CN106427180B - 用于均热双面贴膜的制备方法 - Google Patents

用于均热双面贴膜的制备方法 Download PDF

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CN106427180B
CN106427180B CN201610777925.6A CN201610777925A CN106427180B CN 106427180 B CN106427180 B CN 106427180B CN 201610777925 A CN201610777925 A CN 201610777925A CN 106427180 B CN106427180 B CN 106427180B
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graphite
pad pasting
kapton
degree
soaking
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CN106427180A (zh
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金闯
梁豪
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Sidike New Materials Jiangsu Co Ltd
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Sidike New Materials Jiangsu Co Ltd
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
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    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
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Abstract

本发明公开一种用于均热双面贴膜的制备方法，包括第一导热胶粘层、石墨层和第二导热胶粘层；石墨层通过以下工艺方法获得，此工艺方法包括以下步骤：在经过步骤一的聚酰亚胺薄膜的上、下表面均涂覆一层石墨改性剂获得处理后的聚酰亚胺薄膜；将处理后的聚酰亚胺薄膜升温至800℃，保温后在升温至1200℃获得预烧制的碳化膜；采用压延机压延所述步骤四的预烧制的碳化膜；升温至2400℃，保温后再升温至2900℃从而获得主烧制的石墨膜；然后步骤五所得的主烧制的石墨膜进行压延从而获得所述石墨层。本发明避免胶带局部过热，实现了胶带导热性能的均匀性的同时，提高了产品的散热性能稳定性。

Description

用于均热双面贴膜的制备方法
技术领域
本发明涉及一种用于均热双面贴膜的制备方法，属于双面粘贴片技术领域。
背景技术
计算机发展的趋势是发展更轻和更薄的产品，例如，平板电脑和笔记本电脑越来越流行，因为它们灵巧的外形。由于这些产品的尺寸变得更小，散热始终是一个值得考虑的方面,，高温会降低电子设备的性能、可靠性和使用寿命。因此，当前电子行业对于作为热控系统核心部件的散热材料提出越来越高的要求，迫切需要一种高效导热、轻便的材料迅速将热量传递出去，保障电子设备正常运行。均热片是一种在热源和辅助热交换器之间传递热的热交换器，其表面区域和形状比起热源更有利于散热。通过均热片，由热源产生的热“扩散”至辅助热交换器，这样得以很好的消除热源中的热积蓄。
现有技术中聚酰亚胺薄膜大多用于柔性电路板，虽然有采用聚酰亚胺薄膜烧结获得石墨散热片，从而贴覆在热源上，但是受限于聚酰亚胺薄膜的产品质量和性能的良莠不齐，影响到了散热双面贴膜散热性能的发挥，存在以下技术问题：散热不均匀，易出现胶带局部过热，提高了产品的散热性能不稳定、可靠性性能差，不利于产品质量管控，影响产品的竞争力，如何克服上述技术问题成为本领域技术人员努力的方向。
发明内容
本发明目的是提供一种用于均热双面贴膜的制备方法，该制备方法获得的均热双面贴膜在垂直方向和水平方向均提高了导热性能，避免胶带局部过热，实现了胶带导热性能的均匀性的同时，提高了产品的散热性能稳定性、可靠性，大大降低了产品的成本。
为达到上述目的，本发明采用的技术方案是：一种用于均热双面贴膜的制备方法，所述均热双面贴膜贴合于散热件和发热部件之间，所述散热双面贴膜包括轻剥离型PET膜和重剥离型PET膜，此轻剥离型PET膜和重剥离型PET膜之间依次设置有第一导热胶粘层、石墨层和第二导热胶粘层；其特征在于：所述石墨层通过以下工艺方法获得，此工艺方法包括以下步骤：
步骤一、将聚酰亚胺薄膜从室温升至250℃，保温后升至400℃后降至室温；
步骤二、在经过步骤一的聚酰亚胺薄膜的上、下表面均涂覆一层石墨改性剂获得处理后的聚酰亚胺薄膜，所述石墨改性剂的粘度为30000~48000cP；
所述石墨改性剂由以下重量份的组分组成：
二苯甲酮四酸二酐 23.5份，
均苯四甲酸二酐 16份，
二氨基二苯甲烷 25份，
二甲基甲酰胺 32.5份，
乙二醇 2.5份，
聚二甲基硅氧烷 2.5份；
步骤三、以4~6度/min的速度升至800℃，保持0.9~1.1小时；再以9~11度/min的速度升至1200℃，保持0.9~1.1小时后冷却，从而获得预烧制的碳化膜；
步骤四、采用压延机压延所述步骤三的预烧制的碳化膜；
步骤五、以19~21度/min的速度升至2400℃，保持0.9~1.1小时，再以19~21度/min的速度升至2900℃，保持1.8~2.2小时后冷却，从而获得主烧制的石墨膜；
步骤六、然后步骤五所得的主烧制的石墨膜进行压延从而获得所述石墨层。
上述技术方案中进一步改进的方案如下：
1、上述方案中，所述步骤一中将聚酰亚胺薄膜以4~6度/min速度从室温升至250℃，保持0.9~1.1小时，然后以2.5~3.5度/min，升至400℃，保持1小时后降至室温。
2、上述方案中，将所述步骤六获得石墨膜进行压延处理。
3、上述方案中，所述轻剥离型PET膜剥离力的克重为5~10g/m2。
由于上述技术方案运用，本发明与现有技术相比具有下列优点和效果：
本发明用于均热双面贴膜的制备方法，其结构中石墨层由上、下表面均涂覆一层石墨改性剂的聚酰亚胺薄膜制备而成，提高了在垂直方向和水平方向的导热性能，避免胶带局部过热，实现了胶带导热性能的均匀性；其次，其位于聚酰亚胺薄膜表面的石墨改性剂由二苯甲酮四酸二酐、均苯四甲酸二酐、二氨基二苯甲烷、二甲基甲酰胺、乙二醇、聚二甲基硅氧烷组成，涂覆于聚酰亚胺薄膜上，填充了加热过程中的针孔，提高了结晶度同时，也克服了热收缩过大导致的不均匀，提高了石墨层双向拉伸性能；再次，聚酰亚胺薄膜表面具有石墨改性剂，改善了双面贴膜中石墨层与导热胶粘层导热性能，且采用压延机压延所述预烧制的碳化膜，避免了褶皱和石墨化烧结过程中的体积收缩，提高了致密性和结晶度，进一步提高了在垂直方向和水平方向的导热性能。
具体实施方式
下面结合实施例对本发明作进一步描述：
实施例：一种用于均热双面贴膜的制备方法，所述散热双面贴膜贴合于散热件和发热部件之间，所述散热双面贴膜包括轻剥离型PET膜和重剥离型PET膜，此轻剥离型PET膜和重剥离型PET膜之间依次设置有第一导热胶粘层、石墨层和第二导热胶粘层；所述石墨层通过以下工艺方法获得，此工艺方法包括以下步骤：
步骤一、将聚酰亚胺薄膜以4~6度/min速度从室温升至250℃，保持0.9~1.1小时，然后以2.5~3.5度/min，升至400℃，保持1小时后降至室温；
步骤二、在经过步骤一的聚酰亚胺薄膜的上、下表面均涂覆一层石墨改性剂获得处理后的聚酰亚胺薄膜，所述石墨改性剂由以下重量份的组分组成：
二苯甲酮四酸二酐 23.5份，
均苯四甲酸二酐 16份，
二氨基二苯甲烷 25份，
二甲基甲酰胺 32.5份，
乙二醇 2.5份，
聚二甲基硅氧烷 2.5份；
实施例的石墨改性剂的粘度为38000cP；
步骤三、以4~6度/min的速度升至800℃，保持0.9~1.1小时；再以9~11度/min的速度升至1200℃，保持0.9~1.1小时后冷却，从而获得预烧制的碳化膜；
步骤四、采用压延机压延所述步骤三的预烧制的碳化膜；
步骤五、以19~21度/min的速度升至2400℃，保持0.9~1.1小时，再以19~21度/min的速度升至2900℃，保持1.8~2.2小时后冷却，从而获得主烧制的石墨膜；
步骤六、然后步骤五所得的主烧制的石墨膜进行压延从而获得所述石墨层。
将所述步骤六获得石墨层进行压延处理。
上述轻剥离型PET膜剥离力的克重为5~10g/m2，所述重剥离型PET膜剥离力的克重为50~100g/m2。
采用上述用于均热双面贴膜的制备方法时，其结构中石墨层由上、下表面均涂覆一层石墨改性剂的聚酰亚胺薄膜制备而成，提高了在垂直方向和水平方向的导热性能，避免胶带局部过热，实现了胶带导热性能的均匀性；其次，其位于聚酰亚胺薄膜表面的石墨改性剂由二苯甲酮四酸二酐、均苯四甲酸二酐、二氨基二苯甲烷、二甲基甲酰胺、乙二醇、聚二甲基硅氧烷组成，涂覆于聚酰亚胺薄膜上，填充了加热过程中的针孔，提高了结晶度同时，也克服了热收缩过大导致的不均匀，提高了石墨层双向拉伸性能；再次，聚酰亚胺薄膜表面具有石墨改性剂，改善了双面贴膜中石墨层与导热胶粘层导热性能，且采用压延机压延所述预烧制的碳化膜，避免了褶皱和石墨化烧结过程中的体积收缩，提高了致密性和结晶度，进一步提高了在垂直方向和水平方向的导热性能。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (4)

1.一种用于均热双面贴膜的制备方法，所述均热双面贴膜贴合于散热件和发热部件之间，所述散热双面贴膜包括轻剥离型PET膜和重剥离型PET膜，此轻剥离型PET膜和重剥离型PET膜之间依次设置有第一导热胶粘层、石墨层和第二导热胶粘层；其特征在于：所述石墨层通过以下工艺方法获得，此工艺方法包括以下步骤：
步骤一、将聚酰亚胺薄膜从室温升至250℃，保温后升至400℃后降至室温；
步骤二、在经过步骤一的聚酰亚胺薄膜的上、下表面均涂覆一层石墨改性剂获得处理后的聚酰亚胺薄膜，所述石墨改性剂的粘度为30000~48000cP；
所述石墨改性剂由以下重量份的组分组成：
二苯甲酮四酸二酐 23.5份，
均苯四甲酸二酐 16份，
二氨基二苯甲烷 25份，
二甲基甲酰胺 32.5份，
乙二醇 1.5~2.5份，
聚二甲基硅氧烷 2~3份；
步骤三、以4~6度/min的速度升至800℃，保持0.9~1.1小时；再以9~11度/min的速度升至1200℃，保持0.9~1.1小时后冷却，从而获得预烧制的碳化膜；
步骤四、采用压延机压延所述步骤三的预烧制的碳化膜；
步骤五、以19~21度/min的速度升至2400℃，保持0.9~1.1小时，再以19~21度/min的速度升至2900℃，保持1.8~2.2小时后冷却，从而获得主烧制的石墨膜；
步骤六、然后步骤五所得的主烧制的石墨膜进行压延从而获得所述石墨层。
2.根据权利要求1所述的用于均热双面贴膜的制备方法，其特征在于：所述步骤一中将聚酰亚胺薄膜以4~6度/min速度从室温升至250℃，保持0.9~1.1小时，然后以2.5~3.5度/min，升至400℃，保持1小时后降至室温。
3.根据权利要求1所述的用于均热双面贴膜的制备方法，其特征在于：将所述步骤六获得石墨层进行压延处理。
4.根据权利要求1所述的用于均热双面贴膜的制备方法，其特征在于：所述轻剥离型PET膜剥离力的克重为5~10g/m2。
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