CN106189063A - Exterior wall phenolic-aldehyde heat-insulation board and preparation method thereof - Google Patents

Exterior wall phenolic-aldehyde heat-insulation board and preparation method thereof Download PDF

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Publication number
CN106189063A
CN106189063A CN201610624920.XA CN201610624920A CN106189063A CN 106189063 A CN106189063 A CN 106189063A CN 201610624920 A CN201610624920 A CN 201610624920A CN 106189063 A CN106189063 A CN 106189063A
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China
Prior art keywords
parts
insulation board
phenolic
exterior wall
aldehyde heat
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CN201610624920.XA
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Chinese (zh)
Inventor
刘涛
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Hefei Guangneng New Material Technology Co Ltd
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Hefei Guangneng New Material Technology Co Ltd
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Priority to CN201610624920.XA priority Critical patent/CN106189063A/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/12Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
    • C08J9/14Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
    • C08J9/141Hydrocarbons
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00Foams characterized by the expanding agent
    • C08J2203/14Saturated hydrocarbons, e.g. butane; Unspecified hydrocarbons
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2361/04Condensation polymers of aldehydes or ketones with phenols only
    • C08J2361/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2471/00Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2471/02Polyalkylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/14Applications used for foams

Abstract

The present invention proposes a kind of exterior wall phenolic-aldehyde heat-insulation board and preparation method thereof, calculate by weight, including following raw material: phenolic resin 65~75 parts, surfactant 3~6 parts, foaming agent 5~10 parts, firming agent 10~15 parts and toughener 3~6 parts, described toughener is the mixture that nano silicon is formed in alcohol acid salt solution with graphite oxide.Preparation method: comprise the following steps: 1) phenolic resin, firming agent and toughener are carried out mix homogeneously under the conditions of 40~60 DEG C, obtain mixture A;2) by mixture A, surfactant and foaming agent mixing and stirring, it is quickly poured in the mould of preheating foaming, solidifies.This warming plate intensity and oxygen index (OI) are high, and heat conductivity is low.

Description

Exterior wall phenolic-aldehyde heat-insulation board and preparation method thereof
Technical field
The invention belongs to building exterior wall material technical field, be specifically related to a kind of exterior wall phenolic-aldehyde heat-insulation board and preparation side thereof Method.
Background technology
Phenolic-aldehyde heat-insulation board and hard polyurethane foam belong to organic thermosetting thermal insulation material, building energy saving rate the most in recent years together Gradually step up, application insulation material technical performance more and more higher, market demand is increasing.At Application in Building insulation material In application, not only require that physical technique performance is high and it is necessary to reach fire protecting performance.The foam of phenolic resin production and polyurethane Relatively good insulation material is belonged to though hard bubbling, but excellent, shortcoming that two class insulation materials are had nothing in common with each other, not there is fine complex art Performance.The hard polyurethane foam of polyurethane resin synthesis, has the spy such as lightweight, high-strength, heat conductivity is low, good toughness and easy construction Point, but fire protecting performance only up to reach B1 level fire protecting performance, oxygen index (OI) only up to reach 30%.
The phenolic-aldehyde heat-insulation board that phenolic resin produces, possesses the main principal advantages of Polyurethane Thermal Insulation Building Materials, but fire line Can highlight than hard polyurethane foam, fire-resistant combustion penetrates, cigarette high temperature resistant, low, and oxygen index (OI) is up to 50%, but phenolic-aldehyde heat-insulation board and polyurethane Hard bubbling and compare, the shortcoming of phenolic-aldehyde heat-insulation board maximum is that fragility is big, acid big.Owing to the fragility of phenolic-aldehyde heat-insulation board is big, phenolic aldehyde heat preserving There is the problems such as dry linting, elasticity is low, compressive strength is low, and heat conductivity is the most up to standard in plate, intrinsic excellent fire protecting performance does not has in use Can be utilized very well, therefore, affect the extension of this products application technology, bring a lot of inconvenience to transport, construction simultaneously.Especially Pull strength is low, is difficult to meet relevant criterion requirement.Owing to acidity is big so that phenolic-aldehyde heat-insulation board connects with metal, cement-based material Touch and have certain corrosivity.
Summary of the invention
In order to solve the problem that the heat conductivity of above phenolic foam board is higher, toughness is bad, the present invention proposes outside one Wall phenolic-aldehyde heat-insulation board, this warming plate intensity and oxygen index (OI) are high, and heat conductivity is low.
The technical scheme is that and be achieved in that:
A kind of exterior wall phenolic-aldehyde heat-insulation board, calculates, by weight including following raw material:
Phenolic resin 65~75 parts, surfactant 3~6 parts, foaming agent 5~10 parts, firming agent 10~15 parts are with toughness reinforcing Agent 3~6 parts, described toughener is the mixture that nano silicon is formed in alcohol acid salt solution with graphite oxide.
Further, described alcohol hydrochlorate is lactate, malate, tartrate or citrate;Be preferably sodium lactate, Natrium malicum, sodium tartrate or sodium citrate.
Further, the concentration of described alcohol acid salt solution is 2~6wt%.
Further, described surfactant is Tween 80.
Further, described foaming agent is Pentamethylene. or pentane.
Further, described firming agent is the mixed acid of phosphoric acid and p-methyl benzenesulfonic acid.
It is a further object to provide the preparation method of a kind of exterior wall phenolic-aldehyde heat-insulation board, comprise the following steps:
1) phenolic resin, firming agent and toughener are carried out under the conditions of 40~60 DEG C mix homogeneously, obtain mixture A;
2) by mixture A, surfactant and foaming agent mixing and stirring, it is quickly poured in the mould of preheating and sends out Bubble, solidifies.
Further, described step 2) the preheating temperature of preheated mold is 30~50 DEG C.
The method have the benefit that
1, its toughener of exterior wall phenolic-aldehyde heat-insulation board of the present invention is that nano silicon is molten at alcohol hydrochlorate with graphite oxide The mixture formed in liquid, toughening effect is notable, and has the most fire-retardant and heat resistance.Under the conditions of 40~60 DEG C, Phenolic resin, firming agent and toughener mix, beneficially the toughening modifying of phenolic resin.
2, the heat conductivity of the exterior wall phenolic-aldehyde heat-insulation board of the present invention is 0.016~0.021W/m K, and compressive strength is 0.192~0.198MPa, being perpendicular to plate face intensity is 0.122~0.124MPa, and oxygen index (OI) is 65~70.
Detailed description of the invention
Embodiment 1
A kind of exterior wall phenolic-aldehyde heat-insulation board, calculates, by weight including following raw material:
70 parts, 4 parts Tween 80s of phenolic resin, Pentamethylene. 7 parts, phosphoric acid and 12 parts of the mixed acid of p-methyl benzenesulfonic acid and toughener 4 parts, toughener is the mixture that nano silicon is formed in 4wt% sodium citrate solution with graphite oxide.
Preparation method, comprises the following steps:
1) mixed acid and the toughener of phenolic resin, phosphoric acid and p-methyl benzenesulfonic acid are carried out mixing all under the conditions of 50 DEG C Even, obtain mixture A;
2) by mixture A, Tween 80 and Pentamethylene. mixing and stirring, it is quickly poured in the mould of 40 DEG C of preheatings and sends out Bubble, solidifies.
Embodiment 2
A kind of exterior wall phenolic-aldehyde heat-insulation board, calculates, by weight including following raw material:
65 parts, 3 parts Tween 80s of phenolic resin, pentane 5 parts, phosphoric acid and 11 parts of the mixed acid of p-methyl benzenesulfonic acid and toughener 3 parts, toughener is the mixture that nano silicon is formed in 2wt% sodium tartrate solution with graphite oxide.
Preparation method, comprises the following steps:
1) mixed acid and the toughener of phenolic resin, phosphoric acid and p-methyl benzenesulfonic acid are carried out mixing all under the conditions of 40 DEG C Even, obtain mixture A;
2) by mixture A, Tween 80 and pentane mixing and stirring, it is quickly poured in the mould of 30 DEG C of preheatings and sends out Bubble, solidifies.
Embodiment 3
A kind of exterior wall phenolic-aldehyde heat-insulation board, calculates, by weight including following raw material:
The mixed acid of 72 parts, 5 parts Tween 80s of phenolic resin, pentane 8 parts, phosphoric acid and p-methyl benzenesulfonic acid (phosphoric acid with to benzene The mass ratio of sulfonic acid is 3:1) 10 parts with toughener 5 parts, toughener be nano silicon with graphite oxide at 5wt% sodium lactate The mixture formed in solution.
Preparation method, comprises the following steps:
1) mixed acid and the toughener of phenolic resin, phosphoric acid and p-methyl benzenesulfonic acid are carried out mixing all under the conditions of 55 DEG C Even, obtain mixture A;
2) by mixture A, Tween 80 and pentane mixing and stirring, it is quickly poured in the mould of 45 DEG C of preheatings and sends out Bubble, solidifies.
Embodiment 4
A kind of exterior wall phenolic-aldehyde heat-insulation board, calculates, by weight including following raw material:
The mixed acid of 75 parts, 6 parts Tween 80s of phenolic resin, Pentamethylene. 10 parts, phosphoric acid and p-methyl benzenesulfonic acid (phosphoric acid with to benzene The mass ratio of sulfonic acid is 2:1) 15 parts with toughener 6 parts, toughener be nano silicon with graphite oxide at 6wt% malic acid The mixture formed in sodium solution.
Preparation method, comprises the following steps:
1) mixed acid and the toughener of phenolic resin, phosphoric acid and p-methyl benzenesulfonic acid are carried out mixing all under the conditions of 60 DEG C Even, obtain mixture A;
2) by mixture A, Tween 80 and Pentamethylene. mixing and stirring, it is quickly poured in the mould of 50 DEG C of preheatings and sends out Bubble, solidifies.
Embodiment 5
Warming plate embodiment 1-4 prepared carries out performance detection, the results are shown in Table 1.
Table 1 embodiment 1-4 warming plate performance test results
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention Within god and principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.

Claims (8)

1. an exterior wall phenolic-aldehyde heat-insulation board, it is characterised in that calculate by weight, including following raw material:
Phenolic resin 65~75 parts, surfactant 3~6 parts, foaming agent 5~10 parts, firming agent 10~15 parts and toughener 3~ 6 parts, described toughener is the mixture that nano silicon is formed in alcohol acid salt solution with graphite oxide.
Exterior wall phenolic-aldehyde heat-insulation board the most according to claim 1, it is characterised in that described alcohol hydrochlorate is lactate, Fructus Mali pumilae Hydrochlorate, tartrate or citrate.
Exterior wall phenolic-aldehyde heat-insulation board the most according to claim 1 and 2, it is characterised in that the concentration of described alcohol acid salt solution It is 2~6wt%.
Exterior wall phenolic-aldehyde heat-insulation board the most according to claim 1 and 2, it is characterised in that described surfactant is tween 80。
Exterior wall phenolic-aldehyde heat-insulation board the most according to claim 1 and 2, it is characterised in that described foaming agent be Pentamethylene. or Pentane.
Exterior wall phenolic-aldehyde heat-insulation board the most according to claim 1 and 2, it is characterised in that described firming agent is phosphoric acid and right The mixed acid of toluenesulfonic acid.
7. the preparation method of an exterior wall phenolic-aldehyde heat-insulation board as claimed in claim 1, it is characterised in that include following step Rapid:
1) phenolic resin, firming agent and toughener are carried out under the conditions of 40~60 DEG C mix homogeneously, obtain mixture A;
2) by mixture A, surfactant and foaming agent mixing and stirring, foaming it is quickly poured in the mould of preheating, Gu Change.
The preparation method of exterior wall phenolic-aldehyde heat-insulation board the most according to claim 7, it is characterised in that described step 2) preheating The preheating temperature of mould is 30~50 DEG C.
CN201610624920.XA 2016-08-01 2016-08-01 Exterior wall phenolic-aldehyde heat-insulation board and preparation method thereof Pending CN106189063A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107459766A (en) * 2017-08-03 2017-12-12 合肥泓定科技有限公司 Phenol formaldehyde foam thermal insulating composite panel and preparation method thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107459766A (en) * 2017-08-03 2017-12-12 合肥泓定科技有限公司 Phenol formaldehyde foam thermal insulating composite panel and preparation method thereof

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