CN106380228A - Ceramic chip leveling heat treatment tool and heat treatment process thereof - Google Patents
Ceramic chip leveling heat treatment tool and heat treatment process thereof Download PDFInfo
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- CN106380228A CN106380228A CN201610743542.7A CN201610743542A CN106380228A CN 106380228 A CN106380228 A CN 106380228A CN 201610743542 A CN201610743542 A CN 201610743542A CN 106380228 A CN106380228 A CN 106380228A
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- Prior art keywords
- flaky pottery
- flaky
- planarized
- pottery
- heat treatment
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/08—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads
- B28B11/10—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads by using presses
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The present invention relates to a ceramic chip leveling heat treatment tool and a heat treatment process thereof, and relates to the technical field of ceramic chip heat treatment, which mainly aims to improve the qualified rate of products and lower the production cost. The ceramic chip leveling heat treatment process comprises the steps of placing a to-be-leveled ceramic chip into an accommodating groove, pressing the lower end surface of a pressing cover onto the to-be-leveled ceramic chip through an opening of the accommodating groove so as to load the to-be-leveled ceramic chip into the ceramic chip leveling heat treatment tool, and applying a pressure by adopting a counterweight block; transferring the tool with the to-be-leveled ceramic chip arranged therein into a heat treatment furnace for heat treatment so as to deform and level the to-be-leveled ceramic chip; cooling the tool with the to-be-leveled ceramic chip arranged therein so as to obtain a ceramic chip finished product. in this way, the ceramic chip, which is deformed and warped after the sintering treatment or the surface treatment, is leveled, so that usage requirements can be met. Meanwhile, the product qualified rate of ceramic chips is improved.
Description
Technical field
The present invention relates to flaky pottery technical field of heat treatment, more particularly to a kind of flaky pottery planarizing heat treatment work
Dress and Technology for Heating Processing.
Background technology
Flaky pottery is the substrate preparing ceramic substrate, has good electrical insulation by the ceramic substrate that flaky pottery is made
Energy, high heat conduction characteristic, excellent solderability and high adhesive strength, and can be able to etch each as printing board PCB
Plant figure, there is very big current capacity.Therefore, ceramic substrate has become high-power electric and electronic circuit structure technology and interconnection
The basic material of technology.
The processing technology of flaky pottery commonly uses stacked sintering process at present, by a number of pottery lamella to be sintered
Poststack is sintered, after sintering obtain flaky pottery material property densified, densified after flaky pottery as finished product
Use, make ceramic substrate.
In realizing process of the present invention, inventor finds that in prior art, at least there are the following problems：
In sintering, potsherd to be sintered can occur either large or small deformation, the particularly folded pottery to be sintered burning layer top
Piece buckling deformation is the most serious, usually can fall as waste disposal, have impact on product percent of pass and production cycle, and causes one
Determine the wasting of resources of degree..
Additionally, in order to meet the requirement to flaky pottery surface roughness for the circuit, need after ceramic post sintering to be ground,
The surface treatment such as polishing, due to being affected by grinding and polishing stress, can exist a certain degree of after flaky pottery grinding and polishing
Buckling deformation, leads to product yields to reduce.
Content of the invention
In view of this, the present invention provides a kind of flaky pottery planarizing heat treatment tooling and Technology for Heating Processing, main purpose
It is to improve product percent of pass, reduce production cost.
For reaching above-mentioned purpose, present invention generally provides following technical scheme：
On the one hand, embodiments of the invention provide a kind of flaky pottery planarizing heat treatment tooling it is characterised in that wrapping
Include：
Heat treatment containing groove, its open top, for placing the flaky pottery to be planarized of stacking；
With compressing lid, the outer profile size of its lower surface is less than or equal to described heat treatment and uses containing groove top for heat treatment
The outer profile size of opening, be used for stretching into described containing groove opening push described in flaky pottery to be planarized.
On the other hand, embodiments of the invention provide a kind of flaky pottery planarizing for buckling deformation after surface treatment
Technology for Heating Processing, planarizes heat treatment tooling using above-mentioned flaky pottery, by the flaky pottery to be planarized after surface treatment,
Planarizing heat treatment is finished product flaky pottery, and the flaky pottery to be planarized after being wherein surface-treated is buckling deformation, described
Flaky pottery planarizing heat treatment process technique includes：
Flaky pottery to be planarized after surface treatment is placed in heat treatment containing groove, lid will be compressed by described appearance
Put the opening of groove, on the flaky pottery to be planarized after making described lower surface be pressed in described surface treatment, will described surface
Flaky pottery to be planarized after process is contained in described flaky pottery planarizing heat treatment tooling；
Inside is heat-treated equipped with the frock immigration heat-treatment furnace of the flaky pottery to be planarized after surface treatment, is made
Flaky pottery deformation planarizing to be planarized after surface treatment；
To inside equipped with the frock cooling of the flaky pottery to be planarized after surface treatment, obtain described finished product sheet pottery
Porcelain.
On the other hand, embodiments of the invention provide a kind of flaky pottery for buckling deformation after sintering to planarize at heat
Science and engineering skill, planarizes heat treatment tooling using above-mentioned flaky pottery, by the flaky pottery to be planarized after sintering, planarizing heat
It is processed as finished product flaky pottery, wherein, the flaky pottery to be planarized after sintering is buckling deformation, and described flaky pottery is smooth
Change Technology for Heating Processing to include：
Flaky pottery to be planarized after sintering is placed in heat treatment containing groove, lid will be compressed by described accommodating recessed
The opening of groove, make the lower surface compressing lid be pressed in described on flaky pottery to be planarized, will treating after described sintering planarize
Flaky pottery is contained in described flaky pottery planarizing heat treatment tooling；
Inside is heat-treated equipped with the frock immigration heat-treatment furnace of the flaky pottery to be planarized after sintering, is made sintering
Flaky pottery deformation planarizing to be planarized afterwards；
To inside equipped with the frock cooling of the flaky pottery to be planarized after sintering, obtain described finished product flaky pottery.
By technique scheme, flaky pottery planarizing heat treatment tooling and heat treatment that technical solution of the present invention provides
Technique at least has following advantages：
In technical scheme provided in an embodiment of the present invention, by after sintering or the flaky pottery to be planarized after surface treatment
In the heat treatment containing groove being placed in flaky pottery frock of stacking, reuse and compress the sheet to be planarized that lid is pressed in stacking
On pottery, afterwards, by heat treatment, flaky pottery deformation to be planarized can be made, make flaky pottery to be planarized tend to planarizing,
Thus can make, because the flaky pottery of buckling deformation is planarized after sintering or after surface treatment, meet use requirement, carry
The high product percent of pass of flaky pottery.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
Brief description
By reading the detailed description of hereafter preferred embodiment, various other advantages and benefit are common for this area
Technical staff will be clear from understanding.Accompanying drawing is only used for illustrating the purpose of preferred embodiment, and is not considered as to the present invention
Restriction.And in whole accompanying drawing, it is denoted by the same reference numerals identical part.In the accompanying drawings：
Fig. 1 is the sectional structure signal that a kind of flaky pottery that embodiments of the invention one provide planarizes heat treatment tooling
Figure；
Fig. 2 is a kind of schematic flow sheet of flaky pottery planarizing Technology for Heating Processing of the offer of the present invention.
Specific embodiment
For further illustrating that the present invention is to reach technological means and effect that predetermined goal of the invention is taken, below in conjunction with
Accompanying drawing and preferred embodiment, to planarizing heat treatment tooling and Technology for Heating Processing according to flaky pottery proposed by the present invention, it is concrete
Embodiment, structure, feature and its effect, after describing in detail such as.In the following description, different " embodiment " or " enforcement
What example " referred to is not necessarily same embodiment.Additionally, special characteristic in one or more embodiments, structure or feature can be by any
Suitable form combines.
Embodiment one
As shown in figure 1, a kind of flaky pottery planarizing heat treatment tooling that embodiments of the invention one propose, it includes：
10 heat treatment containing grooves, the open top of heat treatment containing groove, for place stacking wait planarize
Flaky pottery X100；
With compressing lid, the outer profile size compressing the lower surface of lid is less than or equal to described heat treatment with housing for 20 heat treatments
The open-topped outer profile size of groove 10, be used for stretching into described containing groove opening push described in flaky pottery to be planarized
X100.
Wherein, the height of flaky pottery to be planarized after the sintering that the depth within containing groove is laminated as needed and
Fixed, the depth within containing groove is more than the height of the flaky pottery to be planarized after the sintering of stacking；Heat treatment is recessed with housing
Groove, compress lid and can be made using exotic material：As aoxidized aluminium material, the purity of oxidation aluminium material is not less than 99wt%.
In technical scheme provided in an embodiment of the present invention, by after sintering or the flaky pottery to be planarized after surface treatment
In the heat treatment containing groove being placed in flaky pottery frock of stacking, reuse and compress the sheet to be planarized that lid is pressed in stacking
On pottery, afterwards, by heat treatment, flaky pottery deformation to be planarized can be made, make flaky pottery to be planarized tend to planarizing,
Thus can make, by after sintering or surface treatment after buckling deformation flaky pottery, being flattened, meet use requirement, improve
The product percent of pass of flaky pottery.
Wherein, after sintering or the flaky pottery to be planarized after surface treatment are being placed at flaky pottery planarizing heat
Science and engineering fills after high-temperature heat treatment, is provided with heat treatment and compresses lid, piece to be planarized due to pressing on flaky pottery planarize
Shape pottery is easily bonded on the bottom surface of heat treatment containing groove, is not easily taken out；For the ease of by the sheet after high-temperature process
Pottery takes out in heat treatment containing groove, as shown in figure 1, the flaky pottery planarizing heat treatment described in above-described embodiment
Frock, the logical cylinder 11 in including of described heat treatment containing groove 10 and detachable card be contained in described in logical cylinder 11
Base plate 12.The center hole shape of described cylinder is mated with described base plate configuration, and base plate is installed into institute from the one end open of cylinder
State in cylinder；The centre bore of described cylinder is aperture identical vertical holes；Wherein, base plate and described body centre interporal lacuna are joined
Close, under frictional force effect, base plate is snap-fit in cylinder.Flaky pottery to be planarized after the sintering of stacking overlays base plate
On, heat treated after, flaky pottery to be planarized becomes finished product flaky pottery, operating personnel's pressable finished product flaky pottery, makes
Finished product flaky pottery and base plate in slide in logical cylinder, and therefrom separate, in order to divide finished product flaky pottery and base plate
From；Or, operating personnel's pressable base plate, make finished product flaky pottery and base plate in slide in logical cylinder, and therefrom separate,
In order to finished product flaky pottery is separated with base plate.
In after the sintering to stacking or after surface treatment flaky pottery planarize heating, the waiting of warpage is put down
Integralization flaky pottery can deform upon, and the edge that may lead to the flaky pottery to be planarized being laminated after deformation is not same vertical
Plane, leads to the edge of part flaky pottery to be planarized to occur in deformation sagging, in order to improve planarizing thermal treatment quality,
Above-mentioned flaky pottery planarizing heat treatment tooling, the groove footpath geomery of described heat treatment containing groove with described treat smooth
Change the geomery coupling of flaky pottery.During the flaky pottery to be planarized of warpage can deform upon, flaky pottery to be planarized
Four weekly assemblies limited by the groove footpath wall of pockets, so that the edge of flaky pottery planarize of stacking after deformation is erected same
Straight plane.
In specific production, the form-factor of the flaky pottery to be planarized after sintering or after surface treatment differs, thickness
Degree size differs, and needs the pressure being applied to flaky pottery to be planarized also different for compressing lid, the piece to be planarized of stacking
Shape pottery stacking number is higher, thicker, flaky pottery to be planarized the buckling deformation degree of flaky pottery thickness to be planarized more
Greatly, the weight compressing lid needs is bigger, in order to adapt to the flaky pottery to be planarized of different size, as shown in figure 1, above-mentioned piece
Shape pottery planarizing heat treatment tooling, the described lid 20 that compresses includes gland 21 and balancing weight 22；The lower pressure side of described gland 21
For stretching in described containing groove opening, described balancing weight 22 is pressed on described gland 21.Balancing weight has plurality of specifications, point
It is not applied to and increase different counterweight pressure.In addition, the sheet to be planarized after heat treatment containing groove and gland and sintering
Ceramic directly contact, can using oxidation aluminium material make, purity needs to reach standard, balancing weight not with gland with sinter after treat
Planarizing flaky pottery directly contact it is only necessary to no deformation, no dispensing volatile at high temperature, for purity also no requirement (NR).
Wherein, the planarizing treating planarizing flaky pottery is the higher technique of a precision, in the production of different batches
In technique, in order that compressing lid, to treat the pressure stress that planarizing flaky pottery applies consistent, reaches planarization effects in a balanced way,
As shown in figure 1, above-mentioned flaky pottery planarizes heat treatment tooling, described balancing weight 22 is pressed on the top surface of described gland 21,
The form fit of the top surface of the shape of described balancing weight 22 and described gland 21, i.e. the outline of balancing weight can be with gland top
The coincident in face, in order to differentiate the contraposition of gland and balancing weight.
Gland specifically can adopt lower shape：The top surface of described gland generally circular in shape, or with flaky pottery to be planarized
Form fit.
Wherein, in order that gland and balancing weight treat planarizing flaky pottery uniform stressed, the described lower end of described gland
The size shape on the surface that the overall size shape in face is pressed down more than or equal to described flaky pottery to be planarized.Described compress lid
Lower surface be plane, in planarizing, lower surface completely can be pressed in down and be pressed down on surface, make flaky pottery to be planarized
Uniform stressed.In being planarized, its stack height is gradually reduced the (sheet by warpage to the flaky pottery to be planarized of warpage
The flaky pottery that pottery is changed into trend flat board leads to), in order that compressing the flaky pottery to be planarized that lid can follow stacking
Motion, as shown in figure 1, above-mentioned flaky pottery planarizing heat treatment tooling, the described heat treatment side 13 of containing groove 10
Vertical with the bottom surface 14 of described containing groove 10, described lower pressure side 21a outside dimension and the described containing groove 10 compressing lid 20
Internal diameter size coupling, the side 13 of described containing groove 10, as the described slideway compressing lower pressure side 21a of lid, compresses when described
Lower pressure side 21a of lid 20 stretches in described containing groove opening, the described lower surface of described lower pressure side 21a end and described bottom surface
14 remain parallel.Specifically, the bottom surface of containing groove, the lower surface of lower pressure side end are plane, and processed, make table
Surface roughness reaches below 0.3um；The side of containing groove, lower pressure side side processed, make surface roughness reach 1.6um
Below.
Embodiment two
The embodiment of the present invention two provides a kind of flaky pottery for buckling deformation after surface treatment and carries out planarizing heat
Handling process, can be using the flaky pottery planarizing heat treatment tooling described in above-described embodiment one, described in the present embodiment two
Flaky pottery planarize heat treatment tooling and can directly adopt at the described flaky pottery planarizing heat that above-described embodiment one provides
Science and engineering fills, and concrete implementation structure can be found in the related content described in above-described embodiment one, and here is omitted.Described sheet
Pottery planarizing Technology for Heating Processing is used for the flaky pottery to be planarized after surface treatment, and planarizing heat treatment is finished product sheet
Pottery, wherein, described surface treatment is specific to include following situation, and 1, one side grinding is carried out to the flaky pottery after sintering
Process (forming the flaky pottery that the flaky pottery after sintering is carried out with one side milled processed)；2nd, the flaky pottery after sintering is entered
Row twin grinding processes (forming the flaky pottery that the flaky pottery after sintering is carried out with twin grinding process)；3rd, after to sintering
The surface of flaky pottery carries out single-sided polishing process and (forms the piece that the flaky pottery surface after sintering is carried out with single-sided polishing process
Shape pottery)；4th, carry out twin polishing process to the flaky pottery surface after sintering (to be formed and the flaky pottery surface after sintering is entered
The flaky pottery that row twin polishing is processed).Flaky pottery to be planarized after sintering is surface-treated, wherein, described
Surface treatment, that is, include grinding, polishing that the requirement of the surface roughness according to the flaky pottery to be planarized after sintering is carried out
Deng surface treatment, the surface roughness of flaky pottery can be made to improve, angularity reduces；But meanwhile, due in flaky pottery
The presence of portion's machining stress, there is warpage in the super-thin sheet-shaped pottery after surface treatment.
As shown in Fig. 2 described flaky pottery planarizing Technology for Heating Processing includes：
Flaky pottery to be planarized after being surface-treated is placed in heat treatment containing groove by 100a, will compress lid and pass through institute
State the opening of containing groove, on the flaky pottery to be planarized after making described lower surface be pressed in described surface treatment, will be described
Flaky pottery to be planarized after surface treatment is contained in described flaky pottery planarizing heat treatment tooling；
Compress on the flaky pottery to be planarized after lid lower surface is pressed in described surface treatment when described, compress lid described
Action of Gravity Field under, can apply to descend pressure to flaky pottery planarize after the surface treatment of stacking；
Specifically, the described lid that compresses includes gland and balancing weight；The lower pressure side of described gland is used for stretching into described housing
In slot opening, by the weight from the balancing weight being pressed on described gland, under the Action of Gravity Field of gland and balancing weight,
Required lower pressure can be applied to the flaky pottery to be planarized after the surface treatment of stacking.
Inside is carried out at heat by 200a equipped with the frock immigration heat-treatment furnace of the flaky pottery to be planarized after surface treatment
Reason, makes the flaky pottery deformation planarizing to be planarized after surface treatment；
Wherein, the flaky pottery to be planarized after surface treatment is in heat treatment, such as using Muffle furnace, shuttle-type stove or push pedal
The sintering kilns such as stove are heated in certain temperature range, and the flaky pottery to be planarized after surface treatment can occur creep, produce
Raw deformation, under the described Action of Gravity Field compressing lid, the flaky pottery of buckling deformation can trend towards planarizing deformation.
300a obtains described finished product sheet to inside equipped with the frock cooling of the flaky pottery to be planarized after surface treatment
Pottery.
After cooling, the flaky pottery to be planarized after the surface treatment after being heat-treated gradually is shaped, and flatness is higher.
In technical scheme provided in an embodiment of the present invention, by being placed in of the flaky pottery stacking to be planarized after surface treatment
In the heat treatment containing groove of flaky pottery frock, reuse compress lid be pressed on the flaky pottery to be planarized of stacking, it
Afterwards, by heat treatment, the flaky pottery deformation to be planarized after surface treatment can be made, make flaky pottery to be planarized tend to smooth
Change, thus can make, planarizing is able to by the flaky pottery of the rear buckling deformation after being surface-treated and meets use requirement, improve
The product percent of pass of flaky pottery.
Specifically, described by surface treatment after flaky pottery to be planarized be placed in heat treatment containing groove before,
Also include：Ultrasonic wave cleaning is carried out to the surface of the flaky pottery to be planarized after surface treatment, to remove flaky pottery surface
On spot.
In the middle of specific enforcement, above-mentioned flaky pottery planarizing Technology for Heating Processing, described will treating after surface treatment
Planarizing flaky pottery is placed in heat treatment containing groove, specially：Multiple flaky potteries are layered in described heat treatment hold
Receive in groove, stack height is less than or equal to 10mm.
It is not easy to stacking is neat in flaky pottery lamination process to be planarized after to surface treatment, and easily exist
At random in carrying, further, above-mentioned flaky pottery planarizes Technology for Heating Processing, the one week bag of flaky pottery outer wall to stacking
Wrap up in heat and melt winding band.Heat is melted winding band and is melted after being heated to uniform temperature, such as more than 500 DEG C；Heat
Melt be wound around band can be using transparent adhesive tape, adhesive tape is pasted onto the shape pottery periphery one week of stacking.
In the middle of specific enforcement, above-mentioned flaky pottery planarizing Technology for Heating Processing, described compress lid include gland with
And balancing weight；
The lower pressure side of described gland is used for stretching in described containing groove opening, and described balancing weight is pressed on described gland；
By from the weight being pressed in balancing weight on described gland, make described gland lower surface press on described in treat smooth
Pressure on change flaky pottery is in 0.01～0.05MPa.
In order that the flaky pottery to be planarized after surface treatment more completely planarizes in heat treatment and improves simultaneously
Heating efficiency, can using gradient-heated by the way of, described by inside equipped be surface-treated after flaky pottery to be planarized work
Dress moves into heat-treatment furnace and is heat-treated, and specifically includes：
With 1～5 DEG C/min of ramp to T1Degree Celsius；
With 0.5～3 DEG C/min of speed by T1Degree Celsius it is warming up to T2Degree Celsius；
With 0.2～1 DEG C/min of ramp by T2Degree Celsius it is warming up to T3Degree Celsius, and in T3Keep under degree Celsius
60-120Min；
Wherein, T1More than or equal to 300 degrees Celsius, less than or equal to 600 degrees Celsius, T2More than or equal to 700 degrees Celsius, less than etc.
In 900 degrees Celsius, T3More than or equal to 1000 degrees Celsius, less than or equal to 1300 degrees Celsius.
Described to inside equipped with surface treatment after flaky pottery planarize frock lower the temperature, specially：
T is dropped to 3～5 DEG C/min of rate of temperature fall4Degree Celsius, then natural cooling, wherein T4Celsius more than or equal to 400
Degree, less than or equal to 800 degrees Celsius.
Using in cooling method at a slow speed, the speed of cooling is difficult too high, using aforesaid way cooling, it is possible to decrease because too fast
The risk of the flaky pottery cracking to be planarized that cooling leads to, can improve its intensity, improve product quality.
Embodiment three
The embodiment of the present invention three provides a kind of flaky pottery planarizing Technology for Heating Processing for buckling deformation after sintering,
With respect to the flaky pottery planarizing Technology for Heating Processing described in above-described embodiment two, the flaky pottery after the sintering of the present embodiment
Do not make grinding and polishing process, be sintering after flaky pottery blank, the flaky pottery to be planarized after this sintering with respect to
The angularity of the flaky pottery to be planarized after being surface-treated in embodiment two is larger；Flaky pottery described in the present embodiment three
Planarizing heat treatment tooling can directly adopt the described flaky pottery planarizing heat treatment tooling that above-described embodiment one provides, specifically
Structure of realizing can be found in related content described in above-described embodiment one, here is omitted.Described flaky pottery planarizing
Technology for Heating Processing is used for the flaky pottery to be planarized of buckling deformation after sintering, and planarizing heat treatment is finished product sheet pottery
Porcelain, as shown in Fig. 2 described flaky pottery planarizing Technology for Heating Processing includes：
Flaky pottery to be planarized after sintering is placed in heat treatment containing groove by 100b, will compress lid by described appearance
Put the opening of groove, make the lower surface compressing lid be pressed in described on flaky pottery to be planarized, will treating after described sintering put down
Integralization flaky pottery is contained in described flaky pottery planarizing heat treatment tooling；
When described compress lid lower surface be pressed in described on flaky pottery to be planarized, in the described Action of Gravity Field compressing lid
Under, lower pressure can be applied to the flaky pottery to be planarized after the sintering of stacking；
Specifically, the described lid that compresses includes gland and balancing weight；The lower pressure side of described gland is used for stretching into described housing
In slot opening, by the weight from the balancing weight being pressed on described gland, under the Action of Gravity Field of gland and balancing weight,
Required lower pressure can be applied to the flaky pottery to be planarized after the sintering of stacking.
Inside is heat-treated by 200b equipped with the frock immigration heat-treatment furnace of the flaky pottery to be planarized after sintering, makes
Flaky pottery deformation planarizing to be planarized after sintering；
Wherein, the flaky pottery to be planarized after sintering is in heating, such as using Muffle furnace, shuttle-type stove or pusher furnace
It is heated in certain temperature range Deng sintering kiln, the flaky pottery to be planarized after sintering can occur creep, produce deformation,
Under the described Action of Gravity Field compressing lid, the flaky pottery of buckling deformation can trend towards planarizing deformation.
300b obtains described finished product sheet pottery to inside equipped with the frock cooling of the flaky pottery to be planarized after sintering
Porcelain.
After cooling, the flaky pottery to be planarized after being heat-treated gradually is shaped, and flatness is higher.
In technical scheme provided in an embodiment of the present invention, it is placed in sheet by what the flaky pottery to be planarized after sintering was laminated
In the heat treatment containing groove of ceramic frock, reuse and compress lid and be pressed on flaky pottery planarize of stacking, afterwards, logical
Overheating Treatment, can make the flaky pottery deformation to be planarized after sintering, make the flaky pottery to be planarized after sintering tend to smooth
Change, thus can make, planarizing is able to by the flaky pottery of buckling deformation after sintering process and meets use requirement, improve sheet
The product percent of pass of pottery.
Specifically, in also will wrap before flaky pottery to be planarized is placed in heat treatment containing groove after described sintering
Include：The parting sand on surface of flaky pottery planarize after sintering, spot are carried out strike off, sandblasting or ultrasonic cleaning process,
With get rid of flaky pottery to be planarized after sintering the residual sand in surface, spot etc..
In the middle of specific enforcement, above-mentioned flaky pottery planarizing Technology for Heating Processing, described will after sintering treat smooth
Change flaky pottery and be placed in heat treatment containing groove, specially：Multiple flaky potteries are layered in described heat treatment receiving recessed
In groove, stack height is less than or equal to 35mm.
It is not easy to stacking is neat in flaky pottery stacking to be planarized after to sintering, and easily dissipate in carrying
Disorderly, for this reason, the flaky pottery outer wall parcel heat thawing in a week to stacking is wound around band.Heat is melted winding band and is being heated to a constant temperature
Melt after degree, such as more than 500 DEG C；Heat is melted winding band and can be pasted onto heap using transparent adhesive tape, adhesive tape
Folded shape pottery periphery one week.
In the middle of specific enforcement, above-mentioned flaky pottery planarizing Technology for Heating Processing, described compress lid include gland with
And balancing weight；The lower pressure side of described gland is used for stretching in described containing groove opening, and described balancing weight is pressed on described gland；
By from the weight being pressed in balancing weight on described gland, make described gland lower surface press on described in sheet planarize make pottery
Pressure on porcelain is in 0.05～0.2MPa.
In order that the flaky pottery to be planarized after sintering more completely planarizes in heat treatment improves heating simultaneously
Efficiency, can by the way of gradient-heated, described by inside equipped with flaky pottery to be planarized frock move into heat-treatment furnace enter
Row heat treatment, specifically includes：
With 1～5 DEG C/min of ramp to T5Degree Celsius；
With 0.5～3 DEG C/min of speed by T5Degree Celsius it is warming up to T6Degree Celsius；
With 0.2～1 DEG C/min of ramp by T6Degree Celsius it is warming up to T7Degree Celsius, and in T7Keep under degree Celsius
60-120Min；
Wherein, T5More than or equal to 300 degrees Celsius, less than or equal to 600 degrees Celsius, T6More than or equal to 700 degrees Celsius, less than etc.
In 1100 degrees Celsius, T70～100 DEG C of the high-temerature creep temperature more than flaky pottery to be planarized.
The flaky pottery to be planarized for unlike material, specific process parameter is as follows：
First, described flaky pottery to be planarized is aluminum oxide flaky pottery, and its high-temerature creep temperature is 1300 DEG C～1400
℃；
2nd, described flaky pottery to be planarized is zirconium oxide (3Y-TZP) flaky pottery, and its high-temerature creep temperature is 1200
DEG C～1400 DEG C；
3rd, described flaky pottery to be planarized is Zirconia reinforced alumina (ZTA) flaky pottery, its high-temerature creep temperature
At 1430 DEG C～1500 DEG C.
Described to inside equipped with sintering after flaky pottery planarize frock lower the temperature, specially：
T is dropped to 3～5 DEG C/min of rate of temperature fall8Degree Celsius, then natural cooling, wherein T8Celsius more than or equal to 400
Degree, less than or equal to 800 degrees Celsius.
Using in cooling method at a slow speed, the speed of cooling is difficult too high, using aforesaid way cooling, it is possible to decrease because of too fast fall
The risk of the flaky pottery cracking to be planarized that temperature leads to, improves its intensity, improve product quality.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and does not have the portion described in detail in certain embodiment
Point, may refer to the associated description of other embodiment.
It is understood that the correlated characteristic in said apparatus can mutually reference.In addition, in above-described embodiment " the
One ", " second " etc. is for distinguishing each embodiment, and does not represent the quality of each embodiment.
In specification mentioned herein, illustrate a large amount of details.It is to be appreciated, however, that the enforcement of the present invention
Example can be put into practice in the case of not having these details.In some instances, known structure and skill are not been shown in detail
Art, so as not to obscure the understanding of this description.
Similarly it will be appreciated that in order to simplify the disclosure and help understand one or more of each inventive aspect,
Above in the description to the exemplary embodiment of the present invention, each feature of the present invention is grouped together into single enforcement sometimes
In example, figure or descriptions thereof.However, the device of the disclosure should be construed to reflect following intention：I.e. required guarantor
The application claims of shield more features than the feature being expressly recited in each claim.More precisely, it is such as following
Claims reflected as, inventive aspect is all features less than single embodiment disclosed above.Therefore,
The claims following specific embodiment are thus expressly incorporated in this specific embodiment, wherein each claim itself
All as the separate embodiments of the present invention.
Those skilled in the art are appreciated that and the part in the device in embodiment can be carried out adaptively
Change and they are arranged in one or more devices different from this embodiment.Can be the component combination in embodiment
Become a part, and multiple subassemblies can be divided in addition.Except at least some of such feature is mutual
Outside repulsion, can be using any combinations to the institute disclosed in this specification (including adjoint claim, summary and accompanying drawing)
Feature and all parts of so disclosed any device are had to be combined.Unless expressly stated otherwise, this specification (includes
Adjoint claim, summary and accompanying drawing) disclosed in each feature can be by the replacement providing identical, equivalent or similar purpose
Feature is replacing.
Although additionally, it will be appreciated by those of skill in the art that some embodiments described herein include other embodiments
In included some features rather than further feature, but the combination of the feature of different embodiment means to be in the present invention's
Within the scope of and form different embodiments.For example, in the following claims, embodiment required for protection appoint
One of meaning can in any combination mode using.The all parts embodiment of the present invention can be realized with hardware, or
Realized with combinations thereof.
It should be noted that above-described embodiment the present invention will be described rather than limits the invention, and ability
Field technique personnel can design alternative embodiment without departing from the scope of the appended claims.In the claims,
Any reference symbol between bracket should not be configured to limitations on claims.Word "comprising" does not exclude the presence of not
Part listed in the claims or assembly.Word "a" or "an" before part or assembly does not exclude the presence of multiple
Such part or assembly.The present invention can be realized by means of the device including some difference parts.Some listing
In the claim of part, several in these parts can be embodied by same part item.Word first,
Second and the use of third class do not indicate that any order.These words can be construed to title.
The above, be only presently preferred embodiments of the present invention, and not the present invention is made with any pro forma restriction, according to
Any simple modification, equivalent variations and modification above example made according to the technical spirit of the present invention, all still falls within this
In the range of bright technical scheme.
Claims (17)
1. a kind of flaky pottery planarizing heat treatment tooling is it is characterised in that include：
Heat treatment containing groove, its open top, for placing the flaky pottery to be planarized of stacking；
With compressing lid, the outer profile size of its lower surface is less than or equal to described heat treatment and uses containing groove open top for heat treatment
Outer profile size, be used for stretching into described containing groove opening push described in flaky pottery to be planarized.
2. flaky pottery according to claim 1 planarizing heat treatment tooling it is characterised in that
The logical cylinder in including of described heat treatment containing groove and detachable card be contained in described in base plate in logical cylinder.
3. flaky pottery according to claim 1 planarizing heat treatment tooling it is characterised in that
The described lid that compresses includes gland and balancing weight；
The lower pressure side of described gland is used for stretching in described containing groove opening, and described balancing weight is pressed on described gland.
4. flaky pottery according to claim 3 planarizing heat treatment tooling it is characterised in that
The surface that the overall size shape of the lower surface of described gland is pressed down more than or equal to described flaky pottery to be planarized
Size shape.
5. flaky pottery according to claim 1 planarizing heat treatment tooling it is characterised in that
The side of described heat treatment containing groove and the plane perpendicular of described containing groove, the described lower pressure side external diameter compressing lid
Size is mated with the internal diameter size of described containing groove, and the side of described containing groove is as the described cunning compressing the lower pressure side of lid
Road,
When the described lower pressure side compressing lid stretches in described containing groove opening, the described lower surface of described lower pressure side end and institute
State bottom surface and remain parallel.
6. a kind of flaky pottery planarizing Technology for Heating Processing for buckling deformation after surface treatment, using the claims 1-
Arbitrary described flaky pottery planarizing heat treatment tooling in 5, by the flaky pottery to be planarized after surface treatment, planarizing warm
It is processed as finished product flaky pottery, the flaky pottery to be planarized after being wherein surface-treated is for buckling deformation it is characterised in that institute
State flaky pottery planarizing heat treatment process technique to include：
Flaky pottery to be planarized after surface treatment is placed in heat treatment containing groove, lid will be compressed by described accommodating recessed
The opening of groove, on the flaky pottery to be planarized after making described lower surface be pressed in described surface treatment, will described be surface-treated
Flaky pottery to be planarized afterwards is contained in described flaky pottery planarizing heat treatment tooling；
Inside is heat-treated equipped with the frock immigration heat-treatment furnace of the flaky pottery to be planarized after surface treatment, is made surface
Flaky pottery deformation planarizing to be planarized after process；
To inside equipped with the frock cooling of the flaky pottery to be planarized after surface treatment, obtain described finished product flaky pottery.
7. flaky pottery according to claim 6 planarizing Technology for Heating Processing it is characterised in that
Flaky pottery to be planarized after surface treatment includes：
Flaky pottery after sintering is carried out with the flaky pottery of one side milled processed；Or
Flaky pottery after sintering is carried out with the flaky pottery of twin grinding process；Or
Flaky pottery surface after sintering is carried out with the flaky pottery of single-sided polishing process；Or
Flaky pottery surface after sintering is carried out with the flaky pottery of twin polishing process.
8. flaky pottery according to claim 6 planarizing Technology for Heating Processing it is characterised in that
Described by surface treatment after flaky pottery to be planarized be placed in heat treatment containing groove, specially：
Multiple flaky potteries are layered in described heat treatment containing groove, stack height is less than or equal to 10mm.
9. flaky pottery according to claim 8 planarizing Technology for Heating Processing it is characterised in that
Winding band is melted to the one week parcel heat of flaky pottery outer wall of stacking.
10. flaky pottery according to claim 6 planarizing Technology for Heating Processing it is characterised in that
The described lid that compresses includes gland and balancing weight；
The lower pressure side of described gland is used for stretching in described containing groove opening, and described balancing weight is pressed on described gland；
By from the weight being pressed in balancing weight on described gland, make described gland lower surface press on described in piece to be planarized
Shape on ceramics pressure is in 0.01～0.05MPa.
11. flaky potteries according to claim 6 planarizing Technologies for Heating Processing it is characterised in that
Described by inside equipped with surface treatment after flaky pottery planarize frock move into heat-treatment furnace be heat-treated, have
Body includes：
With 1～5 DEG C/min of ramp to T1Degree Celsius；
With 0.5～3 DEG C/min of speed by T1Degree Celsius it is warming up to T2Degree Celsius；
With 0.2～1 DEG C/min of ramp by T2Degree Celsius it is warming up to T3Degree Celsius, and in T360- is kept under degree Celsius
120Min；
Wherein, T1More than or equal to 300 degrees Celsius, less than or equal to 600 degrees Celsius, T2More than or equal to 700 degrees Celsius, less than or equal to 900
Degree Celsius, T3More than or equal to 1000 degrees Celsius, less than or equal to 1300 degrees Celsius.
A kind of 12. flaky pottery planarizing Technologies for Heating Processing for buckling deformation after sintering, using in the claims 1-5
Arbitrary described flaky pottery planarizing heat treatment tooling, by the flaky pottery to be planarized after sintering, planarizing heat treatment is
Finished product flaky pottery, wherein, the flaky pottery to be planarized after sintering is buckling deformation it is characterised in that described sheet is made pottery
Porcelain planarizing Technology for Heating Processing includes：
Flaky pottery to be planarized after sintering is placed in heat treatment containing groove, lid will be compressed by described containing groove
Opening, make the lower surface compressing lid be pressed in described on flaky pottery to be planarized, will sheet to be planarized after described sintering
Pottery is contained in described flaky pottery planarizing heat treatment tooling；
Inside is heat-treated equipped with the frock immigration heat-treatment furnace of the flaky pottery to be planarized after sintering, after making sintering
Flaky pottery deformation planarizing to be planarized；
To inside equipped with the frock cooling of the flaky pottery to be planarized after sintering, obtain described finished product flaky pottery.
13. flaky potteries according to claim 12 planarizing Technologies for Heating Processing it is characterised in that
Described by sintering after flaky pottery to be planarized be placed in heat treatment containing groove, specially：
Multiple flaky potteries are layered in described heat treatment containing groove, stack height is less than or equal to 35mm.
14. flaky potteries according to claim 12 planarizing Technologies for Heating Processing it is characterised in that
Winding band is melted to the one week parcel heat of flaky pottery outer wall of stacking.
15. flaky potteries according to claim 12 planarizing Technologies for Heating Processing it is characterised in that
The described lid that compresses includes gland and balancing weight；
The lower pressure side of described gland is used for stretching in described containing groove opening, and described balancing weight is pressed on described gland；
By from the weight being pressed in balancing weight on described gland, make described gland lower surface press on described in piece to be planarized
Shape on ceramics pressure is in 0.05～0.2MPa.
16. flaky potteries according to claim 12 planarizing Technologies for Heating Processing it is characterised in that
Described inside is moved into heat-treatment furnace and is heat-treated equipped with the frock of flaky pottery planarize after sintering, concrete bag
Include：
With 1～5 DEG C/min of ramp to T5Degree Celsius；
With 0.5～3 DEG C/min of speed by T5Degree Celsius it is warming up to T6Degree Celsius；
With 0.2～1 DEG C/min of ramp by T6Degree Celsius it is warming up to T7Degree Celsius, and in T760- is kept under degree Celsius
120Min；
Wherein, T5More than or equal to 300 degrees Celsius, less than or equal to 600 degrees Celsius, T6More than or equal to 700 degrees Celsius, it is less than or equal to
1100 degrees Celsius, T70～100 DEG C of the high-temerature creep temperature more than flaky pottery to be planarized.
17. flaky potteries according to claim 16 planarizing Technologies for Heating Processing it is characterised in that
Flaky pottery planarize after described sintering is aluminum oxide flaky pottery, and its high-temerature creep temperature is 1300 DEG C～1400
℃；Or,
Flaky pottery planarize after described sintering is zirconium oxide (3Y-TZP) flaky pottery, and its high-temerature creep temperature is 1200
DEG C～1400 DEG C；Or,
Flaky pottery to be planarized after described sintering is Zirconia reinforced alumina (ZTA) flaky pottery, its high-temerature creep temperature
Degree is at 1430 DEG C～1500 DEG C.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107658230A (en) * | 2017-08-30 | 2018-02-02 | 广东风华高新科技股份有限公司 | A kind of regulation and control method of ceramic chips and ltcc substrate surface roughness |
| CN108689724A (en) * | 2017-04-11 | 2018-10-23 | 蓝思科技（长沙）有限公司 | The antidote and ceramic wafer of ceramic wafer flexural deformation |
| CN111554961A (en) * | 2020-04-03 | 2020-08-18 | 佳禾智能科技股份有限公司 | Device for activating double-sided adhesive tape |
| CN116141475A (en) * | 2023-04-04 | 2023-05-23 | 合肥中航天成电子科技有限公司 | Ceramic flatness improvement method |
| CN117245460A (en) * | 2023-11-15 | 2023-12-19 | 苏州博志金钻科技有限责任公司 | Surface treatment method and device for ceramic grinding sheet |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102785384A (en) * | 2012-08-28 | 2012-11-21 | 深圳先进技术研究院 | Flattening device |
-
2016
- 2016-08-26 CN CN201610743542.7A patent/CN106380228B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102785384A (en) * | 2012-08-28 | 2012-11-21 | 深圳先进技术研究院 | Flattening device |
Non-Patent Citations (1)
| Title |
|---|
| 王昆林: "《材料工程基础》", 30 September 2009, 清华大学出版社 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108689724A (en) * | 2017-04-11 | 2018-10-23 | 蓝思科技（长沙）有限公司 | The antidote and ceramic wafer of ceramic wafer flexural deformation |
| CN107658230A (en) * | 2017-08-30 | 2018-02-02 | 广东风华高新科技股份有限公司 | A kind of regulation and control method of ceramic chips and ltcc substrate surface roughness |
| CN111554961A (en) * | 2020-04-03 | 2020-08-18 | 佳禾智能科技股份有限公司 | Device for activating double-sided adhesive tape |
| CN111554961B (en) * | 2020-04-03 | 2023-12-15 | 佳禾智能科技股份有限公司 | Device for activating double faced adhesive tape |
| CN116141475A (en) * | 2023-04-04 | 2023-05-23 | 合肥中航天成电子科技有限公司 | Ceramic flatness improvement method |
| CN117245460A (en) * | 2023-11-15 | 2023-12-19 | 苏州博志金钻科技有限责任公司 | Surface treatment method and device for ceramic grinding sheet |
| CN117245460B (en) * | 2023-11-15 | 2024-02-02 | 苏州博志金钻科技有限责任公司 | Surface treatment method and device for ceramic grinding sheet |
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