CN106363267A - Filter solder feeding device of electronic equipment welding device - Google Patents
Filter solder feeding device of electronic equipment welding device Download PDFInfo
- Publication number
- CN106363267A CN106363267A CN201610903889.3A CN201610903889A CN106363267A CN 106363267 A CN106363267 A CN 106363267A CN 201610903889 A CN201610903889 A CN 201610903889A CN 106363267 A CN106363267 A CN 106363267A
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- CN
- China
- Prior art keywords
- solder
- conducting metal
- heat
- cylinder
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a filter solder feeding device of an electronic equipment welding device. The device comprises a heat conducting metal solder cylinder for filling a solder; a thread sealing cover is arranged at one end of the heat conducting metal solder cylinder, and the other end of the heat conducting metal solder cylinder is a conical joint; the conical joint is communicated with a metal hose; a smooth bonding plane is arranged at the end part of the metal hose; two opposite elastic clamping plates are arranged on the bonding plane; the heat conducting metal solder cylinder is provided with a filter plate in one end of the conical joint; multiple filter holes are formed in the filter plate; and transparent observing bars are axially arranged at the periphery of the heat conducting metal solder cylinder. The device can bond the end part of the metal hose at the end part of a tight welding pen, so that the fed liquid solder can be preferably attached at the end part of the tight welding pen without falling on a circuit board; and internal liquid has liquid and solid particles with diameters less than a certain diameter and capable of sending out, so that the dotting is smooth after sending of the solder, and the subsequent welding is convenient.
Description
Technical field
The present invention relates to electronic equipment fusion splicing devices, belong to electronic equipment manufacture field, it is more particularly related to
The filter-type solder pay-off of a kind of electronic equipment fusion splicing devices.
Background technology
Electronic equipment during processing and manufacturing, pcb plate many electric contacts, junction point, fusing point, the position such as pad, all
Need first to stamp welding basic point above, basic point is all to be got ready by melting solder, and conventional solder is all a circle one circle
Aluminum steel, the hand-held aluminum steel line sending of staff one when getting ready, one hand-held welding pen heating so that operation extremely inconvenience, sometimes
Also can there is line sending to lead to not in time get incomplete situation ready, get ready to basic point and bring inconvenience and problem.
Got ready for convenience, existing design has solder pay-off, automatic ration feeding can be carried out to solder,
But, this device and there is following defect: 1, device loads solid solder, solid solder is sent by metal hose after thawing
Go out, but, conventional solder exists and melts uneven situation, that is, internal solids be heated exist inequality of being heated situation so that
Solid melts thoroughly, and the time of thawing has error, thus part solid small particles are sent with liquid, easily makes in welding
Become salient point or out-of-flatness, quality and effect are got in impact ready；2nd, in feeding, there is a spacing with welding pen in its outlet to metal hose
From solder may without being adhered to when flowing out weld tip of the brushstyle of a writing or painting portion and directly fall on pcb plate, thus damaging pcb plate circuit.More than
Two defects all run in actual use, therefore, for more convenient and safety feeding, and ensure feeding effect, I
Need a kind of safer, more uniform solder pay-off of feeding of design.
Content of the invention
Based on above technical problem, the invention provides the filter-type solder feeding dress of a kind of electronic equipment fusion splicing devices
Put, thus solving the technical problem that conventional device feeding is uneven, unloading position is big with a welding deviation.
For solving above technical problem, the technical solution used in the present invention is as follows:
The filter-type solder pay-off of electronic equipment fusion splicing devices, including the heat-conducting metal solder for loading solder
Cylinder, heat-conducting metal solder cylinder one end is provided with thread sealed closure, and the heat-conducting metal solder cylinder other end is conical interface, circular cone
Shape orifice has metal hose, and the end of metal hose has smooth laminating plane, laminating plane is provided with two phases
To elastic clamp, the inside that described heat-conducting metal solder cylinder is located at conical interface one end is additionally provided with screen plate, screen plate
On open up several filtering holes, described heat-conducting metal solder cylinder circumference is axially disposed transparent observing bar.
Preferably, described heat-conducting metal solder cylinder periphery is additionally provided with heat-conducting metal Elastic buckle.
Preferably, described heat-conducting metal solder cylinder is additionally provided with breather positioned at the periphery of thread sealed closure one end.
Preferably, described heat-conducting metal solder cylinder, metal hose, elastic clamp and heat-conducting metal Elastic buckle are all using resistance to
Thermalloy system.
In sum, it is used for employing technique scheme, the invention has the beneficial effects as follows:
1st, present configuration is simple, easy to use, can continue, quantitative, timely carry out solder conveying, during use, it is solid
Being scheduled on need not be hand-held on heating pen or welding pen, gets ready smoothly and get ready complete, extremely practical.
2nd, metal hose end can be adjacent to welding tip of the brushstyle of a writing or painting portion so that the liquid solder sent can be good at by the present invention
It is attached to tight welding tip of the brushstyle of a writing or painting portion, does not fall out on circuit boards, and internal liquid has liquid and consolidating less than certain diameter
Body granule can be sent it is ensured that solder gets flat smooth ready after sending, and is easy to follow-up welding.
Brief description
Fig. 1 is the structural representation of the present invention；
The label of in figure is expressed as: 1, metal hose；2nd, heat-conducting metal solder cylinder；3rd, transparent observing bar；4th, ventilate
Pipe；5th, thread sealed closure；6th, heat-conducting metal Elastic buckle；7th, screen plate；8th, filtering holes；9th, elastic clamp；10th, laminating plane.
Specific embodiment
The present invention is further illustrated below in conjunction with the accompanying drawings.Embodiments of the present invention include but is not limited to following reality
Apply example.
As shown in figure 1, the filter-type solder pay-off of electronic equipment fusion splicing devices, including the heat conduction for loading solder
Metal welding barrel 2, heat-conducting metal solder cylinder 2 one end is provided with thread sealed closure 5, and heat-conducting metal solder cylinder 2 other end is circle
Cone-shaped interface, conical orifice has metal hose 1, and the end of metal hose 1 has smooth laminating plane 10, and laminating is flat
Two relative elastic clamps 9 are provided with face 10, described heat-conducting metal solder cylinder 2 is located at the inside of conical interface one end also
It is provided with screen plate 7, screen plate 7 opens up several filtering holes 8, described heat-conducting metal solder cylinder 2 circumference are axially disposed to be had
Transparent observing bar 3.
When the present embodiment uses, first solder solid is placed in heat-conducting metal solder cylinder 2, then by heat-conducting metal solder
Cylinder 2 is clamped on heating pen or welding pen, and the opening of metal hose 1 is adjacent to the heating plumb joint in heating pen or welding pen
Portion, electrified regulation pen or welding pen heating, heat passes through metal hose 1 and heat-conducting metal Elastic buckle 6 passes to heat-conducting metal
Solder cylinder 2 heats to internal solder, and after solder heating, slow thawing is covered in heating pen or weldering by metal hose 1 outflow
Connect the heating welded header of pen, carry out basic point such that it is able to quantitative offer liquid solder and get ready.
The end of the metal hose 1 of the present embodiment has smooth laminating plane 10, and laminating plane 10 is provided with two
Relative elastic clamp 9, thereby may be ensured that the end of metal hose 1 preferably can be fitted in heating using laminating plane 10
Pen or a welding end sides, and by elastic clamp 9, its clamping is fixed, it is to avoid when using, metal hose 1 rocks or moves
The dynamic change causing unloading position affects to get ready；And the inside that heat-conducting metal solder cylinder 2 is located at conical interface one end also sets up
There is screen plate 7, screen plate 7 opens up several filtering holes 8, then can pass through screen plate 7 by some with diameter greater than filtering holes 8
The solder solid not melted filters, it is to avoid it sends formation salient point or uneven when getting ready, greatly ensure that and gets quality ready
And efficiency.
The present embodiment structure is simple, easy to use, can continue, quantitative, timely carry out solder conveying, during use, it is solid
Being scheduled on need not be hand-held on heating pen or welding pen, gets ready smoothly and get ready complete, extremely practical.
The present embodiment heat-conducting metal solder cylinder 2 periphery also section's setting heat-conducting metal Elastic buckle 6.Heat-conducting metal elastic card
Button 6 can be clamped on overall for heat-conducting metal solder cylinder 2 on heating pen or welding pen, easy to loading and unloading.
The present embodiment can convey in time in order to ensure solder, is located at thread sealed closure 5 in described heat-conducting metal solder cylinder 2
The periphery of one end is additionally provided with breather 4.Breather 4 is internal with heat-conducting metal solder cylinder 2 to be connected, the cigarette that solder thawing causes
Mist can be discharged from there, simultaneously ensure inside and outside pressure equilibrium, it is to avoid internal solder change in volume cause internal pressure too small and
Cannot the problem of discharging it is ensured that being smoothed out of solder.
The heat-conducting metal solder cylinder 2 of the present embodiment, metal hose 1, elastic clamp 9 and heat-conducting metal Elastic buckle 6 are all adopted
Made with heat-resisting alloy.Heat-resisting alloy has higher high-temperature resistant result and heat-conducting effect it is ensured that can permanent work in hot environment use
And ensure heat-conducting effect.
It is embodiments of the invention as mentioned above.Design parameter in above-described embodiment and embodiment is merely to clear
The invention proof procedure of inventor is stated by Chu, and is not used to limit the scope of patent protection of the present invention, the patent protection of the present invention
Scope is still defined by its claims, and the equivalent structure that the description of every utilization present invention and accompanying drawing content are made becomes
Change, should be included in the same manner in protection scope of the present invention.
Claims (4)
1. electronic equipment fusion splicing devices filter-type solder pay-off it is characterised in that: include the heat conduction for loading solder
Metal welding barrel (2), heat-conducting metal solder cylinder (2) one end is provided with thread sealed closure (5), and heat-conducting metal solder cylinder (2) is another
One end is conical interface, and conical orifice has metal hose (1), and the end of metal hose (1) has smooth laminating
Plane (10), laminating plane (10) is provided with two relative elastic clamps (9), described heat-conducting metal solder cylinder (2) is located at
The inside of conical interface one end is additionally provided with screen plate (7), and screen plate (7) opens up several filtering holes (8), described heat conduction
Metal welding barrel (2) circumference is axially disposed transparent observing bar (3).
2. electronic equipment fusion splicing devices according to claim 1 filter-type solder pay-off it is characterised in that: described
Heat-conducting metal solder cylinder (2) periphery is additionally provided with heat-conducting metal Elastic buckle (6).
3. electronic equipment fusion splicing devices according to claim 1 filter-type solder pay-off it is characterised in that: described
The periphery that heat-conducting metal solder cylinder (2) is located at thread sealed closure (5) one end is additionally provided with breather (4).
4. electronic equipment fusion splicing devices according to claim 1 filter-type solder pay-off it is characterised in that: described
Heat-conducting metal solder cylinder (2), metal hose (1), elastic clamp (9) and heat-conducting metal Elastic buckle (6) are all using heat-resisting alloy
Make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610903889.3A CN106363267A (en) | 2016-10-18 | 2016-10-18 | Filter solder feeding device of electronic equipment welding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610903889.3A CN106363267A (en) | 2016-10-18 | 2016-10-18 | Filter solder feeding device of electronic equipment welding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106363267A true CN106363267A (en) | 2017-02-01 |
Family
ID=57894799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610903889.3A Pending CN106363267A (en) | 2016-10-18 | 2016-10-18 | Filter solder feeding device of electronic equipment welding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106363267A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4936501A (en) * | 1989-04-13 | 1990-06-26 | Sergei Babarin | Soldering device |
| CN1864867A (en) * | 2005-05-20 | 2006-11-22 | 富准精密工业(深圳)有限公司 | Coating device |
| CN201105354Y (en) * | 2007-11-09 | 2008-08-27 | 东莞市普赛特电子科技有限公司 | Syringe loaded solder plaster |
| CN101536620A (en) * | 2006-10-17 | 2009-09-16 | 昭和电工株式会社 | Method for forming solder layer on printed-wiring board and slurry discharge device |
| CN201667761U (en) * | 2010-03-23 | 2010-12-08 | 广州依利安达微通科技有限公司 | Copper removing device for lead-free tin spray process |
| CN202037391U (en) * | 2011-04-22 | 2011-11-16 | 孙磊 | Automatic tin-providing electric soldering iron |
| CN203343577U (en) * | 2013-06-24 | 2013-12-18 | 武汉锐泽科技发展有限公司 | Tin feeding pipe device |
| CN204934808U (en) * | 2015-08-17 | 2016-01-06 | 武汉锐泽科技发展有限公司 | Curvedly send tin syringe needle and send tin device |
-
2016
- 2016-10-18 CN CN201610903889.3A patent/CN106363267A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4936501A (en) * | 1989-04-13 | 1990-06-26 | Sergei Babarin | Soldering device |
| CN1864867A (en) * | 2005-05-20 | 2006-11-22 | 富准精密工业(深圳)有限公司 | Coating device |
| CN101536620A (en) * | 2006-10-17 | 2009-09-16 | 昭和电工株式会社 | Method for forming solder layer on printed-wiring board and slurry discharge device |
| CN201105354Y (en) * | 2007-11-09 | 2008-08-27 | 东莞市普赛特电子科技有限公司 | Syringe loaded solder plaster |
| CN201667761U (en) * | 2010-03-23 | 2010-12-08 | 广州依利安达微通科技有限公司 | Copper removing device for lead-free tin spray process |
| CN202037391U (en) * | 2011-04-22 | 2011-11-16 | 孙磊 | Automatic tin-providing electric soldering iron |
| CN203343577U (en) * | 2013-06-24 | 2013-12-18 | 武汉锐泽科技发展有限公司 | Tin feeding pipe device |
| CN204934808U (en) * | 2015-08-17 | 2016-01-06 | 武汉锐泽科技发展有限公司 | Curvedly send tin syringe needle and send tin device |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170201 |
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| RJ01 | Rejection of invention patent application after publication |