, polyurethane, nano diatomite, acid curing agent and toughener are mixed under the conditions of 60~80 DEG C Close uniformly, obtain mixture A；
    2) mixture A, tween and foaming agent are mixed evenly, are quickly poured into the mould of preheating and foam, solidification.
  7. 7. the preparation method of phenol formaldehyde foam thermal insulating composite panel according to claim 6, it is characterised in that the step 2) is pre- The preheating temperature of mold heat is 50~60 DEG C.
CN201710657955.8A 2017-08-03 2017-08-03 Phenol formaldehyde foam thermal insulating composite panel and preparation method thereof Pending CN107459766A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108276021A (en) * 2018-01-16 2018-07-13 东莞市佳乾新材料科技有限公司 A kind of preparation method of high-performance thermal insulating composite panel
CN113462119A (en) * 2021-08-12 2021-10-01 北海市传创环保科技有限公司 Heat-insulation and heat-preservation plastic and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104327448A (en) * 2014-09-26 2015-02-04 彭定忠 Phenolic foam thermal-insulating fire-proof material and production method thereof
CN105885343A (en) * 2016-05-19 2016-08-24 东南大学 Heat-resistant composite material and preparation method thereof
CN106189063A (en) * 2016-08-01 2016-12-07 合肥广能新材料科技有限公司 Exterior wall phenolic-aldehyde heat-insulation board and preparation method thereof
CN106243613A (en) * 2016-08-01 2016-12-21 合肥广能新材料科技有限公司 Phenol formaldehyde foam thermal insulating composite panel and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104327448A (en) * 2014-09-26 2015-02-04 彭定忠 Phenolic foam thermal-insulating fire-proof material and production method thereof
CN105885343A (en) * 2016-05-19 2016-08-24 东南大学 Heat-resistant composite material and preparation method thereof
CN106189063A (en) * 2016-08-01 2016-12-07 合肥广能新材料科技有限公司 Exterior wall phenolic-aldehyde heat-insulation board and preparation method thereof
CN106243613A (en) * 2016-08-01 2016-12-21 合肥广能新材料科技有限公司 Phenol formaldehyde foam thermal insulating composite panel and preparation method thereof

Non-Patent Citations (1)

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Title
锦州市好为尔保温材料有限公司: "《酚醛泡沫建筑防火保温施工》", 31 January 2015, 中国建材工业出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108276021A (en) * 2018-01-16 2018-07-13 东莞市佳乾新材料科技有限公司 A kind of preparation method of high-performance thermal insulating composite panel
CN113462119A (en) * 2021-08-12 2021-10-01 北海市传创环保科技有限公司 Heat-insulation and heat-preservation plastic and preparation method thereof

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Application publication date: 20171212