JP2016109518A - Temperature measurement device and temperature measurement method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a noninvasive and highly accurate internal temperature measurement technique that has a simple structure and is hardly affected by fluctuations in the thermal resistance of a measurement object, etc.SOLUTION: A temperature measurement device includes a first temperature sensor 61 and a second temperature sensor 62 installed on the surface of a sensor unit 60 that is in contact with a measurement object 9 in such a way that thermal resistance pertaining to heat outflow differs. The temperature measurement device makes calculation by the internal temperature Tc={(Ta-Tout)×Tb-(Tb-Tout)×Ta×A}/{(Ta-Tout)-(Tb-Tout)×A} of the measurement object 9. Here, Tc is the internal temperature, Ta is a first detection temperature, Tb is a second detection temperature, Tout is an outside air temperature, and A is a constant.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a temperature measurement device and the like.

  In order to judge the health state, basal metabolism, or mental state of a person or animal, information on the internal temperature (depth temperature) is required instead of the temperature of the surface layer of the human body or animal. Further, for example, when measuring the internal temperature of a furnace, piping, etc., various effects can be obtained if a temperature measuring device is provided outside the furnace, piping and the internal temperature can be estimated. For example, equipment and members for installing a temperature measuring device inside a furnace, piping, etc. are not required, and it is possible to use a cheaper temperature measuring device in terms of heat resistance, corrosion resistance, and measurement range. In addition, construction costs can be reduced.

  One of the techniques related to the measurement of the internal temperature is a technique of a heat flow compensation type deep thermometer. For example, Patent Document 1 discloses a configuration in which a heater is incorporated in order to achieve temperature equilibrium between the core of the living body and the probe with respect to the configuration of the temperature-sensitive probe unit. Patent Document 2 discloses a technique relating to heater control for shortening the time until the probe, which is the subject of Patent Document 1, reaches temperature equilibrium.

  As another technique related to the measurement of the internal temperature, Patent Document 3 discloses that the temperature is measured by two temperature sensors built in the base attached to the surface of the measured object, and the measured temperature and each of the temperature sensors are measured. A technique for estimating the internal temperature of a measurement object based on a relational expression in which heat inflow and heat outflow related to an installation position are expressed using a thermal resistance circuit is disclosed.

JP-A-55-29794 JP 2006-308538 A JP 2013-61232 A

  In the technique disclosed in Patent Document 1, a large electric power is required for the heater, and portability cannot be expected. Moreover, in the technique disclosed in Patent Document 2, the heat balance between the temperature measurement unit and the surrounding environment (atmosphere) is not taken into consideration for the calculation of the internal temperature (depth temperature). That is, it is premised that an ideal system can be formed in which a constant heat flow from the deep part where the heat balance does not occur to the surrounding environment can be obtained. Therefore, when miniaturization of the temperature measurement unit is promoted, for example, the heat balance between the side surface of the temperature measurement unit and the environment (atmosphere) becomes obvious, and the measurement error corresponding to the difference in the heat balance is ignored. become unable. In this respect, it cannot be denied that a measurement error occurs.

  Further, in the technique disclosed in Patent Document 3, when measuring the internal temperature of a living body, a change in thermal resistance of a measurement target, for example, a body tissue change in a human body (for example, a change in blood flow or compression) A measurement error occurs due to the influence of a change in thermal resistance from the internal heat source to the position at which the temperature is measured due to a change in tissue density due to the external force.

  The present invention has been devised with these problems in mind, and is intended to provide a non-invasive and highly accurate internal temperature measurement technique that is simple in configuration and hardly affected by fluctuations in the thermal resistance of a measurement target. Objective.

  1st invention for solving the above subject is the position which contacts the outer surface of the to-be-measured object, Comprising: The 1st temperature sensor and the 2nd temperature sensor which were provided in the position used as a different temperature in a steady state, Calculation units (for example, the processing unit 200 and the internal temperature calculation unit 203 in FIG. 6) that calculate the internal temperature of the measurement target using the first detection temperature of the first temperature sensor and the second detection temperature of the second temperature sensor. ).

  According to the first invention, the internal temperature can be calculated from the two detected temperatures on the premise that the temperatures are different in the steady state. A structure for temperature compensation such as a heater is not necessary, and the configuration is simple. Moreover, even if the thermal resistance of the measurement object fluctuates, measurement can be performed with high accuracy.

  For example, as a second invention, the first installation position of the first temperature sensor and the second installation position of the second temperature sensor are positions where resistances related to heat outflow from the position to the outside environment are different. 1 temperature measuring device can be configured.

  Furthermore, as a third invention, the temperature measurement device according to the second invention may be configured in which the first installation position is set closer to the center of the device than the second installation position.

  According to a fourth aspect of the present invention, when the temperature measuring device is in contact with the outer surface, the second installation position is determined to be closer to the outer edge of the device than the first installation position. The temperature measuring device according to the third aspect of the invention can also be configured.

  In addition, since the first detection temperature of the first temperature sensor and the second detection temperature of the second temperature sensor are configured to be different in a steady state, the material and shape can be set as appropriate.

  For example, as a fifth invention, the part of the first installation position and the part of the second installation position are configured to have different thermal resistances by different materials or shapes. The temperature measuring device according to any one of the second to fourth inventions can be configured.

  Further, as a sixth invention, a first heat radiating portion for radiating heat via the first installation position and a second heat radiating portion for radiating heat via the second installation position are further provided. The temperature measuring device according to any one of the first to fifth inventions may be configured.

As 7th invention, the said calculating part can comprise the temperature measuring apparatus as described in any one of 1st-6th which calculates the said internal temperature using the following numerical formula.
Tc = {(Ta-Tout) .Tb- (Tb-Tout) .Ta.A}
/ {(Ta−Tout) − (Tb−Tout) · A}
However, Tc is an internal temperature, Ta is a first detection temperature, Tb is a second detection temperature, Tout is an outside air temperature, and A is a constant.

  According to an eighth aspect of the present invention, there is provided the first temperature sensor and the second temperature sensor that are provided at positions that are in contact with the outer surface of the object to be measured and that have different temperatures in a steady state; Calculating the internal temperature of the measurement using a first detection temperature of one temperature sensor and a second detection temperature of the second temperature sensor.

  According to the eighth aspect, the same effect as in the first aspect can be obtained.

The figure which shows the structural example of a temperature measuring apparatus. The figure which shows the structural example of a sensor unit. The heat flow model for demonstrating the calculation method of internal temperature. The heat flow model for demonstrating the calculation method of internal temperature. The heat flow model for demonstrating the calculation method of internal temperature. The functional block diagram which shows the function structural example of a temperature measuring apparatus. Sectional drawing which shows the structural example of the calibration jig | tool for calibrating and setting the thermal resistance ratio A. The flowchart for demonstrating the flow of a 1st constant setting process. Sectional drawing which shows the structural example of the calibration jig | tool for calibrating and setting the thermal resistance R and the thermal capacity C. The flowchart for demonstrating the flow of a 2nd constant setting process. The flowchart for demonstrating the flow of a measurement process. (1) Top view and (2) Side view for demonstrating the simulation model of a temperature measuring device. Table of simulation results of temperature measurement device. Sectional drawing which shows the modification of a sensor unit. Sectional drawing which shows the modification of a sensor unit. Sectional drawing which shows the modification of a sensor unit. Sectional drawing which shows the modification of a sensor unit. The figure which shows the modification of a temperature measuring apparatus.

[First Embodiment]
FIG. 1 is a diagram illustrating a configuration example of a temperature measurement device according to the present embodiment.
The temperature measurement device 10 of the present embodiment includes a main body device 20 and a sensor unit 60 that is communicably connected to the main body device.

  The main unit 20 is a portable computer and includes a touch panel 22, an operation switch 24, a speaker 26, a control board 50, and a built-in battery (not shown).

  The control board 50 includes a CPU (Central Processing Unit) 51, an IC memory 52, a touch panel controller 53, a wireless communicator 54, and an interface controller 55. Of course, electronic / electrical parts other than these can be mounted as appropriate.

  The touch panel controller 53 is a known electronic component or integrated circuit in which functions for performing image display control on the touch panel 22 and output control of an operation input signal according to a touch operation performed on the touch panel 22 are summarized.

  The wireless communication device 54 is a known electronic component or wireless communication device for connecting to a known wireless communication circuit (for example, a mobile phone network, short-range wireless, wireless LAN, etc.). It can also be used for wireless communication with the sensor unit 60.

  The interface controller 55 is a known electronic component or integrated circuit having a function of signal input / output control between the operation switch 24 and various sensors and the CPU 51.

The CPU 51 reads out and executes a program stored in the IC memory 52 to realize various functions for comprehensively controlling the operation of the temperature measuring device 10.
For example,
1) A function for receiving an operation input from the operation switch 24 or the touch panel 22;
2) A function for displaying a user interface screen on the touch panel 22,
3) A function for acquiring measurement results from the sensor unit 60,
4) A function for calculating the internal temperature (depth temperature) of the measuring object 9 from the measurement result,
5) Timekeeping function,
6) a display control function for displaying the calculated internal temperature on the touch panel 22;
7) a data log function for storing the calculated internal temperature in the IC memory 52;
Is realized. Of course, other functions may be realized as appropriate.

  The sensor unit 60 is designed to be attachable to the measurement object 9 (human body in the present embodiment). The wearing part can be appropriately set such as the wrist, the upper arm, the neck, the leg, the ankle, the chest, and the waist. Of course, the measurement object 9 may be other than a person. For example, it can be an animal, piping, mechanical device, or the like.

  FIG. 2 is a diagram illustrating a configuration example of the sensor unit 60 in the present embodiment, where (1) is a schematic cross-sectional view, and (2) is an outline of a measurement surface (bottom surface) to be closely attached to the outer surface of the measurement target 9. FIG. In addition, illustration of the electric wire for wire-connecting the main body apparatus 20 so that communication is possible, the radio | wireless machine for wireless connection, etc. is abbreviate | omitted.

  The sensor unit 60 includes a first temperature sensor 61 and a second temperature sensor 62 provided on the bottom surface side of the base portion 69, and an environmental temperature sensor 63 provided on the top surface side of the base portion 69. When transmitting the measurement result to the main body device 20, when the sensor unit 60 performs signal processing (for example, conversion to a digital signal, filter processing, etc.) and then transmits the measurement result, signal processing necessary as appropriate A circuit can be mounted.

  The first temperature sensor 61 and the second temperature sensor 62 are configured to contact the outer surface of the measurement target 9 and receive the same heat flow from the measurement target 9. For example, the first temperature sensor 61 and the second temperature sensor 62 are configured using the same sensor, and the heat receiving surfaces of the first temperature sensor 61 and the second temperature sensor 62 are exposed on the bottom surface of the base 69 or the same. It is configured to reach the bottom surface of the base 69 via a layer of material and the same thickness (for example, a protective film).

  Further, the heat outflow Ia_out from the first temperature sensor 61 and the heat outflow Ib_out from the second temperature sensor 62 are installed differently. In other words, the sensor unit 60 has a heat outflow Ia_out from the first temperature sensor 61 to the surrounding environment of the sensor unit 60 (atmosphere in the example of FIG. 2), and a heat outflow from the second temperature sensor 62 to the surrounding environment of the sensor unit 60. It is configured to be different from Ib_out. If attention is paid to the steady state, it can be said that the first temperature sensor 61 and the second temperature sensor 62 are provided at different temperatures in the steady state.

  In the present embodiment, the first temperature sensor 61 and the second temperature sensor 62 are configured such that the distance to the outer surface of the base 69 is different in plan view. More specifically, the first temperature sensor 61 is arranged at a position closer to the outer edge of the sensor unit 60 than the second temperature sensor 62, and the second temperature sensor 62 is closer to the sensor unit 60 than the first temperature sensor 61. It is arranged so as to be close to the center. That is, the first temperature sensor 61 and the second temperature sensor 62 are installed so that the heat dissipation, that is, the resistance relating to the heat outflow, is different.

  And the heat from the heat source of the internal temperature Tc of the measuring object 9 flows into the first temperature sensor 61 and the second temperature sensor 62 through the body structure of the thermal resistance R, and the first detection temperature Ta and the second detection temperature, respectively. Measured as Tb. Then, the heat flows from the first temperature sensor 61 and the second temperature sensor 62 through the base 69 to the atmosphere having the temperature Tout.

[Description of internal temperature calculation method]
Next, a method for calculating the internal temperature Tc will be described.
The heat flow input / output relationship shown in FIG. 2 can be modeled as an electric circuit as shown in FIG. 3 can be simplified as shown in FIG. 4 by simplifying the model of the first detection temperature Ta of the first temperature sensor 61 and the second detection temperature Tb of the second temperature sensor 62 separately.

That is, as shown in FIG. 4 (1), with respect to the first temperature sensor 61, heat inflow Ia_in is generated through the thermal resistances Ra11, Ra12,... Ra1 (x-1), Ra1x constituting the parallel circuit, and the parallel circuit The first detected temperature Ta is measured while the heat outflow Ia_out occurs through the thermal resistances Ra21, Ra22,... Ra2 (x-1), Ra2x.
Similarly, as shown in FIG. 4 (2), for the second temperature sensor 62, a heat inflow Ib_in is generated via the thermal resistances Rb11, Rb12,. The second detected temperature Tb is measured while the heat outflow Ib_out occurs through the thermal resistances Rb21, Rb22,... Rb2 (x-1), Rb2x constituting the circuit.

If the model of FIG. 4 is further simplified, it can be shown as in FIG.
That is, for the first temperature sensor 61, the first detected temperature Ta is measured while heat flows in through the combined thermal resistance Ra1 and flows out through the combined thermal resistance Ra2. As for the second temperature sensor 62, the second detected temperature Tb is measured while heat flows in through the combined thermal resistance Rb1 and flows out through the combined thermal resistance Rb2.

As described above, the heat outflow Ia_out from the first temperature sensor 61 is larger than the heat outflow Ib_out from the second temperature sensor 62 in order to satisfy the relationship of the combined heat resistance Ra2> the combined heat resistance Rb2 (FIG. 2). reference). Thereafter, the sign of the combined thermal resistance relating to the heat outflow from the installation position of the first temperature sensor 61 is “Ra”, and the sign of the combined thermal resistance relating to the heat outflow from the installation position of the second temperature sensor 62 is “Rb”. Will be described.
In the present embodiment, since the first temperature sensor 61 and the second temperature sensor 62 are both in close contact with the surface of the measuring object 9, the combined thermal resistance Ra1 and the combined thermal resistance Rb1 The thermal resistance R (see FIG. 2) can be replaced. Therefore, the model shown in FIG. 5A can be expressed as shown in FIG.

Here, when the model of FIG. 5B is expressed by an equation, the first detection temperature Ta of the first temperature sensor 61 is expressed by the equation (1), and the second detection temperature Tb of the second temperature sensor 62 is expressed by the equation (1). 2), respectively.

Equation (3) can be derived from Equation (2).

By substituting the thermal resistance R obtained by equation (3) into equation (1), equation (4) is obtained.

Here, when (Ra / Rb) is regarded as the thermal resistance ratio A, the equation (5) for calculating the internal temperature Tc is derived from the equation (4).

Note that the thermal resistance ratio A is set in advance by a separate calibration operation.
Assuming that the calibration temperature Tout0, the calibration internal temperature Tc0, the calibration first detection temperature Ta0, and the calibration second detection temperature Tb0, the thermal resistance ratio A can be set by equation (6).

[Description of functional configuration]
FIG. 6 is a functional block diagram showing a functional configuration example of the temperature measuring apparatus 10 of the present embodiment. The temperature measurement device 10 of the present embodiment includes an operation input unit 100, a first temperature measurement unit 101, a second temperature measurement unit 103, an environmental temperature measurement unit 105, a processing unit 200, a display unit 300, and a storage. Part 500.

  The operation input unit 100 receives various operation inputs by the operator and outputs an operation input signal corresponding to the operation input to the processing unit 200. It can be realized with a button switch, lever switch, dial switch, trackpad, mouse, etc. The operation switch 24 and the touch panel 22 in FIG. 1 correspond to this.

  The first temperature measuring unit 101 and the second temperature measuring unit 103 are means for measuring the surface temperature of the measuring object 9 and can be realized by a known temperature sensor. In the present embodiment, the former corresponds to the first temperature sensor 61 in FIG. 2, and the latter corresponds to the second temperature sensor 62 in FIG. Then, the first detection temperature Ta and the second detection temperature Tb are measured and output to the processing unit 200, respectively.

  The environmental temperature measuring unit 105 is a means for measuring the temperature of the surrounding environment of the sensor unit 60 and the medium temperature of the heat outflow destination, and can be realized by a known temperature sensor. In the present embodiment, the environmental temperature sensor 63 in FIG. 2 corresponds to this, and measures the temperature Tout and outputs it to the processing unit 200.

  The processing unit 200 realizes various functions of the temperature measuring device 10 by arithmetic processing or the like. The control board 50 of FIG. 1 corresponds to this. In the present embodiment, a constant setting unit 201, an internal temperature calculation unit 203, a measurement result display control unit 205, a measurement result recording control unit 207, a timer unit 209, and an image signal generation unit 260 are provided.

The constant setting unit 201 sets the constant in the mathematical formula for calculating the internal temperature Tc, and performs measurement control during calibration, calculation of the constant, and control for storing the calculated constant in the storage unit 500. I do. In the present embodiment, when the first detection temperature Ta and the second detection temperature Tb are determined to be in a steady state, the thermal resistance ratio 520 used in Equation (5) applied when the determination is in a steady state, The thermal resistance 512 and the thermal capacity 514 used in the equations (7) and (8) applied when the determination is made are calculated and stored.

  The internal temperature calculation unit 203 calculates the internal temperature Tc and stores it as measurement log data 530 in the storage unit 500 in association with the measurement time. In the present embodiment, when it is determined that the first detection temperature Ta and the second detection temperature Tb are in the steady state, the internal temperature Tc is calculated using the equation (5), and in the unsteady state, the equation (8 ) To obtain the internal temperature Tc.

  The measurement result display control unit 205 causes the display unit 300 to display the measurement result. In the present embodiment, at least the internal temperature Tc is displayed together with the measured time.

  The measurement result recording control unit 207 stores the measurement result in the storage unit 500. In this embodiment, a measurement number is automatically generated and stored in the measurement log data 530 together with the measurement date and time and the internal temperature Tc.

  The timer unit 209 measures the current date and time and various timers. For example, it is realized by a known time measuring method using a system clock or a clock.

  The image signal generation unit 260 is realized by, for example, a processor such as a GPU or a digital signal processor (DSP), a program such as a video signal IC or a video codec, a drawing frame IC memory such as a frame buffer, or the like. Then, the image signal generation unit 260 generates an image signal for displaying the internal temperature Tc and the like and outputs it to the display unit 300.

  The display unit 300 is an image display unit, and is realized by an image display device such as a flat panel display. In FIG. 1, the touch panel 22 corresponds to this.

  The storage unit 500 is realized by a storage medium such as an IC memory, a hard disk, or an optical disk, and stores various types of data such as various programs and calculation process data of the processing unit 200. In FIG. 1, the IC memory 52 corresponds to this. In this embodiment, a system program 501, a measurement program 503, a thermal resistance 512, a thermal capacity 514, a product 516 of thermal resistance and thermal capacity, a thermal resistance ratio 520, and measurement log data 530 are stored. In addition, other data such as a time counter can be stored as appropriate.

The system program 501 is a basic program for causing the processing unit 200 to realize basic functions as a computer.
The measurement program 503 is an application program that is executed while the basic program is being executed. The processing unit 200 realizes functions as a constant setting unit 201, an internal temperature calculation unit 203, a measurement result display control unit 205, a measurement result recording control unit 207, a time measuring unit 209, and an image signal generation unit 260. . When the functions of the processing unit 200 are realized by hardware, program elements for realizing the corresponding functions can be appropriately omitted from the measurement program 503.

  The measurement log data 530 stores measurement results in time series. In the present embodiment, the measurement number automatically given in the order of measurement, the measurement date and time, and the measurement result (at least the internal temperature Tc) are associated with each other and stored in time series. Of course, data other than these can be stored in association with each other as appropriate.

[Description of operation]
Next, the operation of the temperature measuring device 10 will be described.
The temperature measuring device 10 sets the thermal resistance ratio A, the thermal resistance R, and the thermal capacity C in the calibration process of the manufacture.

  FIG. 7 is a cross-sectional view showing a configuration example of a calibration jig for calibrating / setting the thermal resistance ratio A. In addition, illustration of the electric wire for wire-connecting the main body apparatus 20 so that communication is possible, the radio | wireless machine for wireless connection, etc. is abbreviate | omitted.

  The calibration jig 80 has a thermal resistor 84 having the same or substantially the same thermal resistance R as the measurement object 9 on the heating element 82 that constantly maintains the calibration internal temperature Tc0. The heating element 82 can be realized by an electric heating plate or the like. The thermal resistor 84 can be realized by a silicon resin plate or the like. The environment in which the calibration jig 80 is placed is the same or substantially the same as the assumed measurement environment.

  In the calibration, the sensor unit 60 of the temperature measuring device 10 to be calibrated is brought into close contact with the surface of the thermal resistor 84 and a predetermined first constant setting operation input is performed from the touch panel 22. When the temperature measuring device 10 detects the operation input, the temperature measuring device 10 executes a first constant setting process.

FIG. 8 is a flowchart for explaining the flow of the first constant setting process.
In this process, the temperature measuring device 10 acquires the calibration internal temperature Tc0 (step S10). For example, an input screen for the calibration internal temperature Tc0 may be displayed on the touch panel 22 to prompt the calibration operator to input. In the configuration in which the internal temperature Tc0 for calibration is stored in the storage unit 500 in advance, this may be read.

Next, the temperature measurement apparatus 10 measures the first detection temperature Ta0 during calibration, the second detection temperature Tb0 during calibration, and the temperature Tout0 during calibration using the first temperature sensor 61, the second temperature sensor 62, and the environmental temperature sensor 63, respectively. (Step S12).
Then, the thermal resistance ratio A is calculated by equation (6) (step S14), stored in the storage unit 500 (step S16), a notification of the end of setting is displayed on the touch panel 22 (step S18), and the first constant The setting process ends.

  FIG. 9 is a cross-sectional view showing a configuration example of a calibration jig for calibrating and setting the thermal resistance R and the thermal capacity C. In addition, illustration of the electric wire for wire-connecting the main body apparatus 20 so that communication is possible, the radio | wireless machine for wireless connection, etc. is abbreviate | omitted.

  As the calibration jig 80, the same jig used for calibration of the thermal resistance ratio A can be used. However, the temperature of the heating element 82 is set to a steady state of Tct∞0 in advance. In the calibration, the sensor unit 60 of the temperature measuring device 10 to be calibrated is brought into close contact with the surface of the thermal resistor 84, and the calibration internal temperature at time t10 is calibrated at time t20 later than Tct10. The internal temperature Tct20 is controlled so as to reach a saturation internal temperature Tc∞0.

  Then, a predetermined second constant setting operation input is performed from the touch panel 22. When the temperature measuring device 10 detects the operation input, the temperature measuring device 10 executes a second constant setting process.

FIG. 10 is a flowchart for explaining the flow of the second constant setting process.
In this process, the temperature measurement device 10 first measures the temperature with the first temperature sensor 61, the second temperature sensor 62, and the environmental temperature sensor 63 at time t10, and based on the measurement result and the equation (5). The first calibration internal temperature Tct10 is calculated (step S20).

  Next, at time t20, which is a predetermined time after time t10, the temperature measuring device 10 similarly measures the temperature with the first temperature sensor 61, the second temperature sensor 62, and the environmental temperature sensor 63, and the measurement result. The second calibration internal temperature Tct20 is calculated on the basis of (5) and (5).

  Then, based on the equations (7) and (8), the thermal resistance R, the heat capacity C, and the product R × C thereof are calculated (step S24), and are stored in the storage unit 500 (step S26). ) A setting end notification is displayed on the touch panel 22 (step S28), and the second constant setting process is ended.

  When the thermal resistance ratio A and the product R × C of the thermal resistance R and the thermal capacity C are set, the temperature measuring device 10 can be used for actual measurement. When the operator inputs a predetermined measurement start operation from the touch panel 22, the temperature measurement device 10 detects this and executes measurement processing.

FIG. 11 is a flowchart for explaining the flow of the measurement process.
In the process, the temperature measuring device 10 starts temperature measurement by the first temperature sensor 61 and the second temperature sensor 62 (step S30).

  Next, the temperature measuring device 10 determines whether the first detection temperature Ta and the second detection temperature Tb are in a steady state (step S32). For example, for each of the first detection temperature Ta and the second detection temperature Tb, a change (temperature change) from the temperature measured last time is calculated.

  And if it is judged that it is a steady state (YES of step S32), temperature will be measured with the 1st temperature sensor 61, the 2nd temperature sensor 62, and the environmental temperature sensor 63 (step S34), the measurement result and formula ( 5), the internal temperature Tc is calculated (step S36). Next, the measurement result is displayed on the touch panel 22 and stored / stored in the measurement log data 530 (step S38). If the operation input for ending the measurement process is not made, the process proceeds to step S32 (step S48: NO), and if the operation input for ending is made (step S48: YES), the measurement process is ended.

  If it is determined that it is not a steady state (NO in step S32), the temperature measuring device 10 measures the internal temperature Tct1 at time t1 in the same manner as in steps S34 to S36 (step S40), and further after a predetermined time. At time t2, the internal temperature Tct2 at time t2 is measured in the same manner as in steps S34 to S36 (step S42).

  Then, the temperature measuring device 10 calculates the internal temperature Tc∞ using the equation (8), and regards this as the measurement result, that is, the internal temperature Tc (step S44). Next, the measurement result is displayed on the touch panel 22 and stored / stored in the measurement log data 530 (step S46). If the operation input for ending the measurement process is not made, the process proceeds to step S32 (step S48: NO), and if the operation input for ending is made (step S48: YES), the measurement process is ended.

[Explanation of measurement accuracy verification results]
FIG. 12 is (1) a top view and (2) a side view for explaining a simulation model of the temperature measuring device 10 of the present embodiment.
The sensor unit 60 is disposed on the human body part 86 where the thermal resistance R corresponding to the human body is set. The first temperature sensor 61 was arranged at the center of the vertical width of the sensor unit 60 (the vertical width toward FIG. 12 (1)) and at a position 10 mm from the left end. The second temperature sensor 62 is arranged at the center of the vertical width of the sensor unit 60 and at a position 40 mm from the left end. Then, the temperature of the bottom surface of the human body part 86 was set to the internal temperature Tc, and the external environment of the sensor unit 60 was set to the atmosphere of the external temperature Tout, and the heat flow simulation was performed.

  The result of the simulation is shown in FIG. Since the thermal resistance R is a thermal resistance in the human body from a heat source (internal temperature) inside the human body, it may vary depending on the state of the human body such as body tissue fluctuations. Therefore, several simulations were performed by changing the outside air temperature Tout and the thermal resistance R (in FIG. 13, expressed as the inverse thermal conductivity). As a result, according to the temperature measurement method of the present embodiment, a value with a very small estimation error was obtained with respect to the true value of the internal temperature Tc.

  As described above, according to the present embodiment, it is possible to realize a non-invasive and highly accurate measurement of the internal temperature, which is simple in structure and less susceptible to the influence of body tissue fluctuations.

[Modification]
Note that the embodiment of the present invention is not limited to the above, and additions, omissions, and changes of components can be appropriately made.

  For example, the outer shape and internal structure of the sensor unit 60 are not limited to the above embodiment, and the thermal resistance related to the heat outflow from the first temperature sensor 61 and the heat related to the outflow of heat from the second temperature sensor 62. As long as it is configured so that the resistance is different, it can be changed as appropriate.

  Specifically, as in the sensor unit 60B of FIG. 14, in addition to the configuration of the above embodiment, the thickness of the material covering the upper part of the first temperature sensor 61 (the opposite side of the measurement surface) and the second temperature sensor 62 The thickness of the material covering the upper part may be changed to provide a difference in heat dissipation.

  Further, as in the sensor unit 60C of FIG. 15, the base material covering the first temperature sensor 61 and the base material covering the second temperature sensor 62 are made of different materials so as to have different thermal resistance and heat capacity. It is good. In the example of FIG. 15, the thermal resistance of the material covering the first temperature sensor 61 is made smaller than the thermal resistance of the material covering the second temperature sensor 62.

  Further, as in the sensor unit 60D of FIG. 16, the heat that passes through the installation position of the first heat radiating portion 64 and the second temperature sensor 62 for radiating the heat through the installation position of the first temperature sensor 61 It is also possible to provide a second heat dissipating part 65 for dissipating heat and to provide a difference in the heat dissipating properties of these heat dissipating parts. In the example of FIG. 16, the first heat radiating portion 64 is more excellent in heat radiating performance than the second heat radiating portion 65. Of course, it is possible to provide a heat radiating part on one side and not on the other side.

  14 to 16 is preferable because the difference between the thermal resistance related to the heat outflow from the first temperature sensor 61 and the thermal resistance related to the heat outflow from the second temperature sensor 62 becomes larger. In these configurations, there are differences in the outer shape of the sensor unit 60, the material that covers each sensor, the performance of the heat radiation part for each sensor, and the like, so the first temperature sensor 61 and the second temperature sensor 62 are connected to the sensor unit 60. It is also possible to arrange them symmetrically (for example, at the same distance from the center in plan view).

  Moreover, in the said embodiment, although the 1st temperature sensor 61, the 2nd temperature sensor 62, and the environmental temperature sensor 63 were made into the integral sensor unit 60, each is separate from each other like the sensor unit 60E of FIG. The configuration described above is also possible.

  Moreover, in the said embodiment, although the main body apparatus 20 and the sensor unit 60 were comprised separately, as shown to the temperature measurement apparatus 10B of FIG. 18, you may comprise both integrally. For example, it is preferable to integrate it into a wristwatch type so that it can be attached to the measuring object 9 with the band 12.

  DESCRIPTION OF SYMBOLS 9 ... Measurement object, 10 ... Temperature measuring device, 20 ... Main body apparatus, 22 ... Touch panel, 24 ... Operation switch, 26 ... Speaker, 50 ... Control board, 51 ... CPU, 52 ... IC memory, 53 ... Touch panel controller, 54 ... Wireless communicator, 55 ... interface controller, 60 ... sensor unit, 61 ... first temperature sensor, 62 ... second temperature sensor, 63 ... environmental temperature sensor, 64 ... first heat radiating part, 65 ... second heat radiating part, 69 ... Base: 80 ... Calibration jig, 82 ... Heating element, 84 ... Thermal resistor, 86 ... Human body part, 100 ... Operation input part, 101 ... First temperature measuring part, 103 ... Second temperature measuring part, 105 ... Environmental temperature Measurement unit, 200 ... processing unit, 201 ... constant setting unit, 203 ... internal temperature calculation unit, 205 ... measurement result display control unit, 207 ... measurement result recording control unit, 209 Timing unit, 260 ... image signal generation unit, 300 ... display unit, 500 ... storage unit, 501 ... system program, 503 ... measurement program, 512 ... heat resistance, 514 ... heat capacity, 520 ... thermal resistance ratio, 530 ... measured log data

Claims (8)

A first temperature sensor and a second temperature sensor provided at positions that are in contact with the outer surface of the measurement object and have different temperatures in a steady state;
A calculation unit that calculates an internal temperature of the measurement target using a first detection temperature of the first temperature sensor and a second detection temperature of the second temperature sensor;
A temperature measuring device equipped with. The first installation position of the first temperature sensor and the second installation position of the second temperature sensor are positions where resistance relating to heat outflow from the position to the outside environment is different.
The temperature measuring device according to claim 1. The first installation position is determined at a position closer to the center of the apparatus than the second installation position;
The temperature measuring device according to claim 2. When the temperature measuring device is in contact with the outer surface, the second installation position is determined at a position closer to the outer edge of the device than the first installation position,
The temperature measuring device according to claim 2 or 3. The part of the first installation position and the part of the second installation position are configured to have different thermal resistances by different materials or shapes.
The temperature measuring apparatus as described in any one of Claims 2-4. A first heat radiating part for radiating heat via the first installation position;
A second heat dissipating part for dissipating heat via the second installation position;
The temperature measuring device according to claim 1, further comprising: The temperature measuring device according to claim 1, wherein the calculation unit calculates the internal temperature using the following mathematical formula.
Tc = {(Ta-Tout) .Tb- (Tb-Tout) .Ta.A}
/ {(Ta−Tout) − (Tb−Tout) · A}
However, Tc is the internal temperature, Ta is the first detection temperature, Tb is the second detection temperature, Tout is the outside air temperature, and A is a constant. Measuring the temperature with a first temperature sensor and a second temperature sensor provided at positions that are in contact with the outer surface of the measurement object and have different temperatures in a steady state;
Calculating an internal temperature of the measurement using a first detection temperature of the first temperature sensor and a second detection temperature of the second temperature sensor;
A temperature measurement method including:

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