CN106413342A - Cooling structure and electronic product - Google Patents
Cooling structure and electronic product Download PDFInfo
- Publication number
- CN106413342A CN106413342A CN201610811589.2A CN201610811589A CN106413342A CN 106413342 A CN106413342 A CN 106413342A CN 201610811589 A CN201610811589 A CN 201610811589A CN 106413342 A CN106413342 A CN 106413342A
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- China
- Prior art keywords
- radiating segment
- heat absorption
- radiating
- absorption area
- segment
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a cooling structure, comprising a cold plate and a pipeline. The cold plate comprises a heat absorption area for matching a heating element. The pipeline comprises a liquid inlet segment, a first heat dissipation segment, a connection segment, a second heat dissipation segment and a liquid outlet segment which are connected in sequence. The first heat dissipation segment is bended towards the heat absorption area. The second heat dissipation segment is bended towards the heat absorption area. The bending direction of the first heat dissipation segment and the bending direction of the second heat dissipation segment are opposite. The first heat dissipation segment and the second heat dissipation segment are located at two sides of a central position of a heat source in the heat absorption area. The invention also discloses an electronic product. According to the cooling structure and the electronic product, the heat dissipation efficiency of the heating element can be improved.
Description
Technical field
The present invention relates to the field of radiating of heater members, with reference to the cooling structure of pipeline and have described particularly to cold drawing
The electronic product of cooling structure.
Background technology
Heater element in electronic product needs cooling system, and in prior art, liquid cold plate is combined with pipeline to heating unit
Part carries out radiating commonly used.With electronic product volume towards lightening development, in limited space, how to improve
The radiating efficiency of heater element, is the direction that industry is persistently studied.
Content of the invention
The present invention provides a kind of cooling structure and electronic product, it is possible to increase the radiating efficiency of heater element.
To achieve these goals, embodiment of the present invention provides following technical scheme：
In a first aspect, the present invention provide a kind of cooling structure, including cold drawing and pipeline, cold drawing include for heater element
The heat absorption area matching, heater element can be chip.Specifically, can be directly to fit between heat absorption area and heater element
Relation it is also possible to area of absorbing heat is conformed to by heater element by heat-conducting glue or other heat-conducting medium.Pipeline includes being sequentially connected
Enter liquid section, the first radiating segment, linkage section, the second radiating segment and go out liquid section；Described first radiating segment is to described heat absorption area inflection
Folding, described second radiating segment is to described heat absorption area inner bending, the overbending direction of described first radiating segment and described second radiating segment
Overbending direction contrary, and described first radiating segment is located at the source center both sides in described heat absorption area with described second radiating segment.
Source center position can be considered as the center in area of absorbing heat.
The present invention has the beneficial effects that：The present invention passes through for pipeline to form the first radiating segment and the second radiating segment, and, the
One radiating segment and the second radiating segment laterally absorb heats area's inner bending from heat absorption area two respectively, the overbending direction of described first radiating segment and
The overbending direction of described second radiating segment is contrary, and described first radiating segment is located at described heat absorption area with described second radiating segment
Source center both sides so that partly described first radiating segment and partly described second radiating segment concentrate conform in described thermal source
At heart position.The present invention passes through the core layout of pipeline, at source center position, to reduce thermal resistance, reduce heating
Component temperature, can improve radiating efficiency.
In a kind of embodiment, from described source center to around extending the heat that preset range is set as described heat absorption area
Concentrated area, the first side pipe that described first radiating segment includes being sequentially connected, pipe and the second side pipe in first, described first side pipe
With described second side pipe be respectively connecting to described in enter liquid section and described linkage section, described second radiating segment includes being sequentially connected
Three side pipes, pipe and the 4th side pipe in second, described 3rd side pipe and described 4th side pipe go out liquid section and institute described in being respectively connecting to
State linkage section, in pipe and described second in described first, pipe is located in described hot concentrated area.
In a kind of embodiment, described first side pipe, pipe and described second side pipe are collectively forming U-shaped structure in described first
Or C-shaped configuration.
In a kind of embodiment, described 3rd side pipe, pipe and described 4th side pipe are collectively forming U-shaped structure in described second
C-shaped configuration.
That is the first radiating segment and the second radiating segment are arranged back-to-back, and the first radiating segment and the second radiating segment are respectively formed
There is the semi-surrounding structure (such as U-shaped structure or C-shaped configuration) of opening, the opening of the two is towards on the contrary.Arrange back-to-back
Structure make absorb heat area central area (i.e. near source center position) can be with centralized arrangement pipeline, such pipeline can carry
Rise radiating efficiency.
In a kind of embodiment, described cold drawing has heat-sinking capability, and described linkage section is located in the range of described cold drawing.
Furthermore, described enter liquid section and described go out liquid section outside described heat absorption area, described enter liquid section and described go out
Liquid section is oppositely arranged on the both sides in described heat absorption area, described enter liquid section and described go out liquid section be located at described heat absorption area away from described
The side of linkage section.
In a kind of embodiment, the quantity in described heat absorption area is at least two, and the quantity of described first radiating segment is at least
Two and enter between liquid section and described linkage section described in being connected in, the quantity of described second radiating segment is at least two and is connected in
Described go out between liquid section and described linkage section, be respectively provided with each described heat absorption area described in described first radiating segment and one
Second radiating segment.
Cooling structure in present embodiment is that at least two heater elements in same electronic product are cooled down simultaneously
Radiating, can eliminate hot cascade phenomenon between at least two heater elements so that the temperature of each heater element keeps uniformly.With two
As a example individual heat absorption area, how explanation present embodiment eliminates hot cascade phenomenon, and two heating elements are pressed close to respectively by two heat absorption areas,
For convenience of explanation, two heat absorption areas number respectively is A heat absorption area and B heat absorption area.First radiating segment of pipeline and the second radiating
The quantity of section is respectively two, and for convenience of explanation, it is A radiating that two the first radiating segments and two the second radiating segments are numbered respectively
Section, B radiating segment, C radiating segment and D radiating segment.A radiating segment, B radiating segment, C radiating segment and D radiating segment are sequentially connected in series on pipeline,
It is arranged in order from upstream to downstream.A radiating segment and D radiating segment are arranged in A heat absorption area, dissipate for one of heater element
Heat.B radiating segment and C radiating segment are arranged in B heat absorption area, for the radiating of another heater element.Cold-producing medium in pipeline flows successively
Through A radiating segment, B radiating segment, C radiating segment and D radiating segment, the A radiating segment positioned at most upstream and be located at most downstream D radiating segment group
Be combined into the radiating of one of heater element, such compound mode make to include in each heat absorption area the radiating segment of upstream and under
The radiating segment of trip, can balance each and inhale hot zone temperature, thus eliminating hot cascade phenomenon so that each temperature of heating elements is equal
Even, it is more beneficial for improving heat radiation efficiency.
In a kind of embodiment, the pipeline being connected between described at least two first radiating segments is in straight tubulose.
In a kind of embodiment, the pipeline being connected between described at least two first radiating segments includes bending segment.Specifically
For, the bending segment of the pipeline between two adjacent the first radiating segments includes 90 degree of bending angles, and that is, adjacent two first dissipate
The layout of hot arc differs 90 degree.Correspondingly, the layout of two adjacent the second radiating segments also differs 90 degree.
In a kind of embodiment, described cold drawing is provided with conduit, and the shape that described conduit extends is extended with described pipeline
Mating shapes, described pipeline is attached in described conduit.
In a kind of embodiment, described pipeline is assembled in described conduit by way of crimping.Between conduit and pipeline
For interference fit.
In a kind of embodiment, in described conduit, it is provided with heat-conducting medium, described heat-conducting medium is located at described pipeline and described
Between the inwall of described conduit of cold drawing.
Described heat-conducting medium can be heat-conducting glue or epoxy resin.
In other embodiment, pipeline can also be fixed in the channel by way of welding.
Second aspect, the present invention also provides a kind of electronic product, and described electronic product is included described in above-mentioned any one
Cooling structure and heater element, the described heat absorption area of described cooling structure is mated with described heater element, thinks that heater element dissipates
Heat.Specifically, can be the relation directly fitted it is also possible to be led by heat-conducting glue or other between heat absorption area and heater element
Area of absorbing heat is conformed to heater element by thermal medium.
Brief description
In order to be illustrated more clearly that technical scheme, below by the accompanying drawing work to use required in embodiment
Simply introduce it should be apparent that, drawings in the following description are only some embodiments of the present invention, general for this area
For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained as these accompanying drawings.
The decomposing schematic representation of the cold drawing structure that Fig. 1 provides for the first embodiment of the present invention, wherein cold drawing and pipeline divides
Open signal, specifically used during pipeline be arranged on cold drawing.
The cold drawing structural representation that Fig. 2 provides for second embodiment of the present invention.
Fig. 3 is the schematic diagram of the pipeline of cold drawing structure shown in Fig. 2.
Fig. 4 is the structural representation of the cold drawing of cold drawing structure shown in Fig. 2.
The cold drawing structural representation that Fig. 5 provides for the third embodiment of the present invention.
Fig. 6 is the schematic diagram of the pipeline of cold drawing structure shown in Fig. 5.
Fig. 7 is the structural representation of the cold drawing of cold drawing structure shown in Fig. 5.
Specific embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is carried out clearly
Chu, it is fully described by.
The present invention relates to the cooling structure of the heater element in electronic product.
As shown in figure 1, cooling structure includes cold drawing 10 and pipeline 20.Cold drawing 10 has heat conduction and heat sinking function.A kind of real
Apply in mode, cold drawing 10 is metal sheet, for example：Cold drawing 10 is aluminum alloy material or steel plate etc..In other embodiment, cold drawing
10 can also be other Heat Conduction Materials, such as ceramic wafer or the plastics with the capacity of heat transmission.Cold drawing 10 include for heating
The heat absorption area 11 of element laminating.Heater element can be the chip in electronic product.In cold drawing 10 shown in Fig. 1, dotted line frame represents
Square region represents heat absorption area 11.Heat absorption area 11 is matched with heater element, and the meaning that the two matches is：Heat absorption area 11 is just right
Heater element is arranged, and specifically, the area of cold drawing 10 can be more than the area of heater element, and the heat absorption area 11 in cold drawing 10 refers to
Be the part pressed close to heater element in cold drawing 10.Furthermore, heat absorption area 11 can be fitted with heater element, or
Heat-conducting medium is set between heat absorption area 11 and heater element, by heat-conducting medium, the conduction of heat that heater element is distributed extremely is inhaled
Hot-zone 11.Heat absorption area 11 can be consistent with the shape of heater element, and in other embodiment, the shape in area 11 of absorbing heat can also be with
Heater element is different, and for example, heater element specifically generates heat and concentrates heart district domain wherein, as long as heat absorption area 11 and heater element center
Region matches.Specifically, can directly fit between heat absorption area 11 and heater element it is also possible to pass through heat-conducting glue or other
Area 11 of absorbing heat is conformed to heater element by heat-conducting medium.Being provided for of heat-conducting glue or other heat-conducting medium assists conduction of heat.
In present embodiment, cold drawing 10 includes conduit 12, and conduit 12 is used for fixing pipeline 20, the shape that described conduit 12 extends
The shape that shape is extended with described pipeline 20 is identical, and described pipeline 20 is attached in described conduit 12.Pipeline 20 can be by crimping
Or the mode of welding is fixed in conduit 12.When described pipeline 20 is assembled in described conduit 12 by way of crimping, conduit
For interference fit that is to say, that the interior space dimension of conduit 12 is slightly smaller compared with pipeline 20 between 12 and pipeline 20, so, pass through
Conduit 12 deformation of itself, pipeline 20 is choked.By the setting of conduit 12, when installation pipeline 20, can be directly by pipe
Road 20 is stuck in conduit 12, accurate positioning, and easy for installation.
In other embodiment, cold drawing 10 can be not provided with conduit, and pipeline 20 is directly arranged on the surface of cold drawing, permissible
By snap assembled it is also possible to be fixed by way of welding, the benefit that cold drawing 10 is not provided with conduit is so that the structure of cold drawing
Simplify it is also possible to save manufacturing cost.
It is provided with heat-conducting medium, described heat-conducting medium is described located at described pipeline 20 and described cold drawing 10 in described conduit 12
Between the inwall of conduit 12.Described heat-conducting medium can be heat-conducting glue or epoxy resin.
Heat is taken away by liquid filling body in pipeline 20 by the flowing of liquid, and liquid can be water or other refrigeration working medium
(for example：Freon R22).What pipeline 20 included being sequentially connected enters liquid section 21, the first radiating segment 22, linkage section 23, second radiating
Section 24 and go out liquid section 25.In a kind of embodiment, described enter liquid section 21 and described go out liquid section 25 outside described heat absorption area 11, enter
Liquid section 21 is separately positioned on the relative both sides in described heat absorption area 11 with going out liquid section 25, enters liquid section 21 and goes out liquid section 25 positioned at described
The side away from described linkage section 23 in heat absorption area 11.Heat absorption area 11 is the region of closing, has its border, the area that border surrounds
Interior zone is referred to as absorbing heat in area 11, and border outer region is referred to as absorbing heat outside area 11.For example, the heat absorption area 11 shown in Fig. 1
Square, the square outer region that heat absorption area 11 refers to outward, refer to square heat absorption area 11 area encompassed in heat absorption area 11.Described
One radiating segment 22 to described heat absorption area 11 inner bending, described second radiating segment 24 to described heat absorption area 11 inner bending, described first
The overbending direction of radiating segment 22 is contrary with the overbending direction of described second radiating segment 24, the first radiating segment 22 and the second radiating segment 24
It is located at the both sides of the source center in described heat absorption area 11 respectively, so that partly described first radiating segment 22 and partly described second
Radiating segment 24 is concentrated and is conformed at described source center position.Source center position can be considered as the center in area 11 of absorbing heat, that is,
The center of heater element.
Specifically, enter liquid section 21 and go out liquid section 25 and be parallel to each other.Linkage section 23 can be the shape such as C-shaped, to realize
From the side in heat absorption area 11 across heat absorption area 11, and the two ends of linkage section 23 are respectively connecting to the first radiating segment 22 He to linkage section 23
Described second radiating segment 24, the orthographic projection on linkage section 23 of the first radiating segment 22 and the second radiating segment 24 is located at linkage section 23 institute
In the range of covering.
The present invention has the beneficial effects that：The present invention passes through for pipeline 20 to form the first radiating segment 22 and the second radiating segment 24,
And, described first radiating segment 22 and described second radiating segment 24 are respectively in 11 liang of described heat absorption area laterally described heat absorption area 11
Bending, the overbending direction of described first radiating segment 22 is contrary with the overbending direction of described second radiating segment 24, and described first dissipates
Hot arc is located at the source center position both sides in described heat absorption area 11 with described second radiating segment, so that partly described first radiating
Section 22 and partly described second radiating segment 24 are concentrated and are conformed at described source center position.The present invention passes through described pipeline 20
Section layout, at source center position, can reduce thermal resistance, reduce temperature of heating elements, can improve radiating efficiency.
From described source center to around extending the hot concentrated area that preset range is set as described heat absorption area 11.Described
Preset range refer to the region in the segment distance near source center position.Can be according to the path of pipeline 20 extension and pipeline
20 diameter is determining preset range.For example, the scope that elliptic region as shown in Figure 1 is comprised is hot concentrated area.
Specifically, described first radiating segment 22 includes pipe 222 and second in the first side pipe 221, first being sequentially connected
Side pipe 223, described first side pipe 221 connect to described enter liquid section 21, described second side pipe 223 connects to described linkage section 23.
Described second radiating segment 24 includes pipe 242 and the 4th side pipe 243 in the 3rd side pipe 241, second being sequentially connected, described 3rd side
Pipe 241 connect to described go out liquid section 25, described 4th side pipe 243 connects to described linkage section 23, pipe 222 and institute in described first
State pipe 242 in second to be located in described hot concentrated area.Specifically, in pipe 222 and second, pipe 242 is close to each other in first,
The two distance is more near better.In pipe 222 and second in first, pipe 242 is located near the source center in described heat absorption area 11.
Described first side pipe 221, pipe 222 and described second side pipe 223 are collectively forming U-shaped structure or C-shaped in described first
Structure.
Described 3rd side pipe 241, pipe 242 and described 4th side pipe 243 are collectively forming U-shaped structure C-shaped knot in described second
Structure.
That is the first radiating segment 22 and the second radiating segment 24 are arranged back-to-back, the first radiating segment 22 and the second radiating segment
24 are respectively formed the semi-surrounding structure (such as U-shaped structure or C-shaped configuration) with opening, and the opening of the two is towards on the contrary.Lean against
The back of the body is provided in such a structure that the central area (i.e. near source center position) in heat absorption area 11 can be with centralized arrangement pipeline 20, so
Pipeline 20 being capable of improving heat radiation efficiency.
As shown in Fig. 2 described linkage section 23 is located in the range of described cold drawing 10, because described cold drawing 10 has heat radiation energy
Power, linkage section 23 is arranged in the range of cold drawing 10, and linkage section 23 also plays the effect of refrigeration, and therefore present embodiment can carry
Rise the refrigeration of cooling structure.
In other embodiment, as shown in figure 5, linkage section 23 can also extend to outside the scope of cold drawing 10.
Refer to Fig. 2 and Fig. 5, the quantity in described heat absorption area 11 is at least two, at least two heat absorption areas 11 can distinguish
It is arranged on different cold drawings 10 that is to say, that the quantity of cold drawing 10 is at least two, also may be used in certain at least two heat absorption areas 11
To be arranged on same cold drawing 10.Correspondingly, the quantity of described first radiating segment 22 is at least two and enters described in being connected in
Between liquid section 21 and described linkage section 23, the quantity of described second radiating segment 24 is at least two and goes out liquid section 25 described in being connected in
And described linkage section 23 between, and described first radiating segment 22 corresponds and is arranged in described heat absorption area 11, and described second dissipates
Hot arc 24 corresponds and is arranged in described heat absorption area 11, is respectively provided with described first radiating in each described heat absorption area 11
Section 22 and described second radiating segment 24.In examples of implementation shown in Fig. 2 and Fig. 5, the quantity of cold drawing 10 is two, and each is cold
One heat absorption area 11 is equipped with plate 10.Pipeline 20 includes two the first radiating segments 22 and two the second radiating segments 24.
Cooling structure in present embodiment is that at least two heater elements in same electronic product are cooled down simultaneously
Radiating, can eliminate hot cascade phenomenon between at least two heater elements so that the temperature of each heater element keeps uniformly.Please join
Read Fig. 2, taking two heat absorption areas as a example how explanation present embodiment eliminates hot cascade phenomenon, two heat absorption areas 11 press close to two respectively
Individual heater element, for convenience of explanation, it is A heat absorption area and B heat absorption area that two heat absorption areas 11 number respectively, for convenience of explanation,
In fig. 2, A heat absorption area is placed in bracket and is marked on after 11.First radiating segment 22 of pipeline 20 and the second radiating segment 24
Quantity is respectively two, and for convenience of explanation, it is A radiating that two the first radiating segments 22 and two the second radiating segments 24 are numbered respectively
Section, B radiating segment, C radiating segment and D radiating segment.A radiating segment, B radiating segment, C radiating segment and D radiating segment are sequentially connected in series on pipeline,
It is arranged in order from upstream to downstream.A radiating segment and D radiating segment are arranged in A heat absorption area, dissipate for one of heater element
Heat.B radiating segment and C radiating segment are arranged in B heat absorption area, for the radiating of another heater element.Cold-producing medium in pipeline flows successively
Through A radiating segment, B radiating segment, C radiating segment and D radiating segment, the A radiating segment positioned at most upstream and be located at most downstream D radiating segment group
Be combined into the radiating of one of heater element, such compound mode make to include in each heat absorption area 11 radiating segment of upstream and
The radiating segment in downstream, can balance each heat absorption area 11 temperature, thus eliminating hot cascade phenomenon so that each temperature of heating elements
Uniformly, it is more beneficial for improving heat radiation efficiency.
When the quantity of heater element is N number of, in pipeline 20, the quantity of the first radiating segment 22 and the second radiating segment 24 is altogether
2N, describe for convenience, the first radiating segment 22 and the second radiating segment 24 are referred to as radiating segment.1st radiating segment dissipates to n-th
Hot arc is the first radiating segment 22, and the N+1 radiating segment is the second radiating segment 24 to the 2N radiating segment, from first radiating segment to
The 2N radiating segment is sequentially connected in series in pipeline, and the 1st radiating segment (for the first radiating segment) and the 2N radiating segment (dissipate for second
Hot arc) it is arranged in the heat absorption area 11 of the cold drawing 10 corresponding to first heater element, the 2nd radiating segment (for the first radiating segment)
It is arranged in the heat absorption area 11 of the cold drawing 10 corresponding to second heater element with 2N-1 (for the second radiating segment) radiating segment,
By that analogy.
In a kind of embodiment, as shown in Figures 2 and 3, it is connected to the pipe between described at least two first radiating segments 22
Road is in straight tubulose.
Refer to Fig. 4, in present embodiment, cooling structure includes the first cold drawing 10a being arranged side by side and the second cold drawing
10b.First cold drawing 10a and the second cold drawing 10b is all rectangle structure.First cold drawing 10a includes the first side 13 being oppositely arranged
With the second side 14, the conduit 12 in the first cold drawing 10a from first when 13 extend to second 14, and conduit in the first cold drawing 10a
12 quantity is two, and two conduits 12 are symmetrically distributed in the both sides of the centrage L1 of the first cold drawing 10a.Second cold drawing 10b bag
Include the 3rd being oppositely arranged when 15 and the 4th 16, the quantity of the conduit 12 in the second cold drawing 10b is one, the second cold drawing 10b
Interior conduit 12 extends inside the 3rd side 15 is to the second cold drawing 10b, and when extending close to the position on the 4th side 16, along
Four side 16 inner side extends, and then goes back to and extends to the 3rd side 15.
The second of first cold drawing 10a while 14 with the 3rd of the second cold drawing 10b while 15 be oppositely arranged, in the first cold drawing 10a
Conduit 12 second when the conduit 12 in the opening on 14 and the second cold drawing 10b is the 3rd 15 on opening be man-to-man just
To relation.
In another embodiment, as shown in Figure 5 and Figure 6, it is connected between described at least two first radiating segments 22
Pipeline includes bending segment 26.The bending segment of the pipeline between two adjacent the first radiating segments 22 includes 90 degree of bending angles, i.e. phase
The layout of two adjacent the first radiating segments 22 differs 90 degree.Correspondingly, the layout of two adjacent the second radiating segments 24 also differs
90 degree.
Refer to Fig. 7, in present embodiment, cold drawing structure includes the first cold drawing 10a being arranged side by side and the second cold drawing
10b.First cold drawing 10a and the second cold drawing 10b is all rectangle structure.First cold drawing 10a includes the first side 13 being oppositely arranged
With the second side 14, and be connected to first when 13 and second 14 between the 5th side 17.Second cold drawing 10b includes being oppositely arranged
The 3rd when 15 and the 4th 16, and be connected to the 3rd when 15 and the 4th 16 between the 6th side 18.6th side 18 and
Two sides 14 are oppositely arranged.5th is 15 conllinear when 17 and the 3rd.It is provided with the first conduit 12a and the second conduit in first cold drawing 10a
, from first when 13 extend to second 14, the second conduit 12b is from first when 13 extend to the 5th 17 for 12b, the first conduit 12a.
Be provided with the 3rd conduit 12c in second cold drawing 10b, the 3rd conduit 12c from the 6th while 18 towards the 4th while 16 extend, extend close to
When at the position of the 4th side 16, extend in the inner side on the 4th side 16, finally extend to the 3rd side 15.
The present invention also provides a kind of electronic product, and described electronic product includes above-mentioned cooling structure and heater element, described
The described heat absorption area of cooling structure is mated with described heater element, is heater element radiating.
The above is the preferred embodiment of the present invention it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (13)
1. a kind of cooling structure is it is characterised in that include：
Cold drawing, including the heat absorption area for matching with heater element；With
Pipeline, enters liquid section, the first radiating segment, linkage section, the second radiating segment and goes out liquid section including be sequentially connected；
Described first radiating segment to described heat absorption area inner bending, described second radiating segment to described heat absorption area inner bending, described
The overbending direction of one radiating segment is contrary with the overbending direction of described second radiating segment, and described first radiating segment and described second dissipates
Hot arc is located at the source center both sides in described heat absorption area.
2. cooling structure as claimed in claim 1 is it is characterised in that set to around extending preset range from described source center
Be set to the hot concentrated area in described heat absorption area, the first side pipe that described first radiating segment includes being sequentially connected, in first pipe and
Second side pipe, described first side pipe and described second side pipe enter liquid section and described linkage section described in being respectively connecting to, and described second
The 3rd side pipe that radiating segment includes being sequentially connected, pipe and the 4th side pipe in second, described 3rd side pipe and described 4th side pipe divide
Do not connect to described go out liquid section and described linkage section, in described first pipe and described second in pipe be located at described hot concentrated area
Interior.
3. cooling structure as claimed in claim 2 is it is characterised in that described first side pipe, pipe and described the in described first
Two side pipes are collectively forming U-shaped structure.
4. cooling structure as claimed in claim 3 is it is characterised in that described 3rd side pipe, pipe and described the in described second
Four side pipes are collectively forming U-shaped structure.
5. cooling structure as claimed in claim 1 is it is characterised in that described cold drawing has heat-sinking capability, described connection section
In the range of described cold drawing.
6. cooling structure as claimed in claim 5 it is characterised in that described enter liquid section and described go out liquid section located at described heat absorption
Outside area, described enter liquid section and described go out liquid section be oppositely arranged on the both sides in described heat absorption area, described enter liquid section and described go out liquid section
The side away from described linkage section positioned at described heat absorption area.
7. cooling structure as claimed in claim 1 is it is characterised in that the quantity in described heat absorption area is at least two, described the
The quantity of one radiating segment is at least two and enters between liquid section and described linkage section described in being connected in, the number of described second radiating segment
Measure as at least two and go out between liquid section and described linkage section described in being connected in, be respectively provided with described in one in each described heat absorption area
First radiating segment and described second radiating segment.
8. cooling structure as claimed in claim 7 is it is characterised in that be connected between described at least two first radiating segments
Pipeline is in straight tubulose.
9. cooling structure as claimed in claim 7 is it is characterised in that be connected between described at least two first radiating segments
Pipeline includes bending segment.
10. the cooling structure as described in claim 1-9 any one claim is it is characterised in that described cold drawing is provided with
Conduit, the mating shapes that the shape that described conduit extends is extended with described pipeline, described pipeline is attached in described conduit.
11. cooling structures as claimed in claim 10 it is characterised in that described pipeline be assembled to by way of crimping described
In conduit.
12. cooling structures as claimed in claim 11 it is characterised in that being provided with heat-conducting medium in described conduit, described heat conduction
Medium is between the inwall of described pipeline and the described conduit of described cold drawing.
A kind of 13. electronic products it is characterised in that described electronic product include cold as described in claim 1-12 any one
But structure and heater element, the described heat absorption area of described cooling structure is mated with described heater element, thinks described heater element
Radiating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610811589.2A CN106413342A (en) | 2016-09-06 | 2016-09-06 | Cooling structure and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610811589.2A CN106413342A (en) | 2016-09-06 | 2016-09-06 | Cooling structure and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106413342A true CN106413342A (en) | 2017-02-15 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610811589.2A Pending CN106413342A (en) | 2016-09-06 | 2016-09-06 | Cooling structure and electronic product |
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| CN (1) | CN106413342A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111402728A (en) * | 2020-03-24 | 2020-07-10 | 京东方科技集团股份有限公司 | Bent gasket subassembly, flexible O L ED module and O L ED equipment |
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| CN103188920A (en) * | 2011-12-30 | 2013-07-03 | 奇鋐科技股份有限公司 | Radiating device |
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| CN2372785Y (en) * | 1999-05-28 | 2000-04-05 | 郭清松 | Radiator for electrical equipment |
| JP4435524B2 (en) * | 2003-09-12 | 2010-03-17 | 株式会社 正和 | Manufacturing method of cooling plate |
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| CN201994827U (en) * | 2011-01-26 | 2011-09-28 | 奇鋐科技股份有限公司 | Solar energy inverter radiating structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111402728A (en) * | 2020-03-24 | 2020-07-10 | 京东方科技集团股份有限公司 | Bent gasket subassembly, flexible O L ED module and O L ED equipment |
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Application publication date: 20170215 |