CN106367723A - Workpiece, electronic equipment and vacuum sputtering coating method - Google Patents
Workpiece, electronic equipment and vacuum sputtering coating method Download PDFInfo
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- CN106367723A CN106367723A CN201610781936.1A CN201610781936A CN106367723A CN 106367723 A CN106367723 A CN 106367723A CN 201610781936 A CN201610781936 A CN 201610781936A CN 106367723 A CN106367723 A CN 106367723A
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- vacuum sputtering
- wearing layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
Abstract
The invention provides a workpiece, electronic equipment and a vacuum sputtering coating method. A coating layer is formed on the surface of the workpiece and comprises a first wearing layer formed on the outer surface of the workpiece, a second wearing layer formed on the outer surface of the first wearing layer, and an anti-fingerprint layer formed on the outer surface of the second wearing layer. The first wearing layer and the second wearing layer are formed between the anti-fingerprint layer and the workpiece, so that the wear resistance of the anti-fingerprint layer can be remarkably improved and the service life of the anti-fingerprint layer can be remarkably prolonged while an anti-fingerprint film has the good anti-fingerprint performance and the good stain resistance.
Description
Technical field
The present invention relates to coating technique field, specifically, it is related to workpiece, electronic equipment and vacuum sputtering coating method.
Background technology
Currently used for the ceramic part of the electronic equipments such as mobile phone, such as ceramic cover plate on fingerprint recognition module, mobile phone battery cover is made pottery
Porcelain cover plate etc., its surface not anti-fingerprint, not stain resistance；Or its surface is by plating one layer of anti-fingerprint film (af), though anti-fingerprint, prevent dirty
Dirty；But af membrane lifetime is limited, consumer is easy to wear away in use；For ceramic cover plate on fingerprint recognition module,
, once wearing and tearing, its surface is easily dirty for anti-fingerprint film (af), fingerprint recognition can be caused to malfunction, affect consumer experience.For handss
Machine back cover ceramic cover plate, once wearing and tearing, its surface is easily dirty for anti-fingerprint film (af), affects outward appearance.
Thus, the anti-fingerprint film currently used for electronic equipments such as mobile phones still has much room for improvement.
Content of the invention
It is contemplated that at least solving one of technical problem in correlation technique to a certain extent.For this reason, the present invention
One purpose is to propose that a kind of wearability is good or the anti-fingerprint film of long service life.
In one aspect of the invention, the invention provides a kind of workpiece.According to embodiments of the invention, this surface of the work
It is formed with film plating layer, described film plating layer includes the first wearing layer being formed at the outer surface of described workpiece, is formed at described first
Second wearing layer of the outer surface of wearing layer, and it is formed at the anti-fingerprint layer of the outer surface of described second wearing layer.Inventor
Find, by forming the first and second two wearing layers between anti-fingerprint layer and workpiece, ensureing that anti-fingerprint film has well
Anti-fingerprint and resist dirty performance while, wearability and the service life of anti-fingerprint layer can be significantly improved.
According to embodiments of the invention, described workpiece is ceramic workpiece.
According to embodiments of the invention, described first wearing layer is formed by aluminium oxide, and the thickness of described first wearing layer is
1-5 nanometer.
According to embodiments of the invention, described second wearing layer is formed by silicon dioxide, the thickness of described second wearing layer
For 6-12 nanometer.
According to embodiments of the invention, described anti-fingerprint layer is formed by PFPE, and the thickness of described anti-fingerprint layer is 15-
25 nanometers.
In another aspect of this invention, the invention provides a kind of electronic equipment.According to embodiments of the invention, this electronics
Equipment comprises foregoing workpiece.It will be understood by those skilled in the art that this electronic equipment has foregoing workpiece
All feature and advantage, this is no longer going to repeat them.
In another aspect of the invention, the invention provides a kind of vacuum sputtering coating method.Enforcement according to the present invention
Example, the method includes: (1) is cleaned to workpiece processing；(2) workpiece that step (1) is obtained carries out the pre-heat treatment；(3) right
The surface of the work that step (2) obtains carries out ion beam cleaning；(4) surface of the work being obtained in step (3) by vacuum sputtering
Form the first wearing layer；(5) pass through surface of the work formation the second wearing layer that vacuum sputtering obtains in step (4)；(6) pass through
The surface of the work that vacuum sputtering obtains in step (5) forms anti-fingerprint layer.Inventor find, by the method can quickly,
Effectively form, in surface of the work, the film layer that adhesive force is strong, consistency is high, be greatly improved the wearability of anti-fingerprint layer, extending it makes
With the life-span, and the method is simple, convenient, it is easy to accomplish industrialized production.
According to embodiments of the invention, in step (1), described workpiece is ceramic workpiece.
According to embodiments of the invention, in step (1), described cleaning treatment is to clean by ultrasound wave or wipe to carry out
's.
According to embodiments of the invention, in step (2), the temperature of described the pre-heat treatment is 80-100 degree Celsius, and the time is
10-20 minute.
According to embodiments of the invention, in step (3), described ion beam cleaning is in vacuum equipment, indifferent gas bromhidrosis
Carry out under atmosphere, wherein, ion source voltage is 110v, and electric current is 5-10a.
According to embodiments of the invention, in step (3), the time that described ion beam cleaning is carried out is 5-30 minute.
According to embodiments of the invention, in step (4) and (5), described vacuum sputtering is each independent to be 5 in vacuum
×10-3To 2 × 10-3Carry out under conditions of pa, the plated film time is independently each 30-40 minute.
According to embodiments of the invention, in step (4), the voltage of described vacuum sputtering is 360-400v, and electric current is 18-
22a
According to embodiments of the invention, in step (4), described first wearing layer is formed by aluminium oxide, and described first is wear-resisting
The thickness of layer is 1-5 nanometer.
According to embodiments of the invention, in step (5), the voltage of the described vacuum sputtering of described vacuum sputtering is
380-400v, electric current is 8-12a.
According to embodiments of the invention, in step (5), described second wearing layer is formed by silicon dioxide, and described second is resistance to
The thickness of mill layer is 6-12 nanometer.
According to embodiments of the invention, in step (6), described vacuum sputtering is 5 × 10 in vacuum-3To 2 × 10- 3Carry out under conditions of pa, the plated film time is 3-8 minute.
According to embodiments of the invention, in step (6), the voltage of described vacuum sputtering is 380v, and electric current is 20-30a.
According to embodiments of the invention, in step (6), described anti-fingerprint layer is formed by PFPE, described anti-fingerprint layer
Thickness be 15-25 nanometer.
According to embodiments of the invention, step (4) is carried out independently of one another to (6) under 80-100 degree Celsius.
According to embodiments of the invention, between described second wearing layer and described anti-fingerprint layer, form chemical bonding.
Brief description
Fig. 1 shows the cross-sectional view of workpiece according to embodiments of the present invention.
Fig. 2 shows the schematic flow sheet of vacuum sputtering coating method according to embodiments of the present invention.
Reference:
1: workpiece
2: film plating layer
21: the first wearing layers
22: the second wearing layers
23: anti-fingerprint layer
Specific embodiment
Embodiments of the invention are described below in detail.The embodiments described below is exemplary, is only used for explaining this
Bright, and be not considered as limiting the invention.Unreceipted particular technique or condition in embodiment, according to literary composition in the art
Offer described technology or condition or carry out according to product description.Agents useful for same or the unreceipted production firm person of instrument, all
For can by city available from conventional products.
In one aspect of the invention, the invention provides a kind of workpiece.According to embodiments of the invention, with reference to Fig. 1, should
Workpiece 1 surface is formed with film plating layer 2, and film plating layer 2 includes the first wearing layer 21, the second wearing layer 22 and anti-fingerprint layer 23.
According to embodiments of the invention, this workpiece 1 can be ceramic workpiece, and the concrete species of workpiece 1 is not especially limited
System, is including but not limited to used for the ceramic cover plate of fingerprint recognition module, the back cover ceramic cap of the electronic equipment such as mobile phone, panel computer
Plate etc..Inventor finds, forms above-mentioned film plating layer on ceramic workpiece surface, the wearing layer consistency of formation, purity are all higher, prevents
While having good anti-fingerprint, resist dirty performance, wearability significantly improves finger print layer.
According to embodiments of the invention, the first wearing layer 21 is formed at the outer surface of workpiece 1.It is resistance to workpiece 1 and second
It is respectively provided with good adhesive force between mill layer 22, wearability and the service life of anti-fingerprint layer 23 can be effectively improved.
According to embodiments of the invention, the first wearing layer 21 can be formed by aluminium oxide, and the thickness of the first wearing layer 21 is
1-5 nanometer.First wearing layer is formed using hardening oxidation aluminum, it is respectively provided with stronger combination and workpiece and the second wearing layer between
Intensity, and the wearability of anti-fingerprint layer can be significantly improved, extend its service life.The thickness of the first wearing layer is arranged on above-mentioned
Scope, while higher anti-wear performance can be effectively ensured, is conducive to saving material, reduces cost, improves efficiency.
According to embodiments of the invention, the second wearing layer 22 is formed at the outer surface of the first wearing layer 21.Second wearing layer
22 and first have good adhesion between wearing layer and anti-fingerprint layer, particularly can form chemistry and anti-fingerprint layer between
Bonding, adhesion further enhances, and can improve the wearability of anti-fingerprint layer further.According to some embodiments of the present invention,
Second wearing layer 22 can be formed by silicon dioxide, and the thickness of the second wearing layer 22 can be 6-12 nanometer.Using silicon dioxide
Form the second wearing layer, it is respectively provided with stronger bond strength and anti-fingerprint layer and the first wearing layer between, and can significantly carry
The wearability of high anti-fingerprint layer, extends its service life.The thickness of the second wearing layer is arranged on above range, can be effectively ensured
While higher anti-wear performance, be conducive to saving material, reduces cost, improve efficiency.
According to embodiments of the invention, anti-fingerprint layer 23 is formed at the outer surface of the second wearing layer 22.Thus, it is possible to make
Workpiece has good anti-fingerprint and anti-dirty performance.According to some embodiments of the present invention, anti-fingerprint layer 23 can be by complete
Perfluoroalkyl polyether is formed, and the thickness of anti-fingerprint layer 23 can be 15-25 nanometer.Can be obtained anti-using PFPE formation anti-fingerprint layer
Greasy dirt, dirty and anti-fingerprint performance preferable anti-fingerprint layer, and good with the adhesion of wearing layer, be conducive to carrying of anti-wear performance
Height, the thickness of anti-fingerprint layer is in above range it is ensured that its serviceability is preferable.
Inventor finds, by forming the first wearing layer and the second wearing layer between anti-fingerprint layer and workpiece, is ensureing
While anti-fingerprint film has good anti-fingerprint and resists dirty performance, wearability and the use of anti-fingerprint layer can be significantly improved
Life-span.
In another aspect of this invention, the invention provides a kind of electronic equipment.According to embodiments of the invention, this electronics
Equipment comprises workpiece above.It will be understood by those skilled in the art that this electronic equipment has all features of workpiece above
And advantage, this is no longer going to repeat them.In addition, the concrete species of this electronic equipment is not particularly limited, including but not limited to handss
Mobile terminal devices such as machine, panel computer etc..And, it will be understood by those skilled in the art that in addition to foregoing workpiece, should
Electronic equipment also has other necessary structures and part, has the conventional structure and composition in this area.With this electronic equipment it is
As a example mobile phone, foregoing workpiece can be the ceramic cover plate of fingerprint recognition module, and in addition this mobile phone also includes conventional cell phone
The other structures having and part, the such as part such as photograph module, battery, touch screen, cpu, flexible PCB, shell.
In another aspect of the invention, the invention provides a kind of vacuum sputtering coating method.Enforcement according to the present invention
Example, with reference to Fig. 2, the method comprises the following steps:
S100: workpiece is cleaned process.
According to embodiments of the invention, in this step, method workpiece being cleaned process is not particularly limited, only
The impurity such as dust, the greasy dirt of surface of the work can effectively be removed.In some embodiments of the invention, can be by super
The method of sound cleaning or manual wipping is cleaned processing.Thus, simple, convenient quick, and cleaning effect is preferable, favorably
Carrying out in subsequent step.
According to some embodiments of the present invention, the workpiece that this step adopts is ceramic workpiece, and the concrete species of workpiece is not
Be particularly limited, including but not limited to be used for the electronic equipment such as mobile phone, panel computer the ceramic cover plate of fingerprint recognition module, after
Shell ceramic cover plate etc..Inventor finds, the method for the present invention is particularly suitable for carrying out plated film on ceramic workpiece surface, formation resistance to
Mill layer consistency, purity are all higher, while having good anti-fingerprint, resist dirty performance, can significantly improve anti-fingerprint
The wearability of film and service life.
S200: the pre-heat treatment is carried out to the workpiece obtaining in step s100.
According to embodiments of the invention, this step can be carried out in vacuum equipment (as vacuum drying oven), specifically, can be by
In upper step, the workpiece dress through cleaning treatment hangs in vacuum equipment, then the workpiece through cleaning treatment is carried out at preheating
Reason.The pre-heat treatment is so that the foreign gas in workpiece discharges, and is discharged foreign gas by follow-up vacuum step, keeps away
Exempt from coating process release and affect the purity of film plating layer, the adhesion of impact film layer and workpiece and wearability.In the present invention
Embodiment in, the temperature carrying out the pre-heat treatment is chosen as 80-100 degree Celsius.In this temperature range, substantially can be with maximum possible
The wearability of raising anti-fingerprint layer and service life, and will not make because temperature is too high in stove clamping material and workpiece this
The foreign gas amount of body discharge increases, evacuation environment in impact subsequent step, and then leads to film plating layer adhesive force and wearability
It is deteriorated.According to embodiments of the invention, the time of the pre-heat treatment can be 10-20 minute, it is ensured that work in time range
Foreign gas in part is discharged, and improves adhesive force and the wearability of film plating layer, and be not result in foreign gas amount excessive and to plating
The adhesive force of film layer and wearability have a negative impact.
S300: ion beam cleaning is carried out to the surface of the work obtaining in step s200.
According to embodiments of the invention, ion beam cleaning typically requires and carries out under vacuum conditions, therefore, is carrying out ion
Before Shu Qingxi, need to carry out evacuation process to vacuum equipment, vacuum can be 5 × 10-3To 2 × 10-3pa.In this vacuum
In the range of degree, the purity of film plating layer is higher, the good bonding strength of film layer, and wearability is preferable, and this vacuum is easily achieved, easily
Control, be to produce feasible preferably vacuum environment.
According to embodiments of the invention, ion beam cleaning typically requires and carries out under atmosphere of inert gases, specifically, ion
Shu Qingxi can operate according to following steps: is passed through noble gases (including but not limited to argon) in vacuum equipment, in ion
Source the two poles of the earth make it ionize generation plasma (as ar plus certain voltage+), ion beam bombardment surface of the work, plays clean surface
And activating surface chemical bond, enable the first wearing layer being subsequently formed to be firmly bonded to surface of the work.Wherein, ion source electricity
Pressure can be 110v, and electric current can be 5-10a, and the ion beam cleaning time can be 5-30 minute.Above-mentioned electricity is adopted in the present invention
Pressure and electric current, it is possible to achieve preferably cleaning effect, significantly improve the adhesive force of the wearing layer being subsequently formed, and then improve anti-finger
The wearability of lamina and service life, if voltage and current is too high, may affect ion source service life and easily cause life
Produce unexpected abnormality.Above-mentioned scavenging period is also the preferably time that inventor obtains through many experiments, in this scavenging period model
In enclosing, cleaning performance is preferable, and the adhesive force of the wearing layer being subsequently formed significantly improves, if scavenging period is too short, wearing layer
Adhesive force is relatively undesirable, if scavenging period is long, affects ion source service life, is unfavorable for producing.
S400: the first wearing layer is formed by the surface of the work that vacuum sputtering obtains in step s300.
According to embodiments of the invention, in this step, can be 5 × 10 in vacuum-3To 2 × 10-3Pa and 80-100 takes the photograph
The condition of family name's degree is carried out.Carry out the preparation of the first wearing layer under above-mentioned vacuum degree condition, it is possible to obtain purity higher first
Wearing layer, and the first wearing layer and workpiece good bonding strength；The work of the first high-abrasive material molecule can be increased using said temperature
Property, increase the adhesion of the first wearing layer, obtain wearability and adhesion all preferably first wearing layer, if temperature is too low,
First wearing layer is undesirable with the adhesion of workpiece, and the wearability of anti-fingerprint layer is not good, if temperature is too high, vacuum equipment is built-in
Press from both sides material and the foreign gas amount of workpiece discharge itself increases, affect vacuum environment, the first wearing layer adhesive force can be led to and prevent
Finger print layer wearability is deteriorated.The plated film time can be 30-40 minute, and the first wearing layer thickness of formation can be 1-5 nanometer, should
Time range can obtain the first suitable wearing layer of thickness, and this thickness range is so that the first wearing layer has preferably makes
With performance, wearability will not be led to because thickness is excessively thin to be deteriorated, also will not cause unnecessary waste because thickness is blocked up, economical
Property preferably, while above-mentioned thickness range can be effectively ensured higher anti-wear performance, be conducive to saving material, reduces cost,
Improve efficiency.
According to embodiments of the invention, in this step, the voltage adopting in vacuum sputtering operation can be 360-400v,
Electric current is can be with 18-22a.In the range of above-mentioned voltage and current, the first wearing layer wearability of acquisition and adhesive force are all preferable,
Serviceability is preferable.
According to embodiments of the invention, the first wearing layer can be formed by aluminium oxide.Form first using hardening oxidation aluminum
Wearing layer, it is respectively provided with stronger bond strength and workpiece and the second wearing layer between, and can significantly improve anti-fingerprint layer
Wearability, extends its service life.
S500: the second wearing layer is formed by the surface of the work that vacuum sputtering obtains in step s400.
According to embodiments of the invention, in this step, can be 5 × 10 in vacuum-3To 2 × 10-3Pa and 80-100 takes the photograph
The condition of family name's degree is carried out.Carry out the preparation of the second wearing layer under above-mentioned vacuum degree condition, it is possible to obtain purity higher second
Wearing layer, and the second wearing layer and the first wearing layer and anti-fingerprint layer good bonding strength；Second can be increased using said temperature
The activity of high-abrasive material molecule, increases the adhesion of the second wearing layer, obtains wearability and adhesion all preferably second is wear-resisting
Layer, if temperature is too low, the second wearing layer is undesirable with the adhesion of the first wearing layer and anti-fingerprint layer, anti-fingerprint layer wear-resisting
Property not good, if temperature is too high, in vacuum equipment clamping material and workpiece itself discharge foreign gas amount increase, affect vacuum
Environment, can lead to the second wearing layer adhesive force and anti-fingerprint layer wearability to be deteriorated.The plated film time can be 30-40 minute, is formed
The second wearing layer thickness can be 6-12 nanometer, this time range can obtain the second suitable wearing layer of thickness, this thickness
Scope, so that the second wearing layer has preferably serviceability, will not lead to wearability to be deteriorated, also not because thickness is excessively thin
Unnecessary waste, better economy can be caused because thickness is blocked up, the thickness of the second wearing layer is arranged on above range, permissible
While higher anti-wear performance is effectively ensured, is conducive to saving material, reduces cost, improves efficiency.
According to embodiments of the invention, in this step, the voltage adopting in vacuum sputtering operation can be 380-400v,
Electric current is can be with 8-12a.In the range of above-mentioned voltage and current, the second wearing layer wearability of acquisition and adhesive force are all preferable,
Serviceability is preferable.
According to embodiments of the invention, the second wearing layer can be formed by silicon dioxide.Form second using silicon dioxide
Wearing layer, it is respectively provided with stronger bond strength and anti-fingerprint layer and the first wearing layer between, and by the method for the present invention
The silicon dioxide layer being formed has higher compactness, can significantly improve the wearability of anti-fingerprint layer, extend its service life.
S600: anti-fingerprint layer is formed by the surface of the work that vacuum sputtering obtains in step s500.
According to embodiments of the invention, can be 5 × 10 in vacuum-3To 2 × 10-3Pa and 80-100 degree Celsius of bar
Carry out under part.Carry out the preparation of anti-fingerprint layer under above-mentioned vacuum degree condition, it is possible to obtain the higher anti-fingerprint layer of purity, and anti-
Finger print layer and wearing layer good bonding strength；Adhesive force and serviceability preferably anti-fingerprint layer can be obtained using said temperature,
If temperature is too low, anti-fingerprint layer is undesirable with the adhesion of wearing layer, if temperature is too high, in vacuum equipment clamping material and
The foreign gas amount of workpiece discharge itself increases, and affects vacuum environment, can lead to the adhesive force of wearing layer and anti-fingerprint layer and resistance to
Mill property is deteriorated.The plated film time can be 3-8 minute, and the thickness of anti-fingerprint layer is 15-25 nanometer, and above-mentioned time range can obtain
Thickness suitable anti-fingerprint layer, the anti-fingerprint layer of above-mentioned thickness range has the same of good anti-dirty, anti-fingerprint function
When, there is good wearability, will not be because excessively thin and wearability is poor, also will not be because blocked up and waste of materials be so that obtain anti-
Finger print layer wearability is all preferable with anti-dirty, anti-fingerprint performance and wearability.
According to embodiments of the invention, in this step, the voltage adopting in vacuum sputtering operation can be 380v, electric current
For can be with 20-30a.In the range of above-mentioned voltage and current, the anti-fingerprint layer serviceability of acquisition is preferable.
According to embodiments of the invention, anti-fingerprint layer can be formed using PFPE, thus, raw material sources extensively, become
This is relatively low and antifouling, anti-fingerprint effect is preferable, and serviceability is preferable.
According to embodiments of the invention, the anti-fingerprint layer being formed in this step can form chemical bonding with the second wearing layer
And molecule link, form low-surface-energy, the surface at high water droplet angle, make surface have the sliding feel of silk, resist dirty, high abrasion characteristic.
Inventor finds, quickly, effectively in surface of the work can form the film that adhesive force is strong, consistency is high by the method
Layer, is greatly improved the wearability of anti-fingerprint layer, extends its service life, and the method is simple, convenient, it is easy to accomplish work
Industry metaplasia is produced.
According to the specific example of the present invention, the present invention passes through in surface of the work plated underlayer last layer hard aluminium sesquioxide
(al2o3), it has stronger adhesive force with surface of the work, simultaneously again with intermediate layer silicon dioxide (sio2) there is stronger combination
Power；One layer of anti-fingerprint film (af) is plated on surface again, and it is with intermediate deposit silicon dioxide (sio2) produce chemical bonding and molecule link,
Also has stronger adhesion；Pass through to adjust related filming parameter simultaneously, make ceramic surface form the film that adhesive force is strong, consistency is high
Layer, is greatly improved the wearability of anti-fingerprint film (af).
Embodiments of the invention are described below in detail.
Embodiment 1
Preparation technology flow process is as follows: workpiece (pottery hung by the cleaning of workpiece to be plated (ceramic) ultrasound wave or manual wipping dress
Porcelain) in vacuum drying oven preheating evacuation ion beam to workpiece (ceramic) surface cleaning plating aluminium sesquioxide
(al2o3) applying silicon oxide (sio2) plating PFPE (af) remove pickup workpiece (ceramic) table after vacuum
Face oily waste treatment.
1st, pass through ultrasound wave to be cleaned to workpiece to be handled processing；
2nd, preheating in vacuum drying oven: the workpiece dress through cleaning treatment is hung in vacuum drying oven, is then heated to 100 DEG C, when
Between be 10 minutes, carry out the pre-heat treatment；
3rd, evacuation: pumpdown time 30-40 minute, make vacuum in stove reach 2 × 10-5pa；
4th, ion beam is to workpiece (ceramic) surface cleaning: is passed through noble gases (argon ar) in a vacuum furnace, in ion source
The two poles of the earth make it ionize generation plasma (ar plus 110v voltage+), ion beam bombardment workpiece (ceramic) surface, play cleaning table
Face and activating surface chemical bond, make coating aluminium sesquioxide (al2o3) workpiece (ceramic) surface can be firmly bonded to.Ion
Source energy setting electric current 10a, cleaning time 5 minutes.
5th, plate aluminium sesquioxide (al2o3): by plasma (ar+) collision negative electrode aluminum target, sputter out Coating Materials
Particle (al), rapidly to workpiece (ceramic) surface, with the oxygen (o being passed through2) fast filming al2o3.Wherein, voltage is 360v,
Electric current is 18a, 30 minutes plated film time, 1 nanometer of thicknesses of layers.
6th, applying silicon oxide (sio2): by plasma (ar+) collision negative electrode silicon target, sputter out Coating Materials
Particle (si), rapidly to workpiece (ceramic) surface, with the oxygen (o being passed through2) fast filming sio2.Wherein, voltage is 380v, electricity
Flow for 8a, 30 minutes plated film time, 6 nanometers of thicknesses of layers.
7th, operational approach is similar with applying silicon oxide, and difference is: electron gun voltage is 380v, and electric current is 20a, during plated film
Between 8 minutes, 25 nanometers of thicknesses of layers.
Embodiment 2:
Preparation technology flow process is as follows: workpiece (pottery hung by the cleaning of workpiece to be plated (ceramic) ultrasound wave or manual wipping dress
Porcelain) in vacuum drying oven preheating evacuation ion beam to workpiece (ceramic) surface cleaning plating aluminium sesquioxide
(al2o3) applying silicon oxide (sio2) plating PFPE (af) remove pickup workpiece (ceramic) table after vacuum
Face oily waste treatment.
1st, pass through ultrasound wave to be cleaned to workpiece to be handled processing；
2nd, preheating in vacuum drying oven: the workpiece dress through cleaning treatment is hung in vacuum drying oven, is then heated to 80 DEG C, the time
For 20 minutes, carry out the pre-heat treatment；
3rd, evacuation: pumpdown time 30-40 minute, make vacuum in stove reach 5 × 10-5pa；
4th, ion beam is to workpiece (ceramic) surface cleaning: is passed through noble gases (argon ar) in a vacuum furnace, in ion source
The two poles of the earth make it ionize generation plasma (ar plus 110v voltage+), ion beam bombardment workpiece (ceramic) surface, play cleaning table
Face and activating surface chemical bond, make coating aluminium sesquioxide (al2o3) workpiece (ceramic) surface can be firmly bonded to.Ion
Source energy setting electric current 8a, cleaning time 15 minutes.
5th, plate aluminium sesquioxide (al2o3): by plasma (ar+) collision negative electrode aluminum target, sputter out Coating Materials
Particle (al), rapidly to workpiece (ceramic) surface, with the oxygen (o being passed through2) fast filming al2o3.Wherein, voltage is 400v,
Electric current is 22a, 35 minutes plated film time, 5 nanometers of thicknesses of layers.
6th, applying silicon oxide (sio2): by plasma (ar+) collision negative electrode silicon target, sputter out Coating Materials
Particle (si), rapidly to workpiece (ceramic) surface, with the oxygen (o being passed through2) fast filming sio2.Wherein, voltage is 390v, electricity
Flow for 10a, 40 minutes plated film time, 10 nanometers of thicknesses of layers.
7th, operational approach is similar with applying silicon oxide, and difference is: electron gun voltage is 380v, and electric current is 25a, during plated film
Between 5 minutes, 20 nanometers of thicknesses of layers.
Embodiment 3:
Preparation technology flow process is as follows: workpiece (pottery hung by the cleaning of workpiece to be plated (ceramic) ultrasound wave or manual wipping dress
Porcelain) in vacuum drying oven preheating evacuation ion beam to workpiece (ceramic) surface cleaning plating aluminium sesquioxide
(al2o3) applying silicon oxide (sio2) plating PFPE (af) remove pickup workpiece (ceramic) table after vacuum
Face oily waste treatment.
1st, pass through ultrasound wave to be cleaned to workpiece to be handled processing；
2nd, preheating in vacuum drying oven: the workpiece dress through cleaning treatment is hung in vacuum drying oven, is then heated to 90 DEG C, the time
For 15 minutes, carry out the pre-heat treatment；
3rd, evacuation: pumpdown time 30-40 minute, make vacuum in stove reach 3 × 10-5pa；
4th, ion beam is to workpiece (ceramic) surface cleaning: is passed through noble gases (argon ar) in a vacuum furnace, in ion source
The two poles of the earth make it ionize generation plasma (ar plus 110v voltage+), ion beam bombardment workpiece (ceramic) surface, play cleaning table
Face and activating surface chemical bond, make coating aluminium sesquioxide (al2o3) workpiece (ceramic) surface can be firmly bonded to.Ion
Source energy setting electric current 5a, cleaning time 30 minutes.
5th, plate aluminium sesquioxide (al2o3): by plasma (ar+) collision negative electrode aluminum target, sputter out Coating Materials
Particle (al), rapidly to workpiece (ceramic) surface, with the oxygen (o being passed through2) fast filming al2o3.Wherein, voltage is 380v,
Electric current is 20a, 40 minutes plated film time, 3 nanometers of thicknesses of layers.
6th, applying silicon oxide (sio2): by plasma (ar+) collision negative electrode silicon target, sputter out Coating Materials
Particle (si), rapidly to workpiece (ceramic) surface, with the oxygen (o being passed through2) fast filming sio2.Wherein, voltage is 400v, electricity
Flow for 12a, 35 minutes plated film time, 12 nanometers of thicknesses of layers.
7th, operational approach is similar with applying silicon oxide, and difference is: electron gun voltage is 380v, and electric current is 30a, during plated film
Between 3 minutes, 15 nanometers of thicknesses of layers.
Embodiment 4:
Preparation technology flow process is as follows: workpiece (pottery hung by the cleaning of workpiece to be plated (ceramic) ultrasound wave or manual wipping dress
Porcelain) in vacuum drying oven preheating evacuation ion beam to workpiece (ceramic) surface cleaning plating aluminium sesquioxide
(al2o3) applying silicon oxide (sio2) plating PFPE (af) remove pickup workpiece (ceramic) table after vacuum
Face oily waste treatment.
1st, pass through ultrasound wave to be cleaned to workpiece to be handled processing；
2nd, preheating in vacuum drying oven: the workpiece dress through cleaning treatment is hung in vacuum drying oven, is then heated to 95 DEG C, the time
For 18 minutes, carry out the pre-heat treatment；
3rd, evacuation: pumpdown time 30-40 minute, make vacuum in stove reach 4 × 10-5pa；
4th, ion beam is to workpiece (ceramic) surface cleaning: is passed through noble gases (argon ar) in a vacuum furnace, in ion source
The two poles of the earth make it ionize generation plasma (ar plus 110v voltage+), ion beam bombardment workpiece (ceramic) surface, play cleaning table
Face and activating surface chemical bond, make coating aluminium sesquioxide (al2o3) workpiece (ceramic) surface can be firmly bonded to.Ion
Source energy setting electric current 7.5a, cleaning time 20 minutes.
5th, plate aluminium sesquioxide (al2o3): by plasma (ar+) collision negative electrode aluminum target, sputter out Coating Materials
Particle (al), rapidly to workpiece (ceramic) surface, with the oxygen (o being passed through2) fast filming al2o3.Wherein, voltage is 390v,
Electric current is 19a, 32 minutes plated film time, 2 nanometers of thicknesses of layers.
6th, applying silicon oxide (sio2): by plasma (ar+) collision negative electrode silicon target, sputter out Coating Materials
Particle (si), rapidly to workpiece (ceramic) surface, with the oxygen (o being passed through2) fast filming sio2.Wherein, voltage is 385v, electricity
Flow for 9a, 25 minutes plated film time, 8 nanometers of thicknesses of layers.
7th, operational approach is similar with applying silicon oxide, and difference is: electron gun voltage is 380v, and electric current is 28.5a, plated film
4 minutes time, 26 nanometers of thicknesses of layers.
Embodiment 5: performance test
By the workpiece preparing in embodiment 1-4, carry out the wear-resisting experiment of film plating layer, specifically, steel wool is loaded into
On friction wear testing machine, and Deca artificial perspiration, carry out fricting movement under the conditions of the loading of 300gf, before test, rub
Wipe the water droplet angle of measurement surface of the work when motion 1000 times and 1500 times, 2000 times, 2500 times and 3000 times, do four groups of parallel realities
Test, result takes the meansigma methodss of four groups of parallel laboratory tests.Wherein, water droplet angle higher explanation film plating layer wearability better it is generally recognized that
Water droplet angle is less than 70 degree, and anti-fingerprint layer had lost efficacy.
Result of the test: in embodiment of the present invention 1-4, the surface of the work film plating layer of preparation is in fricting movement 1000 times and 1500
Secondary, 2000 times, 2500 times and when 3000 times, water droplet angle is respectively 102 degree, 95 degree, 89 degree, 81 degree and 72 degree.
In describing the invention it is to be understood that term " first ", " second " are only used for describing purpose, and can not
It is interpreted as indicating or imply relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " the
One ", the feature of " second " can be expressed or implicitly include one or more this feature.In describing the invention,
" multiple " are meant that two or more, unless otherwise expressly limited specifically.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy describing with reference to this embodiment or example
Point is contained at least one embodiment or the example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.And, the specific features of description, structure, material or feature can be in office
Combine in an appropriate manner in one or more embodiments or example.Additionally, in the case of not conflicting, the skill of this area
The feature of the different embodiments described in this specification or example and different embodiment or example can be tied by art personnel
Close and combine.
Although embodiments of the invention have been shown and described above it is to be understood that above-described embodiment is example
Property it is impossible to be interpreted as limitation of the present invention, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
Claims (22)
1. it is characterised in that described surface of the work is formed with film plating layer, described film plating layer includes a kind of workpiece:
First wearing layer, described first wearing layer is formed at the outer surface of described workpiece；
Second wearing layer, described second wearing layer is formed at the outer surface of described first wearing layer；And
Anti-fingerprint layer, described anti-fingerprint layer is formed at the outer surface of described second wearing layer.
2. workpiece according to claim 1 is it is characterised in that described workpiece is ceramic workpiece.
3. workpiece according to claim 1 is it is characterised in that described first wearing layer is formed by aluminium oxide, and described first
The thickness of wearing layer is 1-5 nanometer.
4. workpiece according to claim 1 is it is characterised in that described second wearing layer is formed by silicon dioxide, and described
The thickness of two wearing layers is 6-12 nanometer.
5. workpiece according to claim 1 is it is characterised in that described anti-fingerprint layer is formed by PFPE, described anti-finger
The thickness of lamina is 15-25 nanometer.
6. a kind of electronic equipment is it is characterised in that comprise:
Workpiece any one of claim 1-5.
7. a kind of vacuum sputtering coating method is it is characterised in that include:
(1) workpiece is cleaned processing；
(2) workpiece that step (1) is obtained carries out the pre-heat treatment；
(3) surface of the work that step (2) is obtained carries out ion beam cleaning；
(4) pass through surface of the work formation the first wearing layer that vacuum sputtering obtains in step (3)；
(5) pass through surface of the work formation the second wearing layer that vacuum sputtering obtains in step (4)；
(6) pass through the surface of the work formation anti-fingerprint layer that vacuum sputtering obtains in step (5).
8. vacuum sputtering coating method according to claim 7 is it is characterised in that in step (1), described workpiece is pottery
Workpiece.
9. vacuum sputtering coating method according to claim 7 is it is characterised in that in step (1), described cleaning treatment is
Cleaned by ultrasound wave or wipe and carry out.
10. vacuum sputtering coating method according to claim 7 is it is characterised in that in step (2), described the pre-heat treatment
Temperature be 80-100 degree Celsius, the time be 10-20 minute.
11. vacuum sputtering coating methods according to claim 7 are it is characterised in that in step (3), described ion beam is clear
Wash in vacuum equipment, carry out under inert gas atmosphere, wherein, ion source voltage is 110v, and electric current is 5-10a.
12. vacuum sputtering coating methods according to claim 7 are it is characterised in that in step (3), described ion beam is clear
Wash the time carrying out for 5-30 minute.
13. vacuum sputtering coating methods according to claim 7 it is characterised in that in step (4) and (5), described vacuum
Sputtering method is each independent to be 5 × 10 in vacuum-3To 2 × 10-3Carry out under conditions of pa, the plated film time is independently each
30-40 minute.
14. vacuum sputtering coating methods according to claim 7 it is characterised in that in step (4), described vacuum sputtering
The voltage of method is 360-400v, and electric current is 18-22a.
15. vacuum sputtering coating methods according to claim 7 are it is characterised in that in step (4), described first is wear-resisting
Layer is formed by aluminium oxide, and the thickness of described first wearing layer is 1-5 nanometer.
16. vacuum sputtering coating methods according to claim 7 it is characterised in that in step (5), described vacuum sputtering
The voltage of the described vacuum sputtering of method is 380-400v, and electric current is 8-12a.
17. vacuum sputtering coating methods according to claim 7 are it is characterised in that in step (5), described second is wear-resisting
Layer is formed by silicon dioxide, and the thickness of described second wearing layer is 6-12 nanometer.
18. vacuum sputtering coating methods according to claim 7 it is characterised in that in step (6), described vacuum sputtering
Method is 5 × 10 in vacuum-3To 2 × 10-3Carry out under conditions of pa, the plated film time is 3-8 minute.
19. vacuum sputtering coating methods according to claim 7 it is characterised in that in step (6), described vacuum sputtering
The voltage of method is 380v, and electric current is 20-30a.
20. vacuum sputtering coating methods according to claim 7 it is characterised in that in step (6), described anti-fingerprint layer
Formed by PFPE, the thickness of described anti-fingerprint layer is 15-25 nanometer.
21. vacuum sputtering coating methods according to claim 7 it is characterised in that step (4) to (6) independently of one another
Carry out under 80-100 degree Celsius.
22. vacuum sputtering coating methods according to claim 7 are it is characterised in that described second wearing layer is anti-with described
Form chemical bonding between finger print layer.
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| CN201610781936.1A CN106367723A (en) | 2016-08-31 | 2016-08-31 | Workpiece, electronic equipment and vacuum sputtering coating method |
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| CN107964649A (en) * | 2017-07-13 | 2018-04-27 | 东莞市隆禧五金塑胶制品有限公司 | Colour-fast coating processing technology |
| CN108284052A (en) * | 2017-06-08 | 2018-07-17 | 深圳市杰尔泰科技有限公司 | A method of mobile phone battery cover is sprayed using ceramic material |
| CN108330434A (en) * | 2018-01-11 | 2018-07-27 | 广东欧珀移动通信有限公司 | Plank and preparation method, shell, electronic equipment |
| CN108342684A (en) * | 2018-05-08 | 2018-07-31 | Oppo广东移动通信有限公司 | Casting of electronic device and preparation method thereof and electronic equipment |
| CN109280887A (en) * | 2017-07-20 | 2019-01-29 | 深圳市诺真空科技有限公司 | A kind of film plating process of fingerprint proof membrane |
| CN109279917A (en) * | 2017-07-20 | 2019-01-29 | 深圳市诺真空科技有限公司 | A kind of film plating process of ceramic surface |
| CN111676450A (en) * | 2020-06-24 | 2020-09-18 | 吉林大学 | Hexagonal boron nitride thick film based on ion beam sputtering deposition and preparation method and application thereof |
| CN113862611A (en) * | 2021-09-30 | 2021-12-31 | 台州星星光电科技有限公司 | Strong-alkali-resistant sapphire glass panel surface coating method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109279917A (en) * | 2017-07-20 | 2019-01-29 | 深圳市诺真空科技有限公司 | A kind of film plating process of ceramic surface |
| CN108330434A (en) * | 2018-01-11 | 2018-07-27 | 广东欧珀移动通信有限公司 | Plank and preparation method, shell, electronic equipment |
| CN108342684A (en) * | 2018-05-08 | 2018-07-31 | Oppo广东移动通信有限公司 | Casting of electronic device and preparation method thereof and electronic equipment |
| CN111676450A (en) * | 2020-06-24 | 2020-09-18 | 吉林大学 | Hexagonal boron nitride thick film based on ion beam sputtering deposition and preparation method and application thereof |
| CN113862611A (en) * | 2021-09-30 | 2021-12-31 | 台州星星光电科技有限公司 | Strong-alkali-resistant sapphire glass panel surface coating method |
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