CN106370311A - Temperature measuring device and measuring method for thermal analyzer - Google Patents

Abstract

The invention relates to a temperature measuring device and a measuring method for a thermal analyzer. The steps include: installing a sensor array and an image sensor that absorb infrared radiation energy in a closed heating furnace, and the sensor array transmits the collected infrared radiation signal to the signal The processor forms the infrared thermal image information and transmits it to the computer; the image sensor installed in the closed heating furnace transmits the collected image information in the heating furnace to the computer through the acquisition card; the computer combines the received infrared thermal image information and The image information collected by the image sensor is processed by information fusion to obtain new temperature data, and the temperature distribution in the heating furnace is displayed through the new temperature data. The invention overcomes the shortcomings of contact temperature measurement, can accurately measure the overall temperature environment, expands the temperature measurement range, and can be widely used in temperature measurement of the overall temperature field in a closed vacuum space. Occasions are especially applicable.

Description

A temperature measuring device and measuring method for a thermal analyzer

technical field

The invention relates to a temperature measuring device and a measuring method, in particular to a temperature measuring device and a measuring method for a thermal analyzer used in measuring the overall temperature field of a closed vacuum space.

Background technique

There are two types of temperature measurement technology, contact and non-contact. Contact temperature measurement methods include expansion temperature measurement, electric quantity temperature measurement, contact photoelectric temperature measurement, and thermochromic temperature measurement. The contact temperature measurement method needs to be in full contact with the measured object or medium during measurement. Generally, it measures the equilibrium temperature of the measured object and the sensor, which will interfere with the measured temperature to a certain extent. The non-contact temperature measurement method does not need to be in contact with the measured object, so it will not interfere with the temperature field, and the dynamic response characteristics are generally good, but it will be affected by the surface state of the measured object or the physical parameters of the measurement medium. Non-contact temperature measurement methods mainly include radiation temperature measurement, spectroscopic temperature measurement, laser interferometry temperature measurement and sonic temperature measurement methods.

In the temperature measurement of the existing thermal analysis instruments, the thermocouple temperature measurement method is mainly used. This method is a contact temperature measurement method, which can measure the temperature value required for the experiment. However, it also has a contact method. Disadvantages of temperature measurement - the measurement is the equilibrium temperature of the measured object and the sensor, which will interfere with the measured temperature to a certain extent. In addition, this method can only obtain the temperature at one point, but cannot obtain the overall temperature situation in the thermal analysis instrument.

Contents of the invention

In view of the above problems, the object of the present invention is to provide a temperature measurement device and measurement method for thermal analyzers, which overcome the shortcomings of contact temperature measurement, can accurately measure the overall temperature environment, and expand the temperature measurement range.

In order to achieve the above object, the present invention adopts the following technical solutions: a temperature measurement method for a thermal analyzer, characterized in that it comprises the following steps: 1) a sensor array and an image sensor for absorbing infrared radiation energy are arranged in a closed heating furnace , the sensor array that absorbs infrared radiation energy transmits the collected infrared radiation signal to the signal processor outside the heating furnace, performs image information processing, forms infrared thermal image information and transmits it to the computer; 2) is set in a closed heating furnace 3) The computer performs information fusion processing on the received infrared thermal image information and the image information collected by the image sensor to obtain new temperature data. This new temperature data shows the temperature distribution in the furnace.

Further, in the step 3), the information fusion processing process is as follows: 3.1) Calibrate the relationship between temperature and color, and establish the corresponding relationship between the infrared thermal image and temperature; 3.2) By absorbing the infrared radiation energy sensor array and The signal processor obtains the first infrared thermal image, and obtains the corresponding temperature value _of each pixel in the infrared thermal image according to the corresponding relationship between the infrared thermal image and the temperature; 3.3) detection by the CCD high-temperature flame image The second image is obtained by the detector and the acquisition card, which is an image in the visible light range. According to the Wien approximation of Planck's formula, the relationship between the color of the optical image and the temperature is obtained, and then the corresponding value of each pixel in the second image is obtained. 3.4) using a linear weighted temperature data fusion method, the temperature value T ₁ corresponding to each pixel in the _first infrared thermal image and the temperature value corresponding to each pixel in the second image T ₂ is fused to obtain the temperature value T ₃ corresponding to each pixel in the image after the fusion of the first infrared thermal image and the second image; 3.5) use the correspondence between the infrared thermal image and temperature in step 3.1) , according to each temperature value T ₃ to get the corresponding pixel points, and then all the pixel points form the image after the fusion of the first infrared thermal image and the second image, and then obtain a color fusion image that can represent the temperature information in the heating furnace , and displayed on the display.

Further, in the step 3.1), the specific process is: 3.1.1) adopt the existing high-precision small black body furnace as the standard airtight heating furnace, control the standard airtight heating furnace to reach different temperatures, and simultaneously use sensors that absorb infrared radiation energy array to obtain infrared thermal images at different temperatures; 3.1.2) use the existing image segmentation method to segment each infrared thermal image obtained to obtain several pixels; 3.1.3) extract the gray value of each pixel , and then obtain the corresponding data of a group of temperature and image grayscale; 3.1.4) store the corresponding data in step 3.1.3) to form the corresponding relationship between infrared thermal image and temperature; when performing temperature measurement, according to the corresponding infrared The gray value of the thermal image can be used to find the corresponding temperature value.

Further, in the step 3.3), the relationship between the color of the optical image and the temperature is as follows:

${\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; 2</span>}}<span\; class="notranslate">\; =</span>\frac{{\mathrm{<span\; class="notranslate">\; C</span>}}_{\mathrm{<span\; class="notranslate">\; 2</span>}}<span\; class="notranslate">\; \&lsqb;</span>\frac{\mathrm{<span\; class="notranslate">\; 2</span>}}{{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; G</span>}}}<span\; class="notranslate">\; -</span>\frac{\mathrm{<span\; class="notranslate">\; 1</span>}}{{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; R</span>}}}<span\; class="notranslate">\; -</span>\frac{\mathrm{<span\; class="notranslate">\; 1</span>}}{{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; B</span>}}}<span\; class="notranslate">\; \&rsqb;</span>}{\mathrm{<span\; class="notranslate">\; ln</span>}\mathrm{<span\; class="notranslate">\; f</span>}<span\; class="notranslate">\; (</span>{\mathrm{<span\; class="notranslate">\; R</span>}}_{\mathrm{<span\; class="notranslate">\; e</span>}}<span\; class="notranslate">\; ,</span>{\mathrm{<span\; class="notranslate">\; G</span>}}_{\mathrm{<span\; class="notranslate">\; e</span>}}<span\; class="notranslate">\; ,</span>{\mathrm{<span\; class="notranslate">\; B</span>}}_{\mathrm{<span\; class="notranslate">\; e</span>}}<span\; class="notranslate">\; )</span><span\; class="notranslate">\; -</span>\mathrm{<span\; class="notranslate">\; 5</span>}\mathrm{<span\; class="notranslate">\; ln</span>}\frac{{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; G</span>}}^{\mathrm{<span\; class="notranslate">\; 2</span>}}}{{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; R</span>}}{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; B</span>}}}}<span\; class="notranslate">\; ,</span>$

In the formula, λ _R , _{λ G} , and _{λ B} are the wavelengths corresponding to the peaks of the spectral characteristic curves of the three channels R, _G , and B respectively; Pink tricolor coefficient; C ₂ is a constant, C ₂ =0.01438833m·k, m is meter, k is Kelvin; and:

$\mathrm{<span\; class="notranslate">\; f</span>}<span\; class="notranslate">\; (</span>{\mathrm{<span\; class="notranslate">\; R</span>}}_{\mathrm{<span\; class="notranslate">\; e</span>}}<span\; class="notranslate">\; ,</span>{\mathrm{<span\; class="notranslate">\; G</span>}}_{\mathrm{<span\; class="notranslate">\; e</span>}}<span\; class="notranslate">\; ,</span>{\mathrm{<span\; class="notranslate">\; B</span>}}_{\mathrm{<span\; class="notranslate">\; e</span>}}<span\; class="notranslate">\; )</span><span\; class="notranslate">\; =</span>\mathrm{<span\; class="notranslate">\; l</span>}\mathrm{<span\; class="notranslate">\; no</span>}\frac{{\mathrm{<span\; class="notranslate">\; P</span>}}_{\mathrm{<span\; class="notranslate">\; T</span>}\mathrm{<span\; class="notranslate">\; b</span>}}<span\; class="notranslate">\; (</span>{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; R</span>}}<span\; class="notranslate">\; )</span>{\mathrm{<span\; class="notranslate">\; P</span>}}_{\mathrm{<span\; class="notranslate">\; T</span>}\mathrm{<span\; class="notranslate">\; b</span>}}<span\; class="notranslate">\; (</span>{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; B</span>}}<span\; class="notranslate">\; )</span>}{{{\mathrm{<span\; class="notranslate">\; P</span>}}_{\mathrm{<span\; class="notranslate">\; T</span>}\mathrm{<span\; class="notranslate">\; b</span>}}}^{\mathrm{<span\; class="notranslate">\; 2</span>}}<span\; class="notranslate">\; (</span>{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; G</span>}}<span\; class="notranslate">\; )</span>}<span\; class="notranslate">\; ,</span>$

P _Tb (λ _R ) is the radiation filter spectrum of the R channel, P _Tb (λ _B ) is the radiation filter spectrum of the B channel, and P _Tb (λ _G ) is the radiation filter spectrum of the G channel.

Further, in the step 3.4), the temperature value T ₃ =uT ₁ +vT ₂ , u is the reliability of the temperature value T ₁ , and v is the reliability of the temperature value T ₂ .

Further, the reliability u _of the temperature value T1 and the reliability v of the temperature value T2 are respectively simplified as a _linear function of temperature, so as to reflect the change of the corresponding reliability by the linear function of temperature, and the linear function of temperature The functions are:

$\mathrm{<span\; class="notranslate">\; u</span>}<span\; class="notranslate">\; (</span>{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; 1</span>}}<span\; class="notranslate">\; )</span><span\; class="notranslate">\; =</span>\mathrm{<span\; class="notranslate">\; 1</span>}<span\; class="notranslate">\; -</span>\frac{{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; 1</span>}}}{{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; max</span>}}}<span\; class="notranslate">\; ;</span>$

$\mathrm{<span\; class="notranslate">\; v</span>}<span\; class="notranslate">\; (</span>{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; 2</span>}}<span\; class="notranslate">\; )</span><span\; class="notranslate">\; =</span>\mathrm{<span\; class="notranslate">\; 1</span>}<span\; class="notranslate">\; -</span>\frac{{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; 2</span>}}<span\; class="notranslate">\; -</span>\mathrm{<span\; class="notranslate">\; 500</span>}}{{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; max</span>}}<span\; class="notranslate">\; -</span>\mathrm{<span\; class="notranslate">\; 500</span>}}<span\; class="notranslate">\; ;</span>$

In the formula, T _max is the preset maximum temperature.

A temperature measuring device for a thermal analyzer for realizing the above method, characterized in that: the device includes a sensor array absorbing infrared radiation energy, an image sensor, a signal processor, an acquisition card, a computer and a display; the sensor array and image The sensors are all arranged on the inner wall surface of the crucible of the closed heating furnace; and the sensor array is electrically connected to the signal processor located outside the closed heating furnace through the connection line, and the image sensor is connected to the signal processor located outside the closed heating furnace through the connection line. The acquisition card outside the furnace is electrically connected; the sensor array transmits the infrared radiation signal to the signal processor, and the signal processor transmits the received infrared radiation signal to the computer after processing, and the image sensor The image information in the closed heating furnace is transmitted to the computer through the acquisition card; the computer processes the received signal to obtain a temperature field, and transmits it to the display for image display.

Further, the connection lines between the sensor array and the signal processor, and the connection lines between the image sensor and the acquisition card all pass through the furnace wall of the closed heating furnace, and the connection lines Sealing with the furnace wall is adopted.

Further, the sensor array absorbing infrared radiation energy adopts an infrared focal plane array composed of thermal detectors.

Further, the image sensor adopts a CCD high temperature flame image detector.

The present invention has the following advantages due to the adoption of the above technical scheme: 1. The present invention adopts a sensor array and an image sensor that absorbs infrared radiation energy to be installed in a closed heating furnace to carry out non-contact temperature measurement in the heating furnace, avoiding contact measurement. At the same time, during the thermal analysis experiment, the temperature distribution in the heating furnace is constantly changing. This non-contact temperature measurement method can observe and monitor the temperature distribution in the heating furnace of the thermal analyzer online in real time. Adjust the temperature in the heating furnace in time, detect instrument failures and experimental failures in time, and provide visual temperature image data for thermal analysis experiments, so that the experimental temperature environment can be observed and recorded, which provides convenience for the improvement and development of thermal analysis experiments in the future. 2. The present invention adopts the radiation temperature measurement method, which realizes that the measurement does not interfere with the measured temperature field, does not affect the distribution of the temperature field, and has high measurement accuracy. 3. The present invention uses real-time online observation to monitor the temperature distribution in the heating furnace of the thermal analyzer, which can not only adjust the temperature in the heating furnace in time, but also detect instrument failures and experimental failures in time, and provide visualized temperature image data for thermal analysis experiments. The experimental temperature environment can be observed and recorded. 4. The present invention combines infrared radiation temperature measurement and spectral temperature measurement method, expands the temperature measurement range, and can be widely used in temperature measurement of the overall temperature field in a closed vacuum space, especially suitable for vacuum occasions that require precise measurement of the overall ambient temperature .

Description of drawings

Fig. 1 is a schematic diagram of the radiation image and optical image acquisition process in the present invention;

Fig. 2 is a schematic diagram of temperature image fusion process in the present invention;

Fig. 3 is a schematic diagram of a fused image in an embodiment of the present invention.

detailed description

When the furnace environment of the thermal analyzer is a vacuum, heat is transmitted in the form of thermal radiation. Thermal radiation is a phenomenon in which an object radiates electromagnetic waves due to its temperature. When the temperature is low, it mainly radiates with invisible infrared light. When the temperature is 300°C, the strongest wavelength of thermal radiation is in the infrared region. When the temperature of the object rises, the radiated energy increases, and accordingly the radiation spectrum moves to the direction of shorter wavelength. When the temperature of the object is above 500°C to 800°C, the strongest wavelength component in the thermal radiation is in the visible light region. During the heating process of the heating furnace, as the temperature changes, the radiated electromagnetic waves change. Therefore, the present invention studies the temperature conditions reflected by the two wavelengths of electromagnetic waves throughout the process, and obtains accurate temperature information based on the fusion of information obtained in the two ways. The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

As shown in FIG. 1 , the present invention provides a temperature measuring device for a thermal analyzer, which includes a sensor array 1 that absorbs infrared radiation energy, an image sensor 2 , a signal processor 3 , an acquisition card 4 , a computer 5 and a display 6 . Both the sensor array 1 and the image sensor 2 are arranged on the inner wall surface of the crucible of the airtight heating furnace 7, and the sensor array 1 is electrically connected to the signal processor 3 located outside the airtight heating furnace 7 through the connecting wire, and the image sensor 2 is connected to the signal processor 3 located outside the airtight heating furnace 7 through the connecting wire. The acquisition card 4 outside the heating furnace 7 is electrically connected, the connection line passes through the furnace wall of the airtight heating furnace 7, and the connection line and the furnace wall are sealed with a seal. The sensor array 1 transmits the infrared radiation signal to the signal processor 3, the signal processor 3 processes the received infrared radiation signal and transmits it to the computer 5, and the image sensor 2 transmits the image information in the closed heating furnace 7 to the computer through the acquisition card 4 5. The computer 5 processes the received signal to obtain a temperature field, and transmits it to the display 6 for image display, judges the temperature in the closed heating furnace according to the image color, and realizes the measurement of the temperature.

In the above embodiments, the sensor array 1 for absorbing infrared radiation energy may adopt an infrared focal plane array composed of thermal detectors. The thermal detector converts the infrared radiation signal into an electrical signal and transmits it to the signal processor 3 , which is amplified and converted into a standard video signal to obtain an infrared thermal image, and transmits the image data to the computer 5 .

In the above-mentioned embodiments, the image sensor 2 can be a CCD high-temperature flame image detector (during installation, it is required that the probe of the detector can observe as large a space area as possible in the furnace). The CCD high-temperature flame detector collects the image information in the furnace, and transmits the image data to the computer 5 through the acquisition card 4 .

As shown in Figures 1 and 2, the present invention also provides a temperature measurement method for thermal analyzers, which is a method of measuring temperature by measuring radiation energy, mainly for thermal analyzers or similar airtight The measurement of the overall ambient temperature of the environment, combined with infrared radiation temperature measurement and spectral temperature measurement method, thereby expanding the temperature measurement range to be suitable for temperature measurement with temperature change process. The present invention comprises the following steps:

1) A sensor array 1 and an image sensor 2 for absorbing infrared radiation energy are arranged in the closed heating furnace, and the sensor array 1 for absorbing infrared radiation energy transmits the collected infrared radiation signal to the signal processor 3 outside the heating furnace to perform The image information is processed to form infrared thermal image information and transmit it to the computer 5 .

2) The image sensor 2 installed in the closed heating furnace transmits the collected image information in the heating furnace (that is, the optical field of view information in the heating furnace) to the computer 5 through the acquisition card 4 .

3) The computer 5 performs information fusion processing on the received infrared thermal image information and the image information collected by the image sensor 2 to obtain new temperature data, through which the detailed conditions of the temperature distribution in the heating furnace are displayed.

In the above step 3), as shown in Figure 2, the information fusion processing process is as follows:

3.1) Calibrate the relationship between temperature and color, so as to establish the corresponding relationship between infrared thermal image and temperature.

3.1.1) Use the existing high-precision small blackbody furnace as the standard airtight heating furnace, control the standard airtight heating furnace to reach different temperatures, and use the sensor array 1 that absorbs infrared radiation energy to obtain infrared thermal images at different temperatures.

3.1.2) using the existing image segmentation method to segment each obtained infrared thermal image to obtain several pixels;

3.1.3) Extract the gray value of each pixel, and then obtain a set of data corresponding to temperature and image gray.

3.1.4) Store the corresponding data in step 3.1.3) to form the corresponding relationship between the infrared thermal image and temperature; when measuring the temperature, the corresponding temperature can be found according to the gray value of the corresponding infrared thermal image value.

3.2) The first infrared thermal image is obtained by the sensor array 1 and the signal processor 3 that absorb infrared radiation energy, and the temperature corresponding to each pixel in the infrared thermal image is obtained according to the corresponding relationship between the infrared thermal image and temperature The value is T ₁ ; the temperature value T ₁ is a temperature value obtained by collecting infrared radiation information with a longer wavelength.

3.3) The second image is obtained by the CCD high-temperature flame image detector and the acquisition card 4, which is an image in the visible light range. According to the Wien approximation of the Planck formula, the relationship between the color of the optical image and the temperature is obtained, and then the second image is obtained. The temperature value T ₂ corresponding to each pixel in the image; the temperature value T ₂ is the temperature value obtained by analyzing the visible light information with a longer wavelength;

Among them, the relationship between optical image color and temperature is as follows:

${\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; 2</span>}}<span\; class="notranslate">\; =</span>\frac{{\mathrm{<span\; class="notranslate">\; C</span>}}_{\mathrm{<span\; class="notranslate">\; 2</span>}}<span\; class="notranslate">\; \&lsqb;</span>\frac{\mathrm{<span\; class="notranslate">\; 2</span>}}{{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; G</span>}}}<span\; class="notranslate">\; -</span>\frac{\mathrm{<span\; class="notranslate">\; 1</span>}}{{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; R</span>}}}<span\; class="notranslate">\; -</span>\frac{\mathrm{<span\; class="notranslate">\; 1</span>}}{{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; B</span>}}}<span\; class="notranslate">\; \&rsqb;</span>}{\mathrm{<span\; class="notranslate">\; l</span>}\mathrm{<span\; class="notranslate">\; no</span>}\mathrm{<span\; class="notranslate">\; f</span>}<span\; class="notranslate">\; (</span>{\mathrm{<span\; class="notranslate">\; R</span>}}_{\mathrm{<span\; class="notranslate">\; e</span>}}<span\; class="notranslate">\; ,</span>{\mathrm{<span\; class="notranslate">\; G</span>}}_{\mathrm{<span\; class="notranslate">\; e</span>}}<span\; class="notranslate">\; ,</span>{\mathrm{<span\; class="notranslate">\; B</span>}}_{\mathrm{<span\; class="notranslate">\; e</span>}}<span\; class="notranslate">\; )</span><span\; class="notranslate">\; -</span>\mathrm{<span\; class="notranslate">\; 5</span>}\mathrm{<span\; class="notranslate">\; l</span>}\mathrm{<span\; class="notranslate">\; no</span>}\frac{{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; G</span>}}^{\mathrm{<span\; class="notranslate">\; 2</span>}}}{{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; R</span>}}{\mathrm{<span\; class="notranslate">\; \&lambda;</span>}}_{\mathrm{<span\; class="notranslate">\; B</span>}}}}<span\; class="notranslate">\; ,</span>$

In the formula, λ _R , _{λ G} , and _{λ B} are the wavelengths corresponding to the peaks of the spectral characteristic curves of the three channels R, _G , and B respectively; Pink tricolor coefficient; C ₂ is a constant, C ₂ =0.01438833m·k, m is meter, k is Kelvin;

and, P _Tb (λ _R ) is the radiation filter spectrum of the R channel, P _Tb (λ _B ) is the radiation filter spectrum of the B channel, and P _Tb (λ _G ) is the radiation filter spectrum of the G channel.

3.4) Using the linear weighted temperature data fusion method, the temperature value T1 corresponding to each pixel in the _first infrared thermal image is fused with the temperature value T2 corresponding to each pixel in the _second image to obtain The temperature value T ₃ corresponding to each pixel in the image after the fusion of the first infrared thermal image and the second image.

3.5) Using the corresponding relationship between the infrared thermal image and temperature in step 3.1), the corresponding pixel points are obtained according to each temperature value T ₃ , and then all the pixels form the first infrared thermal image and the second image after fusion The image, and then obtain a color fusion image that can represent the temperature information in the heating furnace, and display it on the monitor.

In the above step 3.4), T ₃ =uT ₁ +vT ₂ , u is the reliability of the temperature value T ₁ , v is the reliability of the temperature value T ₂ ; due to the transition process of the temperature from low temperature to high temperature, the heating furnace The wavelength of the radiation within also slowly transitions from short-wave to long-wave, so the reliability u of the temperature value T1 measured by the sensor array ₁ that absorbs infrared radiation energy gradually decreases, and the temperature value T2 measured by the image sensor ₂ is credible The degree v increases gradually. Therefore, the reliability u and v are respectively simplified as a linear function of temperature, and the changes of the corresponding reliability are reflected by the linear function of the corresponding temperature respectively; the linear functions of temperature are respectively:

$\mathrm{<span\; class="notranslate">\; u</span>}<span\; class="notranslate">\; (</span>{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; 1</span>}}<span\; class="notranslate">\; )</span><span\; class="notranslate">\; =</span>\mathrm{<span\; class="notranslate">\; 1</span>}<span\; class="notranslate">\; -</span>\frac{{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; 1</span>}}}{{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; max</span>}}}<span\; class="notranslate">\; ;</span>$

$\mathrm{<span\; class="notranslate">\; v</span>}<span\; class="notranslate">\; (</span>{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; 2</span>}}<span\; class="notranslate">\; )</span><span\; class="notranslate">\; =</span>\mathrm{<span\; class="notranslate">\; 1</span>}<span\; class="notranslate">\; -</span>\frac{{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; 2</span>}}<span\; class="notranslate">\; -</span>\mathrm{<span\; class="notranslate">\; 500</span>}}{{\mathrm{<span\; class="notranslate">\; T</span>}}_{\mathrm{<span\; class="notranslate">\; max</span>}}<span\; class="notranslate">\; -</span>\mathrm{<span\; class="notranslate">\; 500</span>}}<span\; class="notranslate">\; ;</span>$

In the formula, T _max is the maximum temperature preset in the thermal analysis experiment.

Example:

The color fusion image finally obtained by the present invention includes both infrared radiation information in the heating furnace and optical information, that is, two main electromagnetic waves radiated during the heating process. It can well characterize the temperature condition in the furnace. For example, as shown in Figure 3, when the temperature is low, the infrared image is obtained, the middle ellipse is yellow, and the surrounding is orange, and different colors represent different temperatures. When the temperature rises, the radiated electromagnetic waves are mainly displayed in the form of visible light. In the obtained optical image, the middle ellipse and the surrounding area are red and orange respectively. The inner wall of the furnace heated to a certain temperature can be regarded as a light source. Different colors reflect different temperature. In the fused image, the part with high temperature is displayed in red tone, and the part with low temperature is displayed in blue tone, which integrates the comprehensive information of thermal infrared image and visible light image in the furnace, and intuitively shows the temperature in the furnace.

The above-mentioned embodiments are only used to illustrate the present invention, and the structure, size, location and shape of each component can be changed. On the basis of the technical solution of the present invention, all improvements to individual components according to the principles of the present invention and equivalent transformations shall not be excluded from the protection scope of the present invention.

Claims (10)

1. a kind of thermometry for thermal analyzer is it is characterised in that comprise the following steps:

1) it is provided with sensor array and the imageing sensor absorbing infrared energy in airtight heating stove, absorb infrared spoke Penetrate energy sensor array the infrared radiation signal collecting is transmitted to heating furnace outside signal processor, carry out image Information process-, forms Infrared Thermogram information and transmits to computer；

2) in airtight heating stove setting imageing sensor by the acquired card of image information in the heating furnace collecting transmit to Computer；

3) computer carries out the image information of the Infrared Thermogram receiving information and imageing sensor collection at information fusion Reason, obtains new temperature data, shows the temperature distribution state in heating furnace by this new temperature data.

2. as claimed in claim 1 a kind of thermometry for thermal analyzer it is characterised in that: described step 3) In, use processing process is as follows:

3.1) relation between temperature and color is demarcated, set up the corresponding relation of Infrared Thermogram and temperature；

3.2) the first width Infrared Thermogram is obtained by the sensor array absorbing infrared energy and signal processor, according to red It is t that the corresponding relation of outer thermography and temperature obtains this temperature value corresponding to each pixel of infrared thermal imagery in figure₁；

3.3) the second width image is obtained by ccd thermal-flame image detector and capture card, this image is in visible-range Image, the Wien according to planck formula approximately obtains the relation of optical imagery color and temperature, and then obtains the second width image In temperature value t corresponding to each pixel₂；

3.4) adopt the temperature data fusion method of linear weighted function, by corresponding for first width each pixel of infrared thermal imagery in figure temperature Angle value t₁Temperature value t corresponding with second each pixel of width in figure₂Merged, obtained the first width Infrared Thermogram and second Temperature value t corresponding to each pixel in image after width image co-registration₃；

3.5) utilize step 3.1) corresponding relation of mid-infrared thermography and temperature, according to each temperature value t₃Obtain corresponding pixel Point, then form the image after the first width Infrared Thermogram and the second width image co-registration by this pixels all, and then obtain energy table Show the color fusion image of heating in-furnace temperature information, and shown by display.

3. as claimed in claim 2 a kind of thermometry for thermal analyzer it is characterised in that: described step 3.1) In, detailed process is:

3.1.1) using having high-precision small-sized blackbody furnace for standard airtight heating stove, standard airtight heating stove is controlled to reach not Same temperature, obtains the Infrared Thermogram under different temperatures using the sensor array absorbing infrared energy simultaneously；

3.1.2) using existing image partition method, each width Infrared Thermogram obtaining all is split, obtained some pictures Element；

3.1.3) extract the gray value of each pixel, and then obtain the corresponding data of one group of temperature and gradation of image；

3.1.4) storing step 3.1.3) in corresponding data, form the corresponding relation of Infrared Thermogram and temperature；Carrying out temperature During degree measurement, its corresponding temperature value can be found according to corresponding Infrared Thermogram gray value.

4. as claimed in claim 2 a kind of thermometry for thermal analyzer it is characterised in that: described step 3.3) In, optical imagery color is as follows with the relation of temperature:

$t_2=\frac{c_2\&lsqb;\frac{2}{{\mathrm{\&lambda;}}_g}-\frac{1}{{\mathrm{\&lambda;}}_r}-\frac{1}{{\mathrm{\&lambda;}}_b}\&rsqb;}{\ln f(r_e,g_e,b_e)-5\ln \frac{{\mathrm{\&lambda;}}_g^2}{{\mathrm{\&lambda;}}_r{\mathrm{\&lambda;}}_b}},$

In formula, λ_r、λ_g、λ_bIt is respectively the wavelength corresponding to tri- passage dichroism peak of curves of r, g, b；r_e、g_e、b_eIt is respectively Ccd thermal-flame image detector images the fluorescent material trichromatic coefficients at end；c₂For constant, c₂=0.01438833m k, m are rice, K is Kelvin；And:

$f(r_e,g_e,b_e)=ln\frac{p_{tb}\left({\mathrm{\&lambda;}}_r\right)p_{tb}\left({\mathrm{\&lambda;}}_b\right)}{{p_{tb}}^2\left({\mathrm{\&lambda;}}_g\right)},$

p_tb(λ_r) for r passage radiation filtering spectrum, p_tb(λ_b) for b passage radiation filtering spectrum, p_tb(λ_g) for g passage radiation filter Wave spectrum.

5. as claimed in claim 2 a kind of thermometry for thermal analyzer it is characterised in that: described step 3.4) In, temperature value t₃=ut₁+vt₂, u is temperature value t₁Credibility, v be temperature value t₂Credibility.

6. as claimed in claim 5 a kind of thermometry for thermal analyzer it is characterised in that: by described temperature value t₁Credibility u, temperature value t₂Credibility v be reduced to the linear function of temperature respectively, to be embodied by the linear function of temperature The change of corresponding credibility, the linear function of temperature is respectively as follows:

$u\left(t_1\right)=1-\frac{t_1}{t_{\max }};$

$v\left(t_2\right)=1-\frac{t_2-500}{t_{\max }-500};$

In formula, t_maxFor maximum temperature set in advance.

7. a kind of temperature measuring equipment for thermal analyzer realized as claim 1 to 6 any one methods described, its feature It is: this device includes absorbing the sensor array of infrared energy, imageing sensor, signal processor, capture card, calculating Machine and display；Described sensor array and imageing sensor are arranged at the crucible interior sidewall surface of airtight heating stove；And it is described Sensor array pass through connecting line with positioned at described airtight heating stove outside described signal processor electrically connect, described image biography Sensor pass through connecting line with positioned at described airtight heating stove outside described capture card electrically connect；Described sensor array will be infrared Radiation signal transmits to described signal processor, described signal processor by transmit after the infrared radiation signal receiving process to Described computer, image information in described airtight heating stove is transmitted to described calculating by described image sensor through described capture card Machine；Described computer obtains temperature field by after the signal processing receiving, and transmits and carry out image to described display and show.

8. as claimed in claim 7 a kind of temperature measuring equipment for thermal analyzer it is characterised in that: described sensor array Arrange the connecting line and described signal processor between, and the connecting line between described image sensor and described capture card is all worn Cross the furnace wall of described airtight heating stove, and between described connecting line and described furnace wall, adopt sealing member to seal.

9. as claimed in claim 7 a kind of temperature measuring equipment for thermal analyzer it is characterised in that: described absorb infrared The sensor array of emittance is using the infrared focal plane array being made up of thermal detector.

10. as claimed in claim 7 a kind of temperature measuring equipment for thermal analyzer it is characterised in that: described image pass Sensor adopts ccd thermal-flame image detector.