CN201105354Y - Syringe loaded solder plaster - Google Patents
Syringe loaded solder plaster Download PDFInfo
- Publication number
- CN201105354Y CN201105354Y CNU2007200593483U CN200720059348U CN201105354Y CN 201105354 Y CN201105354 Y CN 201105354Y CN U2007200593483 U CNU2007200593483 U CN U2007200593483U CN 200720059348 U CN200720059348 U CN 200720059348U CN 201105354 Y CN201105354 Y CN 201105354Y
- Authority
- CN
- China
- Prior art keywords
- solder
- ing
- paste
- urceolus
- syringe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses syringe-packaged solder paste, which comprises an outer tube, a cover-shaped plunger, solder paste, a rear end cover, a front end cover and a solder paste injection head; wherein, the cover-shaped plunger can slide in an intracavity of the outer tube along the axial direction; the solder paste is arranged between the outer tube and the cover-shaped plunger; the rear end cover is clasped with the rear end of the outer tube; an internal thread is arranged at the front end of the outer tube; two external threads are matched with and respectively arranged on the front end cover and the solder paste injection head. By adopting the syringe structure, the syringe-packaged solder paste is especially applicable to coating solder paste on through hole and 3D circuit boards.
Description
Technical field
The utility model relates to the electronic welding technical field, is specifically related to a kind of syringe dress solder(ing) paste that is particularly suitable for coating solder(ing) paste on through hole and 3D circuit board.
Background technology
Solder(ing) paste is to follow surface installation technique (Surface Mount Technology, SMT) a kind of novel welding material that occurs, be extremely important auxiliary material during electronic product is produced, the quality of its quality is directly connected to the quality of surface mount assembly quality.Along with the continuous development of microelectronics solder technology, circuit packing density and reliability requirement are more and more higher, and solder(ing) paste is also had higher requirement in recent years.
At present, the method for coating solder(ing) paste mainly contains three kinds, injection drip be coated with, serigraphy and stencilization.Adopt special distributor or manual carrying out when injection is dripped and to be coated with, use the barreled solder(ing) paste, generally be fit to small lot batch manufacture; Serigraphy is to adopt nylon or the thread material of stainless steel to weave into silk screen, and carves figure in the above, and solder(ing) paste is bitten on the pcb board, generally be fit to packing density not high in, small lot batch manufacture; Stencilization is to adopt brass or stainless steel substrates, carves figure in the above, and solder(ing) paste is printed onto on the pcb board, is used for producing in enormous quantities and packing density height and multilead thin space product.Although stencilization is considered to the most effectively solder(ing) paste coating method for a long time always, but development along with electronics industry, under many situations, the coating of solder(ing) paste can not be used method of printing, for example: the modern 3D circuit that be coated with solder(ing) paste in some through hole, adopts in mobile phone and automotive electronics is coated with solder(ing) paste on the differing heights plane, and the injection of barreled solder(ing) paste is dripped and is coated with because the solder(ing) paste injection volume is difficult for accurate control and can't resolve the problems referred to above equally.
The utility model content
The purpose of this utility model is, a kind of syringe dress solder(ing) paste that is particularly suitable for coating solder(ing) paste on through hole and 3D circuit board is provided.
The technical scheme that the utility model provides is as follows: construct a kind of syringe dress solder(ing) paste, comprise urceolus, outside the lid shape plunger that slides vertically of tube inner chamber, be contained in solder(ing) paste between urceolus and the lid shape plunger, with rear end cap and the drive end bearing bracket and the solder(ing) paste injection head of described outer tube rear end fastening, described outer cylinder front end is provided with internal thread, and described drive end bearing bracket and solder(ing) paste injection head are respectively equipped with the external screw thread that cooperates with it.
Described lid shape plunger is an elastomeric material, and with described urceolus interference fit.
Described urceolus is by being formed near the frustum ante-chamber of front end and the back cavity that is cylindrical-shaped structure of main part, and is corresponding, and described lid shape plunger also is made up of the frustum part and the columnar portion branch that cooperate with described urceolus.
Described solder(ing) paste is a solder(ing) paste for tin bismuth system, tin silver system or tin zinc.
The utlity model has following advantage: adopt syringe cylinder structure, be particularly suitable on through hole and 3D circuit board, being coated with solder(ing) paste; Cover the shape plunger and make the solder(ing) paste in the urceolus all to be extruded cooperating of urceolus; The syringe front and back end is respectively equipped with drive end bearing bracket and rear end cap, and whole syringe can be used as the storage facilities of solder(ing) paste, also is convenient to transportation.
Description of drawings
Fig. 1 is the structural representation of syringe dress solder(ing) paste when loading onto injection head;
Fig. 2 is the STRUCTURE DECOMPOSITION figure of syringe dress solder(ing) paste when loading onto injection head;
Fig. 3 is the structural representation of syringe dress solder(ing) paste when loading onto drive end bearing bracket;
Fig. 4 is the STRUCTURE DECOMPOSITION figure of syringe dress solder(ing) paste when loading onto drive end bearing bracket
The specific embodiment
With reference to Fig. 1-4, a kind of syringe dress solder(ing) paste is provided, comprise urceolus 1, be contained in the lid shape plunger 2 of urceolus 1 inner chamber, rear end cap 3 and drive end bearing bracket 6 and the solder(ing) paste injection head 5 that is contained in solder(ing) paste 4 between urceolus 1 and the lid shape plunger 2, fastens with urceolus 1 rear end, urceolus 1 front end is provided with internal thread 11, and drive end bearing bracket 6 and solder(ing) paste injection head 5 are respectively equipped with the external screw thread 61,51 that cooperates with it.
Urceolus 1 rear end is provided with bead, and rear end cap 3 has the groove that cooperates with it.
Urceolus 1 is by forming near the frustum ante-chamber 12 of front end and 13 of the back cavities that is cylindrical-shaped structure of main part, and is corresponding, and lid shape plunger 2 also is made up of frustum part 21 that cooperates with urceolus 1 and column part 22.Lid shape plunger 2 is an elastomeric material, and column part 22 outer rims are provided with convex, lid shape plunger 2 and urceolus 1 interference fit.
Solder(ing) paste 4 is a solder(ing) paste for tin bismuth system, tin silver system or tin zinc.The solder(ing) paste that uses needs that viscosity is lower, rheological characteristic is better, have the anti-preferably performance of caving in after the coating under pressure.
During production, adopt hydraulic press, under 5-10 ℃ of condition, refrigerate then the solder(ing) paste that the modulates syringe of packing into.When storing, adopt the combination of urceolus 1, lid shape plunger 2, rear end cap 3, solder(ing) paste 4, drive end bearing bracket 6, as shown in Figure 3; During use, adopt the combination of urceolus 1, lid shape plunger 2, rear end cap 3, solder(ing) paste 4, solder(ing) paste injection head 5, as shown in Figure 1, combine with pressure apparatus again, can be implemented in through hole and 3D circuit board etc. and go up the coating solder(ing) paste.
Claims (4)
1, a kind of syringe dress solder(ing) paste, it is characterized in that, comprise urceolus (1), can be at lid shape plunger (2) that urceolus (1) inner chamber slides vertically, the rear end cap (3) and drive end bearing bracket (6) and the solder(ing) paste injection head (5) that are contained in solder(ing) paste (4) between urceolus (1) and the lid shape plunger (2), fasten with described urceolus (1) rear end, described urceolus (1) front end is provided with internal thread (11), and described drive end bearing bracket (6) and solder(ing) paste injection head (5) are respectively equipped with the external screw thread (61,51) that cooperates with it.
2, syringe according to claim 1 dress solder(ing) paste is characterized in that described lid shape plunger (2) is an elastomeric material, and with described urceolus (1) interference fit.
3, syringe dress solder(ing) paste according to claim 1, it is characterized in that, described urceolus (1) is by being formed near the frustum ante-chamber (12) of front end and the back cavity that is cylindrical-shaped structure (13) of main part, accordingly, described lid shape plunger (2) also is made up of the frustum part (21) and the column part (22) that cooperate with described urceolus (1).
4, syringe dress solder(ing) paste according to claim 1 is characterized in that, described solder(ing) paste (4) is a solder(ing) paste for tin bismuth system, tin silver system or tin zinc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200593483U CN201105354Y (en) | 2007-11-09 | 2007-11-09 | Syringe loaded solder plaster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200593483U CN201105354Y (en) | 2007-11-09 | 2007-11-09 | Syringe loaded solder plaster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201105354Y true CN201105354Y (en) | 2008-08-27 |
Family
ID=39957145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200593483U Expired - Fee Related CN201105354Y (en) | 2007-11-09 | 2007-11-09 | Syringe loaded solder plaster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201105354Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105965123A (en) * | 2016-05-31 | 2016-09-28 | 潍坊市高品机械制造有限公司 | Automatic soldering paste coating device |
| CN106363267A (en) * | 2016-10-18 | 2017-02-01 | 成都言行果科技有限公司 | Filter solder feeding device of electronic equipment welding device |
| CN106425004A (en) * | 2016-10-18 | 2017-02-22 | 成都言行果科技有限公司 | Multi-point-position welding flux feeding device of electronic device welding device |
-
2007
- 2007-11-09 CN CNU2007200593483U patent/CN201105354Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105965123A (en) * | 2016-05-31 | 2016-09-28 | 潍坊市高品机械制造有限公司 | Automatic soldering paste coating device |
| CN106363267A (en) * | 2016-10-18 | 2017-02-01 | 成都言行果科技有限公司 | Filter solder feeding device of electronic equipment welding device |
| CN106425004A (en) * | 2016-10-18 | 2017-02-22 | 成都言行果科技有限公司 | Multi-point-position welding flux feeding device of electronic device welding device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201105354Y (en) | Syringe loaded solder plaster | |
| CN111085396A (en) | Gluing device for continuously feeding glue for PCB | |
| CN208873706U (en) | A kind of semiconductor lead frame etching machines | |
| CN112170103A (en) | Energy-saving electronic element device production equipment capable of automatically controlling glue | |
| CN108184313A (en) | True blind hole circuit board manufacturing process | |
| CN207872883U (en) | A kind of stamping die that applicability is wide | |
| CN207711590U (en) | A kind of gold stamping machine base with automatic adjustment machined surface function | |
| WO2003018285A1 (en) | Method and device for forming module electronic component and module electronic component | |
| CN112448251B (en) | Little rectangle connector assembly fixture | |
| CN202475951U (en) | Threaded support column for circuit board | |
| CN208645891U (en) | A kind of automobile support stiffening plate punching molding composite die | |
| CN205762058U (en) | Point Jiao Tongzui and point glue equipment | |
| CN202487420U (en) | Explosion-proof line stamping device for vertical capacitor aluminum shell | |
| CN202818780U (en) | Mounting head structure for multifunctional heterotype chip mounter | |
| DE2060933C3 (en) | Socket for a semiconductor device package and method for its manufacture | |
| CN102843872A (en) | Mounting head structure of multifunctional special chip mounter | |
| CN209206465U (en) | A kind of mold binodal molding glue position ejector sleeve ejecting structure | |
| CN201319379Y (en) | Luminous element assembly | |
| CN206827199U (en) | A kind of L-type pcb board storage rack with fixed magnet | |
| CN219740754U (en) | Resin hole plugging device with positioning function | |
| CN212265651U (en) | A positioning die for cell-phone apron | |
| CN215882280U (en) | Automatic lubricating system for plastic mold | |
| CN207929844U (en) | A kind of auto parts and components diel | |
| CN202085158U (en) | Communication equipment component integrated with antenna | |
| CN202488903U (en) | Working board of PCB (printed circuit board) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: GUANGDONG PERFECTION SCIENCE AND TECHNOLOGY CO., L Free format text: FORMER NAME: DONGGUAN PROFESSIONAL SURFACE TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 523808 Guangdong province Dongguan City Songshan Lake Science and Technology Industrial Park Keyuan song library building B Room 201 Patentee after: Perfection Science and Technology (Dongguan) Co., Ltd. Address before: 523007 productivity building, Songshan Lake Science Park, Guangdong, Dongguan Province, Room 202 Patentee before: Dongguan Professional Surface Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080827 Termination date: 20141109 |
|
| EXPY | Termination of patent right or utility model |