CN106406054A - Printer heating plate and preparation method thereof - Google Patents
Printer heating plate and preparation method thereof Download PDFInfo
- Publication number
- CN106406054A CN106406054A CN201610351344.6A CN201610351344A CN106406054A CN 106406054 A CN106406054 A CN 106406054A CN 201610351344 A CN201610351344 A CN 201610351344A CN 106406054 A CN106406054 A CN 106406054A
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- CN
- China
- Prior art keywords
- layer
- resistor layer
- heating plate
- printer
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
- G03G15/2003—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
- G03G15/2014—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
- G03G15/2053—Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/009—Heaters using conductive material in contact with opposing surfaces of the resistive element or resistive layer
- H05B2203/01—Heaters comprising a particular structure with multiple layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Resistance Heating (AREA)
- Fixing For Electrophotography (AREA)
- Surface Heating Bodies (AREA)
Abstract
The invention relates to a printer heating plate and a preparation method thereof. The printer heating plate comprises an insulating substrate, a heating resistor layer, a first protection layer, a thermistor layer and a second protection layer, wherein the insulating substrate is provided with a first surface and a second surface opposite to the first surface; the heating resistor layer is formed on the first surface; a gap is formed in at least one side edge of the heating resistor layer; extraction electrodes are formed at two ends of the heating resistor layer; the first protection layer covers the surface of a first resistor layer; the thermistor layer is formed on the second surface; and the second protection layer covers the thermistor layer. According to the printer heating plate, temperature sense lag can be avoided.
Description
Technical field
The present invention relates to a kind of printer heating plate and preparation method thereof.
Background technology
Laser printer heating plate is the heater members being formed by high temperature sintering film resistor on substrate.
In laser printer, heating plate by through development postadhesion powdered ink on paper after high temperature melt,
Firmly permanent attachment on paper.
Heating plate must be accurately controlled temperature, and temperature is too low to lead to photocopy effect on driving birds is not good, when heating plate
When temperature is too high, extra burden can be produced to the radiating of printer, be unfavorable for the normal operation of printer.
Existing heating plate, at the back side of heating plate, setting critesistor is used for temperature control, the temperature that critesistor records
The CPU of printer need to be fed back to by external circuit, then again break-make control is carried out to heating plate.However,
External application thermistor temp sensing delayed so that the temperature control of heating plate is not accurate.
Content of the invention
Based on this it is necessary to provide a kind of printer heating plate being avoided that temperature sense is delayed and its preparation side
Method.
A kind of printer heating plate, including：
Insulated substrate, has first surface and the second surface relative with first surface；
Heating resistor layer, is formed at described first surface, and at least one lateral edges of described heating resistor layer are formed
Jagged, the two ends of described heating resistor layer are formed with extraction electrode；
First protective layer, is covered in described first resistor layer surface；
Thermal resistor layer, is formed at described second surface；And
Second protective layer, is covered in described thermal resistor layer.
Wherein in an embodiment, described breach is formed at the middle part on the long side of described heating resistor layer.
Wherein in an embodiment, described breach has two, and two described breach are symmetrically distributed in heating electricity
Two long sides of resistance layer.
Wherein in an embodiment, described thermal resistor layer is formed at the middle part of described second surface.
Wherein in an embodiment, described breach runs through described heating resistor layer, and described breach is beaten along described
The size of print machine heating plate length direction is 5mm～20mm, and described breach is along the width of described printer heating plate
The size in degree direction is 0.1mm～0.5mm.
Wherein in an embodiment, described extraction electrode is formed at described heating resistor layer and described first table
Between face；Or, described extraction electrode is formed between described heating resistor layer and described first protective layer.
Wherein in an embodiment, described heating resistor layer includes the multiple resistance being arranged in order, Duo Ge electricity
Resistance is uniformly distributed in described first surface, and described breach is formed at the resistance of marginal position.
Wherein in an embodiment, also include conductor layer, described conductor layer be located at described thermal resistor layer with
Between described second surface.
The preparation method of the printer heating plate described in any of the above-described, described heating resistor layer is by printing system
Standby.
Above-mentioned printer heating plate, forms breach at least one lateral edges of heating resistor layer, thus heating electricity
The resistance of resistance layer is larger in the resistance of gap regions, by the caloric value in this region during identical electric current than other
Region is slightly larger, and the temperature opening up the region of breach is higher than other regional temperatures, and thermal resistor layer can be right in advance
The temperature change of heating plate is made a response, it is to avoid temperature sense is delayed；Breach is formed at the one of heating resistor layer
Lateral edges, do not affect the heating in other regions, can avoid affecting the overall heats of heating plate；Breach
Although region caloric value is larger, breach is conducive to radiating it is also possible to avoid the uneven insulation base leading to that generates heat
Plate ruptures.
Brief description
Fig. 1 is the structural representation of the printer heating plate of an embodiment；
Fig. 2 is the structural representation of the heating resistor layer of printer heating plate in Fig. 1；
Fig. 3 is the partial enlarged drawing at III in Fig. 2.
Specific embodiment
Mainly in combination with specific embodiment and accompanying drawing, printer heating plate and preparation method thereof is made detailed further below
Thin explanation.
Refer to Fig. 1, the printer heating plate 100 of an embodiment includes insulated substrate 110, extraction electrode
120th, heating resistor layer 130, the first protective layer 140, conductor layer 150, thermal resistor layer 160 and the second guarantor
Sheath 170.
Insulated substrate 110 substantially strip.Insulated substrate 110 be ceramic substrate it is preferred that insulation base
The material of plate 110 is aluminium oxide (Al2O3) or aluminium nitride (AlN).Insulated substrate 110 has first surface
112 and the second surface 114 relative with first surface 112.
Extraction electrode 120 is formed at first surface 112.In the illustrated embodiment, extraction electrode 120 is common
There are two, two extraction electrodes 120 are located at the two ends of first surface 112 respectively.Extraction electrode 120 is by leading
Electric silver paste or silver-colored palladium slurry printing preparation.Preferably, in silver-colored palladium slurry, the weight/mass percentage composition of palladium is less than 10%.
The thickness of extraction electrode 120 is 10～20 μm.
Heating resistor layer 130 is formed at first surface 112 and covering part extraction electrode 120, draws electricity for two
Pole 120 is located at the two ends of heating resistor layer 130 respectively.In the present embodiment, heating resistor layer 130
Material is ruthenium-oxide (RuO2).Certainly, in other embodiments, the material of heating resistor layer 130 also may be used
Think other materials commonly used in the trade such as palladium-silver (Pd-Ag) resistance.
Please refer to Fig. 2, the global shape of heating resistor layer 130 is roughly the same with first surface 112, is
Rectangle, including two relatively long long sides and two relatively short minor faces.In the illustrated embodiment,
Heating resistor layer 130 includes the multiple resistance 132 being arranged in order.Each resistance 132 is strip, multiple
The resistance 132 of strip is arranged successively and is formed the heating resistor layer 130 of rectangle.Multiple resistance 132 are in the first table
Face 112 is uniformly distributed, thus the caloric value in each region of heating plate 100 is essentially identical.Enforcement in diagram
In mode, heating resistor layer 130 includes four resistance 132.Preferably, the thickness of heating resistor layer 130 is
10～20 μm.
The edge of heating resistor layer 130 forms jagged 134.In the illustrated embodiment, breach 134 is common
There are two, a breach 134 is respectively formed with two resistance 132 of both sides of the edge.Breach 134 is located at
The middle part on the long side of heating resistor layer 130.In the illustrated embodiment, two breach 134 are symmetrical
Middle part in two long sides of heating resistor layer 130.
Please refer to Fig. 2 and Fig. 3, breach 134 runs through heating resistor layer 130, such that it is able to insulation base
Plate 110 preferably radiates.Breach 134 is a along the size of printer heating plate length direction, breach 134 edge
The size of the width of printer heating plate is b.Preferably, a=5mm～20mm, b=0.1mm～0.5mm.
It is further preferred that a：B=50：1.
First protective layer 140 is formed at the surface of heating resistor layer 130, and heating resistor layer 130 is completely covered.
The material of the first protective layer 140 is insulant it is preferred that the material of the first protective layer 140 is borosilicate glass
Glass or epoxy resin.Preferably, the thickness of the first protective layer 140 is 80～90 μm.
Referring to Fig. 1, conductor layer 150 is formed at second surface 114.Preferably, conductor layer 150 is covered
The part surface of lid second surface 114.Conductor layer 150 is by conductive silver paste or silver-colored palladium slurry printing preparation.Preferably
, in silver-colored palladium slurry, the weight/mass percentage composition of palladium is less than 10%.Preferably, the thickness of conductor layer 150 is
10～20 μm.
Thermal resistor layer 160 is formed at the surface of conductor layer 150.Preferably, thermal resistor layer 160 is corresponding
Middle part in second surface 114.In the illustrated embodiment, thermal resistor layer 160 is in heating resistor layer
130 projection covers breach 134.Thus, thermal resistor layer 160 can sensing heating resistive layer 130 set in time
It is equipped with the temperature in the region of breach 134.Preferably, the material of thermal resistor layer 160 is selected from manganese (Mn), cobalt
(Co), at least one in nickel (Ni), copper (Cu) and aluminum (Al).Preferably, thermal resistor layer 160
Thickness be 30 μm～60 μm.
Thermal resistor layer 160 is used for temperature change during real-time sensing heating piece work, and the characteristic of NTC is temperature
Degree is higher, and its resistance is lower, by the collection to NTC change in resistance data, in conjunction with the control of logic circuit,
Can achieve the regulation to fixing temperature and constant temperature.
Second protective layer 170 is formed at the surface of thermal resistor layer 160, and thermal resistor layer 160 is completely covered.
The material of the second protective layer 170 is insulant it is preferred that the material of the second protective layer 170 is borosilicate glass
Glass or epoxy resin.Preferably, the thickness of the second protective layer 170 is 20～30 μm.
Above-mentioned printer heating plate, forms breach in the medium position of heating resistor layer, thus resistance is in breach
The resistance in region is larger, and the caloric value by this region during identical electric current is more slightly larger than other regions, opens up scarce
The temperature in the region of mouth is higher than other regional temperatures, the temperature change that thermal resistor layer can in advance to heating plate
Make a response, it is to avoid temperature sense is delayed；Breach is formed at lateral edges of heating resistor layer, does not affect it
The heating in his region, can avoid affecting the overall heats of heating plate；Although gap regions caloric value is relatively
Greatly, but breach be conducive to radiate it is also possible to avoid generate heat inequality lead to insulated substrate fracture.
The heating plate of the present invention, by integrated to critesistor, is compared with the prior art, and has advantages below：
1st, critesistor passes through the back up preparation in heating plate for the thick-film technique, with respect to existing heating plate
Attachment setting, can faster more accurately sensing heating piece real time temperature change.
2nd, critesistor is firmly attached to the back side of heating plate by high temperature sintering (generally 850 DEG C),
Compared with being welded and fixed of the critesistor low temperature of existing heating plate (generally 240 DEG C), long-term reliability and
Stability more preferably, can be save the multiple tracks such as the segmentation of common pasted sheet type thermistor, plating, packaging simultaneously and process
Processing procedure, so preparation cost is lower,.
It is appreciated that extraction electrode is not limitedly formed between insulated substrate and heating resistor layer, conductor layer is not
It is limited to be formed between insulated substrate and thermal resistor layer, in other embodiments, extraction electrode is located at heating
Between resistive layer and the first protective layer, conductor layer is located between thermal resistor layer and the second protective layer.
The preparation method of above-mentioned printer heating plate, comprises the following steps：
Step S210, insulated substrate first surface print extraction electrode.
Preferably, extraction electrode is by conductive silver paste or silver-colored palladium slurry printing preparation.Preferably, palladium in silver-colored palladium slurry
Weight/mass percentage composition is less than 10%.
Step S220, insulated substrate second surface printed conductor layer.
Preferably, conductor layer is by conductive silver paste or silver-colored palladium slurry printing preparation.Preferably, the matter of palladium during silver-colored palladium is starched
Amount percentage composition is less than 10%.
Step S230, the insulated substrate being printed with conductor layer and extraction electrode is sintered.
Preferably, it is sintered in carrying out in high temperature furnace.
Preferably, the temperature of sintering is 840～860 DEG C.
Step S240, in first surface and extraction electrode surface printing heating resistor layer.
Step S250, in conductor layer surface printing thermal resistor layer.
Step S260, the insulated substrate being printed with heating resistor layer and thermal resistor layer is fired.
Preferably, fire and carry out in high temperature furnace.
Preferably, the temperature fired is 840～860 DEG C.
Step S270, the surface of heating resistor layer formed the first protective layer.
Preferably, the material of the first protective layer is Pyrex or epoxy resin.Material when the first protective layer
During for Pyrex, after forming the first protective layer, carry out high-temperature firing；When the material of the first protective layer is epoxy
During resin, after forming the first protective layer, carry out low-temperature setting.
Step S280, the surface of thermal resistor layer formed the second protective layer.
Preferably, the material of the second protective layer is Pyrex or epoxy resin.Material when the second protective layer
During for Pyrex, after forming the second protective layer, carry out high-temperature firing；When the material of the second protective layer is epoxy
During resin, after forming the second protective layer, carry out low-temperature setting.
The preparation method of above-mentioned printer heating plate, prepares heating resistor layer, technique is relatively by way of printing
For simple.
Each technical characteristic of embodiment described above can arbitrarily be combined, for making description succinct, not right
The all possible combination of each technical characteristic in above-described embodiment is all described, as long as however, these skills
There is not contradiction in the combination of art feature, be all considered to be the scope of this specification record.
Embodiment described above description is more concrete and detailed, but can not therefore be interpreted as to patent of invention
The restriction of scope.It should be pointed out that for the person of ordinary skill of the art, without departing from this
On the premise of bright design, some deformation can also be made and improve, these broadly fall into protection scope of the present invention.
Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (9)
1. a kind of printer heating plate is it is characterised in that include：
Insulated substrate, has first surface and the second surface relative with first surface；
Heating resistor layer, is formed at described first surface, and at least one lateral edges of described heating resistor layer are formed
Jagged, the two ends of described heating resistor layer are formed with extraction electrode；
First protective layer, is covered in described first resistor layer surface；
Thermal resistor layer, is formed at described second surface；And
Second protective layer, is covered in described thermal resistor layer.
2. printer heating plate according to claim 1 is it is characterised in that described breach is formed at institute
State the middle part on the long side of heating resistor layer.
3. printer heating plate according to claim 2 is it is characterised in that described breach has two,
Two described breach are symmetrically distributed in two long sides of heating resistor layer.
4. the printer heating plate according to Claims 2 or 3 is it is characterised in that described critesistor
Layer is formed at the middle part of described second surface.
5. printer heating plate according to claim 1 is it is characterised in that described breach runs through described
Heating resistor layer, described breach is 5mm～20mm along the size of described printer heating plate length direction, institute
The size stating the width along described printer heating plate for the breach is 0.1mm～0.5mm.
6. printer heating plate according to claim 1 is it is characterised in that described extraction electrode is formed
Between described heating resistor layer and described first surface；Or, described extraction electrode is formed at described heating electricity
Between resistance layer and described first protective layer.
7. printer heating plate according to claim 1 is it is characterised in that described heating resistor layer bag
Include the multiple resistance being arranged in order, multiple resistance are uniformly distributed in described first surface, and described breach is formed at
Resistance positioned at marginal position.
8. printer heating plate according to claim 1 is it is characterised in that also include conductor layer, institute
State conductor layer to be located between described thermal resistor layer and described second surface.
9. the printer heating plate as described in any one of claim 1～8 preparation method it is characterised in that
Described heating resistor layer is prepared by printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610351344.6A CN106406054B (en) | 2016-05-24 | 2016-05-24 | Printer heating sheet and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610351344.6A CN106406054B (en) | 2016-05-24 | 2016-05-24 | Printer heating sheet and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106406054A true CN106406054A (en) | 2017-02-15 |
| CN106406054B CN106406054B (en) | 2020-09-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610351344.6A Active CN106406054B (en) | 2016-05-24 | 2016-05-24 | Printer heating sheet and preparation method thereof |
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| Country | Link |
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| CN (1) | CN106406054B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107706495A (en) * | 2017-11-09 | 2018-02-16 | 广东风华高新科技股份有限公司 | A kind of preparation method of temperature compensation attenuator |
| CN107946712A (en) * | 2017-11-09 | 2018-04-20 | 广东风华高新科技股份有限公司 | A kind of temperature compensation attenuator |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1311462A (en) * | 2000-02-25 | 2001-09-05 | 东芝照明技术株式会社 | Heating means, and image processing apparatus utilizing same |
| CN1615049A (en) * | 2003-11-06 | 2005-05-11 | 哈利盛东芝照明株式会社 | Plate heater, fixer and image forming device |
| CN201417364Y (en) * | 2009-07-13 | 2010-03-03 | 石磊 | Ceramic heating plate for laser printer |
| CN102749830A (en) * | 2011-04-19 | 2012-10-24 | 佳能株式会社 | Heating device for image fixing |
| CN104936319A (en) * | 2015-07-11 | 2015-09-23 | 保定莱盛打印机配件有限公司 | Ceramic heating sheet and manufacturing method thereof |
| CN204807919U (en) * | 2015-07-02 | 2015-11-25 | 北京新晨办公设备有限公司 | Improved generation laser copys printer heating plate |
-
2016
- 2016-05-24 CN CN201610351344.6A patent/CN106406054B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1311462A (en) * | 2000-02-25 | 2001-09-05 | 东芝照明技术株式会社 | Heating means, and image processing apparatus utilizing same |
| CN1615049A (en) * | 2003-11-06 | 2005-05-11 | 哈利盛东芝照明株式会社 | Plate heater, fixer and image forming device |
| CN201417364Y (en) * | 2009-07-13 | 2010-03-03 | 石磊 | Ceramic heating plate for laser printer |
| CN102749830A (en) * | 2011-04-19 | 2012-10-24 | 佳能株式会社 | Heating device for image fixing |
| CN204807919U (en) * | 2015-07-02 | 2015-11-25 | 北京新晨办公设备有限公司 | Improved generation laser copys printer heating plate |
| CN104936319A (en) * | 2015-07-11 | 2015-09-23 | 保定莱盛打印机配件有限公司 | Ceramic heating sheet and manufacturing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107706495A (en) * | 2017-11-09 | 2018-02-16 | 广东风华高新科技股份有限公司 | A kind of preparation method of temperature compensation attenuator |
| CN107946712A (en) * | 2017-11-09 | 2018-04-20 | 广东风华高新科技股份有限公司 | A kind of temperature compensation attenuator |
| CN107946712B (en) * | 2017-11-09 | 2020-12-25 | 广东风华高新科技股份有限公司 | Temperature compensation attenuator |
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| Publication number | Publication date |
|---|---|
| CN106406054B (en) | 2020-09-11 |
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