CN109727832A - Protection element and its circuit protection device - Google Patents
Protection element and its circuit protection device Download PDFInfo
- Publication number
- CN109727832A CN109727832A CN201711039653.0A CN201711039653A CN109727832A CN 109727832 A CN109727832 A CN 109727832A CN 201711039653 A CN201711039653 A CN 201711039653A CN 109727832 A CN109727832 A CN 109727832A
- Authority
- CN
- China
- Prior art keywords
- metal layer
- protection element
- fusing point
- electrode
- fuse member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The present invention provides a kind of protection element and its circuit protection device.Protection element includes substrate, fuse member and heating member.Substrate surface is equipped with first electrode and second electrode.The fuse member includes the first metal layer and second metal layer, which is set to the first metal layer surface, and the fusing point of the second metal layer is higher than the fusing point of the first metal layer.For the fuse member by solder connection in the first electrode and second electrode, the fusing point of the solder is lower than the fusing point of the first metal layer.When overvoltage or excess temperature occur, which generates heat to melt the fuse member.
Description
Technical field
The present invention relates to a kind of protection elements applied in electronic device and the circuit protection comprising the protection element to fill
It sets, and more particularly to a kind of with preventing overvoltage, the protection element of overcurrent or excess temperature function and its circuit protection from filling
It sets.
Background technique
The protection element of known cutting overcurrent, there are known to extensively by the low-melting-point metals such as lead, tin, silver, bismuth, copper body institute structure
At electric current fuse (fuse).Later, in terms of preventing overcurrent and overvoltage, sustainable development goes out protection element, it includes
Sequentially lamination heating layer and fuse member (fusible element) on one planar substrates.In overvoltage, heating layer can generate heat,
Heat is transmitted bottom-up, is heated and the fuse member that fuses, is cut off the electric current flowed through whereby, to protect relevant circuit or electronics
Device.
Running gear is highly popular in recent years, and the information products such as all mobile phones, computer and individual action assistant are seen everywhere,
So that people are growing day by day to the dependence of information products.However, being had frequently about portable electronic products such as mobile phones
The news that battery explodes during charge and discharge.Therefore, manufacturer gradually improves aforementioned overcurrent and overvoltage protection element
Design, safeguard measure of battery during charge and discharge is promoted, to prevent battery during charge and discharge because of overvoltage
Or overcurrent and explode.
The protection method for the protection element that well-known technique proposes is the circuit string for making fuse member and battery in protection element
Connection, and fuse member and heating layer in protection element is made to be electrically connected to switch (switch) and integrated circuit (IC) element.So
One, being in conducting when IC element is measured to will start switch in overvoltage, making electric current by the heating layer in protection element, making
It obtains heating layer and generates heat with the fuse member that fuses, and then the circuit of battery is made to reach overvoltage protection in the state of open circuit.
Those skilled in the art can also fully understand, and when overcurrent occurs, a large amount of electric current, which flows through fuse member, to make fuse member send out
Heat and fuse, and then reach overcurrent protection.
However, subsequent reflow process is melted because of high temperature in order to prevent for fuse member in above-mentioned existing protection element, lead to
It often will use 300 DEG C of fusing point or more of leaded (Pb) high melting point solder.However, by RoHS (hazardous substances limitation instruction) environmental protection
The use of the specification of instruction, the solder containing Pb will be limited.Therefore how using compared with low melting point fuse member in the case where and still
Reflow can be carried out, is that protection element needs to overcome the problems, such as.
Summary of the invention
The present invention provides a kind of protection element and the circuit protection device comprising the protection element, with overvoltage, mistake
The function of electric current and/or over-temperature protection.The fuse member of the protection element can be supported there are two types of the inside and outside metal layer of different melting points
Resist subsequent reflow process because the problem of interior metal layer melts caused by high temperature.
According to the first aspect of the invention, a kind of protection element is provided, it includes substrate, fuse member and heating members.Substrate
Surface is equipped with first electrode and second electrode.The fuse member includes the first metal layer and second metal layer, which sets
It is placed in the first metal layer surface, and the fusing point of the second metal layer is higher than the fusing point of the first metal layer.The fuse member passes through
For solder connection in the first electrode and second electrode, the fusing point of the solder is lower than the fusing point of the first metal layer.When overvoltage or
When excess temperature occurs, which generates heat to melt the fuse member.
In one embodiment, the fusing point of the second metal layer is higher than the temperature of subsequent reflow process.
In one embodiment, when which carries out reflow, which limits the flowing of the first metal layer.
In one embodiment, which includes tin (Sn) or its alloy.
In one embodiment, which includes silver-colored (Ag), copper (Cu), golden (Au), nickel (Ni) or its alloy.
In one embodiment, the first metal layer with a thickness of 0.02~0.3mm, second metal layer with a thickness of 0.002~
0.01mm。
In one embodiment, which is 10 times to 150 times with a thickness of second metal layer thickness.
In one embodiment, the volume of the first metal layer is greater than the volume of the second metal layer.
In one embodiment, wherein includes the fuse member containing 2 fuses in the equivalent circuit of the protection element and contain
The heating member of 1 heater.
According to the second aspect of the invention, a kind of circuit protection device is provided, it includes protection elements above-mentioned, and arrange in pairs or groups
One detector and a switch.Detector is used to detect the voltage drop or temperature of a circuit to be protected.Switch connect the detector with
Receive its detection signal.When the detector detects voltage drop or temperature is more than preset value, the switch conduction, electric current flows through this
Heating member, so that heating member fever is to melt the fuse member.
Fuse member in protection element of the present invention is the metal layer composite construction of ectonexine, and the metal layer of outer layer is compared with internal layer
The fusing point of metal layer wants high, or further above the temperature of subsequent reflow process.In this way, in subsequent reflow, even if
Reflow temperature is greater than the fusing point of interior metal layer, is limited due to interior metal layer can be covered or be coated by outer layer metal layer,
It will not arbitrarily flow or generate severely deformed, therefore the interior metal layer compared with low melting point can be applied to fuse member, and can be with
Resist subsequent high temperature reflow process.
Detailed description of the invention
Fig. 1 shows the schematic diagram of the section structure of the protection element of one embodiment of the invention.
Fig. 2 shows the equivalent circuit diagram of the protection element of Fig. 1.
Fig. 3 to Fig. 5 shows the structural schematic diagram of multiple embodiments of the fuse member of protection element of the present invention.
Fig. 6 shows the circuit diagram of the circuit protection device of one embodiment of the invention.
Wherein, the reference numerals are as follows:
10: protection element；
11: substrate；
12: heating member；
13: heating electrode；
14: insulating layer；
15: target；
16: fuse member；
16a: the first metal layer；
16b: second metal layer；
17: solder；
18: electrode layer；
18a: first electrode；
18b: second electrode；
19a: lower electrode；
19b: lower electrode；
20: outer cover；
21: scaling powder；
22: conduction element；
60: circuit protection device；
61: detector；
62: switch.
Specific embodiment
For above and other technology contents of the invention, feature and advantage can be clearer and more comprehensible, correlation is cited below particularly out
Embodiment, and cooperate appended attached drawing, it is described in detail below.
Fig. 1 shows the schematic diagram of the section structure of one embodiment of the invention protection element 10.Protection element 10 have substrate 11,
Heating member 12, heating electrode 13, insulating layer 14, target 15, fuse member 16, solder 17, electrode layer 18, lower electrode 19a and
19b and outer cover 20.20 outer rim of outer cover is set to 11 surface of substrate, and provides inner space and accommodate heating member 12 and fuse member 16
Deng.The generally planar insulating substrate of substrate 11.Heating member 12 is configured on substrate 11, and two heating of its both ends electrical connection left and right
Electrode 13.It is located at the first electrode 18a and second electrode 18b of two sides in 16 both ends electrode electrically connected layer 18 of fuse member, and fuses
The middle section of part 16 is connected in the target 15 on 14 surface of insulating layer, and wherein 16 both ends of fuse member can pass through solder 17
It is connected to first electrode 18a and second electrode 18b.First electrode 18a and second electrode 18b can be by being located at 11 side of substrate
Conduction element 22 is connected to left and right lower electrode 19a and 19b.Lower electrode 19a and 19b can be used as adhesive surface to a circuit board (figure
Do not show) interface.Insulating layer 14 covers heating member 12 and heating electrode 13.Fuse member 16 is configured above insulating layer 14 as electricity
The fuse (fuse) of road.The fuse member 16 includes the first metal layer 16a and is set to the second of the surface the first metal layer 16a
Metal layer 16b, and it is composite structure.The second metal layer 16b or the first metal layer 16a oxidation in order to prevent of fuse member 16, can
It is coated with scaling powder 21 comprehensively or partially on fuse member 16.Scaling powder 21 mainly can be in the table of outermost second metal layer 16b
Face forms anti oxidation layer, can be effectively prevented second metal layer 16b oxidation, and then maintain quick fuse efficiency.When overvoltage or
When excess temperature occurs, heating member 12 can generate heat and transfer heat to fuse member 16 so that the melting of fuse member 16 and to the of two sides
One electrode 18a, second electrode 18b and target 15 flow and cause to fuse, so that chopping current reaches protection purpose.Fig. 2
It shows the equivalent circuit diagram of the protection element 10 of Fig. 1, passes through the setting of target 15 in the present embodiment, fuse member 16 can include
Two fuses.It has been observed that the heating member 12 generates heat to melt the fuse member (fuse) 16 when overvoltage or excess temperature occur.
Substrate 11 can be square structure, and wherein material can be selected such as aluminium oxide, aluminium nitride, zirconium oxide, glass ceramics
Insulating material, or the material for printed wiring boards such as glass epoxy substrate, phenolic substrates is selected also may be used.Substrate 11
Thickness is about 0.1~2mm.Electrode layer 18, heating electrode 13 and target 15 may include silver, gold, copper, tin, nickel or other lead
Electric metal, thickness are about 0.005~1mm, or especially 0.01mm, 0.05mm, 0.1mm, 0.3mm, 0.5mm.In addition to using print
Outside brush production electrode, sheet metal production also can be used, to be suitble to high voltage applications.
The fuse member 16 is the composite construction being made of internal layer and outer layer, can be rectangular slat shape or round bar shape, as
The first metal layer 16a of internal layer is low-melting-point metal layer, is Gao Rong in the second metal layer 16b of the outer layer of the first metal layer 16a
Point metal layer, it is, second metal layer 16b has higher fusing point compared to the first metal layer 16a.Second metal layer 16b can
The surface of the first metal layer 16a is formed in using modes such as plating, vapor deposition, fitting, calenderings.The first metal layer 16a is preferably comprised
Using Sn as the metal of principal component or its alloy, such as Sn, Sn-Ag, Sn-Sb, Sn-Zn, Sn-Ag-Cu, Pb-Sn-Ag, Sn-Zn-
Cu, Sn-Bi-Ag and Sn-Bi-Ag-Cu, wherein more preferably can be selected without Pb material to meet RoHS instruction, but the present invention is simultaneously
It is not limited to using no Pb material.Second metal layer including, for example, Ag, Cu, Au, Ni, Zn, or based on either of which person at
The metal or its alloy divided.In one embodiment, fusing point of the fusing point of second metal layer 16b compared with the first metal layer 16a is high outer, and second
The fusing point of metal layer 16b is also above reflow temperature.In this way, which the second metal layer 16b as outer layer will limit and stack or wrap
It is overlying on the flowing of the first metal layer 16a therein, therefore even if reflow temperature is more than the melting temperature of the first metal layer 16a, melted
Broken piece 16 is also unlikely to fuse.The surface of second metal layer 16b may further form anti oxidation layer, which includes example
Such as Sn, in this way, Cu layer can be prevented to aoxidize in the case of second metal layer 16b is such as Cu layer, to prevent the institute that fuses
It takes time and increases because of Cu layers of oxidation.If second metal layer 16b is had the advantages that less oxidizable but on the high side using Ag layers.
The material of heating member 12 may include ruthenium-oxide (RuO2) and the additives such as silver-colored (Ag), palladium (Pd) and platinum (Pt).As heating member 12
The material of the insulating layer 14 being isolated between fuse member 16 can be selected glass (glass), epoxy resin (epoxy), aluminium oxide or
Silica gel (silicone) or glaze material (glaze) etc..
In one embodiment, the thickness of fuse member 16 about 0.05mm to 0.4mm, wherein the thickness of the first metal layer 16a is about
0.02~0.3mm, second metal layer 16b (single layer) about 0.002~0.01mm.Specifically, the thickness of the first metal layer 16a is big
In the thickness of second metal layer 16b (single layer), for example, 10 times to 150 times or 20 times, 50 times, 100 times.However, if thickness ratio
More than 150 times, i.e. the first metal layer 16a is relatively very thick, and second metal layer 16b is relatively very thin, and excessively thin second metal layer 16b exists
The risk for the first metal layer 16a etch being melted is had when reflow, and is unable to maintain that its shape.Preferably, in fuse member 16
The volume of the first metal layer 16a is big compared with the volume of second metal layer 16b.When there is the unusual conditions such as overvoltage or overcurrent
When, the etch that the first metal layer 16a has larger volume to can be effectively carried out second metal layer 16b accelerates fuse member 16 in short-term
Interior fusing.In summary, the ratio of the thickness and volume of the first metal layer 16a and second metal layer 16b has its appropriate value, number
Value is too big or too small is all not suitable for.The too small second metal layer 16b of excessively thin or volume may have first be melted in reflow
The risk of metal layer 16a etch, when the too big second metal layer 16b of too thick or volume may then postpone the fusing of fuse member 16
Between.
Fig. 3, Fig. 4 and Fig. 5 show the different example structures of fuse member 16.As shown in figure 3, the first metal layer 16a's
Second metal layer 16b is arranged in upper and lower surfaces.As shown in figure 4, other than two opposite end faces of fuse member 16, the second gold medal
Belong to around layer 16b cladding the first metal layer 16a.As shown in figure 5, the first metal layer 16a includes both ends of the surface comprehensively by the
Two metal layer 16b cladding.The better structure of covering property, the ability for resisting melting deformation are stronger.It is carried out in protection element 10 subsequent
When reflow process, even if temperature has been more than the fusing point of the first metal layer 16a compared with low melting point, but because the first metal layer 16a quilt
Second metal layer 16b institute's sandwiched or cladding limitation, second metal layer 16b will limit the flowing of the first metal layer 16a, therefore entire molten
Broken piece 16 can't melt-flow and become open circuit.
Table 1 shows the embodiment E1 and E2 of protection element of the present invention and the surface temperature of comparative example C1 and C2 and fusing electricity
The test result of stream.Surface temperature is that thermocouple is placed in 16 surface of fuse member to measure.The first metal layer 16a selects Sn
Or Pb95.5-Sn2-Ag2.5, fusing point are respectively 232 DEG C and 308 DEG C.Embodiment E1 and embodiment E2 are in the first metal layer 16a
Second metal layer 16b, structure as shown in Figure 3 is arranged in upper and lower surface.Second metal layer 16b selects Ag layers.Embodiment E1 and reality
The overall thickness for applying the fuse member 16 of an E2 is the only the first metal layer of fuse member 16 of 0.09mm, comparative example C1 and comparative example C2
16a does not have second metal layer 16b, thinner thickness 0.08mm.It is, the first metal in all embodiments and comparative example
Layer 16a with a thickness of 0.08mm, comparative example C1 and C2 the second metal layer 16b up and down that additionally comprise thickness respectively be 0.005mm.Just
For the first metal layer 16a is the embodiment E1 and comparative example C1 of same material, because there is the implementation of coating second metal layer 16b
The resistance of example E1 is lower, and in the test of energization 20A and 30A, the surface temperature of embodiment E1 fuse member 16 is compared to comparative example
C1 can reduce about 20~40 DEG C, and its blowout current is then compared with comparative example C1 high about 2A to 4A.Similarly, with regard to embodiment E2 and compare
For example C2, there is the embodiment E2 of coating second metal layer 16b to have lower resistance value, in the test of energization 20A and 30A,
The surface temperature of embodiment E2 fuse member 16 can reduce about 15~30 DEG C compared to comparative example C2, and its blowout current then relatively compares
Example C2 high about 2A~3A.
Table 1
It is used to weld fuse member 16 in above-described embodiment E1 and comparative example C1 and selects Sn- in the solder 17 of electrode layer 18
Cu0.7,227 DEG C of fusing point are lower than 232 DEG C of fusing point of its first metal layer 16a.Embodiment E2 and comparative example C2 then select Pb-
Sn2-Ag2.5,268 DEG C of fusing point are lower than 308 DEG C of fusing point of its first metal layer 16a.In addition, the visual fusing point demand of solder 17 is selected
Select Sn-Ag3-Cu0.7 (217 DEG C of fusing point), Sn-Ag0.3-Cu0.7 (217 DEG C of fusing point) or Sn-Bi-Ag (262 DEG C of fusing point) etc..It is special
It is not that the fusing point of solder 17 is lower than the fusing point of the first metal layer 16a of internal layer.There is more commercially available production compared with the solder 17 of low melting point
Product are available, and lower reflow temperature can be used to weld fuse member 16.It is subsequent to be welded in protection element 10
When circuit board, even if technological temperature may be high compared with the fusing point of solder 17, but 11 solders being set between fuse member 16 and substrate
17 there is no by mechanical external force, therefore solder 17 and is not flowing or severely deformed situation.
In summary, fuse member 16 is made of the second metal layer 16b of the first metal layer 16a of internal layer and outer layer, therefore phase
Compared with the known fuse member by constituting compared with the single metal layer of low melting point, can there are higher blowout current and lower surface temperature.
Also, it is low compared to the fusing point of the first metal layer 16a in conjunction with fuse member 16 and the fusing point of the solder 17 of electrode layer 18, compared with low melting point
Solder 17 has more commercial product available, and the reflow process compared with low temperature can be used.
The equivalent circuit diagram of protection element 10 of the invention can also be as shown in the circuit of dashed rectangle in Fig. 6.First electricity
Pole 18a is then connected to as the end point A1 for connecting a device (such as secondary cell or motor) to be protected, second electrode 18b
Such as the end point B1 of charger or other similar device.Target 15 connects a heating electrode 13, another heating electricity
Then connection switch 62 of pole 13.According to the circuit design of protection element 10, the circuit that fuse member 16 is formed includes 2 concatenated fuses
(fuse), heating member 12 forms a heater (showing with resistor symbols).In one embodiment, which can imitate for such as field
Transistor (field effect transistor；FET).The grid (gate) of such as FET of switch 62 connects detector 61, and
Connect another endpoint A2 of circuit to be protected and another endpoint B2 of charger.The detector 61 can be IC element, and having can
Detect the function of voltage drop or temperature.When not having overvoltage or excess temperature, switch 62 is open circuit, and electric current passes through fuse member 16,
But heating member 12 is flowed through without electric current.If there is overcurrent at this time, fuse member 16 can fuse and provide overcurrent protection.When detecing
It surveys device 61 and detects that voltage is more than a preset value (overvoltage) or when temperature is more than a preset value (excess temperature), switch 62 is switched to
On state, electric current is from the source electrode (source) of switch 62 to the heated part 12 of (drain) cocurrent that drains.Heating member 12 fever and
Fuse member 16 is fused, and then the protection of overvoltage or excess temperature is provided.In summary, B1 to A1, B2 form 2 to A2 and are provided to
The power supply line of the circuit to be protected, and protection element 10, detector 61 connect two power supply lines with the combination of switch 62, are formed
Circuit protection device 60.When detector 61 detects the voltage drop of circuit to be protected or temperature is more than preset value, starting heating
The fusing of part 12 fuse member 16.
The equivalent circuit of the protection element of previous embodiment includes 2 fuses and 1 heater.However, it is also possible to utilize
Other different structural circuits designs make including, for example, 2 fuses and 2 heaters or 1 fuse and 1 heater
Circuit form, and still covered by innovative technology of the invention.In another embodiment, fuse member is electrically connected 2 weld pads and forms one
A conductive path, heating member connect other 2 weld pads and form another conductive path, flow through heating member so as to independent control
Electric current with the fuse member that fuses.
Protection element of the invention utilizes low-melting-point metal layer (the first metal layer) and high melting point metal layer (the second metal
Layer) composition composite construction fuse member, main body of the low-melting-point metal as fuse member can be used, and be still enough in subsequent high temperature
The problem of preventing fuse member to be melted in technique.It, can be in addition, fuse member design of the invention is because there is preferable radiating efficiency
The temperature 20-40% on protection element surface is reduced, and the blowout current of fuse member can be improved.Low-melting-point metal can be used in the present invention
Main member of the layer as fuse member, therefore no Pb material can be used.Although Pb material has been not precluded as fuse member in the present invention,
But preferred selection is without Pb material, to meet environmental protection specification now.
Technology contents and technical characterstic of the invention have been disclosed as above, however those skilled in the art are still potentially based on this hair
Bright introduction and open and make various replacements and modification without departing substantially from present inventive concept.Therefore, protection scope of the present invention should not
It is limited to embodiment disclosure of that, and should includes various without departing substantially from replacement and modification of the invention, and be claims institute
Cover.
Claims (14)
1. a kind of protection element, includes:
One substrate, surface are equipped with first electrode and second electrode；
One fuse member, the fuse member include the first metal layer and second metal layer, which is set to first metal
Layer surface, the fusing point of the second metal layer are higher than the fusing point of the first metal layer；
One heating member, when overvoltage or excess temperature generation, which generates heat to melt the fuse member；
Wherein for the fuse member by solder connection in the first electrode and the second electrode, the fusing point of the solder is lower than first gold medal
Belong to the fusing point of layer.
2. protection element according to claim 1, wherein the fusing point of the second metal layer is higher than the temperature of subsequent reflow process
Degree.
3. protection element according to claim 2, wherein the second metal layer limits the stream of the first metal layer when reflow
It is dynamic.
4. protection element according to claim 1, wherein the first metal layer includes tin or its alloy.
5. protection element according to claim 1, wherein the second metal layer includes silver, copper, gold, nickel or its alloy.
6. protection element according to claim 1, wherein the first metal layer with a thickness of 0.02~0.3mm, the second gold medal
Belong to layer with a thickness of 0.002~0.01mm.
7. protection element according to claim 1, wherein the first metal layer is with a thickness of 10 times of second metal layer thickness
To 150 times.
8. protection element according to claim 1, wherein the volume of the first metal layer is greater than the body of the second metal layer
Product.
9. protection element according to claim 1 includes wherein containing 2 fuses in the equivalent circuit of the protection element
Fuse member and heating member containing 1 heater.
10. a kind of circuit protection device, includes:
One protection element includes:
One substrate, surface are equipped with first electrode and second electrode；
One fuse member, the fuse member include the first metal layer and second metal layer, which is set to first metal
Layer surface, the fusing point of the second metal layer are higher than the fusing point of the first metal layer；And
One heating member；
One detector detects the voltage drop or temperature of a circuit to be protected；And
One switch, connects the detector to receive its detection signal；
Wherein for the fuse member by solder connection in the first electrode and second electrode, the fusing point of the solder is lower than first metal
The fusing point of layer；
Wherein when the detector detects voltage drop or temperature is more than preset value, the switch conduction, electric current flows through the heating member,
So that heating member fever is to melt the fuse member.
11. circuit protection device according to claim 10, wherein the fusing point of the second metal layer is higher than subsequent reflow work
The temperature of skill.
12. circuit protection device according to claim 10, wherein the first metal layer includes tin or its alloy.
13. circuit protection device according to claim 10, wherein the second metal layer includes silver, copper, gold, nickel or its conjunction
Gold.
14. circuit protection device according to claim 10, wherein the second metal layer limits first metal when reflow
The flowing of layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711039653.0A CN109727832A (en) | 2017-10-30 | 2017-10-30 | Protection element and its circuit protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711039653.0A CN109727832A (en) | 2017-10-30 | 2017-10-30 | Protection element and its circuit protection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109727832A true CN109727832A (en) | 2019-05-07 |
Family
ID=66292641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711039653.0A Pending CN109727832A (en) | 2017-10-30 | 2017-10-30 | Protection element and its circuit protection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109727832A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992625A (en) * | 2019-12-13 | 2021-06-18 | 聚鼎科技股份有限公司 | Protection element and circuit protection device thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5939969A (en) * | 1997-08-29 | 1999-08-17 | Microelectronic Modules Corporation | Preformed thermal fuse |
| CN102117720A (en) * | 2009-12-31 | 2011-07-06 | 比亚迪股份有限公司 | Temperature protection device |
| CN104835702A (en) * | 2014-02-10 | 2015-08-12 | 陈莎莉 | Composite protection element |
| US20150245469A1 (en) * | 2014-02-25 | 2015-08-27 | Yazaki Corporation | Flexible flat circuit |
| CN105051855A (en) * | 2013-03-28 | 2015-11-11 | 迪睿合株式会社 | Fuse element and fuse device |
| CN106463312A (en) * | 2014-05-28 | 2017-02-22 | 迪睿合株式会社 | Protective element and battery pack |
| CN107104021A (en) * | 2012-03-29 | 2017-08-29 | 迪睿合电子材料有限公司 | Protection element |
-
2017
- 2017-10-30 CN CN201711039653.0A patent/CN109727832A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5939969A (en) * | 1997-08-29 | 1999-08-17 | Microelectronic Modules Corporation | Preformed thermal fuse |
| CN102117720A (en) * | 2009-12-31 | 2011-07-06 | 比亚迪股份有限公司 | Temperature protection device |
| CN107104021A (en) * | 2012-03-29 | 2017-08-29 | 迪睿合电子材料有限公司 | Protection element |
| CN105051855A (en) * | 2013-03-28 | 2015-11-11 | 迪睿合株式会社 | Fuse element and fuse device |
| CN104835702A (en) * | 2014-02-10 | 2015-08-12 | 陈莎莉 | Composite protection element |
| US20150245469A1 (en) * | 2014-02-25 | 2015-08-27 | Yazaki Corporation | Flexible flat circuit |
| CN106463312A (en) * | 2014-05-28 | 2017-02-22 | 迪睿合株式会社 | Protective element and battery pack |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992625A (en) * | 2019-12-13 | 2021-06-18 | 聚鼎科技股份有限公司 | Protection element and circuit protection device thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI557765B (en) | A fuse element for a protective element, a circuit protection element, and a method of manufacturing the same | |
| KR102213303B1 (en) | Fuse element and fuse device | |
| US6344633B1 (en) | Stacked protective device lacking an insulating layer between the heating element and the low-melting element | |
| CN105453211A (en) | Protective element and battery pack | |
| JP6437262B2 (en) | Mounting body manufacturing method, thermal fuse element mounting method, and thermal fuse element | |
| CN101689439A (en) | Protective element | |
| CN105814657B (en) | Switch element, switching circuit and warning circuit | |
| US11640892B2 (en) | Fuse element and protective element | |
| WO2004070758A1 (en) | Protective element | |
| CN109074988B (en) | Protective element | |
| JP2007059295A (en) | Circuit protective element and protection method of circuit | |
| TW202115979A (en) | Protection element | |
| TWI661456B (en) | Protection device | |
| CN109727833B (en) | Protection element and circuit protection device thereof | |
| CN109727832A (en) | Protection element and its circuit protection device | |
| TWI676202B (en) | Protective component | |
| CN106960772B (en) | Protection element and chargeable and dischargeable battery pack | |
| TW201917764A (en) | Protection device and circuit protection apparatus containing the same | |
| TWI651747B (en) | Protection device and circuit protection apparatus containing the same | |
| US20190157031A1 (en) | Protection device and circuit protection apparatus containing the same | |
| JPH087731A (en) | Resistance/temperature fuse for board | |
| JP6711704B2 (en) | Protective device with bypass electrode | |
| CN215869263U (en) | Protection element and circuit protection device thereof | |
| TWI700719B (en) | Protection device and circuit protection apparatus containing the same | |
| CN108987204A (en) | Protection element and its circuit protection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190507 |
|
| WD01 | Invention patent application deemed withdrawn after publication |