CN106384758B - 一种防边缘漏电的太阳电池刻边方法 - Google Patents
一种防边缘漏电的太阳电池刻边方法 Download PDFInfo
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- CN106384758B CN106384758B CN201610892599.3A CN201610892599A CN106384758B CN 106384758 B CN106384758 B CN 106384758B CN 201610892599 A CN201610892599 A CN 201610892599A CN 106384758 B CN106384758 B CN 106384758B
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- silicon chip
- etching slurry
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- 238000000034 method Methods 0.000 title claims abstract description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 48
- 239000010703 silicon Substances 0.000 claims abstract description 48
- 238000005530 etching Methods 0.000 claims abstract description 46
- 239000002002 slurry Substances 0.000 claims abstract description 41
- 238000009792 diffusion process Methods 0.000 claims abstract description 23
- 239000008367 deionised water Substances 0.000 claims abstract description 20
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000001035 drying Methods 0.000 claims abstract description 10
- 238000005406 washing Methods 0.000 claims abstract description 10
- 238000005498 polishing Methods 0.000 claims abstract description 8
- 239000012530 fluid Substances 0.000 claims abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 239000003513 alkali Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- 230000004224 protection Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 1
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Weting (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610892599.3A CN106384758B (zh) | 2016-10-13 | 2016-10-13 | 一种防边缘漏电的太阳电池刻边方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610892599.3A CN106384758B (zh) | 2016-10-13 | 2016-10-13 | 一种防边缘漏电的太阳电池刻边方法 |
Publications (2)
Publication Number | Publication Date |
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CN106384758A CN106384758A (zh) | 2017-02-08 |
CN106384758B true CN106384758B (zh) | 2017-07-28 |
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CN201610892599.3A Active CN106384758B (zh) | 2016-10-13 | 2016-10-13 | 一种防边缘漏电的太阳电池刻边方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111785810B (zh) * | 2020-07-15 | 2022-04-08 | 常州时创能源股份有限公司 | 一种n-pert电池的制备方法 |
CN114765224B (zh) * | 2020-12-30 | 2024-09-27 | 苏州阿特斯阳光电力科技有限公司 | 背接触电池及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101777605A (zh) * | 2010-03-15 | 2010-07-14 | 山东力诺太阳能电力股份有限公司 | 一种晶体硅太阳能电池边缘刻蚀工艺 |
CN103094409A (zh) * | 2011-11-08 | 2013-05-08 | 浚鑫科技股份有限公司 | 一种应用于多晶硅太阳能电池的边缘刻蚀工艺 |
CN103500772A (zh) * | 2013-09-06 | 2014-01-08 | 江苏爱多光伏科技有限公司 | 浆料腐蚀法制备背面抛光多晶硅太阳电池的工艺方法 |
CN104396027A (zh) * | 2012-06-25 | 2015-03-04 | 默克专利股份有限公司 | 制造具有局部背表面场(lbsf)的太阳能电池的方法 |
CN104505431A (zh) * | 2014-12-11 | 2015-04-08 | 东方日升新能源股份有限公司 | 一种减少太阳能电池片刻蚀酸用量的工艺方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8592248B2 (en) * | 2010-11-17 | 2013-11-26 | E I Du Pont De Nemours And Company | Etching method for use with thin-film photovoltaic panel |
-
2016
- 2016-10-13 CN CN201610892599.3A patent/CN106384758B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101777605A (zh) * | 2010-03-15 | 2010-07-14 | 山东力诺太阳能电力股份有限公司 | 一种晶体硅太阳能电池边缘刻蚀工艺 |
CN103094409A (zh) * | 2011-11-08 | 2013-05-08 | 浚鑫科技股份有限公司 | 一种应用于多晶硅太阳能电池的边缘刻蚀工艺 |
CN104396027A (zh) * | 2012-06-25 | 2015-03-04 | 默克专利股份有限公司 | 制造具有局部背表面场(lbsf)的太阳能电池的方法 |
CN103500772A (zh) * | 2013-09-06 | 2014-01-08 | 江苏爱多光伏科技有限公司 | 浆料腐蚀法制备背面抛光多晶硅太阳电池的工艺方法 |
CN104505431A (zh) * | 2014-12-11 | 2015-04-08 | 东方日升新能源股份有限公司 | 一种减少太阳能电池片刻蚀酸用量的工艺方法 |
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Address after: Solar photovoltaic industry park Tianhe Road 213031 north of Jiangsu Province, Changzhou City, No. 2 Co-patentee after: TRINA SOLAR( CHANGZHOU) TECHNOLOGY Co.,Ltd. Patentee after: trina solar Ltd. Address before: Solar photovoltaic industry park Tianhe Road 213031 north of Jiangsu Province, Changzhou City, No. 2 Co-patentee before: TRINA SOLAR( CHANGZHOU) TECHNOLOGY Co.,Ltd. Patentee before: CHANGZHOU TRINA SOLAR ENERGY Co.,Ltd. Address after: Solar photovoltaic industry park Tianhe Road 213031 north of Jiangsu Province, Changzhou City, No. 2 Co-patentee after: TRINA SOLAR( CHANGZHOU) TECHNOLOGY Co.,Ltd. Patentee after: TRINASOLAR Co.,Ltd. Address before: Solar photovoltaic industry park Tianhe Road 213031 north of Jiangsu Province, Changzhou City, No. 2 Co-patentee before: TRINA SOLAR( CHANGZHOU) TECHNOLOGY Co.,Ltd. Patentee before: trina solar Ltd. |
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