JP2015054812A - Burning tool and method for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a burning tool that can prevent adhesion of a burned object in burning by lowering wettability in a membrane part formed so as to cover a substrate part, and a method for producing the burning tool.SOLUTION: The burning tool according to an aspect of an embodiment is configured to comprise the substrate part and the membrane part. The substrate part has a placing surface on which a burned object is placed. The membrane part covers the placing surface of the substrate part and is configured to include a rare earth oxide.

Description

  The embodiment of the disclosure relates to a firing jig and a method for manufacturing the firing jig.

  Conventionally, a process of manufacturing an electronic component such as a multilayer ceramic capacitor includes a step of firing the electronic component. In such a firing process, an electronic component that is an object to be fired is placed on a firing jig and fired in a kiln.

  In the firing jig described above, in order to prevent reaction with the object to be fired during firing, a technique has been proposed in which the object to be fired is placed on the film part and covered with a hardly reactive film part. (For example, refer to Patent Document 1).

JP-A-11-263671

  However, in the above-described electronic component, at the time of firing, for example, a glass component contained in an external electrode of the electronic component may be melted, and the melted glass component may enter between the electronic component and the firing jig.

  In such a case, if the wettability of the film part is relatively high, the glass component may spread on the film part and cause the object to be fired and the film part of the firing jig to adhere. When the above-described adhesion occurs, when the object to be fired is lowered from the firing jig after firing, the film part may stick to the object to be fired and peel from the firing jig.

  One aspect of the embodiment has been made in view of the above, and is a firing jig and a firing jig that can be made difficult to adhere to a fired object during firing by reducing the wettability of the film part. An object is to provide a manufacturing method.

  A firing jig according to an aspect of the embodiment includes a base material portion and a film portion. The base material portion has a placement surface on which the object to be fired is placed. The film part covers the mounting surface of the base part and includes a rare earth oxide.

  According to one aspect of the embodiment, by reducing the wettability of the film part, it is possible to make it difficult to adhere to an object to be fired during firing.

FIG. 1 is a schematic perspective view showing a firing jig according to the embodiment. FIG. 2A is a schematic front view of the setter and the object to be fired shown in FIG. FIG. 2B is a schematic plan view of the setter and the object to be fired shown in FIG. 2A. FIG. 3 is an enlarged schematic cross-sectional view taken along line III-III in FIG. 2B. FIG. 4 is a flowchart showing a processing procedure for forming the film part on the base material part. FIG. 5 is a schematic plan view of a setter showing a modification of the setter of the firing jig according to the embodiment. FIG. 6 is a schematic plan view of a setter showing a further modification of the setter of the firing jig according to the embodiment.

  Hereinafter, embodiments of a firing jig and a method of manufacturing a firing jig disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

  FIG. 1 is a schematic perspective view showing a firing jig according to the embodiment. In the following description, for easy understanding, an X-axis direction, a Y-axis direction, and a Z-axis direction that are orthogonal to each other are defined, and the positive Z-axis direction is defined as a vertically upward direction.

  As shown in FIG. 1, the firing jig 1 includes a base 10 and a setter 20 (both will be described later). Then, the object to be fired 30 is placed on the setter 20 of the firing jig 1.

  The object to be fired 30 is an electronic component such as a multilayer ceramic capacitor. That is, the above-described firing jig 1 is a firing jig for electronic parts. In addition, although the to-be-fired material 30 was made into the multilayer ceramic capacitor in the above, this is an illustration and is not limited. That is, the object to be fired 30 may be of any type as long as it is an electronic component to be fired, such as a chip inductor or a semiconductor substrate.

  The firing jig 1 is placed in a kiln (not shown) in a state where the firing object 30 is placed on the setter 20, and a firing process for firing the firing object 30 is performed.

  By the way, in the firing jig, for example, a setter on which the material to be fired is covered with a non-reactive film part to prevent reaction with the material to be fired during firing. However, in an electronic component that is an object to be fired, during firing, for example, a glass component contained in an external electrode of the electronic component may melt, and the melted glass component may enter between the electronic component and the firing jig. is there. In such a case, if the wettability of the film part is relatively high, the glass component spreads on the film part, and the object to be fired and the film part of the firing jig may adhere to each other.

  Therefore, the firing jig 1 according to the present embodiment has a configuration in which the wettability of the film portion is reduced so that it is difficult to adhere to the firing object 30 during firing. Hereinafter, the firing jig 1 will be described in detail.

  The base 10 of the firing jig 1 includes a plate portion 11 and a support portion 12. The plate portion 11 has a shape capable of placing the setter 20 on the upper surface, specifically, for example, a substantially flat plate shape and a substantially rectangular shape in plan view.

  There are a plurality of support parts 12 (for example, four, one is not visible in FIG. 1), and they are formed at appropriate positions on the lower surface side of the plate part 11. Specifically, the support part 12 is formed so as to protrude in the negative direction of the Z axis from the four corners of the lower surface of the plate part 11, and supports the plate part 11.

  The plate part 11 and the support part 12 configured as described above are integrally formed of a refractory material. Specifically, the base 10 in which the plate portion 11 and the support portion 12 are integrally formed is completed by so-called press molding in which a powdery or clay-like refractory is poured into a mold (not shown) and pressed. The refractory is, for example, alumina, mullite, zirconia, or the like, and is a material that can withstand relatively high temperatures (for example, 1500 ° C. or more) and has air permeability.

  The base 10 is not limited to the shape shown in FIG. That is, the base 10 may be, for example, a sheath (a mortar) or a rack, and may be any shape as long as the setter 20 can be placed thereon. Furthermore, the base 10 and the setter 20 do not need to be separate bodies, and may be configured to be integrated.

  2A is a schematic front view of the setter 20 and the object to be fired 30 shown in FIG. 1 when viewed from the negative side of the Y axis, and FIG. 2B is a pattern of the setter 20 and the object to be fired 30 shown in FIG. 2A. It is a top view.

  As shown in FIG. 2A, the setter 20 includes a base material part 21 and a film part 22. In FIG. 2A, for convenience of understanding, the film portion 22 is schematically shown exaggerated in the Z-axis direction. Moreover, in FIG. 2B, the site | part in which the film | membrane part 22 is formed in the base material part 21 was shown with the oblique line.

  As shown well in FIGS. 2A and 2B, the base material portion 21 is formed in a substantially rectangular shape in plan view, and has a thin plate shape with a relatively small thickness in the Z-axis direction. Thus, the base material part 21 and the baking jig | tool 1 itself can be reduced in weight because the base material part 21 is made into thin plate shape.

  The base material part 21 is manufactured by press-molding a refractory like the base 10. As the refractory for the base material portion 21, for example, alumina, mullite, zirconia, etc. are used as in the base 10, and can withstand relatively high temperatures (for example, 1500 ° C. or higher) and have air permeability. It is said.

  Thus, the plate part 11 of the base 10 and the base material part 21 of the setter 20 are manufactured with a fire-resistant material having air permeability, so that the hot air in the kiln causes the base 10 and the setter 20 to flow in the firing step. It also reaches the lower surface side of the object to be fired 30. Thereby, baking of the to-be-fired material 30 can be performed efficiently. In addition, since the base 10 and the setter 20 have air permeability, the binder can be efficiently removed from the object to be fired 30 when the binder is removed.

  In the base material portion 21 configured as described above, the object to be fired 30 is placed on the upper surface 21a in the Z-axis direction. Hereinafter, in the base material portion 21, the upper surface 21 a on which the object to be fired 30 is placed is referred to as “placement surface 21 a”.

  The film part 22 is formed so as to cover the entire surface of the mounting surface 21a of the base part 21, and the thickness in the Z-axis direction is, for example, 50 to 500 μm. Specifically, for example, if the thickness of the film portion is less than 50 μm and is relatively thin, the effect on wettability is not sufficient, and conversely if it is thicker than 500 μm, it is against cracks in the film and the substrate portion of the film portion. Peeling may occur. For the above reasons, the thickness of the film part 22 is preferably 50 to 500 μm as described above.

  Further, the film portion 22 has a smooth contact surface 22 a that contacts the object to be fired 30. Specifically, the film portion 22 has a surface roughness Ra of the contact surface 22a of, for example, less than 5 μm. By making the contact surface 22a of the film portion 22 a smooth surface having a surface roughness Ra of less than 5 μm as described above, the wettability of the film portion 22 is lowered, and thus the object to be fired 30 and the firing jig 1 are fired during firing. The setter 20 can be made difficult to adhere. The surface roughness Ra is a value measured as “arithmetic average roughness Ra” described in JIS B0601: 2013.

  This will be described with reference to FIG. FIG. 3 is an enlarged schematic cross-sectional view taken along line III-III in FIG. 2B. In addition, although the separation distance between the film part 22 of the setter 20 and the object to be fired 30 is a minimum of about several μm, in FIG. 3, the distance between the setter 20 and the object to be fired 30 is Z It is schematically shown exaggerated in the axial direction. In addition, a glass component G that melts from an object to be fired 30 described later is also schematically shown.

  First, the firing object 30 will be described. The firing object 30 is a multilayer ceramic capacitor as described above, and includes a ceramic dielectric layer 31, an internal electrode layer 32, and an external electrode 33. The ceramic dielectric layers 31 and the internal electrode layers 32 are arranged so as to be alternately stacked to constitute a capacitor element body.

  The external electrodes 33 are arranged on both side surfaces in the X-axis direction of the capacitor element body (in FIG. 3, only one of the external electrodes 33 on both side surfaces is shown). The external electrode 33 is electrically connected to the internal electrode layer 32 to form a capacitor circuit.

The external electrode 33 includes an alloy containing Ag and Pd or a metal component such as Cu and Ni, calcia (CaO), silica (SiO ₂ ), alumina (Al ₂ O ₃ ), zinc oxide (ZnO), oxide And glass components such as boron (B ₂ O ₃ ). Therefore, when the object to be fired 30 is heated during the sintering process, the glass component of the external electrode 33 is melted, and the glass component appears on the surface of the external electrode 33, so that the object to be fired 30 and the setter 20 are interposed. invade. In FIG. 3, the glass component melted from the external electrode 33 is indicated by a symbol G.

  Here, as described above, since the film portion 22 is smoothed so that the surface roughness Ra of the contact surface 22a is less than 5 μm, for example, the wettability of the film portion 22 is reduced, and thus the glass component G 3 has a substantially spherical shape as shown in FIG. 3, and the contact area with the film part 22 decreases, in other words, the film part 22 makes point contact. By reducing the contact area between the glass component G and the film part 22, it is possible to make it difficult to adhere the article 30 to be fired and the film part 22 of the setter 20 during firing.

  In addition, in the film | membrane part 22, when surface roughness Ra is 5 micrometers or more, for example, the wettability of the film | membrane part 22 becomes comparatively high. Therefore, as shown by an imaginary line in FIG. 3, the glass component G spreads on the contact surface 22a of the film part 22 and increases the contact area with the film part 22, in other words, the film part 22 and the surface. It will come into contact. When the contact area increases, the object 30 and the film part 22 are likely to adhere to each other. As a result, when the object 30 is lowered from the baking jig 1 after baking, the film part 22 sticks to the object 30 side. And peeled off from the firing jig 1.

  In the firing jig 1 according to the present embodiment, as described above, since the object to be fired 30 and the film part 22 are difficult to adhere at the time of firing, the film part 22 sticks to the object to be fired 30 side. Thus, it does not peel off from the firing jig 1.

Continuing the description of the film part 22, the film part 22 is configured to include a rare earth oxide. As the rare earth oxide contained in the film part 22, for example, yttrium oxide (Y ₂ O ₃ ) can be used.

  Since the rare earth oxide is chemically stable, it has a low solubility with respect to the glass component G, and is difficult to react with the material to be fired 30 during firing, so-called hardly reactive. Therefore, by configuring the film part 22 to include a rare earth oxide, the film part 22 can be made difficult to react with the object to be fired 30 during firing. Moreover, in the film | membrane part 22, since the solubility with respect to the glass component G is small, it can make it difficult to get wet with the glass component G. FIG.

In the above description, yttrium oxide is used as the rare earth oxide. However, this is merely an example and is not limited. For example, lanthanum oxide (La ₂ O ₃ ), cerium oxide (CeO ₂ ), neodymium oxide (Nd) ₂ O ₃ ), ytterbium oxide (Yb ₂ O ₃ ), lutetium oxide (Lu ₂ O ₃ ), samarium oxide (Sm ₂ O ₃ ), and other rare earth element oxides.

The film portion 22 has a rare earth oxide content of 10% by weight or more, preferably 30% by weight or more, and more preferably 100% by weight. In the film part 22, when the rare earth oxide content is 10 wt% or more and less than 100 wt%, zirconia (ZrO ₂ ) is included in addition to the rare earth oxide.

  Although the rare earth oxide is a relatively expensive material, the film portion 22 has a property that, when the content of the rare earth oxide is, for example, 10% by weight, it is difficult to react with the object to be fired 30 while suppressing cost. It can be constituted as follows.

  In addition, the film part 22 may be configured so that the content of the rare earth oxide is increased from 10% by weight. In this case, the difficulty of reacting with the object to be fired 30 is improved as the content increases. Can be made. That is, if the content of the rare earth oxide in the film part 22 is, for example, 30% by weight or more, it is possible to improve the difficult reactivity of the film part 22 while suppressing the cost. If, for example, 100% by weight, the difficulty of the film part 22 can be further improved.

  Although not shown in the drawing, a multilayered film part is formed by thinly forming a film part having a rare earth oxide content of, for example, 100% by weight on a film part having a rare earth oxide content of, for example, 10% by weight. In this case, it is possible to achieve both cost reduction and poor reactivity improvement.

  The membrane portion 22 is formed so as to be porous with a porosity of 17% or more, more specifically, the porosity is 17% or more and 40% or less, more preferably the porosity is 20% or more. And it forms so that it may become 30% or less porous.

  Thus, by making the membrane portion 22 porous with a porosity of 17% or more, the amount of thermal expansion of the membrane portion 22 during sintering can be reduced, and dimensional changes due to temperature changes can be suppressed. Thereby, the thermal expansion difference between the base material part 21 and the film part 22 can be reduced, and thus, for example, the film part 22 is cracked during sintering, and the film part 22 peels from the base material part 21. It is possible to prevent the occurrence of problems such as.

  Next, a process for forming the above film part 22 on the base material part 21 will be described. FIG. 4 is a flowchart showing a processing procedure for forming the film part 22 on the base material part 21.

  First, the base material part 21 is set in a film forming apparatus (not shown) and a film forming process is performed (step S1). In the film forming process, a process of covering the placement surface 21 a of the base material part 21 with the film part 22 is performed. Specifically, the film portion 22 is a sprayed film formed by a thermal spraying method, and specifically, for example, is formed by spraying a sprayed material heated by plasma spraying, that is, a rare earth oxide or the like. In this film forming process, the film part 22 is formed to be porous with a porosity of 17% or more.

  As described above, the film portion 22 can be easily formed on the base material portion 21 by using the thermal spraying method. In the above description, the film portion 22 is formed by the thermal spraying method. However, the present invention is not limited to this. For example, other components such as a CVD (Chemical Vapor Deposition) method and a PVD (Physical Vapor Deposition) method are used. A membrane technique may be used. Further, in order to improve the adhesion of the film part 22 to the base material part 21, the base material part 21 may be blasted in advance before the film forming process to roughen the surface of the base material part 21. .

  Next, a polishing process is performed on the film part 22 formed in step S1 (step S2). In the polishing process, a process of polishing the contact surface 22a of the film part 22 is performed until the surface roughness Ra of the film part 22 is less than 5 μm. As a result, the film portion 22 having a surface roughness Ra of less than 5 μm is formed on the base material portion 21.

  In the above-described polishing treatment, for example, a polishing operation is performed using a polishing machine such as a belt sander, a disk grinder, or a straight grinder, but the present invention is not limited to this, and for example, manually using a sandpaper or the like. You may grind | polish.

  Next, a verification example of this embodiment is shown. In addition, this verification was performed by performing the following thermal cycle tests with respect to the baking jig 1 and the to-be-baked object 30. FIG.

  First, an electronic component as the object to be fired 30 is placed on the setter 20 of the firing jig 1 and placed in an environment of 900 degrees. Specifically, for example, the environmental temperature is raised to 900 degrees over 1.5 hours, and then 900 degrees is maintained for 0.5 hours. Next, the environmental temperature is lowered to the temperature before the temperature increase over 0.5 hours.

  The above-described series of temperature increase, temperature maintenance, and temperature decrease processes are regarded as one cycle, and this one cycle is repeated 50 times. And the to-be-fired object 30 is dropped from the firing jig 1 (specifically, the setter 20), the presence or absence of adhesion between the to-be-fired object 30 and the firing jig 1, the presence or absence of peeling of the film part 22 from the base material part 21, The presence or absence of a crack in the film part 22 is confirmed. The verification results obtained by the thermal cycle test described above are shown in Table 1 below.

  In Table 1, ◎ indicates that there is no phenomenon such as adhesion and is particularly good, ◯ indicates that there is no adhesion and is good, △ indicates that adhesion is slightly confirmed, △ indicates that there is a lot of adhesion, etc. The evaluation was made in 4 grades. Of the four-step evaluation described above, ◎ and ○ are evaluations that satisfy the criteria for a firing jig.

  As shown in “Embodiment 1” of Table 1 above, the film portion 22 has a surface roughness Ra of 4 μm, a rare earth oxide content of 100 wt%, a porosity of 30%, and a thickness of 100 μm. In this case, adhesion between the object to be fired 30 and the firing jig 1, peeling of the film part 22 from the base material part 21, and cracking of the film part 22 were not observed, and very good results were obtained.

  In “Embodiment 2” of Table 1, the film portion 22 having a surface roughness Ra of 4 μm, a rare earth oxide content of 100 wt%, a porosity of 17%, and a thickness of 100 μm was verified. Even in this case, the adhesion between the object to be fired 30 and the firing jig 1, the peeling of the film part 22 from the base material part 21, and the crack of the film part 22 were all not good, and were good.

In “Embodiments 3 and 4” in Table 1, the content of the rare earth oxide, which was 100 wt% in “Embodiment 1”, was changed to 10 wt% or 30 wt% and verified. In any case, adhesion between the object to be fired and the firing jig, peeling of the film part, and cracks were not observed, and it was good. In “Embodiments 3 and 4” and “Comparative Example 4”, the other component contained in the film portion other than the rare earth oxide is zirconia (ZrO ₂ ).

  On the other hand, as shown in “Comparative Example 1” in Table 1, the film portion had a surface roughness Ra of 8 μm, a rare earth oxide content of 100% by weight, a porosity of 32%, and a thickness of 100 μm. In some cases, peeling or cracking of the film part was not observed, but adhesion between the object to be fired and the firing jig was confirmed.

  Further, as shown in “Comparative Example 2”, even when the surface roughness Ra, which was 8 μm in “Comparative Example 1”, was changed to 5 μm, similarly, no peeling or cracking of the film part was observed. However, adhesion between the object to be fired and the firing jig was confirmed.

  This is because the film portion has a surface roughness Ra of 5 μm or more and is not smoothed, so that the wettability of the film portion becomes relatively high, and the fired product adheres to the film portion by the glass component melted from the fired product. It is thought that.

  Further, as shown in “Comparative Example 3” in Table 1, in the film portion, the surface roughness Ra is 7 μm, the rare earth oxide content is 100 wt%, the porosity is 15%, and the thickness is 600 μm. In addition, adhesion between the object to be fired and the firing jig, peeling of the film part and cracks were all observed, and in particular, many peeling and cracking of the film part were confirmed.

  The reason why the object to be fired adheres to the film part is considered to be that, as described above, the film part is not smoothed with a surface roughness Ra of 5 μm or more, and the thickness of the film part exceeds 500 μm. Further, in Comparative Example 3, since the porosity is less than 17%, a relatively large difference in thermal expansion occurs between the base material portion and the film portion. Is considered to have peeled from the base material.

  Further, as shown in “Comparative Example 4” in Table 1, in the film portion, the surface roughness Ra is 5 μm, the rare earth oxide content is 5 wt%, the porosity is 30%, and the thickness is 45 μm. Although peeling and cracking of the film part were not observed, much adhesion between the object to be fired and the firing jig was confirmed.

  This is because the film portion has a surface roughness Ra of 5 μm or more and is not smoothed, the rare earth oxide content is less than 10 wt%, and the thickness of the film portion is less than 50 μm. It is considered that the wettability is higher than that of the film parts of Comparative Examples 1 to 3, the glass component spreads widely on the film part, and the fired product adheres to the film part.

  As described above, the firing jig 1 according to this embodiment includes the base material portion 21 and the film portion 22. The base material portion 21 has a placement surface 21a on which the object to be fired 30 is placed. The film part 22 covers the mounting surface 21a of the base material part 21, has a surface roughness Ra of less than 5 μm, and contains a rare earth oxide. Thereby, in the baking jig | tool 1, it can make it difficult to adhere to the to-be-fired material 30 at the time of baking by reducing the wettability of the film | membrane part 22. FIG.

  FIG. 5 is a schematic plan view of the setter 20 showing a modification of the setter 20 of the firing jig 1 according to the embodiment. In FIG. 5, a portion where the object to be fired 30 is placed on the placement surface 21 a of the base material portion 21 is surrounded by a broken line A. In the following, the part A surrounded by the broken line A is referred to as “mounting part A”.

  In the firing jig 1 according to the embodiment, the film portion 22 covers the entire surface of the mounting surface 21a of the base material portion 21. However, in the example shown in FIG. It is formed so that it may coat | cover. That is, on the placement surface 21a, the film portion 22 is not formed in the part B other than the placement part A.

  Thereby, since the area of the film | membrane part 22 in the mounting surface 21a of the base material part 21 reduces, the quantity of the thermal spray material for the film | membrane parts 22, ie, a rare earth oxide, can be reduced, and cost can be suppressed. Furthermore, although the film | membrane part 22 is grind | polished in a grinding | polishing process, the area to grind | polish can also be reduced and the time required for formation of the film | membrane part 22 can be shortened.

  In FIG. 5, the placement site A on the placement surface 21 a is set to a size that includes all of the objects to be fired 30 in a plan view, but is not limited thereto. FIG. 6 is a schematic plan view of the setter 20 showing a further modification of the setter 20 of the firing jig 1 according to the embodiment.

  As shown in FIG. 6, when there are a plurality of objects to be fired 30 to be placed, the placement parts A <b> 1 and A <b> 2 may be set for each of the objects to be fired 30. In this case, only the placement parts A1 and A2 are covered with the film part 22. Thereby, the area of the film part 22 and the area to be polished on the mounting surface 21a can be further reduced, so that the cost can be suppressed and the time required for forming the film part 22 can be shortened.

  In the above description, only the placement site A and the placement sites A1 and A2 on the placement surface 21a are covered with the film part 22, but the modification is not limited thereto. That is, for example, the film part 22 may cover the entire surface of the mounting surface 21a, and only the mounting part A and the mounting parts A1 and A2 may be polished.

  As described above, the film portion 22 is formed so that the surface roughness Ra of the portions A, A1, and A2 where the object 30 is placed on the placement surface 21a is less than 5 μm. May be formed so that the surface roughness Ra of the portion (indicated by reference numeral B in FIGS. 5 and 6) where no is placed is 5 μm or more.

  Even when the film part 22 is configured as described above, the area to be polished in the film part 22 can be reduced, and the time required for forming the film part 22 can be shortened.

  Furthermore, you may make it make the height in the Z-axis direction of mounting site | part A, A1, A2 higher to the to-be-baked material 30 side than the site | part B which is not mounted. Thereby, since the mounting parts A, A1, and A2 to be polished are higher than the other parts B, the mounting parts A, A1, and A2 can be easily polished.

  Although not shown, a lattice-like groove may be provided on the mounting surface 21a. Specifically, for example, M grooves (M is an integer of 1 or more) parallel to the X-axis direction and N grooves (N is an integer of 1 or more) parallel to the Y-axis direction are provided. Alternatively, only the part surrounded by the groove may be polished. Even in this case, the area to be polished in the film part 22 can be reduced, and the time required for forming the film part 22 can be shortened.

  In the above description, the film portion 22 is formed on the setter 20 side. However, the present invention is not limited to this. That is, for example, when the object to be fired 30 is directly placed on the plate part 11 of the base 10 without using the setter 20, the film part 22 may be formed on the upper surface of the plate part 11.

  In addition, in FIG. 1, one firing jig 1 is shown. However, the present invention is not limited to this. For example, a plurality of firing jigs 1 are stacked and placed on the firing jig 1 in a plurality of stages. The object 30 may be fired at once.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

DESCRIPTION OF SYMBOLS 1 Firing jig | tool 10 Base 11 Plate part 12 Support part 20 Setter 21 Base material part 21a (Base material part) mounting surface 22 Film | membrane part 30 To-be-fired object 31 Ceramic dielectric layer 32 Internal electrode layer 33 External electrode A, A1, A2 Placement G Glass component

Claims (7)

A base material portion having a placement surface on which the object to be fired is placed;
A firing jig comprising: a film portion including a rare earth oxide while covering the mounting surface of the base material portion. The membrane part is
The firing jig according to claim 1, wherein the surface roughness Ra is less than 5 μm. The membrane part is
The firing jig according to claim 1 or 2, wherein the porosity is 17% or more. The membrane part is
The firing jig according to any one of claims 1 to 3, wherein the rare earth oxide content is 10 wt% or more. The membrane part is
The firing jig according to any one of claims 1 to 4, wherein the firing jig is formed so as to cover only a portion where the firing object is placed on the placement surface. The membrane part is
While the surface roughness Ra of the portion on which the object to be fired is placed is less than 5 μm on the placement surface, the surface roughness Ra of the part on which the material to be fired is not placed is 5 μm or more. It forms so that it may become. The baking jig | tool as described in any one of Claims 1-4 characterized by the above-mentioned. A step of coating a mounting surface on which a material to be fired is mounted in a base material portion with a film portion containing a rare earth oxide;
And a step of making the surface roughness Ra less than 5 μm in the film part.

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