TW201917764A - Protection device and circuit protection apparatus containing the same - Google Patents
Protection device and circuit protection apparatus containing the same Download PDFInfo
- Publication number
- TW201917764A TW201917764A TW106135937A TW106135937A TW201917764A TW 201917764 A TW201917764 A TW 201917764A TW 106135937 A TW106135937 A TW 106135937A TW 106135937 A TW106135937 A TW 106135937A TW 201917764 A TW201917764 A TW 201917764A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal layer
- fuse
- melting point
- electrode
- protective element
- Prior art date
Links
Landscapes
- Fuses (AREA)
Abstract
Description
本發明係關於一種應用於電子裝置中的保護元件及包含該保護元件的電路保護裝置,且特別是關於一種具有防止過電壓、過電流或過溫度功能的保護元件及其電路保護裝置。The present invention relates to a protection element applied to an electronic device and a circuit protection device including the same, and more particularly to a protection element having a function of preventing overvoltage, overcurrent or overtemperature and a circuit protection device thereof.
習知切斷過電流的保護元件,廣泛周知有由鉛、錫、銀、鉍、銅等低熔點金屬體所構成的電流熔絲(fuse)。之後,在防止過電流和過電壓方面,持續發展出保護元件,其包含在一個平面基板上依序積層發熱層及熔斷件(fusible element)。在過電壓時發熱層會發熱,熱從底部向上傳遞,加熱而熔斷該熔斷件,藉此切斷流經的電流,以保護相關的電路或電子裝置。A current fuse having a low-melting-point metal body such as lead, tin, silver, antimony or copper is widely known as a protective element for cutting off an overcurrent. Thereafter, in terms of preventing overcurrent and overvoltage, the protective element is continuously developed, which comprises sequentially laminating a heat generating layer and a fusible element on a planar substrate. When an overvoltage occurs, the heat generating layer generates heat, and heat is transferred upward from the bottom, and the fuse is heated to fuse the fuse, thereby cutting off the current flowing through to protect the associated circuit or electronic device.
近年來行動裝置高度普及,舉凡手機、電腦及個人行動助理等資訊產品隨處可見,使得人們對資訊產品之依賴性與日俱增。然而,不時出現有關於手機等可攜式電子產品的電池在充放電的過程中爆炸的新聞。因此,製造商逐步改良前述過電流和過電壓保護元件的設計,提升電池在充放電的過程中的保護措施,以防止電池在充放電的過程中因過電壓或過電流而爆炸。In recent years, mobile devices have become highly popular, and information products such as mobile phones, computers, and personal mobile assistants are everywhere, making people's dependence on information products increasing. However, from time to time, there has been news about the explosion of batteries in portable electronic products such as mobile phones during charging and discharging. Therefore, the manufacturer gradually improves the design of the aforementioned overcurrent and overvoltage protection components, and enhances the protection measures of the battery during charging and discharging to prevent the battery from exploding due to overvoltage or overcurrent during charging and discharging.
習知技術提出的保護元件的防護方式是使保護元件中的熔斷件與電池的電路串聯,且使保護元件中的熔斷件與發熱層電連接至開關(switch)與積體電路(IC)元件。如此一來,當IC元件量測到在過電壓時會啟動開關呈導通,使電流通過保護元件中的發熱層,使得發熱層產生熱量以熔斷該熔斷件,進而使電池的電路呈斷路的狀態而達到過電壓保護。本領域技術人員亦可充分瞭解,當過電流發生時,大量的電流流經熔斷件會使得熔斷件發熱而熔斷,進而達到過電流保護。The protective element proposed by the prior art is protected by connecting the fuse in the protection element in series with the circuit of the battery, and electrically connecting the fuse and the heat generating layer in the protection element to the switch and the integrated circuit (IC) component. . In this way, when the IC component measures the overvoltage, the switch is turned on, and the current is passed through the heat generating layer in the protection component, so that the heat generating layer generates heat to blow the fuse, thereby causing the circuit of the battery to be disconnected. And to achieve overvoltage protection. Those skilled in the art can also fully understand that when an overcurrent occurs, a large amount of current flowing through the fuse will cause the fuse to heat up and fuse, thereby achieving overcurrent protection.
然而,上述既有保護元件中的熔斷件為了防止後續回焊製程因高溫發生熔融,通常會使用熔點300℃以上的含鉛(Pb)高熔點焊料。然而,按RoHS(危害性物質限制指令)環保指令的規範,含Pb焊料之使用將被限制。因此如何在使用較低熔點的熔斷件的情況下而仍可進行回焊,是保護元件亟需克服的問題。However, in order to prevent the subsequent reflow process from melting at a high temperature in order to prevent the fuse in the existing protective element from being used, a lead-containing (Pb) high melting point solder having a melting point of 300 ° C or higher is usually used. However, the use of Pb-containing solders will be limited by the RoHS Directive (Environmental Restriction Directive) environmental directive. Therefore, how to reflow in the case of using a fuse having a lower melting point is a problem that the protective component needs to overcome.
本發明係提供一種保護元件及包含該保護元件的電路保護裝置,其具有過電壓、過電流及/或過溫度保護的功能。該保護元件的熔斷件有兩種不同熔點的內外金屬層,可以抵抗後續回焊製程因高溫所導致內層金屬層熔融的問題。The present invention provides a protection element and a circuit protection device including the same, which has the function of overvoltage, overcurrent and/or overtemperature protection. The fuse of the protection element has two inner and outer metal layers of different melting points, which can resist the problem of melting of the inner metal layer caused by high temperature in the subsequent reflow process.
根據本發明的第一方面,提供一種保護元件,其包含基板、熔斷件及加熱件。基板表面設有第一電極和第二電極。該熔斷件包含第一金屬層和第二金屬層,該第二金屬層設置於該第一金屬層表面,且該第二金屬層的熔點高於該第一金屬層的熔點。該熔斷件通過焊料連接於該第一電極和第二電極,該焊料的熔點低於該第一金屬層的熔點。當過電壓或過溫度發生時,該加熱件發熱以熔融該熔斷件。According to a first aspect of the invention, there is provided a protective element comprising a substrate, a fuse and a heating element. The surface of the substrate is provided with a first electrode and a second electrode. The fuse includes a first metal layer and a second metal layer, the second metal layer is disposed on a surface of the first metal layer, and a melting point of the second metal layer is higher than a melting point of the first metal layer. The fuse is connected to the first electrode and the second electrode by solder, and the melting point of the solder is lower than the melting point of the first metal layer. When an overvoltage or overtemperature occurs, the heating element heats up to melt the fuse.
一實施例中,該第二金屬層的熔點高於後續回焊製程的溫度。In one embodiment, the melting point of the second metal layer is higher than the temperature of the subsequent reflow process.
一實施例中,該保護元件進行回焊時,該第二金屬層限制第一金屬層的流動。In one embodiment, the second metal layer limits the flow of the first metal layer when the protective element is reflowed.
一實施例中,該第一金屬層包含錫(Sn)或其合金。In one embodiment, the first metal layer comprises tin (Sn) or an alloy thereof.
一實施例中,該第二金屬層包含銀(Ag)、銅(Cu)、金(Au)、鎳(Ni)或其合金。In one embodiment, the second metal layer comprises silver (Ag), copper (Cu), gold (Au), nickel (Ni), or alloys thereof.
一實施例中,該第一金屬層的厚度為0.02~0.3mm,第二金屬層的厚度為0.002~0.01mm。In one embodiment, the first metal layer has a thickness of 0.02 to 0.3 mm, and the second metal layer has a thickness of 0.002 to 0.01 mm.
一實施例中,該第一金屬層厚度為第二金屬層厚度的為10倍至150倍。In one embodiment, the first metal layer has a thickness of 10 to 150 times the thickness of the second metal layer.
一實施例中,該第一金屬層的體積大於該第二金屬層的體積。In one embodiment, the volume of the first metal layer is greater than the volume of the second metal layer.
一實施例中,該保護元件中,該熔斷件為包含2個熔絲、該加熱件為包含1個加熱器的等效電路。In one embodiment, in the protection element, the fuse member includes two fuses, and the heating element is an equivalent circuit including one heater.
根據本發明的第二方面,提供一種電路保護裝置,其包含前述之保護元件,並搭配一偵測器及一開關。偵測器用來偵測一待保護電路的電壓降或溫度。開關連接該偵測器以接受其偵測信號。當該偵測器偵測到電壓降或溫度超過預設值時,該開關導通,電流流經該加熱件,使得該加熱件發熱以熔融該熔斷件。According to a second aspect of the present invention, a circuit protection device comprising the aforementioned protection component is provided with a detector and a switch. The detector is used to detect the voltage drop or temperature of a circuit to be protected. A switch is connected to the detector to receive its detection signal. When the detector detects a voltage drop or the temperature exceeds a preset value, the switch is turned on, and a current flows through the heating member, so that the heating member generates heat to melt the fuse.
本發明保護元件中之熔斷件為內外層之金屬層複合結構,外層的金屬層較內層的金屬層的熔點要高,或者進一步高於後續回焊製程的溫度。如此一來,在後續回焊時,即使回焊溫度大於內層金屬層的熔點,因內層金屬層會被外層金屬層覆蓋或包覆而有所限制,不會任意流動或產生嚴重變形,因此可以將較低熔點的內層金屬層應用於熔斷件,而可以抵抗後續高溫回焊製程。The fuse element in the protective element of the present invention is a metal layer composite structure of the inner and outer layers, and the metal layer of the outer layer has a higher melting point than the metal layer of the inner layer or is further higher than the temperature of the subsequent reflow process. In this way, in the subsequent reflow, even if the reflow temperature is greater than the melting point of the inner metal layer, the inner metal layer is limited or covered by the outer metal layer, and does not flow arbitrarily or cause severe deformation. Therefore, the lower melting inner metal layer can be applied to the fuse and resist the subsequent high temperature reflow process.
為讓本發明之上述和其他技術內容、特徵和優點能更明顯易懂,下文特舉出相關實施例,並配合所附圖式,作詳細說明如下。The above and other technical contents, features and advantages of the present invention will become more apparent from the following description.
圖1顯示本發明一實施例保護元件10的結構圖。保護元件10具有基板11、加熱件12、加熱電極13、絕緣層14、中間電極15、熔斷件16、焊料17、電極層18、下電極19a和19b及外罩20。外罩20外緣設置於基板11表面,而提供內部空間容納加熱件12及熔斷件16等。該基板11通常為平面絕緣基板。加熱件12配置於基板11上,且其兩端電連接左右兩加熱電極13。熔斷件16兩端電連接電極層18中位於兩側的第一電極18a和第二電極18b,且熔斷件16的中間部分連接設置於絕緣層14表面的中間電極15,其中熔斷件16兩端可通過焊料17連接於第一電極18a和第二電極18b。第一電極18a和第二電極18b可通過位於基板11側面的導通件22連接至左、右之下電極19a和19b。下電極19a和19b可作為表面黏著至一電路板(圖未示)的介面。絕緣層14覆蓋加熱件12和加熱電極13。熔斷件16配置於絕緣層14上方作為電路上的熔絲(fuse)。該熔斷件16包含第一金屬層16a和設置於該第一金屬層16a表面的第二金屬層16b,而為複合式結構。熔斷件16為了防止第二金屬層16b或第一金屬層16a氧化,可在熔斷件16上全面或部分塗布助焊劑21。助焊劑21主要可在最外層之第二金屬層16b的表面形成抗氧化層,能有效地防止第二金屬層16b氧化,進而維持快速熔斷效率。當過電壓或過溫度發生時,加熱件12會發熱且將熱傳遞至熔斷件16,以使熔斷件16熔融而向兩側的第一電極18a、第二電極18b和中間電極15流動而導致熔斷,從而截斷電流達到保護目的。圖2顯示圖1之保護元件10的等效電路圖,本實施例中藉由中間電極15的設置,熔斷件16會包含兩個熔絲。如前述,當過電壓或過溫度發生時,該加熱件12發熱以熔融該熔斷件(熔絲)16。1 shows a block diagram of a protective element 10 in accordance with an embodiment of the present invention. The protective element 10 has a substrate 11, a heating member 12, a heating electrode 13, an insulating layer 14, an intermediate electrode 15, a fuse 16, a solder 17, an electrode layer 18, lower electrodes 19a and 19b, and a cover 20. The outer edge of the outer cover 20 is disposed on the surface of the substrate 11, and an internal space is provided to accommodate the heating member 12, the fuse member 16, and the like. The substrate 11 is typically a planar insulating substrate. The heating element 12 is disposed on the substrate 11 and is electrically connected to the left and right heating electrodes 13 at both ends thereof. The fuse member 16 is electrically connected to the first electrode 18a and the second electrode 18b on both sides of the electrode layer 18, and the intermediate portion of the fuse member 16 is connected to the intermediate electrode 15 disposed on the surface of the insulating layer 14, wherein the fuse member 16 is provided at both ends It may be connected to the first electrode 18a and the second electrode 18b by the solder 17. The first electrode 18a and the second electrode 18b may be connected to the left and right lower electrodes 19a and 19b through the conduction members 22 on the side of the substrate 11. The lower electrodes 19a and 19b can serve as an interface for surface adhesion to a circuit board (not shown). The insulating layer 14 covers the heating member 12 and the heating electrode 13. The fuse 16 is disposed above the insulating layer 14 as a fuse on the circuit. The fuse member 16 includes a first metal layer 16a and a second metal layer 16b disposed on the surface of the first metal layer 16a, and has a composite structure. The fuse member 16 may be entirely or partially coated with the flux 21 on the fuse member 16 in order to prevent oxidation of the second metal layer 16b or the first metal layer 16a. The flux 21 can form an oxidation resistant layer mainly on the surface of the outermost second metal layer 16b, and can effectively prevent oxidation of the second metal layer 16b, thereby maintaining rapid melting efficiency. When an overvoltage or an overtemperature occurs, the heating member 12 generates heat and transfers heat to the fuse member 16 to melt the fuse member 16 to flow to the first electrode 18a, the second electrode 18b, and the intermediate electrode 15 on both sides, resulting in the flow. Fuse, thereby cutting off the current for protection purposes. 2 shows an equivalent circuit diagram of the protection element 10 of FIG. 1. In the present embodiment, the fuse element 16 will contain two fuses by the arrangement of the intermediate electrode 15. As described above, when an overvoltage or an overtemperature occurs, the heating member 12 generates heat to melt the fuse (fuse) 16.
基板11可為方形結構,其中材質可選用例如氧化鋁、氮化鋁、氧化鋯、玻璃陶瓷等之絕緣性材料,或者選用用於玻璃環氧基板、酚醛基板等之印刷配線基板之材料亦可。基板11的厚度約為0.1~2mm。電極層18、加熱電極13和中間電極15可包含銀、金、銅、錫、鎳或其他導電金屬,厚度約為0.005~1mm,或特別是0.01mm、0.05mm、0.1mm、0.3mm、0.5mm。除了使用印刷製作電極外,也可以使用金屬片製作,以適合高電壓應用。The substrate 11 may have a square structure, and the material may be selected from an insulating material such as alumina, aluminum nitride, zirconia, or glass ceramic, or a printed wiring board for a glass epoxy substrate or a phenolic substrate. . The thickness of the substrate 11 is about 0.1 to 2 mm. The electrode layer 18, the heating electrode 13 and the intermediate electrode 15 may comprise silver, gold, copper, tin, nickel or other conductive metal having a thickness of about 0.005 to 1 mm, or particularly 0.01 mm, 0.05 mm, 0.1 mm, 0.3 mm, 0.5. Mm. In addition to using printed electrodes, it can also be fabricated using sheet metal for high voltage applications.
該熔斷件16係由內層與外層構成之複合構造體,可為矩形長條狀或圓條狀,作為內層的第一金屬層16a為低熔點金屬層,在第一金屬層16a之外層的第二金屬層16b為高熔點金屬層,亦即,第二金屬層16b相較於第一金屬層16a有較高的熔點。第二金屬層16b可使用電鍍、蒸鍍、貼合、壓延等方式形成在第一金屬層16a之表面。第一金屬層16a較佳包含以Sn為主成分之金屬或其合金,例如Sn、Sn-Ag、Sn-Sb、Sn-Zn、Sn-Ag-Cu、Pb-Sn-Ag、Sn-Zn-Cu、Sn-Bi-Ag及Sn-Bi-Ag-Cu,其中優選地可選用無Pb材料以符合RoHS指令,但本發明並不限於使用無Pb材料。第二金屬層包含例如Ag、Cu、Au、Ni、Zn,或以此等中之任一者為主成分之金屬或其合金。一實施例中,第二金屬層16b的熔點較第一金屬層16a的熔點高外,第二金屬層16b的熔點也高於回焊溫度。如此一來,作為外層的第二金屬層16b會限制疊設或包覆於其中的第一金屬層16a的流動,因此即使回焊溫度超過第一金屬層16a之熔融溫度,熔斷件16亦不至於熔斷。第二金屬層16b的表面進一步可以形成抗氧化層,該抗氧化層包含例如Sn,如此一來,在第二金屬層16b為例如Cu層的情形下,可防止Cu層氧化,從而防止熔斷所需時間因Cu層氧化而增加。若第二金屬層16b使用Ag層有較不易氧化的優點,但價格偏高。加熱件12的材料可包含氧化釕(RuO2 )和銀(Ag)、鈀(Pd)和鉑(Pt)等添加物。作為加熱件12與熔斷件16之間隔離的絕緣層14的材料可選用玻璃(glass)、環氧樹脂(epoxy)、氧化鋁或矽膠(silicone)或釉材料(glaze)等。The fuse member 16 is a composite structure composed of an inner layer and an outer layer, and may have a rectangular strip shape or a strip shape. The first metal layer 16a as an inner layer is a low melting point metal layer, and is outside the first metal layer 16a. The second metal layer 16b is a high melting point metal layer, that is, the second metal layer 16b has a higher melting point than the first metal layer 16a. The second metal layer 16b may be formed on the surface of the first metal layer 16a by plating, vapor deposition, lamination, rolling, or the like. The first metal layer 16a preferably contains a metal containing Sn as a main component or an alloy thereof, such as Sn, Sn-Ag, Sn-Sb, Sn-Zn, Sn-Ag-Cu, Pb-Sn-Ag, Sn-Zn- Cu, Sn-Bi-Ag, and Sn-Bi-Ag-Cu, wherein a Pb-free material is preferably selected to comply with the RoHS directive, but the invention is not limited to the use of a Pb-free material. The second metal layer contains, for example, Ag, Cu, Au, Ni, Zn, or a metal or alloy thereof as a main component. In one embodiment, the melting point of the second metal layer 16b is higher than the melting point of the first metal layer 16a, and the melting point of the second metal layer 16b is also higher than the reflow temperature. As a result, the second metal layer 16b as the outer layer restricts the flow of the first metal layer 16a stacked or covered therein, so even if the reflow temperature exceeds the melting temperature of the first metal layer 16a, the fuse 16 does not As for the fuse. The surface of the second metal layer 16b may further form an oxidation resistant layer containing, for example, Sn, such that in the case where the second metal layer 16b is, for example, a Cu layer, oxidation of the Cu layer is prevented, thereby preventing the fuse from being blown. The time required increases due to oxidation of the Cu layer. If the second metal layer 16b uses the Ag layer, it has the advantage of being less susceptible to oxidation, but the price is relatively high. The material of the heating member 12 may include additives such as ruthenium oxide (RuO 2 ) and silver (Ag), palladium (Pd), and platinum (Pt). As the material of the insulating layer 14 which is isolated between the heating member 12 and the fuse member 16, a glass, an epoxy, an alumina or a silicone or a glaze may be used.
一實施例中,熔斷件16的厚度約0.05mm至0.4mm,其中第一金屬層16a的厚度約0.02~0.3mm,第二金屬層16b (單層)約0.002~0.01mm。具體而言,第一金屬層16a的厚度大於第二金屬層16b(單層)的厚度,例如為10倍至150倍,或20倍、50倍、100倍。然而,若厚度比超過150倍,即第一金屬層16a相對很厚,第二金屬層16b相對很薄,過薄的第二金屬層16b在回焊時會有被熔融的第一金屬層16a浸蝕之虞,而無法維持其形狀。優選地,熔斷件16中第一金屬層16a之體積較第二金屬層16b之體積大。當有過電壓或過電流等異常狀況發生時,第一金屬層16a有較大體積能有效地進行第二金屬層16b之浸蝕,加速熔斷件16在短時間內熔斷。綜言之,第一金屬層16a和第二金屬層16b的厚度和體積的比例都有其適當值,數值太大或太小都不適宜。過薄或體積太小的第二金屬層16b可能在回焊時有被熔融的第一金屬層16a浸蝕的風險,太厚或體積太大的第二金屬層16b則可能延遲熔斷件16的熔斷時間。In one embodiment, the fuse member 16 has a thickness of about 0.05 mm to 0.4 mm, wherein the first metal layer 16a has a thickness of about 0.02 to 0.3 mm, and the second metal layer 16b (single layer) has a thickness of about 0.002 to 0.01 mm. Specifically, the thickness of the first metal layer 16a is greater than the thickness of the second metal layer 16b (single layer), for example, 10 times to 150 times, or 20 times, 50 times, 100 times. However, if the thickness ratio is more than 150 times, that is, the first metal layer 16a is relatively thick, the second metal layer 16b is relatively thin, and the too thin second metal layer 16b has a molten first metal layer 16a during reflow. After eroding, it is impossible to maintain its shape. Preferably, the volume of the first metal layer 16a in the fuse member 16 is larger than the volume of the second metal layer 16b. When an abnormal condition such as an overvoltage or an overcurrent occurs, the first metal layer 16a has a large volume to effectively etch the second metal layer 16b, and the fuse 17 is accelerated in a short time. In summary, the ratio of the thickness and the volume of the first metal layer 16a and the second metal layer 16b have appropriate values, and the values are too large or too small to be suitable. The second metal layer 16b which is too thin or too small may be at risk of being etched by the molten first metal layer 16a during reflow, and the second metal layer 16b which is too thick or too large may delay the fusing of the fuse 16. time.
圖3、圖4和圖5顯示熔斷件16的不同實施例結構。如圖3所示,在第一金屬層16a的上表面和下表面設置第二金屬層16b。如圖4所示,除了熔斷件16對向的二個端面外,第二金屬層16b包覆第一金屬層16a的周圍。如圖5所示,第一金屬層16a包含兩端面之全面都被第二金屬層16b包覆。包覆性愈佳的結構,抵抗熔融變形的能力愈強。在保護元件10進行後續回焊製程時,溫度即使已超過較低熔點的第一金屬層16a的熔點,但因為第一金屬層16a被第二金屬層16b所夾設或包覆限制,第二金屬層16b會限制第一金屬層16a的流動,故整個熔斷件16並不會熔融流動而成為斷路。3, 4 and 5 show the different embodiment configurations of the fuse member 16. As shown in FIG. 3, a second metal layer 16b is provided on the upper surface and the lower surface of the first metal layer 16a. As shown in FIG. 4, the second metal layer 16b covers the periphery of the first metal layer 16a except for the opposite end faces of the fuse member 16. As shown in FIG. 5, the first metal layer 16a includes both end faces which are all covered by the second metal layer 16b. The better the coating, the stronger the ability to resist melt deformation. When the protective element 10 is subjected to a subsequent reflow process, the temperature exceeds the melting point of the first metal layer 16a of the lower melting point, but because the first metal layer 16a is sandwiched or covered by the second metal layer 16b, the second The metal layer 16b restricts the flow of the first metal layer 16a, so that the entire fuse member 16 does not melt and flow to become an open circuit.
表1顯示本發明保護元件的實施例E1和E2以及比較例C1和C2的表面溫度和熔斷電流的測試結果。表面溫度是將熱電偶放置於熔斷件16表面進行量測。第一金屬層16a選用Sn或Pb95.5-Sn2-Ag2.5,其熔點分別為232℃和308℃。實施例E1和實施例E2於第一金屬層16a上下表面設置第二金屬層16b,如圖3所示之結構。第二金屬層16b選用Ag層。實施例E1和實施例E2的熔斷件16的總厚度為0.09mm,比較例C1和比較例C2的熔斷件16只有第一金屬層16a,沒有第二金屬層16b,其厚度較薄為0.08mm。亦即,所有實施例和比較例中第一金屬層16a的厚度為0.08mm,比較例C1和C2另外包含厚度各為0.005mm的上下第二金屬層16b。就第一金屬層16a為同樣材質的實施例E1和比較例C1而言,因為有披覆第二金屬層16b的實施例E1的電阻較低,在通電20A和30A的測試中,實施例E1熔斷件16的表面溫度相較於比較例C1可降低約20~40o C,而其熔斷電流則較比較例C1高約2A至4A。類似地,就實施例E2和比較例C2而言,有披覆第二金屬層16b的實施例E2有較低的電阻值,在通電20A和30A的測試中,實施例E2熔斷件16的表面溫度相較於比較例C2可降低約15~30o C,而其熔斷電流則較比較例C2高約2A~3A。Table 1 shows the test results of the surface temperature and the fusing current of Examples E1 and E2 of the protective element of the present invention and Comparative Examples C1 and C2. The surface temperature is measured by placing a thermocouple on the surface of the fuse member 16. The first metal layer 16a is made of Sn or Pb95.5-Sn2-Ag2.5 and has melting points of 232 ° C and 308 ° C, respectively. In the embodiment E1 and the embodiment E2, the second metal layer 16b is disposed on the upper and lower surfaces of the first metal layer 16a, as shown in FIG. The second metal layer 16b is made of an Ag layer. The total thickness of the fuse member 16 of the embodiment E1 and the embodiment E2 is 0.09 mm, and the fuse member 16 of the comparative example C1 and the comparative example C2 has only the first metal layer 16a and no second metal layer 16b, and the thickness thereof is 0.08 mm. . That is, the thickness of the first metal layer 16a in all of the examples and the comparative examples was 0.08 mm, and the comparative examples C1 and C2 additionally included the upper and lower second metal layers 16b each having a thickness of 0.005 mm. In the case of the embodiment E1 and the comparative example C1 in which the first metal layer 16a is of the same material, since the electric resistance of the embodiment E1 having the second metal layer 16b is low, in the test of the energization of 20A and 30A, the embodiment E1 The surface temperature of the fuse 16 was reduced by about 20 to 40 o C compared to the comparative example C1, and the fusing current was about 2 A to 4 A higher than that of the comparative example C1. Similarly, with respect to Example E2 and Comparative Example C2, Example E2 having the second metal layer 16b coated had a lower resistance value, and in the test of energization 20A and 30A, the surface of the fuse member 16 of Example E2. The temperature was reduced by about 15~30 o C compared to the comparative example C2, and the fusing current was about 2A~3A higher than the comparative example C2.
表1
上述實施例E1和比較例C1中用來焊接熔斷件16於電極層18的焊料17係選用Sn-Cu0.7,其熔點227o C低於其第一金屬層16a之熔點232o C。實施例E2和比較例C2則選用Pb-Sn2-Ag2.5,其熔點268o C低於其第一金屬層16a之熔點308o C。另外,焊料17可視熔點需求選擇Sn-Ag3-Cu0.7(熔點217o C)、Sn-Ag0.3-Cu0.7(熔點217o C)或Sn-Bi-Ag(熔點262o C)等。特別是,焊料17的熔點低於內層的第一金屬層16a的熔點。較低熔點的焊料17有較多的市售產品可供選擇,且可使用較低的回焊溫度來將熔斷件16進行焊接。後續將保謢元件10焊接於電路板時,即使製程溫度可能較焊料17的熔點高,但設置於熔斷件16和基板之間的11焊料17並沒有受到機械外力,因此焊料17並不致於有流動或嚴重變形的情形。The solder 17 for soldering the fuse member 16 to the electrode layer 18 in the above embodiment E1 and the comparative example C1 is selected from Sn-Cu0.7, and its melting point 227 o C is lower than the melting point 232 o C of the first metal layer 16a. In Example E2 and Comparative Example C2, Pb-Sn2-Ag2.5 having a melting point of 268 o C lower than the melting point 308 o C of the first metal layer 16a was selected. In addition, the solder 17 may select Sn-Ag3-Cu0.7 (melting point 217 o C), Sn-Ag0.3-Cu0.7 (melting point 217 o C) or Sn-Bi-Ag (melting point 262 o C) depending on the melting point requirement. . In particular, the melting point of the solder 17 is lower than the melting point of the first metal layer 16a of the inner layer. The lower melting point solder 17 has a number of commercially available products to choose from, and the lower reflow temperature can be used to weld the fuse member 16. When the protective element 10 is subsequently soldered to the circuit board, even if the process temperature may be higher than the melting point of the solder 17, the 11 solder 17 disposed between the fuse 16 and the substrate is not subjected to mechanical external force, so the solder 17 does not have Flow or severe deformation.
綜言之,熔斷件16由內層之第一金屬層16a和外層之第二金屬層16b構成,因此相較於由較低熔點單一金屬層構成之習知熔斷件,能有較高的熔斷電流和較低的表面溫度。又,結合熔斷件16和電極層18的焊料17的熔點相較於第一金屬層16a的熔點低,較低熔點的焊料17有較多的市售產品可供選擇,且可使用較低溫的回焊製程。In summary, the fuse member 16 is composed of the first metal layer 16a of the inner layer and the second metal layer 16b of the outer layer, so that it has a higher fuse than the conventional fuse member composed of a single metal layer of a lower melting point. Current and lower surface temperature. Further, the melting point of the solder 17 in combination with the fuse member 16 and the electrode layer 18 is lower than the melting point of the first metal layer 16a, and the lower melting point solder 17 has many commercially available products to be selected, and a lower temperature can be used. Reflow process.
本發明之保護元件10的等效電路圖也可以如圖6中虛線方框之電路所示。第一電極18a作為連接一個待保護裝置(例如二次電池或馬達)的一端點A1,第二電極18b則連接到例如充電器或其他類似裝置的一端點B1。中間電極15連接一個加熱電極13,另一個加熱電極13則連接開關62。根據保護元件10的電路設計,熔斷件16形成的電路包含2個串聯的熔絲(fuse),加熱件12形成一個加熱器(以電阻符號顯示)。一實施例中,該開關62可為例如場效電晶體(field effect transistor;FET)。開關62例如FET的閘極(gate)連接偵測器61,且連接待保護電路的另一端點A2,以及充電器的另一端點B2。該偵測器61可為IC元件,具備可偵測電壓降或溫度的功能。當沒有過電壓或過溫度時,開關62為斷路,電流通過熔斷件16,但沒有電流流經加熱件12。若此時有過電流發生,熔斷件16會熔斷而提供過電流保護。當偵測器61偵測到電壓超過一預設值(過電壓)或溫度超過一預設值(過溫度)時,開關62切換為導通狀態,電流自開關62的源極(source)至汲極(drain)並流經加熱件12。加熱件12發熱而將熔斷件16熔斷,進而提供過電壓或過溫度的保護。綜言之,B1至A1,B2至A2形成2條提供至該待保護電路的電源線,而保護元件10、偵測器61和開關62的組合連接該兩條電源線,形成電路保護裝置60。當偵測器61偵測到待保護電路的電壓降或溫度超過預設值時,啟動加熱件12熔斷該熔斷件16。The equivalent circuit diagram of the protection element 10 of the present invention can also be shown in the circuit of the dashed box in FIG. The first electrode 18a is connected to an end point A1 of a device to be protected (for example, a secondary battery or a motor), and the second electrode 18b is connected to an end point B1 such as a charger or the like. The intermediate electrode 15 is connected to one heating electrode 13, and the other heating electrode 13 is connected to the switch 62. According to the circuit design of the protection element 10, the fuse 16 is formed with a circuit comprising two fuses connected in series, and the heating element 12 forms a heater (shown by a resistance symbol). In one embodiment, the switch 62 can be, for example, a field effect transistor (FET). A switch 62, such as a gate of the FET, is coupled to the detector 61 and is coupled to the other terminal A2 of the circuit to be protected, and to the other end B2 of the charger. The detector 61 can be an IC component and has a function of detecting a voltage drop or a temperature. When there is no overvoltage or overtemperature, the switch 62 is open and current is passed through the fuse 16, but no current flows through the heater 12. If an overcurrent occurs at this time, the fuse 16 is blown to provide overcurrent protection. When the detector 61 detects that the voltage exceeds a predetermined value (overvoltage) or the temperature exceeds a predetermined value (over temperature), the switch 62 is switched to the on state, and the current is sourced from the source of the switch 62 to the 汲Drain and flow through the heating element 12. The heating element 12 generates heat to fuse the fuse member 16, thereby providing protection against overvoltage or overtemperature. In summary, B1 to A1, B2 to A2 form two power lines provided to the circuit to be protected, and a combination of the protection element 10, the detector 61 and the switch 62 connects the two power lines to form a circuit protection device 60. . When the detector 61 detects that the voltage drop or temperature of the circuit to be protected exceeds a preset value, the activation heating member 12 blows the fuse member 16.
前述實施例的保護元件的等效電路包含2個熔絲及1個加熱器。惟,也可以利用其他不同的結構電路設計,製作包含例如2個熔絲和2加熱器,或者1個熔絲和1個加熱器的電路形式,而仍為本發明之創新技術所涵蓋。又一實施例中,熔斷件電連接2個焊墊形成一個導電通路,加熱件連接另外2個焊墊形成另一個導電通路,從而可以獨立控制流過加熱件的電流以熔斷該熔斷件。The equivalent circuit of the protective element of the foregoing embodiment includes two fuses and one heater. However, it is also possible to fabricate circuit forms comprising, for example, two fuses and two heaters, or one fuse and one heater, using other different structural circuit designs, while still being covered by the innovative technology of the present invention. In still another embodiment, the fuse member electrically connects the two pads to form a conductive path, and the heating member connects the other two pads to form another conductive path, so that the current flowing through the heating member can be independently controlled to blow the fuse.
本發明的保護元件利用低熔點金屬層(第一金屬層)和高熔點金屬層(第二金屬層)組成複合結構的熔斷件,可以使用低熔點金屬作為熔斷件的主體,而仍足以在後續高溫製程中防止熔斷件被熔融的問題。另外,本發明的熔斷件設計因為有較佳的散熱效率,可以降低保護元件表面的溫度20-40%,且可提高熔斷件的熔斷電流。本發明可使用低熔點金屬層作為熔斷件的主要構件,故可採用無Pb材料。雖然本發明並不排除有Pb材料作為熔斷件,但優選的係選擇無Pb材料,以符合現今的環保規範。The protective element of the present invention utilizes a low melting point metal layer (first metal layer) and a high melting point metal layer (second metal layer) to form a composite structure fuse, and a low melting point metal can be used as the fuse body, but still sufficient for subsequent The problem of preventing the fuse from being melted in the high temperature process. In addition, the fuse design of the present invention can reduce the temperature of the surface of the protection component by 20-40% because of better heat dissipation efficiency, and can improve the fuse current of the fuse. The present invention can use a low melting point metal layer as the main component of the fuse member, so that a Pb-free material can be used. Although the present invention does not exclude the use of a Pb material as a fuse, it is preferred to select a Pb-free material to comply with today's environmental regulations.
本發明之技術內容及技術特點已揭示如上,然而本領域具有通常知識之技術人士仍可能基於本發明之教示及揭示而作種種不背離本發明精神之替換及修飾。因此,本發明之保護範圍應不限於實施例所揭示者,而應包括各種不背離本發明之替換及修飾,並為以下之申請專利範圍所涵蓋。The technical contents and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims
10‧‧‧保護元件10‧‧‧Protection components
11‧‧‧基板11‧‧‧Substrate
12‧‧‧加熱件12‧‧‧heating parts
13‧‧‧加熱電極13‧‧‧heating electrode
14‧‧‧絕緣層14‧‧‧Insulation
15‧‧‧中間電極15‧‧‧Intermediate electrode
16‧‧‧熔斷件16‧‧‧Fuse parts
16a‧‧‧第一金屬層16a‧‧‧First metal layer
16b‧‧‧第二金屬層16b‧‧‧Second metal layer
17‧‧‧焊料17‧‧‧ solder
18‧‧‧電極層18‧‧‧Electrical layer
18a‧‧‧第一電極18a‧‧‧first electrode
18b‧‧‧第二電極18b‧‧‧second electrode
19a‧‧‧下電極19a‧‧‧ lower electrode
19b‧‧‧下電極19b‧‧‧ lower electrode
20‧‧‧外罩20‧‧‧ Cover
21‧‧‧助焊劑21‧‧‧ Flux
22‧‧‧導通件22‧‧‧Connecting parts
60‧‧‧電路保護裝置60‧‧‧Circuit protection device
61‧‧‧偵測器61‧‧‧Detector
62‧‧‧開關62‧‧‧ switch
圖1顯示本發明一實施例之保護元件的結構示意圖。 圖2顯示圖1之保護元件的等效電路圖。 圖3至圖5顯示本發明保護元件的熔斷件的多個實施例。 圖6顯示本發明一實施例之電路保護裝置的電路示意圖。1 is a schematic view showing the structure of a protective element according to an embodiment of the present invention. Figure 2 shows an equivalent circuit diagram of the protection element of Figure 1. Figures 3 through 5 show various embodiments of fuses of the protective element of the present invention. FIG. 6 is a circuit diagram showing a circuit protection device according to an embodiment of the present invention.
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106135937A TW201917764A (en) | 2017-10-19 | 2017-10-19 | Protection device and circuit protection apparatus containing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106135937A TW201917764A (en) | 2017-10-19 | 2017-10-19 | Protection device and circuit protection apparatus containing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201917764A true TW201917764A (en) | 2019-05-01 |
Family
ID=67347523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106135937A TW201917764A (en) | 2017-10-19 | 2017-10-19 | Protection device and circuit protection apparatus containing the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201917764A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11362505B2 (en) | 2020-10-12 | 2022-06-14 | Conquer Electronics Co., Ltd. | Protective element and a fabrication method thereof |
-
2017
- 2017-10-19 TW TW106135937A patent/TW201917764A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11362505B2 (en) | 2020-10-12 | 2022-06-14 | Conquer Electronics Co., Ltd. | Protective element and a fabrication method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102213303B1 (en) | Fuse element and fuse device | |
TWI398894B (en) | Protection element | |
TWI503850B (en) | Over-current protection device | |
JP6249600B2 (en) | Protective element | |
JP6437262B2 (en) | Mounting body manufacturing method, thermal fuse element mounting method, and thermal fuse element | |
TWI681433B (en) | Protection device and battery pack | |
TWI648760B (en) | Protection device and battery pack | |
US10395876B1 (en) | Protection device | |
CN109727833B (en) | Protection element and circuit protection device thereof | |
US20190157031A1 (en) | Protection device and circuit protection apparatus containing the same | |
TWI676202B (en) | Protective component | |
TW201917764A (en) | Protection device and circuit protection apparatus containing the same | |
TWI700719B (en) | Protection device and circuit protection apparatus containing the same | |
US10892130B2 (en) | Protection device and circuit protection apparatus containing the same | |
WO2020209198A1 (en) | Protective element | |
CN109727832A (en) | Protection element and its circuit protection device | |
CN215869263U (en) | Protection element and circuit protection device thereof | |
CN110828254B (en) | Protective element | |
JP4219502B2 (en) | Resistive fuse | |
TWM653402U (en) | Protection device | |
JPH0622093B2 (en) | Substrate type thermal fuse and resistor and method of manufacturing the same | |
TW201843690A (en) | Protection device and circuit protection apparatus containing the same |