利用紅外線熱影像檢測熱管品質之裝置與方法Device and method for detecting heat pipe quality by using infrared thermal image
本發明係有關於一種利用紅外線熱影像檢測熱管品質之裝置與方法，尤指涉及一種利用紅外線熱像儀結合數據資料計算分析流程檢測熱管導熱品質與真空品質之裝置，以及使用此裝置之方法，特別係指可以全面線上整體檢測，提供快速檢驗熱管之功能，並且無需破壞熱管，即能達到有效率之品質管制，以符合熱管大量生產模式之品質檢驗需要者。The invention relates to a device and a method for detecting the quality of a heat pipe by using infrared thermal image, in particular to a device for detecting heat conduction quality and vacuum quality of a heat pipe by using an infrared thermal imager combined with a data data calculation and analysis process, and a method using the same, In particular, it can be used for comprehensive online inspection, providing the function of quickly checking the heat pipe, and without the need to damage the heat pipe, it can achieve efficient quality control to meet the quality inspection requirements of the mass production mode of the heat pipe.
熱管係現今電子產品散熱裝置中最普遍高效之導熱（非散熱）元件。台灣曾是國際熱管電子散熱模組之輸出大國，已具有小型熱管製作技術基礎。 現有之專利技術如：中華民國專利I252305所揭露之以紅外線熱影像檢測熱管溫度之方法與裝置，係一種以紅外線熱影像檢測熱管溫度之方法；中華民國專利M306648所揭露之熱管除氣之溫度檢測裝置，係一種利用溫度檢知器感應溫度之裝置；中華民國專利I306944所揭露之熱管性能檢測裝置，係一種利用溫度感測器檢測熱管性能之裝置；中華民國專利I346774所揭露之熱管真空度檢測方法及其裝置，係一種提供真空環境，透過破壞熱管，分析溫溼度與壓力變化以計算真空度；美國專利US 2008/0271463 A1所揭露之熱管量測系統（heat pipe measuring system），係一種在熱管蒸發段安裝加熱器與溫度感測器，且在熱管冷凝段安裝致冷晶片（Thermoelectric Cooling, TEC）與溫度感測器，然後再根據量測溫度變化，決定熱管品質；以及美國專利US 2005/0220168 A1所揭露之熱管測量裝置（Measuring device for heat pipe），係一種在熱管蒸發段加熱，且在熱管冷凝段冷卻，並以溫度探針量測兩段溫度變化，決定熱傳特性。 然而以上傳統之熱管檢測方法及缺失如下： 1.需要在熱管表面安裝溫度感測器，一支一支地量測，非常耗費時間與人力，並且無法判斷導熱性能與真空度優劣。 2.需要在熱管表面覆蓋特殊薄膜，再以紅外線熱像儀檢測溫度，雖然節省時間與人力，但是此特殊薄膜不易取得，致增加成本，並且無法判斷導熱性能與真空度優劣。 3.需要提供真空環境，並且破壞熱管，透過分析溫度、濕度與壓力前後變化，然後計算真空度；同時只能一支一支地量測，非常耗費時間與人力，且無法判斷導熱性能優劣。 因此，傳統之熱管檢測方法無法符合熱管大量生產模式之品質檢驗需要。 鑑於熱管之導熱特性與真空度係熱管品質之重要指標，而目前大規模熱管生產之品質檢驗，係採取隨機抽樣逐支點狀檢測，無法全面檢測而非常耗時或需破壞熱管之外，目前之檢測方法亦無法同時量測導熱特性與真空度。故，ㄧ般習用者係無法符合使用者於實際使用時達到熱管大量生產模式之品質檢驗之所需。Heat pipes are the most common and efficient thermal (non-heating) components in today's electronic product heat sinks. Taiwan was once the largest exporter of international heat pipe electronic cooling modules, and it has the foundation of small heat pipe production technology. The existing patented technology, such as the method and device for detecting the temperature of the heat pipe by the infrared thermal image disclosed in the Republic of China Patent No. I252305, is a method for detecting the temperature of the heat pipe by infrared thermal image; the temperature detection of the heat pipe degassing disclosed by the Republic of China patent M306648 The device is a device for sensing temperature by using a temperature detector; the heat pipe performance detecting device disclosed in the Republic of China Patent No. I306944 is a device for detecting the performance of a heat pipe by using a temperature sensor; the heat pipe vacuum degree detection disclosed in the Republic of China Patent I346774 The method and the device thereof are a vacuum environment for analyzing the temperature and humidity and the pressure change by destroying the heat pipe to calculate the degree of vacuum; the heat pipe measuring system disclosed in US 2008/0271463 A1 is a type A heater and a temperature sensor are installed in the heat pipe evaporation section, and a thermoelectric cooling device (TEC) and a temperature sensor are installed in the heat pipe condensation section, and then the heat pipe quality is determined according to the temperature change; and the US patent US 2005 /0220168 Heat pipe measuring device disclosed in A1 (Measuri Ng device for heat pipe) is a type of heating in the heat pipe evaporation section, and cooling in the condensation section of the heat pipe, and measuring the temperature changes of the two sections by the temperature probe to determine the heat transfer characteristics. However, the above traditional heat pipe detection methods and the following are missing: 1. It is necessary to install a temperature sensor on the surface of the heat pipe, which is measured one by one, which is very time consuming and labor-intensive, and cannot judge the thermal conductivity and the degree of vacuum. 2. It is necessary to cover the surface of the heat pipe with a special film and then measure the temperature with an infrared camera. Although it saves time and manpower, this special film is not easy to obtain, which increases the cost, and it is impossible to judge the thermal conductivity and the degree of vacuum. 3. It is necessary to provide a vacuum environment and destroy the heat pipe. By analyzing the temperature, humidity and pressure before and after the change, and then calculating the degree of vacuum; at the same time, it can only measure one by one, which is very time consuming and manpower, and can not judge the thermal conductivity. Therefore, the traditional heat pipe inspection method cannot meet the quality inspection requirements of the mass production mode of the heat pipe. In view of the thermal conductivity characteristics of the heat pipe and the importance of the heat quality of the heat pipe, the current quality inspection of large-scale heat pipe production adopts random sampling and point-by-point inspection, which cannot be fully detected and is very time consuming or needs to damage the heat pipe. The detection method also cannot measure the thermal conductivity and the degree of vacuum at the same time. Therefore, the user-like users cannot meet the requirements of the quality inspection of the mass production mode of the heat pipe when the user actually uses it.
本發明之主要目的係在於，克服習知技藝所遭遇之上述問題並提供一種利用紅外線熱像儀結合數據資料計算分析流程檢測熱管導熱品質與真空品質之裝置，以及使用此裝置之方法，可以全面線上整體檢測，提供快速檢驗熱管之功能，並且無需破壞熱管，即能達到有效率之品質管制，以符合熱管大量生產模式之品質檢驗需要者。 為達以上之目的，本發明係一種利用紅外線熱像儀檢測熱管品質之裝置，係包括：一待測熱管，係一內含工作流體之封閉腔體，該封閉腔體內之工作流體係可隨溫度變化作持續循環之液、汽二相變化，該待測熱管包含有加熱區域、非凝結氣體區域、及介於該加熱區域與該非凝結氣體區域之間之飽和蒸汽區域；一膠帶，係黏貼於該待測熱管受測表面，使其補償該待測熱管之低發射率，以改善量測準確性；一固定基座，其設有一固定基板及一基板腳座，該固定基板為一板體且於中央設有一貫穿之通孔，該基板腳座係設置在該固定基板之周緣，經由該固定基板及該基板腳座之組設使該固定基座內部形成有一設置空間，用以將該待測熱管端部由該通孔安置於該固定基座；一加熱設備，係設於該固定基座之設置空間中並與該通孔相對應，用以對該待測熱管端部由該通孔穿入該固定基板以下之部位進行加熱，使該待測熱管位於該固定基板以下部位形成為加熱區域，而位於該固定基板以上部位形成為飽和蒸汽區域與非凝結氣體區域；一紅外線熱像儀，係與該待測熱管受測表面上之膠帶相對面向，用以檢測該待測熱管受測表面上之膠帶黏貼部位之溫度變化與分佈情況，擷取其一紅外線熱像圖，並輸出，其中該紅外線熱像圖包含該飽和蒸汽區域下端溫度（T111）、該飽和蒸汽區域上端溫度（T112）、該飽和蒸汽區域之長度（L1）、及該非凝結氣體區域之長度（L2）之數據資料；一訊號線，係與該紅外線熱像儀連接，用以接收該紅外線熱像圖並傳輸；以及一電子設備，係經由該訊號線與該紅外線熱像儀連接，其包含有一顯示器、一電腦主機及一輸入模組，該電腦主機與該顯示器及該輸入模組電性連接，內部並安裝有一熱管品質檢測程式，該輸入模組係提供一使用者根據生產目標與製作經驗輸入導熱品質標準（K1）與真空品質標準（K2），由該熱管品質檢測程式讀取該K1與該K2，並從該訊號線讀取該紅外線熱像儀輸出之紅外線熱像圖，再以導熱品質法則與真空品質法則判斷良品或不良品，最後將該待測熱管之溫度分佈，導熱品質與真空品質檢測結果顯示於該顯示器。 於本發明上述實施例中，該膠帶係選自深色不透明之電工絕緣膠帶、包裝膠帶、文書膠帶或其它可補償低發射率之材料。 於本發明上述實施例中，該膠帶係具有發射率在0.8以上，厚度小於0.2 mm，並且耐溫100°C以上者。 於本發明上述實施例中，該加熱設備係為盛裝熱水之容器、盛裝熱油之容器、電熱爐，燃燒爐或加熱帶任其一。 於本發明上述實施例中，該導熱品質法則判斷標準為(T111-T112)/L1＜K1，K1=KT/L1，KT係容許降溫幅度，符合為良品，不符合則為不良品。 於本發明上述實施例中，該真空品質法則判斷標準為L2＜K2，符合為良品，不符合則為不良品。 於本發明上述實施例中，係可省略該訊號線、該熱管品質檢測程式、及該電子設備之使用，直接由該紅外線熱像儀輸出該紅外線熱像圖，從該紅外線熱像儀或電腦解讀該紅外線熱像圖之T111、T112、L1及L2，再計算(T111-T112)/L1，藉導熱品質法則與真空品質法則判斷該待測熱管品質優劣。 於本發明上述實施例中，係膠帶係黏貼在該待測熱管加熱區域以上部位表面。 為達以上之目的，本發明更係一種利用紅外線熱像儀檢測熱管品質之方法，其至少包含下列步驟：（Ａ）將一待測熱管加熱區域以上部位表面使用一膠帶黏貼，該待測熱管內係充填有可隨溫度變化作液、汽兩相變化之工作流體；（Ｂ）將該待測熱管安置於一固定基座上，並使該膠帶面向一紅外線熱像儀，而該加熱區域位在該固定基座之固定基板以下；（Ｃ）對該待測熱管在該固定基板以下部位使用一加熱設備加熱，使該待測熱管位於該固定基板以下部位形成為加熱區域，而位於該固定基板以上部位形成為飽和蒸汽區域與非凝結氣體區域；（Ｄ）使用該紅外線熱像儀針對該膠帶黏貼部位進行檢測，並擷取其一紅外線熱像圖，該紅外線熱像圖中包含測量所得T111、T112、L1、及L2之數據資料；（Ｅ）使用者根據生產目標與製作經驗輸入K1與K2，利用該紅外線熱像儀輸出之數據T111、T112、L1與L2，以導熱品質法則與真空品質法計算分析該待測熱管之導熱特性與真空度，藉以判斷良品或不良品；以及（Ｆ）從一顯示器讀取該待測熱管之溫度分佈，導熱品質與真空品質檢測結果。 於本發明上述實施例中，該膠帶係選自深色不透明之電工絕緣膠帶、包裝膠帶、文書膠帶或其它可補償低發射率之材料。 於本發明上述實施例中，該膠帶係具有發射率在0.8以上，厚度小於0.2 mm，並且耐溫100°C以上者。 於本發明上述實施例中，該加熱設備係為盛裝熱水之容器、盛裝熱油之容器、電熱爐，燃燒爐或加熱帶任其一。 於本發明上述實施例中，該導熱品質法則判斷標準為(T111-T112)/L1＜K1，K1=KT/L1，KT係容許降溫幅度，符合為良品，不符合則為不良品。 於本發明上述實施例中，該真空品質法則判斷標準為L2＜K2，符合為良品，不符合則為不良品。The main object of the present invention is to overcome the above problems encountered in the prior art and to provide a device for detecting heat conduction quality and vacuum quality of a heat pipe by using an infrared thermal imager combined with a data data calculation and analysis process, and a method using the same, which can be comprehensive On-line overall inspection provides the ability to quickly inspect heat pipes without the need to damage the heat pipes, enabling efficient quality control to meet the quality inspection needs of mass production models. For the purpose of the above, the present invention is a device for detecting the quality of a heat pipe by using an infrared camera, which comprises: a heat pipe to be tested, which is a closed cavity containing a working fluid, and the workflow system in the closed cavity can be The temperature change is a two-phase change of liquid and vapor for continuous circulation, and the heat pipe to be tested comprises a heating zone, a non-condensing gas zone, and a saturated steam zone between the heating zone and the non-condensing gas zone; a tape is attached The surface of the heat pipe to be tested is compensated for the low emissivity of the heat pipe to be tested to improve the measurement accuracy; a fixed base is provided with a fixed substrate and a substrate base, and the fixed substrate is a plate a through hole is formed in the center, and the substrate foot is disposed on a periphery of the fixed substrate. The fixing substrate and the substrate base are arranged to form a setting space inside the fixing base for The end of the heat pipe to be tested is disposed on the fixed base by the through hole; a heating device is disposed in the installation space of the fixed base and corresponds to the through hole for the end of the heat pipe to be tested The through hole penetrates into a portion below the fixed substrate for heating, so that the heat pipe to be tested is formed as a heating region below the fixed substrate, and a saturated vapor region and a non-condensed gas region are formed at a portion above the fixed substrate; The infrared thermal imager is opposite to the tape on the surface to be tested of the heat pipe to be tested, and is used for detecting the temperature change and distribution of the adhesive tape on the surface to be tested of the heat pipe to be tested, and taking an infrared thermal image thereof. And outputting, wherein the infrared thermogram includes a temperature at a lower end of the saturated vapor region (T111), a temperature at an upper end of the saturated vapor region (T112), a length of the saturated vapor region (L1), and a length of the non-condensed gas region (L2) Data line; a signal line connected to the infrared camera for receiving the infrared thermal image and transmitted; and an electronic device connected to the infrared camera via the signal line, which includes a display, a computer mainframe and an input module, the computer mainframe is electrically connected to the display and the input module, and is internally installed A heat pipe quality detecting program, the input module is provided for a user to input a heat conduction quality standard (K1) and a vacuum quality standard (K2) according to a production target and a production experience, and the K1 and the K2 are read by the heat pipe quality detecting program. And reading the infrared thermal image of the infrared camera output from the signal line, and then determining the good or bad product by the heat quality rule and the vacuum quality rule, and finally measuring the temperature distribution, heat conduction quality and vacuum quality of the heat pipe to be tested. The result is shown on the display. In the above embodiment of the invention, the tape is selected from the group consisting of dark opaque electrical insulating tape, packaging tape, instrument tape or other materials that compensate for low emissivity. In the above embodiment of the invention, the tape has an emissivity of 0.8 or more, a thickness of less than 0.2 mm, and a temperature resistance of 100 ° C or more. In the above embodiment of the present invention, the heating device is a container for hot water, a container for hot oil, an electric furnace, a combustion furnace or a heating belt. In the above embodiment of the present invention, the thermal conductivity quality criterion is (T111-T112)/L1<K1, K1=KT/L1, and the KT system is allowed to cool down, which is a good product, and if it is not, it is a defective product. In the above embodiment of the present invention, the vacuum quality rule determines that the standard is L2 < K2, which is a good product, and if it does not, it is a defective product. In the above embodiment of the present invention, the signal line, the heat pipe quality detecting program, and the use of the electronic device can be omitted, and the infrared thermal image image is directly output from the infrared thermal imager, from the infrared thermal imager or the computer. Interpret the T111, T112, L1 and L2 of the infrared thermal image, and then calculate (T111-T112)/L1, and judge the quality of the heat pipe to be tested by the thermal quality rule and the vacuum quality rule. In the above embodiment of the present invention, the adhesive tape is adhered to the surface of the upper portion of the heat pipe to be tested. For the purpose of the above, the present invention further relates to a method for detecting the quality of a heat pipe by using an infrared thermal imager, which comprises at least the following steps: (A) attaching a surface of a portion above the heating zone of the heat pipe to be tested with a tape, the heat pipe to be tested The internal system is filled with a working fluid which can change between liquid and vapor as the temperature changes; (B) the heat pipe to be tested is placed on a fixed base, and the tape faces the infrared camera, and the heating area Positioned below the fixed substrate of the fixed base; (C) heating the heat pipe to be tested under the fixed substrate with a heating device, so that the heat pipe to be tested is formed as a heating region below the fixed substrate, and The upper portion of the fixed substrate is formed as a saturated vapor region and a non-condensed gas region; (D) detecting the adhesive portion of the adhesive tape using the infrared thermal imager, and extracting an infrared thermal image thereof, the infrared thermal image includes measurement The data of T111, T112, L1, and L2 are obtained; (E) the user inputs K1 and K2 according to the production target and production experience, and uses the infrared The thermal image output data T111, T112, L1 and L2 are calculated and analyzed by the thermal mass quality rule and the vacuum quality method to analyze the thermal conductivity and vacuum of the heat pipe to be tested, thereby judging good or defective products; and (F) reading from a display Take the temperature distribution of the heat pipe to be tested, heat conduction quality and vacuum quality test results. In the above embodiment of the invention, the tape is selected from the group consisting of dark opaque electrical insulating tape, packaging tape, instrument tape or other materials that compensate for low emissivity. In the above embodiment of the invention, the tape has an emissivity of 0.8 or more, a thickness of less than 0.2 mm, and a temperature resistance of 100 ° C or more. In the above embodiment of the present invention, the heating device is a container for hot water, a container for hot oil, an electric furnace, a combustion furnace or a heating belt. In the above embodiment of the present invention, the thermal conductivity quality criterion is (T111-T112)/L1<K1, K1=KT/L1, and the KT system is allowed to cool down, which is a good product, and if it is not, it is a defective product. In the above embodiment of the present invention, the vacuum quality rule determines that the standard is L2 < K2, which is a good product, and if it does not, it is a defective product.
請參閱『第１圖～第５圖』所示，係分別為本發明利用紅外線熱影像檢測熱管品質之裝置架構示意圖、本發明熱管品質檢測程式之計算與分析流程示意圖、本發明紅外線熱像儀輸出之數據意義示意圖、本發明利用紅外線熱影像檢測熱管品質之方法流程示意圖、及本發明一具體實施例之照片圖。如圖所示：本發明係一種利用紅外線熱像儀結合數據資料計算分析流程檢測熱管導熱特性與真空度之裝置，以及使用此裝置之方法。本發明之裝置如第１圖所示，其包括一待測熱管１、一膠帶２、一固定基座３、一加熱設備４、一紅外線熱像儀５、一訊號線６、一熱管品質檢測程式７、以及一電子設備８所構成。 上述所提之待測熱管１係一內含工作流體之封閉腔體，該封閉腔體內之工作流體係可隨溫度變化作持續循環之液、汽二相變化，使腔體表面呈現快速均溫之特性而達到傳熱之目的。該待測熱管１包含有加熱區域１０、非凝結氣體區域１２、及介於該加熱區域１０與該非凝結氣體區域１２之間之飽和蒸汽區域１１。 該膠帶２係黏貼於該待測熱管１受測表面，具有發射率在0.8以上，厚度小於0.2 mm，並且耐溫100°C以上者。大多數拋光金屬表面發射率低於0.1，導致紅外線熱像儀不易量測溫度；因此本發明在熱管受測表面黏貼發射率較高之膠帶，如深色不透明之電工絕緣膠帶，包裝膠帶或文書膠帶，可補償該待測熱管１之低發射率，以改善量測準確性。 該固定基座３設有一固定基板３１及一基板腳座３２，該固定基板３１為一板體且於中央設有一貫穿之通孔３１１，該基板腳座３２係設置在該固定基板３１之周緣，經由該固定基板３１及該基板腳座３２之組設使該固定基座３內部形成有一設置空間３３，用以將該待測熱管１端部由該通孔３１１安置於該固定基座３。 該加熱設備４係設於該固定基座３之設置空間３３中並與該通孔３１１相對應，用以對該待測熱管１端部由該通孔３１１穿入該固定基板３１以下之部位進行加熱，使該待測熱管１位於該固定基板３１以下部位形成為加熱區域１０，而位於該固定基板３１以上部位形成為飽和蒸汽區域１１與非凝結氣體區域１２。其中，該加熱設備４可為盛裝熱水之容器、盛裝熱油之容器、電熱爐，燃燒爐或加熱帶任其一。 該紅外線熱像儀５係一種儀器，能將人眼無法看到之紅外線輻射熱能量轉換為電訊號，並以各種不同之顏色來顯示出不同溫度之分佈，使整個溫度分布狀態以可視圖像顯示出來。因此，本發明係將該紅外線熱像儀５與該待測熱管１受測表面上之膠帶２相對面向，用以檢測該待測熱管１受測表面上之膠帶２黏貼部位之溫度變化與分佈情況，擷取其一紅外線熱像圖，並輸出；其中該紅外線熱像圖包含該飽和蒸汽區域下端溫度（T111）、該飽和蒸汽區域上端溫度（T112）、該飽和蒸汽區域之長度（L1）、及該非凝結氣體區域之長度（L2）等數據資料。 該訊號線６係與該紅外線熱像儀５連接，用以接收該紅外線熱像圖並傳輸。 該電子設備８係經由該訊號線６與該紅外線熱像儀５連接，其包含有一顯示器８１、一電腦主機８２及一輸入模組８３，該電腦主機８２與該顯示器８１及該輸入模組８３電性連接，內部並安裝有該熱管品質檢測程式７，該熱管品質檢測程式７主要計算與分析流程如第２圖所示，係由該輸入模組８３讀取其提供一使用者根據生產目標與製作經驗所輸入之導熱品質標準（K1）與真空品質標準（K2），並從該訊號線６讀取該紅外線熱像儀５輸出之紅外線熱像圖，解讀出數據T111、T112、L1及L2，再以導熱品質法則與真空品質法則判斷良品或不良品，最後將該待測熱管１之溫度分佈，導熱品質與真空品質檢測結果顯示於該顯示器８１。 上述所提T111、T112、L1及L2之意義如第３圖所示，於環境１００中，當待測熱管１在固定基板３１以下區域１１受熱，經過時間約10～50秒，在固定基板３１以上之待測熱管１表面溫度會上升，但是如果熱管真空度不良，熱管內部上端會累積非凝結氣體，非凝結氣體之導熱係數低，以至於溫度上升不大，因而形成飽和蒸汽與非凝結氣體兩個區域１１、１２，其中區域１１溫度＞區域１２溫度＞環境１００溫度。T111為飽和蒸汽區域１１下端溫度，T112為飽和蒸汽區域１１上端溫度，因T112離熱源較T111遠，故T112低於T111，L1為飽和蒸汽區域１１長度，L2為非凝結氣體區域１２長度。導熱品質法則判斷標準為(T111-T112)/L1＜K1，K1=KT/L1，KT係容許降溫幅度，根據生產目標與製作經驗決定，符合為良品，不符合則為不良品。真空品質法則判斷標準為L2＜K2，符合為良品，不符合則為不良品。最後將待測熱管１之溫度分佈，導熱品質與真空品質檢測結果顯示於顯示器８１。 使用本裝置之方法如第４圖所示，步驟s11，將待測熱管加熱區域以上部位表面用膠帶黏貼，而該待測熱管內係充填有可隨溫度變化作液 、汽兩相變化之工作流體；步驟s12，將待測熱管安置於固定基座，使膠帶面向紅外線熱像儀，而加熱區域位在固定基板以下；步驟s13，對待測熱管在固定基板以下部位用加熱設備加熱，使待測熱管位於固定基板以下部位形成為加熱區域，而位於固定基板以上部位形成為飽和蒸汽區域與非凝結氣體區域；步驟s14，使用紅外線熱像儀針對膠帶黏貼部位進行檢測，並擷取其一紅外線熱像圖，該紅外線熱像圖中包含測量所得T111、T112、L1、及L2等數據資料；步驟s15，使用者根據生產目標與製作經驗輸入K1與K2，利用紅外線熱像儀輸出之數據T111、T112、L1與L2，以導熱品質法則與真空品質法計算分析待測熱管之導熱特性與真空度，藉以判斷良品或不良品；以及步驟s16，從顯示器讀取待測熱管之溫度分佈，導熱品質與真空品質檢測結果。 於一具體實施例中，四支熱管１ａ、１ｂ、１ｃ及１ｄ之內部充填水作為工作流體，以杯裝熱水加熱，時間約20秒，如第５圖所示。非凝結氣體因密度較輕，最先逸出，浮在熱管內部最頂端，因導熱性較差，溫度較低，而水呈現飽和蒸汽，溫度較高，也因此呈現飽和蒸汽與非凝結氣體兩個不同區域１１、１２，而區域１２之長度L2越長，表示非凝結氣體越多，真空品質越差。由圖中可以明顯看出區域１１溫度＞區域１２溫度＞環境１００溫度。熱管１ｄ之L2較長，真空品質較差，熱管１ａ之導熱品質與真空品質均最佳，其KT=5°C，L1=250 mm，L2=1 mm，T111=72.5°C，T112=71.2°C，(T111-T112)/L1=5.2 °C/m。 本發明除上述第一實施例所提結構型態之外，亦可為本第二實施例之結構型態，而其所不同之處係在於，可省略訊號線、熱管品質檢測程式、及電子設備之使用，直接由紅外線熱像儀輸出紅外線熱像圖，從紅外線熱像儀或電腦解讀該紅外線熱像圖之T111、T112、L1及L2，再計算(T111-T112)/L1，藉導熱品質法則與真空品質法則判斷待測熱管品質優劣。 藉此，本發明提出一種利用紅外線熱影像檢測熱管品質之裝置與方法 ，尤指一種利用紅外線熱像儀結合數據資料計算分析流程檢測熱管導熱品質與真空品質之裝置，以及使用此裝置之方法，採取本發明，可以全面線上整體檢測，並且無需破壞熱管，即能達到有效率之品質管制，以符合熱管大量生產模式之品質檢驗需要。 綜上所述，本發明係一種利用紅外線熱影像檢測熱管品質之裝置與方法，可有效改善習用之種種缺點，利用紅外線熱像儀結合數據資料計算分析流程檢測熱管導熱品質與真空品質之裝置，以及使用此裝置之方法，可以全面線上整體檢測，提供快速檢驗熱管之功能，並且無需破壞熱管，即能達到有效率之品質管制，以符合熱管大量生產模式之品質檢驗需要，進而使本發明之□生能更進步、更實用、更符合使用者之所須，確已符合發明專利申請之要件，爰依法提出專利申請。 惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍；故，凡依本發明申請專利範圍及發明說明書內容所作之簡單的等效變化與修飾，皆應仍屬本發明專利涵蓋之範圍內。Please refer to FIG. 1 to FIG. 5, which are schematic diagrams of the device architecture for detecting the quality of the heat pipe by infrared thermal image, the calculation and analysis flow chart of the heat pipe quality testing program of the present invention, and the infrared camera of the present invention. The schematic diagram of the data meaning of the output, the schematic diagram of the method for detecting the quality of the heat pipe by the infrared thermal image, and the photographic diagram of a specific embodiment of the present invention. As shown in the figure: The present invention is a device for detecting heat conduction characteristics and vacuum degree of a heat pipe by using an infrared thermal imager combined with a data data calculation and analysis process, and a method of using the same. As shown in FIG. 1 , the device of the present invention comprises a heat pipe 1 to be tested, a tape 2, a fixed base 3, a heating device 4, an infrared camera 5, a signal line 6, and a heat pipe quality inspection. The program 7 and an electronic device 8 are constructed. The heat pipe 1 to be tested mentioned above is a closed cavity containing a working fluid, and the working flow system in the closed cavity can continuously change the liquid and vapor two phases with temperature change, so that the surface of the cavity exhibits rapid temperature uniformity. The characteristics of the heat transfer purpose. The heat pipe 1 to be tested includes a heating zone 10, a non-condensing gas zone 12, and a saturated vapor zone 11 between the heating zone 10 and the non-condensing gas zone 12. The tape 2 is adhered to the surface to be tested of the heat pipe 1 to be tested, and has an emissivity of 0.8 or more, a thickness of less than 0.2 mm, and a temperature resistance of 100 ° C or more. Most polished metal surface emissivity is less than 0.1, which makes the infrared thermal imager difficult to measure the temperature; therefore, the present invention adheres to a high emissivity tape on the surface of the heat pipe, such as dark opaque electrical insulating tape, packaging tape or instrument. The tape can compensate the low emissivity of the heat pipe 1 to be tested to improve the measurement accuracy. The fixed base 3 is provided with a fixed substrate 31 and a substrate base 32. The fixed substrate 31 is a plate body and has a through hole 311 extending through the center thereof. The substrate base 32 is disposed on the periphery of the fixed substrate 31. An arrangement space 33 is formed in the fixed base 3 through the assembly of the fixed substrate 31 and the substrate base 32. The end of the heat pipe 1 to be tested is disposed on the fixed base 3 by the through hole 311. . The heating device 4 is disposed in the installation space 33 of the fixed base 3 and corresponds to the through hole 311, and is configured to penetrate the end of the heat pipe 1 to be tested from the through hole 311 into the lower portion of the fixed substrate 31. Heating is performed so that the heat pipe 1 to be tested is formed as a heating region 10 at a portion below the fixed substrate 31, and a saturated vapor region 11 and a non-condensed gas region 12 are formed at a portion above the fixed substrate 31. Wherein, the heating device 4 can be any one of a container for hot water, a container for hot oil, an electric furnace, a burning furnace or a heating belt. The infrared camera 5 is an instrument capable of converting infrared radiant heat energy that is invisible to the human eye into an electrical signal, and displaying different temperature distributions in various colors, so that the entire temperature distribution state is displayed as a visible image. come out. Therefore, in the present invention, the infrared camera 5 is opposite to the tape 2 on the surface to be tested of the heat pipe 1 to be tested, and is used for detecting the temperature change and distribution of the adhesive portion of the tape 2 on the surface to be tested of the heat pipe 1 to be tested. In the case, an infrared thermal image is taken and outputted; wherein the infrared thermal image includes a temperature at a lower end of the saturated vapor region (T111), a temperature at an upper end of the saturated vapor region (T112), and a length of the saturated vapor region (L1) And data such as the length (L2) of the non-condensed gas region. The signal line 6 is connected to the infrared camera 5 for receiving and transmitting the infrared thermal image. The electronic device 8 is connected to the infrared camera 5 via the signal line 6 and includes a display 81, a computer host 82 and an input module 83. The computer host 82 and the display 81 and the input module 83 are included. Electrically connected, the heat pipe quality detecting program 7 is installed inside, and the heat pipe quality detecting program 7 mainly calculates and analyzes the flow as shown in FIG. 2, and is read by the input module 83 to provide a user according to the production target. And the thermal conductivity quality standard (K1) and vacuum quality standard (K2) input by the production experience, and the infrared thermal image outputted by the infrared thermal imager 5 is read from the signal line 6, and the data T111, T112, L1 and L2, and then judge the good or bad product by the heat quality rule and the vacuum quality rule, and finally display the temperature distribution, heat conduction quality and vacuum quality test result of the heat pipe 1 to be tested on the display 81. The meanings of T111, T112, L1 and L2 mentioned above are as shown in FIG. 3. In the environment 100, when the heat pipe 1 to be tested is heated in the region 11 below the fixed substrate 31, the elapsed time is about 10 to 50 seconds on the fixed substrate 31. The surface temperature of the heat pipe 1 to be tested above will rise, but if the heat pipe vacuum is poor, the non-condensing gas will accumulate at the upper end of the heat pipe, and the non-condensing gas has a low thermal conductivity, so that the temperature rise is not large, thereby forming saturated steam and non-condensing gas. Two zones 11, 12, wherein zone 11 temperature > zone 12 temperature > environment 100 temperature. T111 is the lower end temperature of the saturated steam region 11, and T112 is the upper end temperature of the saturated steam region 11. Since T112 is farther away from the heat source than T111, T112 is lower than T111, L1 is the length of the saturated steam region 11, and L2 is the length of the non-condensed gas region 12. The thermal conductivity quality criterion is (T111-T112)/L1<K1, K1=KT/L1, and the KT system is allowed to cool down. It is determined according to the production target and production experience, and is a good product. If it is not, it is a defective product. The vacuum quality rule determines that the standard is L2 < K2, which is a good product, and if it does not, it is a defective product. Finally, the temperature distribution of the heat pipe 1 to be tested, the heat conduction quality and the vacuum quality test result are displayed on the display 81. The method of using the device is as shown in FIG. 4, step s11, the surface of the upper part of the heating pipe to be tested is taped with a tape, and the heat pipe to be tested is filled with a liquid phase and a vapor phase change with temperature change. Fluid s12, the heat pipe to be tested is placed on the fixed base so that the tape faces the infrared camera, and the heating zone is below the fixed substrate; in step s13, the heat pipe to be tested is heated by the heating device below the fixed substrate, so that The heat measuring tube is formed as a heating area below the fixed substrate, and is formed as a saturated vapor area and a non-condensing gas area in a portion above the fixed substrate; in step s14, an infrared thermal imager is used to detect the adhesive portion of the adhesive tape, and an infrared ray is taken. Thermal image, the infrared thermal image contains measured data such as T111, T112, L1, and L2; in step s15, the user inputs K1 and K2 according to the production target and production experience, and uses the infrared thermal imager to output the data T111. , T112, L1 and L2, calculate the thermal conductivity and vacuum degree of the heat pipe to be tested by the heat conduction quality rule and the vacuum quality method. To determine non-defective or defective; and a step S16, reads the temperature distribution of the heat pipe to be measured, the thermal conductivity of the vacuum quality detection result from the display quality. In one embodiment, the internal heat of the four heat pipes 1a, 1b, 1c, and 1d is used as a working fluid and heated in a cup of hot water for about 20 seconds, as shown in FIG. The non-condensing gas is lighter in density and first escapes, floating at the top of the heat pipe. Due to poor thermal conductivity, the temperature is low, and the water is saturated with steam, and the temperature is high, so there are two saturated steam and non-condensed gas. The different regions 11, 12, and the longer the length L2 of the region 12, the more non-condensing gas, the worse the vacuum quality. It is apparent from the figure that the region 11 temperature > region 12 temperature > environment 100 temperature. The heat pipe 1d has a long L2 and poor vacuum quality. The heat transfer quality and vacuum quality of the heat pipe 1a are the best, and its KT=5°C, L1=250 mm, L2=1 mm, T111=72.5°C, T112=71.2°. C, (T111-T112) / L1 = 5.2 °C / m. In addition to the configuration of the first embodiment, the present invention may also be the configuration of the second embodiment, and the difference is that the signal line, the heat pipe quality detecting program, and the electronic device may be omitted. For the use of the equipment, the infrared thermal imager is directly output from the infrared camera, and the infrared thermal imager or computer is used to interpret the infrared thermal image images T111, T112, L1 and L2, and then calculate (T111-T112)/L1, by heat conduction The quality rule and the vacuum quality rule determine the quality of the heat pipe to be tested. Accordingly, the present invention provides an apparatus and method for detecting the quality of a heat pipe by using infrared thermal image, in particular, a device for detecting heat conduction quality and vacuum quality of a heat pipe by using an infrared thermal imager combined with a data data calculation and analysis process, and a method using the same, By adopting the invention, the overall inspection can be carried out on the whole line, and the quality control can be achieved without destroying the heat pipe, so as to meet the quality inspection requirements of the mass production mode of the heat pipe. In summary, the present invention is a device and method for detecting the quality of a heat pipe by using infrared thermal image, which can effectively improve various shortcomings of the conventional use, and uses an infrared thermal imager combined with a data data calculation and analysis process to detect the heat conduction quality and vacuum quality of the heat pipe. And the method of using the device can comprehensively detect on the whole line, provide the function of quickly checking the heat pipe, and can achieve efficient quality control without damaging the heat pipe, so as to meet the quality inspection requirements of the mass production mode of the heat pipe, thereby making the invention □ Health is more progressive, more practical, and more in line with the needs of users. It has indeed met the requirements of the invention patent application and has filed a patent application in accordance with the law. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto; therefore, the simple equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the invention are modified. All should remain within the scope of the invention patent.
環境１００ 待測熱管１ 加熱區域１０ 飽和蒸汽區域１１ 非凝結氣體區域１２ 膠帶２ 固定基座３ 固定基板３１ 通孔３１１ 基板腳座３２ 設置空間３３ 加熱設備４ 紅外線熱像儀５ 訊號線６ 熱管品質檢測程式７ 電子設備８ 顯示器８１ 電腦主機８２ 輸入模組８３ 步驟s11～步驟s16Environment 100 Heat pipe to be tested 1 Heating zone 10 Saturated steam zone 11 Non-condensing gas zone 12 Tape 2 Fixed base 3 Fixed base plate 31 Through hole 311 Base plate base 32 Setting space 33 Heating equipment 4 Infrared camera 5 Signal line 6 Heat pipe quality Test program 7 Electronic device 8 Display 81 Computer host 82 Input module 83 Step s11 to step s16
第１圖，係本發明利用紅外線熱影像檢測熱管品質之裝置架構示意圖。 第２圖，係本發明熱管品質檢測程式之計算與分析流程示意圖。 第３圖，係本發明紅外線熱像儀輸出之數據意義示意圖。 第４圖，係本發明利用紅外線熱影像檢測熱管品質之方法流程示意圖。 第５圖，係本發明一具體實施例之照片圖。Fig. 1 is a schematic view showing the structure of an apparatus for detecting the quality of a heat pipe by using infrared thermal imaging. Fig. 2 is a schematic diagram showing the calculation and analysis process of the heat pipe quality testing program of the present invention. Fig. 3 is a schematic view showing the meaning of data of the output of the infrared camera of the present invention. Fig. 4 is a schematic flow chart showing the method for detecting the quality of a heat pipe by using infrared thermal image. Figure 5 is a photograph of a specific embodiment of the present invention.