CN106384740A - Frameless display device and preparation method therefor - Google Patents
Frameless display device and preparation method therefor Download PDFInfo
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- CN106384740A CN106384740A CN201610835122.1A CN201610835122A CN106384740A CN 106384740 A CN106384740 A CN 106384740A CN 201610835122 A CN201610835122 A CN 201610835122A CN 106384740 A CN106384740 A CN 106384740A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a frameless display device and a preparation method therefor, and the method comprises the steps: providing a carrier; forming a separation layer on the carrier; forming a plurality of metal contact pads on the separation layer; sequentially forming an organic film layer and metal routing layer on the separation layer, wherein the organic film layer is provided with a first plug which is located above the metal contact pads and electrically contacts with the metal contact pads, and the metal routing layer is electrically connected with the first plug; forming an insulating layer on the metal routing layer, wherein the insulating layer is provided with a plurality of second plugs which are electrically connected with the metal routing layer; forming a display module on the insulating layer and a packaging layer on the display module, wherein the display module is electrically connected with the second plugs; separating the separation layer with the organic film layer, exposing the metal contact pads, and enabling the metal contact pads to be electrically connected with a drive circuit. According to the invention, metal wires and the drive circuit are disposed on the back surface of the display module, thereby reducing the width of the frame of a display device, and achieving a frameless display device.
Description
Technical field
The present invention relates to technical field of display panel, more particularly, to a kind of frame-free displaying device and preparation method thereof.
Background technology
Organic light emitting display (OLED, Organic Light Emitting Display) is active luminous component,
With present main flow flat panel display Thin Film Transistor-LCD (TFT LCD, Thin Film Transistor-
Liquid Crystal Display) compare, OLED has the advantages that contrast is high, visual angle is wide, low in energy consumption, volume is thinner, has
Hope the flat panel display of future generation becoming after LCD.
However, the scanning circuit on current AMOLED is arranged at the front of display screen and is located at the left side in the front of display screen
Right both sides, occupy the space of display screen frame, the large-size screen monitors high definition design of impact later stage display screen structure.Due to scanning circuit
Array structure design leads to the screen body frame of display screen wider, and the requirement to the display screen narrow frame such as mobile phone for the client is increasingly
High.Therefore, it is badly in need of proposing a kind of display screen structure of Rimless, to cater to the development trend of display screen.
Content of the invention
It is an object of the invention to, a kind of frame-free displaying device and preparation method thereof is provided, solves aobvious in prior art
The screen wider problem of body frame of display screen.
For solving above-mentioned technical problem, the present invention provides a kind of preparation method of frame-free displaying device, including：
One carrier is provided；
Form stratum disjunctum on the carrier；
Multiple metal contact pads are formed on described stratum disjunctum；
Form organic film and metal routing layer in described stratum disjunctum successively, have positioned at described in described organic film
The first connector being electrically connected with above metal contact pad and with described metal contact pad, described metal routing layer is inserted with described first
Plug is electrically connected with；
Described metal routing layer forms insulating barrier, there is multiple and described metal routing layer electrical in described insulating barrier
The second connector connecting；
On described insulating barrier formed display module and be located at described display module on encapsulated layer, described display module with
Described second connector is electrically connected with；
Described stratum disjunctum is separated with described organic film, exposes described metal contact pad, and by metal contact pad with
Drive circuit is electrically connected with.
Optionally, detached with described organic film for described stratum disjunctum concrete steps are included：
Using laser lift-off, described carrier is peeled off, peel off and while described carrier, remove partly described stratum disjunctum；
After described carrier is peeled off from described stratum disjunctum, removed described completely using process chemically or physically
Stratum disjunctum.
Optionally, the material of described stratum disjunctum be polyimides, polyethylene, PEN, poly- to benzene two
Any one in formic acid glycol ester or cellophane.
Optionally, the concrete steps forming described first connector include：
Organic film is formed on described stratum disjunctum；
Etch described organic film, form the first groove of metal contact pad described in multiple expose portions；
Described metal routing layer is formed on described organic film, and in described first groove filler metal formed described
First connector, described metal routing layer is electrically connected with described first connector.
Optionally, the concrete steps forming described first connector include：
On partly described metal contact pad, deposited metal forms multiple described first connectors；
Described stratum disjunctum forms described organic film, and described organic film exposes described first connector；
Described metal routing layer is formed on described organic film, described metal routing layer is electrically connected with described first connector
Connect.
Optionally, the concrete steps forming described second connector include：
Insulating barrier is formed on described metal routing layer；
Etch described insulating barrier, form multiple second grooves, metal routing described in multiple described second groove expose portions
Layer；
In described second groove, filler metal forms described second connector.
Optionally, the concrete steps forming described second connector include：
Multiple described second connectors are formed on described metal routing layer；
Described insulating barrier is formed on described metal routing layer, described insulating layer exposing goes out described second connector.
Optionally, described display module includes the TFT layer on described insulating barrier, and is located on described TFT layer
Oled layer, described TFT layer is electrically connected with described second connector.
Optionally, the material of described encapsulated layer is at least one of which inorganic oxide film layer, or at least one of which organic matter film
Layer, or one layer of inorganic oxide film layer and one layer of organic film stacked spaced apart setting.
Accordingly, the present invention also provides a kind of frame-free displaying device, including：
Metal contact pad；
Multiple first connectors on described metal contact pad；
Cover the organic film of described metal contact pad, described organic film exposes described first connector；
Metal routing layer on described organic film, described metal routing layer is electrically connected with described first connector；
Insulating barrier on described metal routing layer, has multiple second connectors in described insulating barrier；
Positioned at the display module on described insulating barrier and be located at described display module on encapsulated layer, described display module with
Described second connector is electrically connected with；
The drive circuit being electrically connected with described metal contact pad.
Compared with prior art, frame-free displaying device of the present invention and preparation method thereof at least has following beneficial effect
Really：
In the present invention, metal routing is arranged on the back side of display module, drive circuit passes through metal contact pad and first and inserts
Plug is electrically connected with metal routing layer, thus drive signal is exported metal routing layer by drive circuit, metal routing layer passes through
Drive signal is exported display module by the second connector, and display module receives this drive signal and completes its display function.The present invention
In metal routing and drive circuit be arranged on the back side of display module, thus reducing the width of display device framework, realize aobvious
The Rimless of showing device.
Brief description
Fig. 1 is the preparation flow figure of frame-free displaying device in one embodiment of the invention；
Fig. 2 is the cross-sectional view forming metal contact pad in one embodiment of the invention；
Fig. 3 is the cross-sectional view forming first groove in one embodiment of the invention；
Fig. 4 is the cross-sectional view forming metal routing layer and the first connector in one embodiment of the invention；
Fig. 5 is the cross-sectional view forming insulating barrier in one embodiment of the invention；
Fig. 6 is the cross-sectional view forming second groove in one embodiment of the invention；
Fig. 7 is the cross-sectional view forming the second connector in one embodiment of the invention；
Fig. 8 is the cross-sectional view forming display module and encapsulated layer in one embodiment of the invention；
Fig. 9 is the cross-sectional view in one embodiment of the invention peeled off carrier；
Figure 10 is the cross-sectional view removing stratum disjunctum in one embodiment of the invention completely；
Figure 11 is the cross-sectional view forming drive circuit in one embodiment of the invention.
Specific embodiment
Below in conjunction with schematic diagram, frame-free displaying device of the present invention and preparation method thereof is described in more detail,
Which show the preferred embodiments of the present invention it should be appreciated that those skilled in the art can change invention described herein,
And still realize the advantageous effects of the present invention.Therefore, description below be appreciated that extensive for those skilled in the art
Know, and be not intended as limitation of the present invention.
Referring to the drawings the present invention more particularly described below by way of example in the following passage.Will according to following explanation and right
Seek book, advantages and features of the invention will become apparent from.It should be noted that, accompanying drawing is all in the form of very simplification and all using non-
Accurately ratio, only in order to purpose that is convenient, lucidly aiding in illustrating the embodiment of the present invention.
The core concept of the present invention is, metal routing is arranged on the back side of display module, and drive circuit passes through metal
Engagement pad and the first connector are electrically connected with metal routing layer, drive signal are exported metal routing layer, metal routing layer leads to
Cross the second connector and drive signal is exported display module, complete the display function of display module.Metal routing in the present invention
And drive circuit is arranged on the back side of display module, thus realizing the Rimless of display device, reduce display device framework
Width.
Below in conjunction with accompanying drawing 1 to Figure 11, frame-free displaying device of the present invention and preparation method thereof is specifically retouched
State.The flow chart giving the frame-free displaying device preparation method of the present invention in Fig. 1, gives each step in Fig. 2～Figure 11
Corresponding cross-sectional view.The preparation method of the frame-free displaying device of the present invention specifically includes following steps：
First, execution step S1, with reference to shown in Fig. 2, provides a carrier 10, and in the present embodiment, described carrier 10 is transparent
Glass.
Execution step S2, with continued reference to shown in Fig. 2, forms stratum disjunctum 20 on described carrier 10.In the present embodiment, adopt
The method of rotary coating or slot coated forms a wet film layer over the carrier 10, and using 300 DEG C～500 DEG C of high-temperature baking
Described wet film layer, to form described stratum disjunctum 20 over the carrier 10.The material of described stratum disjunctum 20 can select polyimides
(Polyimide, PI), polyethylene (polyethylene, PE), PEN (PEN), poly terephthalic acid second
The exotic materials such as diol ester (PET), cellophane (PT), stratum disjunctum 20 removes it is preferred that described point in follow-up stripping process
Absciss layer 20 is relatively thin, and for example, thickness is 1 μm～10 μm, for example, 3 μm, 5 μm, 6 μm, 8 μm, is easy to remove in subsequent technique.
Execution step S3, with continued reference to multiple metal contact pads 30, shown in Fig. 2, are formed on described stratum disjunctum 20, described
Stratum disjunctum 20 described in metal contact pad 30 covering part.In the present embodiment, described gold is formed using techniques such as physical vapour deposition (PVD)s
Belong to engagement pad 30, described metal contact pad 30 is the metal such as copper metal, aluminum metal, silver metal, ITO, described metal contact pad
Thickness is 1 μm～5 μm.
Secondly, execution step S4, forms organic film and metal routing layer successively in described stratum disjunctum 20, described organic
The first connector having in film layer above described metal contact pad and being electrically connected with described metal contact pad, described metal
Routing layer is electrically connected with described first connector.In the present embodiment, form described organic film, described metal routing layer and institute
The concrete steps stating the first connector include：
With reference to shown in Fig. 2, described stratum disjunctum 20 forms organic film 40, in the present embodiment, can be applied using rotation
The method of cloth or slot coated forms a wet film layer in stratum disjunctum 20, and using described in 300 DEG C～500 DEG C of high-temperature baking
Organic film 40, to form described organic film 40 in stratum disjunctum 20.The material of described organic film 40 can select polyamides
Imines (Polyimide, PI), polyethylene (polyethylene, PE), PEN (PEN), poly- terephthaldehyde
The exotic materials such as sour glycol ester (PET), cellophane (PT), the thickness of described organic film 40 is 10 μm～20 μm.
Then, with reference to shown in Fig. 3, etch described organic film 40, form the of metal contact pad 30 described in expose portion
One groove 51.Specifically, the photoresistance (not shown) of patterning is first formed on described organic film 40, using plasma
Body etching technics etches described organic film 40, only exposes part metals engagement pad 30, so that the first connector being formed
Shared space less.
With reference to shown in Fig. 4, described organic film 40 forms described metal routing layer 60, simultaneously in described first groove
51 filler metal form described first connector 31, thus the first connector 31 and metal routing layer 50 are electrically connected with.
It is understood, however, that in another embodiment of the invention, the concrete steps of described first connector are formed also
Can include：First, on partly described metal contact pad 30, deposited metal forms described first connector 31；Then, described
Described organic film 40 is formed on stratum disjunctum 20, and described organic film 40 exposes described first connector 31；Afterwards, described
Described metal routing layer 60 is formed on organic film 40, described metal routing layer 60 is electrically connected with described first connector 31.Need
It is noted that due to adopting coating process to form organic film 40, organic membrane on metal contact pad 30 and the first connector 31
The thickness of layer 40 is wayward, easily makes organic film first connector 31 is completely covered, therefore, in the present embodiment, it is preferred to use
Etching organic film forms first groove, and the mode refilling first groove forms the first connector.
Again, execution step S5, on described metal routing layer 60 formed insulating barrier, have in described insulating barrier with described
The second connector that metal routing layer is electrically connected with.In the present embodiment, form the concrete of described insulating barrier and described second connector
Step includes：
With reference to shown in Fig. 5, insulating barrier 70, in the present embodiment, described insulating barrier 70 are formed on described metal routing layer 60
For inorganic material or organic material layer, described insulating barrier 70 is for being isolated between metal routing layer and display module.
With reference to shown in Fig. 6, the photoresistance (not shown) of patterning is formed on insulating barrier 70, then using plasma is carved
Etching technique etches described insulating barrier 70, forms multiple second grooves 52, metal routing described in described second groove 52 expose portion
Layer 60.Wherein, described second groove 52 may be located at the first connector 31 top it is also possible to be located at metal routing layer on other
Position, the present invention not limits to this.
With reference to shown in Fig. 7, in described second groove 52, filler metal forms described second connector 32, thus the second connector
32 are electrically connected with metal routing layer 60, and the first connector 31 with lower section and metal contact pad 30 are electrically connected with, for by gold
The drive signal belonging in routing layer 60 exports to display module.
However, in another embodiment of the invention, forming the concrete steps of described insulating barrier and described second connector
Can also include：First, the described metal routing layer above described first connector 31 forms described second connector 32；Institute
State and described insulating barrier is formed on metal routing layer, described insulating barrier 70 exposes described second connector 32.
Afterwards, execution step S6, with reference to shown in Fig. 8, forms display module 80 on described insulating barrier 70 and is located at described
Encapsulated layer 90 on display module 80, described display module 80 is electrically connected with described second connector 32.Wherein, described display group
Part 80 includes the TFT layer 81 on described insulating barrier 70, and is located at the oled layer 82 on described TFT layer 81, described TFT layer 81
It is electrically connected with described second connector 32.Specifically, prepare TFT layer 81 and the technique of oled layer 82 is referred to traditional skill
Art, such as TFT layer 81 can adopt the backboard processing technology of low temperature polycrystalline silicon (LTPS), form electrode, hole in oled layer 82
Implanted layer, hole transmission layer, organic luminous layer, electron transfer layer, electron injecting layer etc., for realizing the display work(of display screen
Energy.Described encapsulated layer 90 is used for protecting display module 80, and its material is at least one of which inorganic oxide film layer, or at least one of which
Organic film, or one layer of inorganic oxide film layer and one layer of organic film stacked spaced apart setting.
Then, execution step S7, described stratum disjunctum 20 is separated with described organic film 40, exposes described metal contact
Pad 30, in the present embodiment, detached with described organic film 40 for described stratum disjunctum 20 concrete steps is included：
With reference to shown in Fig. 9, using laser lift-off, described carrier 10 is peeled off, in the present embodiment, by laser from carrier
10 one sides deviating from stratum disjunctum 2013 are injected, and scan so that stratum disjunctum 20 sinters to the other end from one end of carrier 10, thus
Carrier 10 is separated from stratum disjunctum 20, in the process, also removes at least partly while peeling off described carrier 10
Described stratum disjunctum 10, according to process conditions, can only remove and be partially separated layer 10 it is also possible to remove stratum disjunctum 10 completely by metal
Engagement pad 30 comes out.
Afterwards, with reference to shown in Figure 10, after described carrier 10 is peeled off from described stratum disjunctum 20, only remove and be partially separated
During layer 10, more described stratum disjunctum 20 is removed completely using the process such as chemically or physically, thus exposing metal contact pad 30.
It is for instance possible to use the technique such as laser lift-off or mechanical stripping removes stratum disjunctum 20 completely.
Finally, by bonding technology, metal contact pad 30 is electrically connected with one drive circuit 100, drive circuit is display
Device provides drive signal.In the present invention, drive circuit 100 passes through metal contact pad 30 and the first connector 31 and metal routing layer
60 electric connections, thus drive signal is passed through drive circuit 100 metal contact pad 30 and the first connector 31 exports metal and walks
Line layer 60, drive signal is exported display module 80 by the second connector 32 by metal routing layer 60 again, drives TFT layer 81, TFT
Layer 81 will make oled layer light, thus completing the display function of display module.And, the metal routing layer 60 in the present invention with
And drive circuit 100 is arranged on the back side of display module 80 such that it is able to reduce the width of display device framework, realize display dress
The Rimless put.
Accordingly, with reference to shown in Figure 11, the present invention also provides a kind of frame-free displaying device, including：
Metal contact pad 30；
The first connector 31 on described metal contact pad 30；
Cover the organic film 40 of described metal contact pad 30, described organic film 40 exposes described first connector 31；
Metal routing layer 60 on described organic film 40, described metal routing layer 60 and described first connector 31 electricity
Property connect；
Insulating barrier 70 on described metal routing layer 60, has in described insulating barrier 70 positioned at described first connector 31
Top and the second connector 32 being electrically connected with described first connector 31；
Positioned at the display module 80 on described insulating barrier 70 and the encapsulated layer 90 on described display module 80, described aobvious
Show that assembly 80 is electrically connected with described second connector 32；
The drive circuit 100 being electrically connected with described metal contact pad 30.
In sum, in frame-free displaying device that the present invention provides and preparation method thereof, metal routing is arranged on aobvious
Show the back side of assembly, drive circuit is passed through metal contact pad and the first connector and is electrically connected with metal routing layer, by drive signal
Export metal routing layer, drive signal is exported display module by the second connector, completes display module by metal routing layer
Display function.Metal routing in the present invention and drive circuit are arranged on the back side of display module, thus realizing display dress
The Rimless put, reduces the width of display device framework.
Obviously, those skilled in the art can carry out the various changes and modification essence without deviating from the present invention to the present invention
God and scope.So, if these modifications of the present invention and modification belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprise these changes and modification.
Claims (10)
1. a kind of preparation method of frame-free displaying device is it is characterised in that include：
One carrier is provided；
Form stratum disjunctum on the carrier；
Multiple metal contact pads are formed on described stratum disjunctum；
Form organic film and metal routing layer in described stratum disjunctum successively, have positioned at described metal in described organic film
The first connector being electrically connected with above engagement pad and with described metal contact pad, described metal routing layer and described first connector electricity
Property connect；
Described metal routing layer forms insulating barrier, there is in described insulating barrier multiple and described metal routing layer and be electrically connected with
The second connector；
On described insulating barrier formed display module and be located at described display module on encapsulated layer, described display module with described
Second connector is electrically connected with；
Described stratum disjunctum is separated with described organic film, exposes described metal contact pad, and by metal contact pad and driving
Circuit is electrically connected with.
2. frame-free displaying device as claimed in claim 1 preparation method it is characterised in that by described stratum disjunctum with described
The detached concrete steps of organic film include：
Using laser lift-off, described carrier is peeled off, peel off and while described carrier, remove partly described stratum disjunctum；
After described carrier is peeled off from described stratum disjunctum, described separation is removed completely using process chemically or physically
Layer.
3. the preparation method of frame-free displaying device as claimed in claim 2 is it is characterised in that the material of described stratum disjunctum is
Any one in polyimides, polyethylene, PEN, polyethylene terephthalate or cellophane.
4. the preparation method of frame-free displaying device as claimed in claim 1 is it is characterised in that form described first connector
Concrete steps include：
Organic film is formed on described stratum disjunctum；
Etch described organic film, form the first groove of metal contact pad described in multiple expose portions；
Described metal routing layer is formed on described organic film, and filler metal forms described first in described first groove
Connector, described metal routing layer is electrically connected with described first connector.
5. the preparation method of frame-free displaying device as claimed in claim 1 is it is characterised in that form described first connector
Concrete steps include：
On partly described metal contact pad, deposited metal forms multiple described first connectors；
Described stratum disjunctum forms described organic film, and described organic film exposes described first connector；
Described metal routing layer is formed on described organic film, described metal routing layer is electrically connected with described first connector.
6. the preparation method of frame-free displaying device as claimed in claim 1 is it is characterised in that form described second connector
Concrete steps include：
Insulating barrier is formed on described metal routing layer；
Etch described insulating barrier, form multiple second grooves, metal routing layer described in multiple described second groove expose portions；
In described second groove, filler metal forms described second connector.
7. the preparation method of frame-free displaying device as claimed in claim 1 is it is characterised in that form described second connector
Concrete steps include：
Multiple described second connectors are formed on described metal routing layer；
Described insulating barrier is formed on described metal routing layer, described insulating layer exposing goes out described second connector.
8. the preparation method of frame-free displaying device as claimed in claim 1 is it is characterised in that described display module includes position
TFT layer on described insulating barrier, and it is located at the oled layer on described TFT layer, described TFT layer is electrically connected with described second connector
Connect.
9. the preparation method of frame-free displaying device as claimed in claim 1 is it is characterised in that the material of described encapsulated layer is
At least one of which inorganic oxide film layer, or at least one of which organic film, or one layer of inorganic oxide film layer had with one layer
Machine thing film layer stacked spaced apart is arranged.
10. a kind of frame-free displaying device is it is characterised in that include：
Metal contact pad；
Multiple first connectors on described metal contact pad；
Cover the organic film of described metal contact pad, described organic film exposes described first connector；
Metal routing layer on described organic film, described metal routing layer is electrically connected with described first connector；
Insulating barrier on described metal routing layer, has multiple second connectors in described insulating barrier；
Positioned at the display module on described insulating barrier and be located at described display module on encapsulated layer, described display module with described
Second connector is electrically connected with；
The drive circuit being electrically connected with described metal contact pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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