CN111858206B - Temperature control method, device, equipment and storage medium of memory chip - Google Patents
Temperature control method, device, equipment and storage medium of memory chip Download PDFInfo
- Publication number
- CN111858206B CN111858206B CN202010614720.2A CN202010614720A CN111858206B CN 111858206 B CN111858206 B CN 111858206B CN 202010614720 A CN202010614720 A CN 202010614720A CN 111858206 B CN111858206 B CN 111858206B
- Authority
- CN
- China
- Prior art keywords
- temperature
- target
- current
- memory chip
- target test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000012360 testing method Methods 0.000 claims abstract description 189
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 58
- 238000013507 mapping Methods 0.000 claims abstract description 57
- 238000004590 computer program Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 description 11
- 238000001816 cooling Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000001960 triggered effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/2205—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
Abstract
The application discloses a temperature control method, a device, equipment and a computer readable storage medium of a memory chip, wherein the method comprises the following steps: determining a first standard temperature inside an aluminum shell when a first current temperature of a target memory chip reaches a corresponding test temperature, and setting a mapping relation between the test temperature and the first standard temperature; then, acquiring a target test temperature and a first current temperature of a target memory chip, and determining the magnitude relation between the first current temperature and the target test temperature; and adjusting a second current temperature inside the aluminum shell according to the size relationship and a target mapping relationship corresponding to the target test temperature, so that the first current temperature is equal to the target test temperature. Therefore, the method can enable the first current temperature of the target memory chip to reach the target test temperature more accurately, and therefore the accuracy of temperature control over the target memory chip is improved.
Description
Technical Field
The present invention relates to the field of chip testing, and in particular, to a method, an apparatus, a device, and a computer readable storage medium for controlling a temperature of a memory chip.
Background
When testing the characteristics of the memory chip, the memory chip needs to be tested in a variable temperature environment to test the operation conditions of the memory chip in various different environments. In order to make the temperature of the whole memory chip uniform, the temperature of the memory chip is generally controlled by the memory chip temperature control device shown in fig. 1 in the prior art. During testing, fixing a target memory chip in a Socket of a control board, and in order to ensure that the target memory chip is uniformly heated, the Socket is in a full wrapping type, completely wrapping the target memory chip in the Socket, and then covering an aluminum shell on the Socket; the first temperature sensor is fixed in the aluminum shell and plays a role in measuring the temperature in the aluminum shell; the heating sheet is arranged in the aluminum shell, is not in contact with the Socket and serves as a heating source; the heat dissipation fan is fixed outside the aluminum shell to play a role in heat dissipation; the heating plate and the cooling fan are both electrically connected with the PID controller, the PID controller controls the heating plate and the cooling fan to operate, the heating plate heats air inside the aluminum shell, and heat is conducted to the target memory chip through the Socket, so that the whole target memory chip is uniformly heated, and the purpose of controlling the temperature of the target memory chip is achieved.
However, since the target memory chip is wrapped inside the Socket, the temperature of the target memory chip has a certain temperature difference compared with the actual temperature of the air inside the aluminum housing, and the value of the temperature difference is different according to the material of the Socket. That is, when the PID controller is used to heat the temperature inside the aluminum case to the target test temperature in the prior art, the temperature of the target memory chip may not be equal to the target test temperature in practice, and thus the characteristic test of the target memory chip cannot be accurately performed.
Therefore, how to improve the accuracy of temperature control of the target memory chip is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method for controlling a temperature of a memory chip, which can improve the accuracy of controlling the temperature of the memory chip; another object of the present invention is to provide a temperature control apparatus, device and computer readable storage medium for memory chips, all having the above-mentioned advantages.
In order to solve the above technical problem, the present invention provides a method for controlling a temperature of a memory chip, including:
determining a first standard temperature inside an aluminum shell when a first current temperature of a target memory chip reaches a corresponding test temperature, and setting a mapping relation between the test temperature and the first standard temperature;
acquiring a target test temperature and the first current temperature of a target memory chip, and determining the magnitude relation between the first current temperature and the target test temperature;
and adjusting a second current temperature inside the aluminum shell according to the size relationship and a target mapping relationship corresponding to the target test temperature, so that the first current temperature is equal to the target test temperature.
Preferably, the adjusting a second current temperature inside the aluminum housing according to the size relationship and a target mapping relationship corresponding to the target test temperature so that the first current temperature is equal to the target test temperature specifically includes:
if the first current temperature is lower than the target test temperature, determining a target first standard temperature corresponding to the target test temperature according to the mapping relation, and controlling the second current temperature inside the aluminum shell to reach the target first standard temperature so as to enable the first current temperature to be equal to the target test temperature;
and if the first current temperature is higher than the target test temperature, controlling the first current temperature to be reduced to be lower than the target test temperature, determining a target first standard temperature corresponding to the target test temperature according to the mapping relation, and controlling the second current temperature inside the aluminum shell to reach the target first standard temperature so as to enable the first current temperature to be equal to the target test temperature.
Preferably, if the first current temperature is higher than the target test temperature, the process of controlling the first current temperature to be lower than the target test temperature specifically includes:
and if the first current temperature is higher than the target test temperature, controlling the first current temperature to be lower than the target test temperature to a preset degree.
Preferably, further comprising:
acquiring the first current temperature and the corresponding target test temperature of the target memory chip according to a preset time period, and calculating the real-time temperature difference between the first current temperature and the target test temperature;
judging whether the real-time temperature difference is smaller than a preset temperature control error or not;
and if not, adjusting the second current temperature according to the real-time temperature difference.
Preferably, after the obtaining the first current temperature of the target memory chip and the corresponding target test temperature according to the preset time period and calculating a real-time temperature difference between the first current temperature and the target test temperature, the method further includes:
displaying the first current temperature and the real-time temperature difference.
Preferably, after the obtaining the first current temperature of the target memory chip and the corresponding target test temperature according to the preset time period and calculating a real-time temperature difference between the first current temperature and the target test temperature, the method further includes:
and sending first prompt information when the first current temperature of the target memory chip exceeds a preset temperature threshold.
Preferably, after the adjusting the second current temperature inside the aluminum housing according to the magnitude relation so that the first current temperature is equal to the target test temperature, further comprising:
and sending out first prompt information.
In order to solve the above technical problem, the present invention further provides a temperature control device for a memory chip, including:
the device comprises a mapping relation determining module, a temperature measuring module and a temperature measuring module, wherein the mapping relation determining module is used for determining a first standard temperature in an aluminum shell when a first current temperature of a target memory chip reaches a corresponding test temperature, and setting a mapping relation between the test temperature and the first standard temperature;
the temperature comparison module is used for acquiring a target test temperature and the first current temperature of a target memory chip and determining the magnitude relation between the first current temperature and the target test temperature;
and the temperature adjusting module is used for adjusting a second current temperature inside the aluminum shell according to the size relationship and a target mapping relationship corresponding to the target test temperature so as to enable the first current temperature to be equal to the target test temperature.
In order to solve the above technical problem, the present invention further provides a temperature control device for a memory chip, including:
a memory for storing a computer program;
and the processor is used for realizing the steps of any one of the above temperature control methods of the memory chip when executing the computer program.
In order to solve the above technical problem, the present invention further provides a computer-readable storage medium, where a computer program is stored, and the computer program, when executed by a processor, implements the steps of any one of the above methods for controlling the temperature of a memory chip.
The invention provides a temperature control method of a memory chip, which comprises the steps of firstly determining a first standard temperature in an aluminum shell when a first current temperature of a target memory chip reaches a corresponding test temperature, and setting a mapping relation between the test temperature and the first standard temperature; then, acquiring a target test temperature and a first current temperature of a target memory chip, and determining the magnitude relation between the first current temperature and the target test temperature; and adjusting a second current temperature inside the aluminum shell according to the size relationship and a target mapping relationship corresponding to the target test temperature, so that the first current temperature is equal to the target test temperature. Therefore, the method considers the problem of temperature difference between the target memory chip and the inside of the aluminum shell, the first standard temperature inside the aluminum shell when the first current temperature of the target memory chip reaches the corresponding test temperature is predetermined, the mapping relation between the test temperature and the first standard temperature is set, and the second current temperature inside the aluminum shell is adjusted according to the magnitude relation and the mapping relation between the first current temperature and the target test temperature, so that the first current temperature of the target memory chip can more accurately reach the target test temperature, and the accuracy of temperature control over the target memory chip is improved.
In order to solve the technical problems, the invention also provides a temperature control device, equipment and a computer readable storage medium of the memory chip, which have the beneficial effects.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a prior art memory chip temperature control device;
fig. 2 is a flowchart of a temperature control method of a memory chip according to an embodiment of the present invention;
fig. 3 is a flowchart of setting a mapping relationship according to an embodiment of the present invention;
fig. 4 is a flowchart of another method for controlling the temperature of a memory chip according to an embodiment of the present invention;
fig. 5 is a structural diagram of a temperature control apparatus for a memory chip according to an embodiment of the present invention;
fig. 6 is a structural diagram of a temperature control device of a memory chip according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The core of the embodiment of the invention is to provide a temperature control method of a memory chip, which can improve the accuracy of temperature control of the memory chip; another core of the present invention is to provide a temperature control device, a device and a computer readable storage medium for a memory chip, all having the above-mentioned advantages.
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 2 is a flowchart of a method for controlling a temperature of a memory chip according to an embodiment of the present invention. As shown in fig. 2, a method for controlling the temperature of a memory chip includes:
s10: and determining a first standard temperature inside the aluminum shell when the first current temperature of the target memory chip reaches the corresponding test temperature, and setting a mapping relation between the test temperature and the first standard temperature.
Specifically, since there is a temperature difference between the temperature of the target memory chip and the temperature inside the aluminum housing, in this embodiment, first, when the first current temperature of the target memory chip reaches the corresponding test temperature, the first standard temperature inside the aluminum housing is determined, and a mapping relationship between the test temperature and the first standard temperature is set.
In this embodiment, the target memory chip may be Nand Flash, and the embodiment does not limit the specific type of the target memory chip. Fig. 3 is a flowchart of setting a mapping relationship according to an embodiment of the present invention. In practice, a plurality of test temperatures are typically set, such as T1, T2, T3, \8230;, ti, \8230;, tn (temperature going from low to high), and a temperature control error Terr is set. Reading a test temperature Ti of which the mapping relation needs to be set currently, sending the test temperature Ti to a PID controller, setting a control temperature Ts (Ts = Ti) of the PID controller according to the test temperature Ti, controlling a heating sheet to operate according to the control temperature Ts by the PID controller, heating air inside an aluminum shell, enabling the temperature inside the aluminum shell to reach the control temperature Ts, waiting for the temperature to be stable, acquiring a first current temperature Tp collected by a temperature sensor arranged inside a target memory chip, and judging.
If abs (Tp-Ti) = Terr, the control temperature Ts is a temperature which can enable the first current temperature of the target memory chip to reach the corresponding test temperature, and the control temperature Ts is a first standard temperature inside the aluminum shell; and setting a mapping relation between the test temperature and the first standard temperature, and recording a mapping relation Ti-Ts to temperature mapping table corresponding to the test temperature.
If abs (Tp-Ti) > Terr, adjusting the control temperature Ts = Ts +/-Terr of the PID controller, controlling the heating sheet to operate by the PID controller by using the adjusted control temperature Ts, waiting for the temperature to be stable, acquiring a first current temperature Tp acquired by a temperature sensor arranged in a target memory chip, and judging; the process is circulated until the error between the first current temperature Tp of the target memory chip and the test temperature Ti is within the temperature control error Terr, namely abs (Tp-Ti) < = Terr, and then a mapping relation Ti-Ts to temperature mapping table corresponding to the test temperature is recorded; and then setting the mapping relation of the next testing temperature until the mapping relation corresponding to all the testing temperatures is set.
S20: acquiring a target test temperature and a first current temperature of a target memory chip, and determining the magnitude relation between the first current temperature and the target test temperature;
s30: and adjusting a second current temperature inside the aluminum shell according to the size relationship and a target mapping relationship corresponding to the target test temperature, so that the first current temperature is equal to the target test temperature.
Specifically, after the corresponding mapping relationships are set for all the test temperatures, the temperature of the target memory chip can be controlled according to the target test temperature. Firstly, a target test temperature is obtained, wherein the target test temperature is one of test temperatures with preset mapping relations. Then, a first current temperature of the target memory chip is obtained, and the magnitude relation between the first current temperature and the target test temperature is compared.
It can be understood that if the first current temperature is lower than the target test temperature, determining a corresponding target mapping relationship according to the target test temperature, where the target mapping relationship includes a target first standard temperature corresponding to the target test temperature, and then heating by controlling the heating sheet to raise the second current temperature inside the aluminum housing to the target first standard temperature, so as to raise the first current temperature of the target memory chip to be equal to the target test temperature; if the first current temperature is higher than the target test temperature, determining a corresponding target mapping relation according to the target test temperature, wherein the target mapping relation comprises a target first standard temperature corresponding to the target test temperature, and then controlling the cooling fan to operate to reduce the second current temperature inside the aluminum shell to the target first standard temperature, so that the first current temperature of the target memory chip is reduced to be equal to the target test temperature.
It should be noted that the relationship that "the first current temperature is equal to the target test temperature" in the present embodiment means that the first current temperature is within the error range of the target test temperature, and is not limited to that the first current temperature and the target test temperature are completely equal.
The temperature control method of the memory chip provided by the embodiment of the invention comprises the steps of firstly determining a first standard temperature in an aluminum shell when a first current temperature of a target memory chip reaches a corresponding test temperature, and setting a mapping relation between the test temperature and the first standard temperature; then, acquiring a target test temperature and a first current temperature of a target memory chip, and determining the magnitude relation between the first current temperature and the target test temperature; and adjusting a second current temperature inside the aluminum shell according to the size relationship and a target mapping relationship corresponding to the target test temperature, so that the first current temperature is equal to the target test temperature. Therefore, the method considers the problem of temperature difference between the target memory chip and the inside of the aluminum shell, the first standard temperature inside the aluminum shell when the first current temperature of the target memory chip reaches the corresponding test temperature is predetermined, the mapping relation between the test temperature and the first standard temperature is set, and the second current temperature inside the aluminum shell is adjusted according to the magnitude relation and the mapping relation between the first current temperature and the target test temperature, so that the first current temperature of the target memory chip can more accurately reach the target test temperature, and the accuracy of temperature control over the target memory chip is improved.
Fig. 4 is a flowchart of another method for controlling the temperature of a memory chip according to an embodiment of the present invention. Based on the foregoing embodiment, this embodiment further describes and optimizes the technical solution, and specifically, in this embodiment, a process of adjusting a second current temperature inside the aluminum housing according to the size relationship and a target mapping relationship corresponding to the target test temperature so that the first current temperature is equal to the target test temperature specifically includes:
if the first current temperature is lower than the target test temperature, determining a target first standard temperature corresponding to the target test temperature according to the mapping relation, and controlling a second current temperature inside the aluminum shell to reach the target first standard temperature so as to enable the first current temperature to be equal to the target test temperature;
and if the first current temperature is higher than the target test temperature, controlling the first current temperature to be reduced to be lower than the target test temperature, determining a target first standard temperature corresponding to the target test temperature according to the mapping relation, and controlling a second current temperature inside the aluminum shell to reach the target first standard temperature so as to enable the first current temperature to be equal to the target test temperature.
Specifically, in this embodiment, if the first current temperature is lower than the target test temperature, the corresponding target mapping relationship is determined according to the target test temperature, where the target mapping relationship includes a target first standard temperature corresponding to the target test temperature, and then the heating sheet is controlled to heat the aluminum housing, so that the second current temperature inside the aluminum housing is raised to the target first standard temperature, and the first current temperature is raised to be equal to the target test temperature.
If the first current temperature is higher than the target test temperature, the PID controller is used for controlling the operation of the cooling fan, so that the first current temperature of the target memory chip is reduced to be lower than the target test temperature, namely the first current temperature is lower than the target test temperature at the moment, and then a corresponding method is called when the first current temperature is lower than the target test temperature, namely a target first standard temperature corresponding to the target test temperature is determined according to the mapping relation, and the second current temperature inside the aluminum shell is controlled to reach the target first standard temperature, so that the first current temperature is equal to the target test temperature.
It can be seen that, in this embodiment, when the first current temperature is higher than the target test temperature, the first current temperature is first reduced to be lower than the target test temperature, and then the first current temperature is increased to be equal to the target test temperature.
As a preferred implementation manner, in this embodiment, if the first current temperature is higher than the target test temperature, the process of controlling the first current temperature to be lower than the target test temperature specifically includes:
and if the first current temperature is higher than the target test temperature, controlling the first current temperature to be lower than the target test temperature to a preset degree.
Specifically, in actual operation, the heat dissipation fan is controlled to dissipate heat of the aluminum housing, so that the temperature inside the aluminum housing is reduced, and the first current temperature in the target memory chip is reduced.
In this embodiment, if the target test temperature Ti is less than the first current temperature Tp, the control temperature Ts of the PID controller is first set to (Ti-2), the cooling fan is turned on, the temperature inside the aluminum case and the target memory chip is decreased, after the first current temperature Tp of the target memory chip is less than (the target test temperature Ti-2), the cooling fan is turned off, the target first standard temperature corresponding to the target test temperature is found according to the preset mapping relationship, and the target first standard temperature is sent to the PID controller, so that the PID controller controls the temperature inside the aluminum case to be increased to the target first standard temperature, and at this time, the first current temperature of the target memory chip reaches the corresponding target test temperature, and the setting process is completed. It should be noted that, in this embodiment, the preset degree is preferably set to be 2, and in other embodiments, other preset degrees may also be used, which is not limited in this embodiment.
It can be seen that, in this embodiment, the first current temperature of the target memory chip is further reduced to be lower than the preset degree lower than the target test temperature, the preset degree can facilitate temperature rise control, and then the first current temperature reaches the target test temperature by controlling the second current temperature to rise, so that the temperature control on the target memory chip is more accurate.
On the basis of the above embodiment, the embodiment further describes and optimizes the technical solution, and specifically, the embodiment further includes:
acquiring a first current temperature of a target memory chip and a corresponding target test temperature according to a preset time period, and calculating a real-time temperature difference between the first current temperature and the target test temperature;
judging whether the real-time temperature difference is smaller than a preset temperature control error or not;
if not, adjusting the second current temperature according to the real-time temperature difference.
Specifically, in this embodiment, first, a first current temperature of a target memory chip and a corresponding target test temperature are obtained according to a preset time period, and a real-time temperature difference between the first current temperature and the target test temperature is calculated; the preset time period is determined according to actual requirements, and the preset time period is not limited by the embodiment; by setting a preset time period, the control program regularly obtains a first current temperature of the target memory chip and a corresponding target test temperature.
Specifically, after the real-time temperature difference is calculated, whether the real-time temperature difference is smaller than a preset temperature control error Terr is judged; specifically, if abs (Tp-Ti) is less than or equal to Terr, the real-time temperature difference is within the temperature control error Terr, and no operation is performed; if abs (Tp-Ti) > Terr, adjusting the control temperature of the PID controller to Ts = Ts +/-Terr, and then waiting for the next time period to obtain the first current temperature of the target memory chip, namely waiting for the arrival of the next temperature self-adjusting time.
Therefore, in the embodiment, after the temperature of the target memory chip is adjusted and controlled, the temperature of the target memory chip is further monitored and dynamically self-adjusted, so that errors in mapping relationships under different external environments can be avoided, and the accuracy of temperature control is further ensured.
On the basis of the foregoing embodiment, this embodiment further describes and optimizes the technical solution, and specifically, after acquiring the first current temperature of the target memory chip and the corresponding target test temperature according to a preset time period and calculating a real-time temperature difference between the first current temperature and the target test temperature, the embodiment further includes:
and displaying the first current temperature and the real-time temperature difference.
Specifically, in this embodiment, after a first current temperature of the target memory chip and a corresponding target test temperature are obtained according to a preset time period and a real-time temperature difference between the first current temperature and the target test temperature is calculated, a preset display device is used to display the currently obtained first current temperature and the calculated corresponding real-time temperature difference. In this embodiment, a specific form of displaying the first current temperature and the real-time temperature difference is not limited, and in actual operation, the obtaining time corresponding to the first current temperature may be further obtained and correspondingly displayed. In addition, in the present embodiment, the specific type of the display device is not limited, and may be, for example, a liquid crystal display or a touch panel.
It is thus clear that this embodiment is through further showing first current temperature and real-time temperature difference, consequently can be convenient for the user more directly perceivedly look over current first current temperature and real-time temperature difference, knows the temperature condition of target memory chip to further promote user's use and experience.
On the basis of the foregoing embodiment, this embodiment further describes and optimizes the technical solution, and specifically, after acquiring the first current temperature of the target memory chip and the corresponding target test temperature according to the preset time period and calculating a real-time temperature difference between the first current temperature and the target test temperature, this embodiment further includes:
and sending first prompt information when the first current temperature of the target memory chip exceeds a preset temperature threshold value.
Specifically, in this embodiment, a preset temperature threshold is further set, where the preset temperature threshold refers to a critical value of the highest temperature of the target memory chip, after the first current temperature of the target memory chip is obtained according to a preset time period, the first current temperature is compared with the preset temperature threshold, and if the first current temperature exceeds the preset temperature threshold, it indicates that the temperature of the current target memory chip is too high, and other abnormalities may be caused, so that the preset first prompting device is triggered to send out corresponding first prompting information.
It should be noted that the first prompting device may specifically be a buzzer, an indicator light and/or a display, and the buzzer, the indicator light, the display and the like are triggered to send corresponding first prompting information, such as a buzzer sound, a flashing light, a display text or an image and the like, to intuitively prompt a user about a current temperature control condition of the target memory chip, so that the use experience of the user can be further improved.
Based on the foregoing embodiment, the present embodiment further describes and optimizes the technical solution, and specifically, after adjusting the second current temperature inside the aluminum housing according to the size relationship so that the first current temperature is equal to the target test temperature, the present embodiment further includes:
and sending out second prompt information.
Specifically, in this embodiment, after detecting that the second current temperature inside the aluminum housing is adjusted according to the size relationship and making the first current temperature equal to the target test temperature, that is, when the current temperature of the target memory chip is required to reach the target test temperature, the preset second prompting device is triggered to send out the corresponding second prompting information. It is understood that, in this embodiment, the second prompting device may be the same as the first prompting device in the previous embodiment or a same group of devices, and the second prompting message is generally different from the first prompting message to prompt different situations.
It can be seen that, in this embodiment, the corresponding second prompt information is further sent to the condition that the temperature control on the target memory chip is completed, so that the user can perform the characteristic test on the target memory chip after the temperature adjustment in time, and the use experience of the user is further improved.
Fig. 5 is a structural diagram of a temperature control device of a memory chip according to an embodiment of the present invention, and as shown in fig. 5, the temperature control device of the memory chip includes:
a mapping relation determining module 51, configured to determine a first standard temperature inside the aluminum housing when a first current temperature of the target memory chip reaches a corresponding test temperature, and set a mapping relation between the test temperature and the first standard temperature;
the temperature comparison module 52 is configured to obtain a target test temperature and a first current temperature of the target memory chip, and determine a magnitude relationship between the first current temperature and the target test temperature;
and the temperature adjusting module 53 is configured to adjust a second current temperature inside the aluminum housing according to the size relationship and a target mapping relationship corresponding to the target test temperature, so that the first current temperature is equal to the target test temperature.
The temperature control device of the memory chip provided by the embodiment of the invention has the beneficial effects of the temperature control method of the memory chip.
Fig. 6 is a structural diagram of a temperature control device of a memory chip according to an embodiment of the present invention, and as shown in fig. 6, the temperature control device of the memory chip includes:
a memory 61 for storing a computer program;
the processor 62 is configured to implement the steps of the temperature control method of the memory chip as described above when executing the computer program.
The temperature control device of the memory chip provided by the embodiment of the invention has the beneficial effects of the temperature control method of the memory chip.
In order to solve the above technical problem, the present invention further provides a computer-readable storage medium, on which a computer program is stored, and the computer program, when executed by a processor, implements the steps of the temperature control method of the memory chip.
The computer-readable storage medium provided by the embodiment of the invention has the beneficial effects of the temperature control method of the memory chip.
The method, apparatus, device and computer readable storage medium for controlling the temperature of the memory chip provided by the present invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are set forth only to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
Claims (9)
1. A method for controlling the temperature of a memory chip is characterized by comprising the following steps:
determining a first standard temperature inside an aluminum shell when a first current temperature of a target memory chip reaches a corresponding test temperature, and setting a mapping relation between the test temperature and the first standard temperature;
acquiring a target test temperature and the first current temperature of a target memory chip, and determining the magnitude relation between the first current temperature and the target test temperature;
if the first current temperature is lower than the target test temperature, determining a target first standard temperature corresponding to the target test temperature according to the mapping relation, and controlling a second current temperature inside the aluminum shell to reach the target first standard temperature so as to enable the first current temperature to be equal to the target test temperature;
and if the first current temperature is higher than the target test temperature, controlling the first current temperature to be reduced to be lower than the target test temperature, determining a target first standard temperature corresponding to the target test temperature according to the mapping relation, and controlling the second current temperature inside the aluminum shell to reach the target first standard temperature so as to enable the first current temperature to be equal to the target test temperature.
2. The method of claim 1, wherein if the first current temperature is higher than the target test temperature, controlling the process of lowering the first current temperature to be lower than the target test temperature comprises:
and if the first current temperature is higher than the target test temperature, controlling the first current temperature to be lower than the target test temperature to a preset degree.
3. The method of claim 1, further comprising:
acquiring the first current temperature and the corresponding target test temperature of the target memory chip according to a preset time period, and calculating the real-time temperature difference between the first current temperature and the target test temperature;
judging whether the real-time temperature difference is smaller than a preset temperature control error or not;
and if not, adjusting the second current temperature according to the real-time temperature difference.
4. The method of claim 3, wherein after the obtaining the first current temperature and the corresponding target test temperature of the target memory chip according to the preset time period and calculating a real-time temperature difference between the first current temperature and the target test temperature, further comprising:
displaying the first current temperature and the real-time temperature difference.
5. The method of claim 3, wherein after the obtaining the first current temperature and the corresponding target test temperature of the target memory chip according to the preset time period and calculating a real-time temperature difference between the first current temperature and the target test temperature, further comprising:
and sending first prompt information when the first current temperature of the target memory chip exceeds a preset temperature threshold.
6. The method of any of claims 1 to 5, further comprising, after adjusting a second current temperature inside the aluminum enclosure according to the magnitude relationship and a target mapping corresponding to the target test temperature such that the first current temperature is equal to the target test temperature:
and sending out first prompt information.
7. A temperature control device for a memory chip, comprising:
the mapping relation determining module is used for determining a first standard temperature in the aluminum shell when a first current temperature of a target memory chip reaches a corresponding test temperature, and setting a mapping relation between the test temperature and the first standard temperature;
the temperature comparison module is used for acquiring a target test temperature and the first current temperature of a target memory chip and determining the magnitude relation between the first current temperature and the target test temperature;
the first temperature adjusting module is used for determining a target first standard temperature corresponding to the target test temperature according to the mapping relation if the first current temperature is lower than the target test temperature, and controlling a second current temperature inside the aluminum shell to reach the target first standard temperature so as to enable the first current temperature to be equal to the target test temperature;
and a second temperature adjusting module, configured to control the first current temperature to be lower than the target test temperature if the first current temperature is higher than the target test temperature, determine a target first standard temperature corresponding to the target test temperature according to the mapping relationship, and control the second current temperature inside the aluminum housing to reach the target first standard temperature, so that the first current temperature is equal to the target test temperature.
8. A temperature control apparatus of a memory chip, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the method of controlling the temperature of a memory chip according to any one of claims 1 to 6 when executing the computer program.
9. A computer-readable storage medium, having stored thereon a computer program which, when being executed by a processor, carries out the steps of the method for temperature control of a memory chip according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010614720.2A CN111858206B (en) | 2020-06-30 | 2020-06-30 | Temperature control method, device, equipment and storage medium of memory chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010614720.2A CN111858206B (en) | 2020-06-30 | 2020-06-30 | Temperature control method, device, equipment and storage medium of memory chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111858206A CN111858206A (en) | 2020-10-30 |
| CN111858206B true CN111858206B (en) | 2023-01-10 |
Family
ID=72988835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010614720.2A Active CN111858206B (en) | 2020-06-30 | 2020-06-30 | Temperature control method, device, equipment and storage medium of memory chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111858206B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112485645A (en) * | 2020-11-30 | 2021-03-12 | 海光信息技术股份有限公司 | Chip test temperature control method, control system, temperature control board card and test system |
| CN114816005A (en) * | 2021-01-19 | 2022-07-29 | 深圳市万普拉斯科技有限公司 | Terminal control method and device, computer equipment and storage medium |
| CN117686888A (en) * | 2024-01-24 | 2024-03-12 | 苏州贝克微电子股份有限公司 | Three-temperature test method, device, equipment and medium for semiconductor chip |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110716592A (en) * | 2019-10-12 | 2020-01-21 | Oppo广东移动通信有限公司 | Temperature control method and related equipment |
| CN111274079A (en) * | 2020-03-27 | 2020-06-12 | 东莞记忆存储科技有限公司 | Memory module testing temperature control device, control method, computer equipment and storage medium |
-
2020
- 2020-06-30 CN CN202010614720.2A patent/CN111858206B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110716592A (en) * | 2019-10-12 | 2020-01-21 | Oppo广东移动通信有限公司 | Temperature control method and related equipment |
| CN111274079A (en) * | 2020-03-27 | 2020-06-12 | 东莞记忆存储科技有限公司 | Memory module testing temperature control device, control method, computer equipment and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111858206A (en) | 2020-10-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111858206B (en) | Temperature control method, device, equipment and storage medium of memory chip | |
| EP3324164B1 (en) | Compensating a sensor signal | |
| KR20140131882A (en) | Portable electronic device | |
| CN103868610A (en) | Temperature correction method, device and equipment | |
| US9829393B2 (en) | Method for determining the ambient temperature of a mobile device | |
| CN110687942B (en) | Temperature compensation method for carbon fiber controller | |
| CN103234647A (en) | Temperature correction method and temperature correction system of embedded system | |
| JP2011002372A (en) | Device and method for testing conduction deterioration | |
| JP2018080920A (en) | Temperature measurement device, inspection device, and method for control | |
| US9927308B1 (en) | Temperature sensor calibration of an entire wafer in a liquid bath | |
| CN111829692B (en) | Blower parameter calibration device | |
| CN218974520U (en) | Aging device | |
| CN110926401A (en) | Method and device for calibrating oscillating angle of galvanometer, projection system and storage medium | |
| JP2016109518A (en) | Temperature measurement device and temperature measurement method | |
| JP6965013B2 (en) | Measurement data processor and measurement system | |
| CN114038372B (en) | Gamma adjustment method, related device and storage medium | |
| JP2017181245A (en) | Heat insulating performance checkup device | |
| JP2010066119A (en) | Power regulator | |
| CN115468671A (en) | Method, device, equipment and medium for estimating chip junction temperature of power semiconductor device | |
| CN112113612A (en) | Inductive film temperature-sensing detection device and temperature-sensing detection method using same | |
| TWI792273B (en) | Non-contact detection apparatus for thermal conductive pipes and method thereof | |
| JP2008008677A (en) | Method of measuring temperature of electric element and load testing system | |
| CN215066431U (en) | Temperature and humidity detection device and air detector | |
| KR20110026563A (en) | The apparatus for controlling supply voltage of memory module and method therefor | |
| CN213022329U (en) | Radiating component detection circuit and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |