TWI792273B - Non-contact detection apparatus for thermal conductive pipes and method thereof - Google Patents

Abstract

A non-contact detection apparatus for heat pipes and a method thereof are provided. The disclosure controls an infrared heating module to heat a thermal conductive pipe to be tested based on a heating parameter, and controls an infrared temperature measurement module to collect the measurement temperature data of the thermal conductive pipe. The disclosure monitors the temperature slopes of the measurement temperature data during heating, calculates a score based on the temperature slopes when the temperature slopes converge on a stop slope, and determines a quality of the thermal conductive pipe based on its score. The disclosure can detect the conductive quality of the thermal conductive objects.

Description

Non-contact detection device and method for heat pipe

The invention relates to the detection of heat pipes, in particular to the non-contact detection of heat pipes.

At present, most of the detection methods for heat pipes are contact detection methods. Specifically, the contact detection method is to heat the heating block to a constant temperature, and then bring the heating block into contact with the heat pipe to heat the heat pipe through heat conduction until the temperature of the heat pipe reaches a steady state. Then, use a contact temperature sensor to touch two points on the heat pipe to measure the temperature of the two points, and determine whether the heat conduction effect of the heat pipe is good or not according to the temperature difference between the two points.

The existing contact detection methods have at least the following problems: 1. The contact detection method must heat the heating block to a constant temperature and wait for the temperature of the heat pipe to reach a steady state, which greatly increases the detection time. 2. There is a problem of heat loss in the heating block, and the different contact force or area between the heating block and the heat pipe will lead to different heating power provided, which cannot provide stable heating power to the heat pipe. 3. The temperature of the contact temperature sensor is usually lower than the temperature of the heated heat pipe, which makes the above-mentioned temperature difference cause measurement errors when the contact temperature sensor contacts the heat pipe; in addition, the contact force will also It affects the thermal resistance, and the measurement results are different for different thermal resistances. 4. With different heating power, the temperature difference between two points on the heat pipe will also be different, which makes the test results unable to be used to judge the conduction effect.

Therefore, the above-mentioned problems exist in the existing contact detection method, and a more effective solution is urgently needed to be proposed.

The main purpose of the present invention is to provide a non-contact detection device and method for heat pipes, which adopts non-contact heating and temperature measurement, and the temperature of the heat pipes does not need to reach a steady state to complete the detection.

The present invention provides a non-contact detection method for heat pipes, which is applied to a non-contact detection device including an infrared heating module and an infrared temperature measurement module. The method includes the following steps: a) obtaining a heating parameter and An object information of a heat pipe to be tested; b) calculating a stop slope based on an infrared heating parameter of the infrared heating module and an object heating parameter of the heat pipe to be tested; c) controlling the infrared heating based on the heating parameter The module heats the heat pipe to be tested, and controls the infrared temperature measurement module to measure a measured temperature data of the heat pipe to be tested; d) monitors a temperature of the measured temperature data during the heating process slope; e) when a stop condition is detected to be met, perform a scoring process based on the temperature slope to determine a score for detecting the heat pipe under test, wherein the stop condition includes the temperature slope converging to the stop slope; and f) When the score of the heat pipe under test is better than a score threshold, it is determined that the heat pipe under test is a good product, and when the score is not better than the score threshold, it is determined that the heat pipe under test is a bad product.

The present invention also provides a non-contact detection device for heat pipes, including an infrared heating module, an infrared temperature measurement module, and a control module electrically connected to the infrared heating module and the infrared temperature measurement module . The infrared heating module is configured to heat a heat pipe under test based on a heating parameter; the infrared temperature measurement module is configured to measure a measured temperature data of the heat pipe under test; the control module is configured to configured to obtain a heating parameter and an object information of the heat pipe under test, the control module is configured to calculate a stop based on an infrared heating parameter of the infrared heating module and an object heating parameter of the heat pipe under test slope, the control module is configured to monitor a temperature slope of the measured temperature data during the heating process, and determine a score for detecting the heat pipe under test based on the temperature slope when a stop condition is satisfied, the control The module is configured to determine that the heat pipe under test is a good product when the score of the heat pipe under test is higher than a score threshold, and determine that the heat pipe under test is inferior when the score is not better than the score threshold wherein the stopping condition includes the temperature slope converging to the stopping slope.

The invention can effectively judge whether the conductivity of the heat pipe is good or bad.

A preferred embodiment of the present invention will be described in detail below with reference to the drawings.

The present invention proposes a non-contact detection device and method, which realizes non-contact heating and temperature measurement through infrared heating and infrared temperature measurement, thereby providing stable heating power and eliminating the need for "contact temperature sensors and heat pipes." The temperature difference will cause the problem of measurement error.

Moreover, the present invention evaluates the thermal conductivity of the heat pipe based on the slope of the temperature change, which not only has high accuracy, but also does not need to wait for the heat pipe to reach a steady state temperature to complete the detection, and can greatly reduce the detection time.

Please refer to FIG. 1 , which is a structural diagram of a non-contact detection device according to an embodiment of the present invention.

The non-contact detection device 1 of this embodiment includes an infrared heating module 11 , an infrared temperature measuring module 12 and a control module 10 electrically connected to the above modules.

Infrared heating modules 11, such as halogen heaters, short wave infrared heaters, fast medium wave infrared heaters, carbon medium wave infrared heaters, (carbon dioxide) laser heaters or other types of infrared heaters, are controlled to heat based on parameter to heat the object.

It is worth mentioning that, compared to the indirect heating through hot air convection of the hot air stove, which has poor heating efficiency, the infrared heating module 11 of the present invention performs direct heating through infrared radiation on the heat pipe, which can provide better heating efficiency.

The infrared temperature measurement module 12, such as a single-point infrared thermometer, a multi-point infrared thermometer, a laser thermometer or other types of infrared thermometers, is used to continuously measure the surface temperature of the heat pipe.

The control module 10 (such as computer, processor, microcontroller, control box, etc.) is used to control the non-contact detection device 1 to realize the non-contact detection of the present invention.

Please refer to FIG. 2 , which is a structural diagram of a non-contact detection device according to another embodiment of the present invention.

As shown in Figure 2, the control module 10 can be a computer system (such as a general-purpose computer system such as a personal computer, a tablet computer, a smart phone, a notebook computer), and connects the infrared heating module 11 and the infrared temperature sensor through a communication device 101. Measuring module 12.

The control module 10 may include a communication device 101 , a man-machine interface 102 , a storage device 103 and a processor 100 (such as a central processing unit) electrically connected to the above devices.

The communication device 101 (such as a network card, a Wi-Fi interface, a Bluetooth interface, a USB interface, an Ethernet interface, a ZigBee interface, an RS232 interface, or any combination thereof) is used to connect external devices for communication.

The man-machine interface 102 (such as keyboard, mouse, touch panel and other input devices, display, speaker, buzzer, indicator light and other output devices or touch screen and other input and output devices) is used to accept user input and output Information.

The storage device 103 (such as storage modules such as disk hard disk, solid state disk, flash memory, RAM, EEPROM, etc.) is used for storing data.

The processor 100 is used to control various devices and modules to implement the non-contact detection of the present invention (details will be described later).

Please refer to FIG. 3 , which is an architecture diagram of a processor according to another embodiment of the present invention. The processor 100 of the present invention may include all or part of the following modules 30-38, and the modules 30-38 are respectively used to realize different functions.

1. Heating control module 30 : configured to control the infrared heating module 11 .

2. Measurement control module 31 : configured to control the infrared temperature measurement module 12 .

3. Stop monitoring module 32: configured to monitor whether a preset stop condition is met.

4. Scoring module 33: configured to score this test.

In one embodiment, the scoring module 33 may include a heating scoring module 34 , a conduction scoring module 35 and a convection scoring module 36 . The heating scoring module 34 is configured to score the heating state detected this time. Conductivity scoring module 35 is configured to score the conductivity of heated conductive objects. The convection scoring module 36 is configured to score the detected environmental state (such as thermal convection).

5. Threshold calculation module 37: configured to calculate scoring thresholds (such as heating scoring thresholds, conduction scoring thresholds, and convection scoring thresholds). The aforementioned scoring thresholds are used as judgment criteria to judge heating status, environmental status, or conductivity, etc. pros and cons of attributes.

6. Initialization module 38: configured to perform initialization settings before testing.

The aforementioned modules 30-38 are interconnected (which can be electrical connection and information connection), and can be hardware modules (such as electronic circuit modules, integrated circuit modules, SoC, etc.), software modules (such as firmware, operating system, or application) or a mix of hardware and software modules, without limitation.

It is worth mentioning that when the aforementioned modules 30-38 are software modules (such as application programs), the storage device 103 may include a non-transitory computer-readable recording medium, and the aforementioned non-transitory computer-readable recording medium stores Computer program, the computer program records computer-executable program codes, and when the processor 100 executes the aforementioned program codes, the functions of the aforementioned modules 30-38 can be realized.

Referring again to FIG. 2 , in one embodiment, the control module 10 is only used to control the heating of the infrared heating module 11 and the temperature measurement of the infrared temperature measurement module 12 , but does not perform scoring processing.

Specifically, the modules 33-38 can be built on the computing platform 20 (such as a cloud computing service platform or a remote server), and the control module 10 can connect to the computing platform 20 through the communication device 101 to obtain initialization related data (such as Scoring thresholds, stop conditions, etc. described later), and upload the collected data (such as temperature measurement data or slope data) to the computing platform 20, so as to be calculated and processed by the computing platform 20 to obtain various scores. In this way, since the high-load calculation is performed by the computing platform 20, the control module 10 only needs to have general processing capability, and a lower-level processor can be used.

In one embodiment, the infrared heating module 11 may include one or more heating elements (a heating element 110 is taken as an example in FIG. 2 ), such as a combination of an infrared light source and a lens. Each heating element 110 can heat a single point or a small area on the heat pipe (the heating area depends on the infrared projected area). In this way, when multiple heating elements 110 are provided, multiple points or large areas on the heat pipe 22 can be heated at the same time, thereby increasing the heating power.

In one embodiment, the infrared temperature measurement module 12 may include one or more measuring elements (FIG. 2 is an example of two measuring elements 120-121). Each measuring element 120 - 121 can be, for example, a set of infrared thermometers, which can measure the temperature of a single point on the heat pipe 22 . Thereby, when multiple measuring elements 120 - 121 are provided, temperature measurement can be performed on multiple points on the heat pipe at the same time, so as to obtain more temperature measurement data.

In one embodiment, the non-contact detection device 1 further includes a positioning jig 21 . The positioning fixture 21 is used to fix the heat pipe 22 to be measured, so that during the heating process, the infrared heating module 11 can continuously heat the same position of the heat pipe 22, and the infrared temperature measurement module 12 can heat the heat pipe 22. Continuous temperature measurement at the same position.

Please refer to FIG. 8 , which is a schematic diagram of a non-contact detection setup according to an embodiment of the present invention. As shown in the figure, the positioning jig 21 may include a first installation structure 211 , a second installation structure 212 , a third installation structure 210 and a base 213 disposed between the first installation structure 211 and the second installation structure 212 .

When the heat pipe 22 to be tested is to be tested, the heating element 110 of the infrared heating module 1 is fixedly installed on the first installation structure 211, and the measuring elements 120-121 of the infrared temperature measurement module 12 are fixedly installed. on the second installation structure 212 , and fix and clamp the heat pipe 22 to be tested on the third installation structure 210 .

In this way, the heating element 110 can heat the heating position A1 on one side of the heat pipe 22, and the measuring elements 120-121 can measure the temperature of multiple measurement positions A2, A3 on the other side (different side) of the heat pipe 22. .

In one embodiment, one of the measurement positions A2 is located directly behind the heating position A1 to measure the temperature near the heating point, and at least one measurement position A3 is away from the directly behind the heating position A1 to measure the temperature far from the heating point temperature. With the above configuration, the present invention can obtain the temperature difference between the measurement locations A2 and A3, and use this temperature difference to score the conductivity of the heat pipe 22 (details will be described later).

In one embodiment, the heat pipe 22 is coated with dark radiant paint on the heating position A1 and the measurement positions A2 and A3. The dark radiant paint can improve the absorption of radiant heat, thereby improving the heating efficiency and improving the success of temperature measurement. rate and accuracy.

In one embodiment, the coating area of the dark radiant paint at the heating position A1 is larger than the (laser) infrared irradiation area D1 of the heating element 110 , so that the heating infrared rays can completely irradiate the dark radiant paint. Moreover, the coating area of the dark radiant paint at each measuring position A2, A3 is larger than the measuring areas D2, D3 of the measuring elements 120, 120, so that the temperature measuring infrared rays can be completely irradiated on the dark radiant paint.

In one embodiment, the distance L1 (first distance) between the heating element 110 and the heat pipe 22 is adjusted based on the focal length of the lens of the heating element 110, such as equal to the focal length of the lens, so that the thermal infrared rays can be effectively focused on the heating position A1.

In addition, the distance L2 (second distance) between the measuring elements 120, 121 and the heat pipe 22 is adjusted based on the focal length of the lens of the measuring element 120, 121, such as equal to the focal length of the lens, so that the temperature measuring infrared rays can be effectively focused At measurement positions A2 and A3.

In one embodiment, the second distances between the measurement elements 120 , 121 and the heat pipe 22 are equal, such as the distance L2 , so as to eliminate temperature measurement errors caused by different measurement distances.

Please refer to FIGS. 9 and 10 . FIG. 9 is a schematic view of one side of the heat pipe according to an embodiment of the present invention, and FIG. 10 is a schematic view of the other side of the heat pipe of FIG. 9 .

The invention is particularly suitable for the heat conduction detection of an ultra-thin vapor chamber (VC). Specifically, the present invention can heat the heating position H (Figure 10) on one side of the ultra-thin vapor chamber, and measure the temperature of the measurement positions T1 and T2 on the other side, wherein the measurement position T1 is located at the heating position H front and back.

Moreover, when the heating position H of the ultra-thin vapor chamber is heated, the liquid under the wall surface at the heating position H end absorbs heat and turns into vapor and moves to other positions with low pressure (such as the measurement position T2 end), through contact measurement The wall surface at the T2 end absorbs heat and condenses back to liquid again, and then flows back to the H end at the heating position to form a thermal cycle, that is, to realize the heat dissipation function.

Please refer to FIG. 4 , which is a flowchart of a non-contact detection method according to an embodiment of the present invention.

Step S10: The processor 100 obtains the heating parameter, the stop slope, and the object information of the heat pipe 22 to be tested.

The aforementioned heating parameters are used to control the heating power output by the infrared heating module 11 . The stop slope is used to judge whether to stop the detection. The object information may include but not limited to the mass, area, specific heat capacity, target temperature, etc. of the heat pipe 22 .

The aforementioned heating parameters, stop slope and object information can be preset and stored in the storage device 103, or manually input by the user, without limitation.

In one embodiment, the processor 100 can obtain the infrared heating parameters of the infrared heating module 11 (ie, the heating capability of the infrared heating module 11 ) and the object heating parameters of the heat pipe 22 (ie, the temperature change capability of the heat pipe 22 ). , and calculate the stop slope according to the infrared heating parameter and the object heating parameter.

Step S11: The processor 100 controls the infrared heating module 11 to heat the heat pipe 22 through the heating control module 30 based on the heating parameters, and controls the infrared temperature measurement module 12 to continuously measure the heating temperature through the measurement control module 31 The temperature of the heat pipe 22 is used to obtain the measurement temperature data of the measurement position.

In one embodiment, the processor 100 can control the multiple measurement elements 120-121 of the infrared temperature measurement module 12 to simultaneously measure multiple measurement positions A2-A3 of the heat pipe 22 to obtain multiple measurements. A plurality of measured temperature data of measuring positions A2-A3.

Step S12: During the heating process, the processor 100 obtains the measured temperature data of the infrared temperature measurement module 12 through the measurement control module 31, and monitors the temperature slope of the measured temperature data in real time, such as calculating two consecutive time points (such as the slope corresponding to the temperature change between 0.5 seconds, 1 second, 5 seconds, 10 seconds, etc.).

Step S13: The processor 100 monitors whether a preset stop condition is met through the stop monitoring module 32.

In one embodiment, the aforementioned stop conditions include that the temperature slope converges to the stop slope (such as the temperature slope gradually decreases to the stop slope), that is, the stop monitoring module 32 determines to stop the detection when it detects that the instantaneous temperature slope converges to the stop slope.

In one embodiment, the stop condition includes that the accumulated heating time (ie, the heating duration) reaches the upper detection time limit (such as 1 minute, 5 minutes, 30 minutes, etc.), that is, the stop monitoring module 32 detects that the accumulated heating time is overtime, and then Determined to stop detection.

In one embodiment, the stop condition includes the temperature slope converges to the stop slope and the accumulated heating time, that is, the temperature slope converges to the stop slope or the accumulated heating time expires, the stop monitoring module 32 will determine to stop the detection.

If the stop condition is not satisfied, repeat step S13 to continue heating, temperature measurement, monitor temperature slope, and monitor whether the stop condition is satisfied.

If the stop condition is satisfied, step S14 is executed: the processor 100 controls the infrared heating module 11 to stop heating through the heating control module 30 , and controls the infrared temperature measurement module 12 to stop temperature measurement through the measurement control module 31 .

It is worth mentioning that step S14 is not a necessary step. In one embodiment, the present invention can continue heating and temperature measurement after the stop condition is met, and directly execute step S15 to score the heat pipe 22 with the data before the stop condition is met.

Step S15 : The processor 100 performs scoring processing based on the temperature slope of the measured temperature data by the scoring module 33 to determine a score for detecting the heat pipe 22 . The aforementioned score can be a numerical value, and the magnitude of the numerical value indicates the quality of the property (such as the state of conduction, convection or heating), such as a larger value means better, or a smaller value means better.

In one embodiment, the scoring module 33 can further compare the score of the detected heat pipe 22 with a preset scoring threshold, and determine that the heat pipe 22 is a good product when the score is higher than the scoring threshold, and determine that the heat pipe 22 is a good product if the score is not better than the scoring threshold. When the threshold is exceeded, it is determined that the heat pipe 22 is inferior. The aforementioned score can be set such that a larger numerical value indicates better quality, or a smaller numerical value indicates better quality, which is not limited.

In one embodiment, the scoring module 33 can compare one or more temperature slopes (slope data) of the measured temperature data with one or more preset good product slopes, and score according to the matching degree.

In one embodiment, when the accumulated heating time is over, it means that the heat pipe 22 may not be able to find obvious conduction characteristics within the specified time due to poor conduction. For this, the scoring module 33 can directly give the heat pipe 22 a poor score (such as a score of inferior grade) or directly determine that it is inferior.

Therefore, the present invention can detect the conductivity of the heat pipe through a non-contact detection method.

Please refer to FIG. 4 and FIG. 5 together. FIG. 5 is a partial flowchart of a non-contact detection method according to another embodiment of the present invention. Compared with the embodiment in FIG. 4 , step S10 in the embodiment in FIG. 5 further includes specific initialization steps S20 - S23 , wherein the execution sequence of steps S21 - S23 can be changed arbitrarily according to user requirements, or executed simultaneously.

Step S20: The processor 100 sets the object information and the target temperature through the initialization module 38 .

In one embodiment, the user can directly input the object information of the heat pipe 22 (such as mass, size, material, specific heat capacity, single surface area or total area, etc.) through the man-machine interface 102, and can input the target temperature (such as 60 degrees Celsius, 70 or 80 degrees, etc.).

In one embodiment, the initialization module 38 can read a plurality of pre-stored object information and a plurality of target temperatures from the storage device 103 and display them on the man-machine interface 102 for the user to use the man-machine interface 102 to select.

Step S21 : The processor 100 calculates the heating parameters of the infrared heating module 11 through the initialization module 38 .

In one embodiment, the heating parameters include the heating input voltage of the infrared heating module 11 , and the heating power output by the infrared heating module 11 can be adjusted by adjusting the heating input voltage.

Specifically, the initialization module 38 can obtain the object heating parameters of the heat pipe 22 based on the mass and specific heat capacity of the heat pipe 22, and then based on the object heating parameters and the infrared heating parameters of the infrared heating module 11 (such as infrared heater power, Infrared emissivity and radiation attenuation rate) to calculate the heating input voltage as a heating parameter.

可基於紅外線加熱器功率

、紅外線發射率

與輻射衰減率σ等因子的全部或部分，來計算獲得，但不以此限定。 In one embodiment, the object heating parameters of the heat pipe 22

Can be based on infrared heater power

, infrared emissivity

All or part of factors such as the radiation attenuation rate σ can be obtained by calculation, but not limited thereto.

還可基於熱導管22的質量

、熱導管22的比熱容

與熱導管22的量測溫度

等因子的全部或部分，來計算獲得，但不以此限定。 In one embodiment, the object heating parameters of the heat pipe 22

can also be based on the mass of the heat pipe 22

, the specific heat capacity of the heat pipe 22

The measured temperature with the heat pipe 22

All or part of the equal factors are obtained by calculation, but not limited thereto.

。 Therefore, through the above relationship, the present invention can obtain infrared emissivity

.

--------------(式一)

---------------(式二) 其中，

為對熱導物件22的物件加熱參數；

為紅外線加熱器功率；

為紅外線發射率；σ為輻射衰減率；

為熱導物件22的質量；

為熱導物件22的比熱容；

為熱導物件22的量測溫度。 In one embodiment, the initialization module 38 can calculate the power of the infrared heater based on the following (Formula 1) and (Formula 2).

--------------(Formula 1)

---------------(Formula 2) Among them,

is the object heating parameter for the thermally conductive object 22;

is the infrared heater power;

is the infrared emissivity; σ is the radiation attenuation rate;

Be the quality of heat conduction object 22;

is the specific heat capacity of the thermally conductive object 22;

is the measured temperature of the thermally conductive object 22 .

Please refer to FIG. 11 , which is a graph showing the relationship between heating power and voltage according to an embodiment of the present invention. After calculating the power of the infrared heater, the initialization module 38 can calculate the corresponding heating input voltage as the heating parameter according to the specification of the infrared heating module 11 (as shown in FIG. 11 ). For example, when the power of the infrared heater is 10W, the heating input voltage is 7.5V.

Referring again to FIG. 5 , step S22 : the processor 100 calculates the detection time limit through the initialization module 38 . The aforementioned upper detection time limit can be used as part of the stop condition.

Specifically, the initialization module 38 obtains the set target temperature, and calculates the detection time limit based on the temperature difference between the target temperature and the ambient temperature, the object information of the heat pipe 22 , the object heating parameters, and the ambient convection parameters.

可基於熱導管22的質量

、熱導管22的比熱容

、目標溫度

、環境溫度

、對熱導管22的物件加熱參數

、熱導管22的單面面積

、環境對流係數

(一般介於20-40(

)之間)等因子的全部或部分，來計算獲得，但不以此限定。 In one embodiment, the detection time upper limit

may be based on the mass of the heat pipe 22

, the specific heat capacity of the heat pipe 22

, target temperature

, ambient temperature

, the object heating parameters of the heat pipe 22

, the single-sided area of the heat pipe 22

, Environmental convection coefficient

(Generally between 20-40(

) between) and other factors are obtained by calculation, but not limited thereto.

--------------(式三) 其中，

為檢測時間上限；

為熱導物件22的質量；

為熱導物件22的比熱容；

為目標溫度；

為環境溫度；

為對熱導物件22的物件加熱參數；

為熱導物件22的單面面積；

為環境對流係數，一般介於20-40(

)。 In one embodiment, the initialization module 38 can calculate the detection time limit based on the following (Formula 3).

--------------(Formula 3) Among them,

is the upper limit of detection time;

is the mass of the thermally conductive object 22;

is the specific heat capacity of the thermally conductive object 22;

is the target temperature;

is the ambient temperature;

is the object heating parameter for the thermally conductive object 22;

is the single-sided area of the thermally conductive object 22;

is the environmental convection coefficient, generally between 20-40 (

).

Step S23: The processor 100 calculates the stop slope through the initialization module 38 . The aforementioned stop slope is used as part of the stop condition.

Please refer to FIG. 12 , which is a graph showing the relationship between temperature slope and time according to an embodiment of the present invention.

Specifically, the initialization module 38 can simulate and calculate the time-temperature simulation change of the heat pipe 22 based on the temperature difference between the target temperature and the ambient temperature, the object information of the heat pipe to be tested, the object heating parameters, and the environmental convection parameters (as shown in FIG. 12 . shown), and set the stop slope based on this time-temperature analog change and the upper detection time limit. For example, a slope of 4 (corresponding to a time of 50 seconds) or a slope of 2.8 (corresponding to a time of 100 seconds) may be selected.

In one embodiment, the stop slope is greater than 1, that is, the detection ends before the temperature of the heat pipe 22 reaches a steady state.

In this way, the present invention can complete the initialization setting.

Please refer to FIG. 4 and FIG. 6 together. FIG. 6 is a partial flowchart of a non-contact detection method according to another embodiment of the present invention. Compared with the embodiment in FIG. 4 , step S15 in the embodiment in FIG. 6 further includes specific initialization steps S30 - S33 , wherein the execution sequence of steps S31 - S33 can be changed arbitrarily according to user requirements, or executed simultaneously.

Step S30: The processor 100 calculates the slope data of the obtained measured temperature data through the scoring module 33. The aforementioned slope data includes multiple slopes, and the multiple slopes correspond to the temperature changes of the heat pipe 22 in different time intervals during the heating process. degree.

Step S31 : The processor 100 calculates the heating score of the infrared heating module 11 in this test through the heating scoring module 34 based on multiple slopes of the slope data.

In one embodiment, the heating score module 34 can select all or part of multiple slopes of the slope data (such as a specified time interval), and calculate the average of the selected multiple slopes to obtain the aforementioned heating score.

In one embodiment, as shown in FIG. 8 , when measuring the temperature of multiple heat pipes 22 at the same time, the heating scoring module 34 can select the measurement position A2 directly behind (or closest to) the heating position A1 The aforementioned heating score is calculated based on the temperature measurement data, so that the heating score is closer to the heating performance of the infrared heating module 11 .

Step S32: The processor 100 calculates the convection score of the detection environment through the convection score module 36 .

Step S33 : The processor 100 calculates the conduction score of the heat pipe 22 through the conduction score module 35 .

In one embodiment, as shown in Figure 8, when multiple measurement locations A2, A3 are measured, multiple temperature measurement data of multiple measurement locations A2, A3 are obtained (such as starting to heat until the stop condition is satisfied, Two sets of temperature curves of measurement positions A2 and A3 during this period, or two sets of temperature curves of measurement positions A2 and A3 during this period from the specified period of starting heating (such as 3 seconds after starting heating) until the stop condition is met) At this time, the processor 100 first calculates the temperature difference data between multiple measured temperature data through the convection scoring module 36 and the conduction scoring module 35 (for example, subtracting two measured temperature data to obtain the measurement positions A2, A3 The temperature difference data between them), and then calculate the aforementioned convection score and conduction score based on the slope data and the temperature difference data.

In one embodiment, the convection scoring module 36 and the conduction scoring module 35 firstly divide the slope data by the temperature difference data to obtain characteristic data (such as convection characteristic data or conduction characteristic data), and then calculate the regression on the characteristic data (such as the minimum average method) to obtain an exponential decay formula (such as fitting the characteristic data to a set of curves to obtain the exponential decay formula of the curve), and determine the aforementioned convection score and the aforementioned conduction score based on the exponential decay formula.

Further, as shown in Figure 8, when there are multiple measurement positions A2 and A3, the above calculation is to select the slope data of the temperature measurement data of the measurement position A2 directly behind (or closest to) the heating position A1 to divide by The temperature difference data is used to obtain the characteristic data, but it is not limited thereto, and the temperature measurement data at a far measurement location A2 can also be used.

It is worth mentioning that the aforementioned exponential decay formula includes a base part and an exponent part, and the present invention determines the conduction score based on the base part, and determines the convection score based on the exponent part.

In this way, the present invention can determine different types of scoring.

The embodiment in FIG. 6 further includes steps S40-S45 for judging detection results based on scores, wherein the execution order of steps S40-S42 can be changed arbitrarily according to user requirements, or executed simultaneously.

Step S40: The processor 100 determines whether the heating score is lower than a preset heating score threshold through the heating score module 34.

If the heating score is worse than the heating score threshold, step S44 is executed: the processor 100 issues a warning through the man-machine interface 102 to remind the user that the heating state is not good.

If the heating score is better than the heating score threshold, it means that the heating state is good (eg, the heating power is stable), and step S41 is executed: the processor 100 determines whether the convection score is worse than the preset convection score threshold through the convection score module 36 .

If the convection score is worse than the convection score threshold, step S44 is executed: the processor 100 issues a warning through the man-machine interface 102 to remind the user that the environment state (especially the convection state) is not good.

After executing step S44, the processor 100 may then execute step S42 to continuously determine whether the conduction score is qualified, but not limited thereto.

In another embodiment, when the heating state or the environmental state is not good, the detected conductivity score may not correctly reflect whether the heat pipe 22 has good or bad conductivity. In this regard, the processor 100 may end the detection directly after executing step S4 without evaluating whether the heat pipe 22 is good or bad.

If the convection score is better than the convection score threshold, it means that the current environmental status is good, and step S42 is executed: the processor 100 judges whether the score (conduction score) of the heat pipe 22 is better than the score threshold through the scoring module 33 (conduction scoring module 35) (conduction scoring threshold) to determine whether the heat pipe 22 is a good product or a bad product (defective product).

If the conductivity score is lower than the conductivity score threshold, it means that the conductivity is not good, and step S43 is executed: the processor 100 determines that the heat pipe 22 is a defective product through the conduction scoring module 35 , and can further display a defective product notification through the man-machine interface 102 .

If the conductivity score is higher than the conductivity score threshold, it means that the conductivity is good, and step S45 is executed: the processor 100 determines that the heat pipe 22 is a good product through the conduction score module 35 , and can further display a good product notification through the man-machine interface 102 .

The present invention can effectively detect the conductivity of the heat pipe 22 and automatically generate detection results.

In addition, the present invention can detect the heating state and the environmental state at the same time, so as to avoid misjudgment of the detection result due to the bad heating state or the environmental state.

Please refer to FIGS. 4-7 together. FIG. 7 is a partial flowchart of a non-contact detection method according to another embodiment of the present invention. Compared with the embodiment in FIG. 4 , the embodiment in FIG. 7 further provides a scoring threshold calculation function, and the scoring threshold of the corresponding good product can be obtained by detecting the same type of good product. The method of this embodiment further includes the following steps.

Step S50: The user can perform multiple inspections on the non-contact testing device 1 for good heat pipes of the same type as the heat pipe 22 to be tested (by performing steps S10-S15 at least twice) to obtain multiple good product scores (by executing S30-S33), such as multiple heating good product scores, multiple convection good product scores and multiple conduction good product scores obtained from multiple inspections.

Step S51: The processor 100 obtains the above-mentioned multiple good product scores through the threshold calculation module 37, and sets a scoring threshold based on the multiple good product scores.

In one embodiment, the threshold calculation module 37 calculates the heating score threshold based on a plurality of heating good product scores, calculates the convection score threshold based on a plurality of convective good product scores, and calculates the conduction score threshold based on a plurality of conduction good product scores.

In one embodiment, the threshold calculation module 37 calculates the average value (such as weighted average or general average) of multiple good product scores, and moderately adjusts the average value.

For example, if the higher the score is, the better it is, the average value can be lowered by 20%, lowered by 10%, or the range of ±10% can be used as the scoring threshold.

In another example, if the lower the score is, the better it is, the average increase of 20%, the increase of 10%, or the range of ±15% can be used as the score threshold.

Thereby, the present invention can effectively set various types of scoring thresholds, which is beneficial for judging the usability of the detection results.

The above descriptions are only preferred specific examples of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent changes made by using the content of the present invention are all included in the scope of the present invention in the same way. Chen Ming.

1: Non-contact detection equipment

10: Control Module

11: Infrared heating module

12: Infrared temperature measurement module

10: Control Module

100: Processor

101: Communication device

102: Human-machine interface

103: storage device

11: Infrared heating module

110: heating element

12: Infrared temperature measurement module

120: Measuring element

121: Measuring element

20: Computing platform

21: Positioning fixture

210-212: Installation structure

213: base

22: heat pipe

30: heating control module

31: Measurement control module

32: stop monitoring module

33: Scoring Module

34: Heat Scoring Module

35: Conduction Scoring Module

36: Convection Scoring Mod

37: Threshold calculation module

38: Initialize the module

A1-A3, T1, T2, H: Position

L1, L2: Distance

D1-D3: Area

S10-S15: heating and detection steps

S20-S23: Initialization steps

S30-S33: Scoring Steps

S40-S45: Judgment steps

S50-S51: Threshold acquisition steps

FIG. 1 is a structural diagram of a non-contact detection device according to an embodiment of the present invention.

FIG. 2 is a structural diagram of a non-contact detection device according to another embodiment of the present invention.

FIG. 3 is a structural diagram of a processor according to another embodiment of the present invention.

FIG. 4 is a flowchart of a non-contact detection method according to an embodiment of the present invention.

FIG. 5 is a partial flowchart of a non-contact detection method according to another embodiment of the present invention.

FIG. 6 is a partial flowchart of a non-contact detection method according to another embodiment of the present invention.

FIG. 7 is a partial flowchart of a non-contact detection method according to another embodiment of the present invention.

FIG. 8 is a schematic diagram of a non-contact detection setup according to an embodiment of the present invention.

FIG. 9 is a schematic view of one side of the heat pipe according to an embodiment of the present invention.

FIG. 10 is a schematic view of the appearance of the other side of the heat pipe in FIG. 9 .

Fig. 11 is a graph showing the relationship between heating power and voltage according to an embodiment of the present invention.

FIG. 12 is a graph showing the relationship between temperature slope and time according to an embodiment of the present invention.

S10-S15: heating and detection steps

Claims (20)

A non-contact detection method for a heat pipe is applied to a non-contact detection device including an infrared heating module and an infrared temperature measurement module. The method includes the following steps: a) obtaining a heating parameter and an object information of a heat pipe to be tested; b) calculating a stop slope based on an infrared heating parameter of the infrared heating module and an object heating parameter of the heat pipe to be tested; c) controlling the infrared heating module to heat the heat pipe under test based on the heating parameter, and controlling the infrared temperature measurement module to measure a measured temperature data of the heat pipe under test; d) During the heating process, monitor a temperature slope of the measured temperature data; e) when a stop condition is detected to be satisfied, performing a scoring process based on the temperature slope to determine a score for detecting the heat pipe under test, wherein the stop condition includes the temperature slope converging to the stop slope; and f) When the score of the heat pipe under test is higher than a score threshold, it is determined that the heat pipe under test is a good product, and when the score is not better than the score threshold, it is determined that the heat pipe under test is a bad product. The method as described in claim 1, wherein the step a) comprises the following steps: g1) Obtain the heating parameters of the object based on the mass and specific heat capacity of the heat pipe to be tested; and g2) Obtain a heating input voltage of the infrared heating module as the heating parameter based on the object heating parameter and the infrared heating parameter. The method as claimed in item 1, wherein the stop condition includes that the accumulated heating time reaches an upper detection time limit; Wherein, the step c) further includes the following steps: h1) setting a target temperature based on user operations; and h2) Obtaining the detection time limit based on a temperature difference between the target temperature and the ambient temperature, the object information, the object heating parameter, and an ambient convection parameter. The method as described in claim 1, wherein the step b) comprises the following steps: i1) based on a temperature difference between a target temperature and ambient temperature, the object information, the object heating parameter, the infrared heating parameter and an ambient convection parameter simulation calculation of a time-temperature simulation change of the heat pipe under test; and i2) Set the stop slope based on the time-temperature analog change and the detection time upper limit, wherein the stop slope is greater than 1. The method described in claim 1 further includes the following steps before the step e): j1) Controlling the infrared heating module to heat a good heat pipe of the same type as the heat pipe to be tested based on the heating parameters, and controlling the infrared temperature measurement module to measure a measured temperature data of the good heat pipe ; j2) calculating a good score of the good heat pipe based on the measured temperature data of the good heat pipe; j3) Repeat steps j1), j2) at least twice to obtain multiple good product scores; and j4) Set the scoring threshold based on the multiple good product scores. The method as described in Claim 1, wherein the scoring process includes: k1) calculating a slope data of the measured temperature data; and k2) calculating a heating score based on multiple slopes of the slope data, wherein the multiple slopes correspond to different time intervals of the heating process; Wherein, the step e) includes a step l1) when the heating score is lower than a heating score threshold, issuing an alarm to indicate that the heating state is not good. The method as described in claim 1, wherein the step c) is to control the infrared temperature measurement module to measure a plurality of measurement positions of the heat pipe to be measured to obtain the plurality of measurement positions of the plurality of measurement positions Measure temperature data; Among them, the scoring process includes: m1) calculating a slope data of the measured temperature data; m2) calculating a temperature difference data between the plurality of measured temperature data; and m3) calculating a convection score and a conduction score based on the slope data and the temperature difference data; Wherein, the step e) comprises the following steps: n1) When the convection score is worse than the convection score threshold, a warning is issued to indicate that the environmental state is not good; n2) When the conduction score is better than a conduction score threshold, it is determined that the heat pipe under test is a good product; and n3) When the conduction score is worse than the conduction score threshold, it is determined that the heat pipe under test is inferior. The method as described in claim 7, wherein the step m3) is to divide the slope data by the temperature difference data to obtain a characteristic data, calculate a regression on the characteristic data to obtain an exponential decay formula, and determine based on the exponential decay formula The convection score and the conduction score. The method as described in claim 1, wherein the step c) is to control the infrared heating module to heat a heating position on one side of the heat pipe to be measured, and control the infrared temperature measurement module to heat the heat pipe to be measured. performing measurements at a plurality of measurement positions on the other side of the conduit to obtain the plurality of measurement temperature data at the plurality of measurement positions; Wherein, the heating position is located directly behind one of the measuring positions, the heating position and the plurality of measuring positions are coated with dark radiation paint, and the area of the dark radiation paint at the heating position is larger than that of the infrared heating mold The laser irradiation area of the group, the area of the dark radiation paint at each measurement position is larger than the measurement area of the infrared heating module. The method as described in claim 9, wherein the heat pipe to be tested is an ultra-thin vapor chamber (VC), and the step c) is to heat the heating position of the heat pipe to be tested so that the wall surface of the heat pipe The liquid below absorbs heat and turns into vapor and goes to other locations with low pressure, absorbs heat through contact with the walls of other locations, condenses back to liquid again, and then flows back to the heated location to form a thermal cycle. A non-contact detection device for heat pipes, comprising: an infrared heating module configured to heat a heat pipe under test based on a heating parameter; an infrared temperature measurement module configured to measure a measured temperature data of the heat pipe to be tested; and A control module, electrically connected to the infrared heating module and the infrared temperature measurement module, is configured to obtain a heating parameter and an object information of the heat pipe to be measured, and the control module is configured to obtain a heating parameter based on the infrared An infrared heating parameter of the heating module and an object heating parameter of the heat pipe to be tested calculate a stop slope, the control module is configured to monitor a temperature slope of the measured temperature data during the heating process, and in a When the stop condition is satisfied, a score of the heat pipe under test is determined based on the temperature slope, and the control module is configured to determine that the heat pipe under test is when the score of the heat pipe under test is higher than a score threshold. Good product, and when the score is not higher than the score threshold, it is determined that the heat pipe under test is a bad product, wherein the stop condition includes that the temperature slope converges to the stop slope. The non-contact detection device as described in claim 11, wherein the control module includes: an initialization module configured to obtain the object heating parameter based on the mass and specific heat capacity of the heat pipe to be tested, and based on the object heating parameter Obtaining a heating input voltage of the infrared heating module as the heating parameter with the infrared heating parameter, the initialization module is configured based on a temperature difference between a target temperature and ambient temperature, the object information, the object heating parameter and An environmental convection parameter simulation calculates a time-temperature simulation change of the heat pipe to be tested, and sets the stop slope based on the time-temperature simulation change and the detection time upper limit, wherein the stop slope is greater than 1. The non-contact detection device as described in claim 11, wherein the stop condition further includes that the accumulated heating time reaches an upper detection time limit; Among them, the control module includes: An initialization module is configured to set a target temperature based on user operations, and obtain a detection time limit based on a temperature difference between the target temperature and ambient temperature, the object information, the object heating parameter, and an ambient convection parameter. The non-contact detection device as described in claim 11, wherein the control module includes: a heating control module configured to control the infrared heating module for heating; a measurement control module configured to control the infrared temperature measurement module to perform temperature measurement; a stop monitoring module configured to monitor whether the stop condition is met; a scoring module configured to calculate the score and configured to compare the score to the scoring threshold; and a threshold calculation module configured to execute multiple times on a good heat pipe of the same type as the heat pipe under test through the heating control module, the measurement control module, the stop monitoring module and the scoring module A plurality of good product scores are obtained through heating inspection, and a scoring threshold is set based on the plurality of good product scores. The non-contact detection device as described in claim 11, wherein the control module includes: a heating score module configured to calculate a heating score based on a plurality of slopes of a slope data of the measured temperature data, and when the heating score is lower than a heating score threshold, an alarm is issued to indicate that the heating state is not good, Wherein the plurality of slopes respectively correspond to different time intervals of the heating process. The non-contact detection device as described in claim 11, wherein the infrared temperature measurement module includes a plurality of measurement elements, and the plurality of measurement elements are used to measure the plurality of measurement positions of the heat pipe to be measured Obtain the plurality of measured temperature data of the plurality of measurement positions by measuring; Among them, the control module includes: a conductance scoring module configured to calculate a conductance score based on a slope data of the measured temperature data and a temperature difference data among the plurality of measured temperature data, when the conductance score is better than a conductance score threshold, Determining that the heat pipe under test is a good product, and when the conduction score is lower than the conduction score threshold, determining that the heat pipe under test is a bad product; and The convection score module is configured to calculate the convection score based on the slope data and the temperature difference data, and when the convection score is worse than the convection score threshold, an alarm is issued to indicate that the environmental state is not good. The non-contact detection equipment as described in claim 11 further includes a positioning fixture, and the positioning fixture includes: A first mounting structure for installing the infrared heating module so that the infrared heating module heats a heating position on one side of the heat pipe to be tested; A second installation structure is used to install the infrared temperature measurement module, so that the multiple measurement elements of the infrared temperature measurement module measure the multiple measurement positions on the other side of the heat pipe to be measured test; and A third installation structure, arranged between the first installation structure and the second installation structure, for fixing the heat pipe to be tested; Wherein, the infrared heating module installed in the first installation structure and the infrared temperature measurement module installed in the second installation structure are respectively facing the heat pipe to be measured placed in the third installation structure. Different sides. The non-contact detection device as described in claim 17, wherein the heating position is located directly behind one of the measuring positions, and at least one of the measuring positions is away from the directly behind the heating position; Wherein, the heat pipe to be tested is coated with dark radiation paint on the heating position and the plurality of measurement positions, and the area of the dark radiation paint on the heating position is larger than the laser irradiation area of the infrared heating module, each The area of the dark radiant paint at the measuring position is larger than the measuring area of the infrared heating module. The non-contact detection device as claimed in claim 17, wherein there is a first distance between the infrared heating module installed in the first installation structure and the heat pipe to be tested placed in the third installation structure It is adjusted based on the focal length of a lens of the infrared heating module; Wherein, a second distance between the infrared temperature measurement module installed in the second installation structure and the heat pipe to be measured placed in the third installation structure is based on the infrared temperature measurement module A preset measuring distance is adjusted. The non-contact detection device as described in claim 11, wherein the heat pipe to be tested is an ultra-thin vapor chamber (VC), and the infrared heating module is used to heat the heating position of the heat pipe to be tested, So that the liquid under the wall of the heating position absorbs heat and turns into vapor and goes to other positions with low pressure, absorbs heat through contact with the wall of other positions, condenses back to liquid again, and then flows back to the heating position to form a heat cycle.

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