CN106358409B - A kind of communication apparatus metal shell and preparation method thereof - Google Patents
A kind of communication apparatus metal shell and preparation method thereof Download PDFInfo
- Publication number
- CN106358409B CN106358409B CN201510416993.5A CN201510416993A CN106358409B CN 106358409 B CN106358409 B CN 106358409B CN 201510416993 A CN201510416993 A CN 201510416993A CN 106358409 B CN106358409 B CN 106358409B
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- communication apparatus
- metal shell
- groove
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- ing And Chemical Polishing (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to communication apparatus metal shell field, a kind of communication apparatus metal shell and preparation method thereof is disclosed, communication apparatus metal shell of the invention includes metal substrate and decorative layer；The decorative layer covers the metal substrate outer surface；The inner surface of the metal substrate opens up fluted, and the bottom of the groove offers the slit through the metal substrate.Its slit appearance of communication apparatus metal shell provided by the invention is invisible, and metal shell is apparent clean and tidy smooth consistent.
Description
Technical field
The present invention relates to a kind of communication apparatus metal shells and preparation method thereof.
Background technique
Antenna for mobile phone is the equipment on mobile phone for receiving signal, and smart phone is mostly built-in antenna at present, this requires
Cell phone rear cover cannot play shielding action to signal.This problem is not present in plastic cellphone, for the hot topic-metal fuselage risen
How mobile phone solves the problems, such as that signal shielding is the key that one of its design and manufacture.
Currently, metallic mobile phone mostly uses Kaitian's wire casing and the method being molded solves the problems, such as that its airframe signal shields, such as HTC
The two strip antenna slot up and down of ONE, side antenna slot of iphone5/5s etc..The above-mentioned prior art in antenna slot by filling
Plastics carry out the shielding of anti-stop signal, but cause certain destruction to metallic mobile phone fuselage overall structure, and it is whole to affect its appearance
The cleaning and continuity of body.
Summary of the invention
It is an object of the invention to overcome above-mentioned problems of the prior art, a kind of communication apparatus metal shell is provided
And preparation method thereof.Its slit (i.e. antenna slot) appearance of communication apparatus metal shell provided by the invention is invisible, metal shell
It is apparent clean and tidy smooth consistent.
To achieve the goals above, the present invention provides a kind of communication apparatus metal shell, wherein the communication apparatus metal
Shell includes metal substrate and decorative layer；The decorative layer covers the metal substrate outer surface；The interior table of the metal substrate
Face opens up fluted, and the bottom of the groove offers the slit through the metal substrate.
The present invention also provides a kind of preparation methods of communication apparatus metal shell, wherein method includes the following steps:
1) the step of metal substrate surface forms the first protective layer；
2) step of the groove through first protective layer and part metals ground is formed in the inner surface side of metal substrate
Suddenly；
3) first protective layer is removed, and the step of the inner surface of the metal substrate forms the second protective layer；
4) the step of the metal substrate outer surface forms decorative layer；
5) the step of the bottom portion of groove forms the slit for running through metal substrate.
The communication apparatus metal shell obtained by means of the present invention has slit, passes through for communication signal, realizes
Normal communication function.Also, its slit (i.e. antenna slot) appearance of communication apparatus metal shell provided by the invention is invisible, gold
It is apparent clean and tidy smooth consistent to belong to shell.Also, pass through electrophoresis, common anode oxidation, enamelled anodizing, hard anodic oxygen
One of change, differential arc oxidation and spraying or a variety of surfaces in metal substrate form decorative layer and are filled with and fill out in slit in turn
Part is filled, its hardness, wear-resisting, antidetonation and corrosion resisting property can be significantly improved.
Other features and advantages of the present invention will the following detailed description will be given in the detailed implementation section.
Detailed description of the invention
The drawings are intended to provide a further understanding of the invention, and constitutes part of specification, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the schematic cross-section of the preparation process of communication apparatus metal shell of the invention.
Fig. 2 is the schematic cross-section of the communication apparatus metal shell of one embodiment of the present invention.
Description of symbols
1 metal substrate
2 first protective layers
3 grooves
4 second protective layers
5 coverings
6 decorative layers
7 openings
8 slits
9 filling members
Specific embodiment
Detailed description of the preferred embodiments below.It should be understood that described herein specific
Embodiment is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
As shown in Fig. 2, the communication apparatus metal shell includes metal substrate 1 and decorative layer 6；The decorative layer 6 covers
1 outer surface of metal substrate；The inner surface of the metal substrate 1 opens up fluted 3, and the bottom of the groove, which offers, to be run through
The slit 8 of the metal substrate.
Although in addition, it is necessary to which communication of the invention is set, it is noted that schematically illustrating only two slits in Fig. 2
Standby metal shell obviously can have a plurality of slit.
In the present invention, the communication apparatus for example can be with are as follows: mobile phone, tablet computer, laptop, bluetooth headset
Deng.Preferably, the communication apparatus metal shell is mobile phone metal shell.
In the present invention, when the inner surface of the metal shell is defined as being used in communication apparatus, metal shell court
To the surface inside communication apparatus.It is understood that when the outer surface of metal shell is defined as being used in communication apparatus,
Surface of the metal shell towards the external world.In addition, the surfaces externally and internally for being used to prepare the metal substrate of metal shell be also applied for it is above-mentioned
Definition.
In the present invention, the material of the metal substrate can for commonly used in the art for the various metals of communication apparatus,
It such as can be aluminium alloy, stainless steel, magnesium alloy or titanium alloy etc.；Preferably aluminium alloy.
There is no particular limitation for the thickness of the metal substrate, and those skilled in the art can be according to specific communication apparatus
Suitably selected.Such as the thickness of the metal substrate can be 0.3-0.6mm, preferably 0.3-0.5mm, more preferably
0.3-0.4mm。
In the present invention, the groove and the slit are interconnected, real for guaranteeing that antenna and extraneous signal transmit
Now communicate.
For above-mentioned groove, the depth of the groove can be 0.22-0.5mm, preferably 0.22-0.4, more preferably
0.22-0.3。
The width of above-mentioned groove can be 2-5mm, preferably 3-4mm.
The length of above-mentioned groove can be 10-100mm, further preferably 10-60mm.
For above-mentioned slit, the depth of the slit is 0.08-0.15mm, preferably 0.08-0.12mm, more preferably
0.08-0.1mm。
The width of above-mentioned slit can be 30-60 μm, preferably 40-50 μm.
The length of above-mentioned slit can be 10-100mm；Further preferably 10-60mm.In addition, particularly preferably described narrow
The length of seam is identical as the length of the groove.
In addition, there is no particular limitation for the item number of groove and slit, it as long as can be realized communication, such as can be 1-
200, preferably 5-50 item.In addition, when the groove and slit are a plurality of, the spacing between adjacent two grooves can be
2-5mm, preferably 2-3mm.
According to the present invention, the communication apparatus metal shell also has the decorative layer positioned at metal substrate outer surface, described
Decorative layer covers the slit.
It can be to pass through electrophoresis, common anode oxidation, hard anodizing, differential arc oxidation and spraying as above-mentioned decorative layer
One of or a variety of formation decorative layer.
According to the present invention, to the thickness of the decorative layer, there is no particular limitation, can be the general thickness of this field.Example
If the thickness of the decorative layer can be 15-35 μm, preferably 25-35 μm.
In the case where, according to the invention it is preferred to, the communication apparatus metal shell further includes protective layer, and the protective layer covers
Cover the region in addition to slit of the metal substrate inner surface.
It in the present invention, can be the protective layer for passing through electrophoresis and/or spraying formation as above-mentioned protective layer.To the guarantor
There is no particular limitation for the thickness of sheath, such as the thickness of the protective layer can be 5-25 μm, preferably 5-15 μm.
In the case where, according to the invention it is preferred to, the communication apparatus metal shell further includes filling member, the filling member position
In the groove and the slit.
It is highly preferred that the filling member is the filling member formed by UV glue curing.The UV glue is, for example, to be purchased from
The UV glue of 3211 models of Le Tai company.
Shown in (h) as shown in figure 1, in a particularly preferred embodiment of the invention, the communication apparatus metal
Shell includes metal substrate 1, decorative layer 6, protective layer 4 and filling member 9；The decorative layer 6 covers 1 appearance of metal substrate
Face；The inner surface of the metal substrate 1 opens up fluted 3；The bottom of the groove is offered through the narrow of the metal substrate
Seam 8；The protective layer 4 covers the region in addition to slit 8 of 1 inner surface of metal substrate；The filling member 9 is located at described
In groove 3 and the slit 8.
The present invention also provides the preparation methods of above-mentioned communication apparatus metal shell, wherein method includes the following steps:
1) the step of metal substrate surface forms the first protective layer；
2) step of the groove through first protective layer and part metals ground is formed in the inner surface side of metal substrate
Suddenly；
3) first protective layer is removed, and the step of the inner surface of the metal substrate forms the second protective layer；
4) the step of the metal substrate outer surface forms decorative layer；
5) the step of the bottom portion of groove forms the slit for running through metal substrate.
Above-mentioned steps of the invention are described in detail respectively below.
Step 1): in the step of metal substrate surface forms the first protective layer
In the present invention, for the thickness of used metal substrate, there is no particular limitation, and those skilled in the art can
Suitably to be selected according to specific communication apparatus.Such as the thickness of the metal substrate can be 0.3-0.6mm, preferably
For 0.3-0.5mm, more preferably 0.3-0.4mm.
The material of the metal substrate can be for commonly used in the art for the various metals of communication apparatus, such as can be aluminium
Alloy, stainless steel, magnesium alloy or titanium alloy etc.；Preferably aluminium alloy.
In this step, preferably described first protective layer is UV ink layer.
Various method and conditions commonly used in the art, example can be used in the method that metal substrate surface forms UV ink layer
After such as UV ink being sprayed on being located at the metal substrate surface, toasted 20-30 minutes at 70-90 DEG C.
Various UV ink commonly used in the art can be used in above-mentioned UV ink, such as can be UV ink for 5680.
In the present invention, there is no particular limitation for the thickness of the ink layer formed by the above method, can be this field
General thickness, such as the thickness can be 10-30 μm, preferably 15-25 μm.
Shown in (a) as shown in figure 1, pass through the structure for the metal substrate that step 1) obtains are as follows: in the upper following table of metal substrate 1
Face is formed with the first protective layer (UV ink layer) 2.
Step 2): the groove for running through first protective layer and part metals ground is formed in the inner surface side of metal substrate
The step of
This step is used to open up the groove in the inner surface of the metal substrate, as described above, the groove is through described
The groove of first protective layer and part metals ground, that is, the groove is through first protective layer but not exclusively through institute
Metal substrate is stated, thus opens up groove in metal substrate inner surface.
In the present invention, as long as the method that the groove can be opened up in metal substrate inner surface, for opening up
There is no particular limitation for the method for groove, can be method commonly used in the art.Preferably, in this step, pass through purple
Outer light exposure is exposed the UV ink layer formed in step 1), so that the outer surface exposure development in metal substrate goes out 1
Then above ground band forms the groove by etching.
The width of above-mentioned ground band can be 2-5mm, preferably 3-4mm.
It is highly preferred that the length of the ground band is 10-100mm, preferably 10-60mm.
When the ground band is a plurality of, the spacing between adjacent two ground bands is 2-5mm, preferably 2-3mm.
In the present invention, the groove is formed on the outer surface of metal substrate by step 2), namely passes through the erosion
Quarter is etched the metal of the ground region of the metal, forms groove in the ground region of metal substrate.Preferably,
By etching so that the metal substrate thickness of the ground region with a thickness of 0.08-0.15mm；It is highly preferred that passing through erosion
Carve so that the metal substrate thickness of the ground region with a thickness of 0.08-0.12mm；It is further preferred that by etching,
So that the metal substrate thickness of the ground region with a thickness of 0.08-0.1mm.
In the present invention, as long as the etching can reach above-mentioned purpose, the etching of this field routine can be used
Method.Preferably, in step 2), the etching includes acidic etching liquid etching and alkaline etching liquid etching.
Above-mentioned acidic etching liquid is preferably the mixed solution of ferric trichloride, hydrochloric acid and water.It is highly preferred that relative to 100g
Water, the ferric trichloride can be 550-600g, and hydrochloric acid can be 30-50g.In addition, the condition of above-mentioned acidic etching liquid etching
Include: temperature be 10-35 DEG C, the time be 8-10 minutes.
Above-mentioned alkaline etching liquid preferably contains 50-60g/L sodium hydroxide, 50-60g/L sodium carbonate and 50-60g/L nitric acid
The solution of sodium.In addition, it is 35-45 DEG C that the condition of above-mentioned alkaline etching liquid etching, which includes: temperature, the time is 20-40 minutes.
Shown in (b) as shown in figure 1, the structure of the metal substrate 2) obtained through the above steps are as follows: the interior table of metal substrate 1
Face offers the groove 3, and the surface other than the groove 3 of metal substrate 1 is covered with the first protective layer (UV ink layer) 2.
Step 3): first protective layer is removed, and forms the step of the second protective layer in the inner surface of the metal substrate
Suddenly
In this step, first protective layer is first removed, the metal substrate with the groove is obtained.
Shown in (c) of the structure of metal substrate after removing first protective layer as shown in figure 1.
It can be the various methods of this field routine for the method for removing first protective layer.For example, described
It, can be in the case where temperature be 10-35 DEG C, by the metal substrate with the first protective layer in paint stripper when one protective layer is UV ink layer
Middle immersion 10-20min, the paint stripper for example can be the SH-665 for being purchased from four brightness of Dongguan City surface treatment Science and Technology Ltd.
The paint stripper of model.
After removing first protective layer, in order to only form the second protective layer in the inner surface of the metal substrate, need
Second protective layer is formed under conditions of being covered the outer surface of the metal substrate using covering.
It can be using the common various of this field as the covering for covering the outer surface of the metal substrate
Covering.The covering for example can be insulating tape.In addition, the insulating tape can be purchased from the western alliance spy electronics in Shenzhen
Co., Ltd.
As the method for forming second protective layer, there is no particular limitation, in this step, preferably by electrophoresis and/
Or spraying is to form second protective layer.
Condition as the electrophoresis may include: that temperature is 29-31 DEG C, electrophoretic voltage 120-140V, pH 7-9,
Time is 1-3min.In addition, the electrophoresis liquid of the electrophoresis can for the dumb light paint (WNO-1) containing Japanese clear water Co., Ltd. and
The electrophoresis liquid of the polish lacquer (NNO-4) of Japanese clear water Co., Ltd., wherein the dumb light paint (WNO-1) of Japanese clear water Co., Ltd.
Weight ratio with the polish lacquer (NNO-4) of Japanese clear water Co., Ltd. can be 0-4:1, preferably 7:3.In addition, electrophoresis liquid
Solid content can be 8-15 weight %, preferably 13 weight %.
The spraying refers to the organic or inorganic object coating for spraying one or more layers in metallic substrate surface, coating layer thickness
It can control at 10-25 μm.The coating of the spraying for example can be epoxy resin.
In the present invention, the thickness of the second protective layer formed by the above method can be 5-25 μm, preferably 5-15 μ
m。
Shown in (d) as shown in figure 1, the structure of the metal substrate 3) obtained through the above steps are as follows: outside metal substrate 1
Surface shaded has covering 5, and the inner surface of metal substrate 1 is formed with the second protective layer 4.
Step 4): in the step of metal substrate outer surface forms decorative layer
The outer surface formation decorative layer for the metal substrate that this step is used to obtain in step 3).
In this step, the covering that first remove the outer surface of the metal substrate, then in the metal substrate
Outer surface forms decorative layer.
The decorative layer can be carried out using the conventional method and condition of this field, such as can pass through electrophoresis, common sun
One of pole oxidation, enamelled anodizing, hard anodizing, differential arc oxidation and spraying or a variety of surfaces in metal substrate
Form decorative layer.
According to the present invention, the thickness of the decorative layer can be 15-35 μm.
Condition as the electrophoresis may include: that temperature is 28-32 DEG C, voltage 140-200V, time 1-3min,
PH is 7-9.In addition, the electrophoresis liquid of the electrophoresis can be the dumb light paint (WNO-1) containing Japanese clear water Co., Ltd. and Japan
The electrophoresis liquid of the polish lacquer (NNO-4) of clear water Co., Ltd., wherein the dumb light paint (WNO-1) of Japanese clear water Co., Ltd. and day
The weight ratio of the polish lacquer (NNO-4) of this clear water Co., Ltd. can be 0-4:1, preferably 7:3.In addition, consolidating for electrophoresis liquid contains
Amount can be 8-15 weight %, preferably 13 weight %.It is usually 25-35 by the decorative layer thickness that above-mentioned electrophoresis method is formed
μm。
Condition as common anode oxidation may include: that anode voltage is 13-17V, and temperature is 17-21 DEG C, oxygen
The change time is 30-60min.In addition, anodizing solution is 180-200g/L sulfuric acid.The dress formed by above-mentioned anode oxidation method
Adoring thickness degree is usually 15-25 μm.
Condition as the hard anodizing may include: that current density is 4A/dm2, time 30-60min, temperature
Degree is 5-10 DEG C, and electrolyte is 180-200g/L sulfuric acid and 5-15g/L oxalic acid.It is formed by above-mentioned Hard anode oxidation method
Decorative layer thickness is usually 25-45 μm.
Condition as the enamelled anodizing may include: voltage be 80-120V, oxidization time 30-60min,
Oxidizing temperature is 30-50 DEG C.In addition, porcelain anolyte is 40-50g/L titanium potassium oxalate, 1-4g/L oxalic acid, 6-10g/L boron
Acid and 0.5-2g/L citric acid.It is usually 15-30 μm by the decorative layer thickness that above-mentioned enamelled anodizing method is formed.
Condition as the differential arc oxidation may include: that oxidizing temperature is 20-30 DEG C, aoxidize forward voltage: 400-
600V, oxidization time 40-100min.In addition, the composition of micro-arc oxidation electrolyte are as follows: 0.02-0.05mol/L sodium metasilicate and
0.03-0.07mol/L sodium hydroxide.It is usually 15-40 μm by the decorative layer thickness that above-mentioned differential arc oxidation method is formed.
The spraying refers to the organic or inorganic object coating for spraying one or more layers in metallic substrate surface, coating layer thickness
It can control at 10-50 μm.The coating of the spraying for example can be epoxy resin.
According to the present invention, in step 4), it is preferable that before the surface of metal substrate forms decorative layer, preferably to institute
State metal substrate carry out pre-treatment, with clean surface it is dirty and improve lustrous surface.
The method of the pre-treatment preferably uses following steps to carry out:
(1) at 50-70 DEG C, metal substrate is subjected to alkaline etching 1-2min in Alkaline etchant, then cleans 2 with deionized water
It is secondary；
(2) at 10-35 DEG C, light 3-5min is gone out in light-emitting solution, is then cleaned 2 times with deionized water；
(3) at 10-35 DEG C, 10-30s is polished changing to throw in liquid, is then cleaned 2 times with deionized water.
Above-mentioned Alkaline etchant is preferably 15-20g/L sodium hydroxide solution；Above-mentioned light-emitting solution is preferably 200-300ml/L nitric acid
Solution；It is preferably the solution containing 650-750ml/L phosphoric acid and 350-250ml/L sulfuric acid that describedization, which throws liquid,.
Shown in (e) as shown in figure 1, the structure of the metal substrate 4) obtained through the above steps are as follows: the appearance of metal substrate 1
Face is covered with decorative layer 6, and the inner surface of metal substrate 1 opens up fluted 3, and the inner surface of metal substrate 1 is formed with the second guarantor
Sheath 4.
Step 5): in the step of bottom portion of groove forms the slit for running through metal substrate
In this step, it can adopt and be formed with the conventional methods in the field in the bottom portion of groove through the narrow of metal substrate
Seam.But this step preferably includes: the step of the bottom portion of groove forms the slit for running through metal substrate
(1) opening is formed on the second protective layer of the bottom portion of groove with the metal of the exposure metal substrate；
(2) alkaline etching liquid etching is carried out to exposed metal substrate, to form slit.
In the present invention, it is preferred to form opening on the second protective layer of the bottom portion of groove by laser.Additionally, it is preferred that
The length of the opening formed in groove and the length of groove are identical.
The width of the opening can be 30-60 μm；Preferably 30-40 μm.
Condition as the laser can be with are as follows: power 70% walks ray velocity 3000mm/s, frequency 80KHz.
Shown in (f) as shown in figure 1, the structure for the metal substrate that (1) obtains through the above steps are as follows: outside metal substrate 1
Surface is covered with decorative layer 6, and the inner surface of metal substrate 1 opens up fluted 3, and the inner surface of metal substrate 1 is formed with the second guarantor
Sheath 4, the second protective layer have opening 7 in 3 bottom of groove.
In step (2), the alkaline etching liquid be containing 50-60g/L sodium hydroxide, 50-60g/L sodium carbonate and
The solution of 50-60g/L sodium nitrate, it is 35-45 DEG C that the condition of the alkalies etching, which includes: temperature, and the time is 10-20 minutes.
Shown in (g) as shown in figure 1, the structure for the metal substrate that (2) obtain through the above steps are as follows: outside metal substrate 1
Surface is covered with decorative layer 6, and the inner surface of metal substrate 1 opens up fluted 3, and the inner surface of metal substrate 1 is formed with the second guarantor
Sheath 4 offers the slit 8 through metal substrate 1 in 3 bottom of groove.
In the case where, according to the invention it is preferred to, the preparation method of communication apparatus metal shell of the invention further includes step
6): the step of filling UV glue in the groove and the slit and solidifying.
According to the present invention, before filling UV glue in the groove and the slit, it can remove or do not remove described
Second protective layer.
The UV glue can be various UV glue commonly used in the art, and the UV glue is, for example, the Le Tai company that is purchased from
The UV glue of 3211 models.In addition, the curing method of the UV glue can be carried out using conventional method in that art, such as can be with
For ultraviolet photoetching.The condition of the ultraviolet photoetching is well known in the art, does not state herein tired.
Shown in (h) as shown in figure 1, the structure of the metal substrate 6) obtained through the above steps are as follows: the appearance of metal substrate 1
Face is covered with decorative layer 6, and the inner surface of metal substrate 1 opens up fluted 3, and the inner surface of metal substrate 1 is formed with the second protection
Layer 4 offers the slit 8 through metal substrate 1 in 3 bottom of groove, and have in groove 3 and slit 8 filling member 9 (namely by
Filling member 9 is filled).
The present invention will be described in detail by way of examples below.But the present invention is not limited in following embodiments.
Embodiment 1
1) aluminium alloy (is purchased from Dongguan City port ancient sacrificial bronze ware and belongs to company, Materials Co., Ltd, the trade mark 6063, with a thickness of 0.4mm)
The size of 15mm x 80mm is cut into as metal substrate.On metal substrate surface, spraying 5680 is that UV ink (is purchased from Shenzhen ten thousand
Good original is refined Science and Technology Co., Ltd., same as below) after, after then being toasted 25 minutes at 80 DEG C, carries out uv-exposure and (expose
Striation part is time 2min, luminous intensity 800mJ/cm2), form the ground band of 2 2mm wide, wherein the length of the ground band
Degree is 75mm, and the spacing between adjacent two ground bands is 3mm.In addition, formed UV ink layer with a thickness of 20 μm.
2) after the metal substrate for obtaining step 1) carries out acidic etching liquid etching, then alkaline etching liquid etching is carried out.Its
In, the acidic etching liquid is the mixed solution of the water of the ferric trichloride of 550g, the hydrochloric acid of 30g and 100g, the acid erosion
Carve the condition of liquid etching are as follows: temperature is 30 DEG C, and the time is 10 minutes；The alkaline etching liquid be containing 50g/L sodium hydroxide,
The solution of 50g/L sodium carbonate and 50g/L sodium nitrate, the condition of the alkaline etching liquid etching are as follows: temperature is 40 DEG C, the time 33
Minute.It obtains opening up reeded metal substrate in the inner surface of metal substrate as a result, wherein the width of the groove is 2mm
Left and right, the metal substrate of recess region is with a thickness of 0.08mm or so, and the length of groove is 75mm, and the spacing between adjacent grooves is
2mm。
3) pass through the soaking in the paint stripper for being purchased from the SH-665 model that four brightness of Dongguan City is surface-treated Science and Technology Ltd.
15min removes the ink layer on the metal substrate surface.
It 4) will be outside the metal substrate with insulating tape (being purchased from Xi Mengte Electronics Co., Ltd., Shenzhen, same as below)
Surface shaded, and the protective layer with a thickness of 10 μm is formed in the inner surface of the metal substrate by electrophoresis；Wherein, electrophoresis liquid
Are as follows: the dumb light paint (WNO-1) of Japanese clear water Co., Ltd.: polish lacquer (NNO-4)=7:3 (weight of Japanese clear water Co., Ltd.
Than the solid content of electrophoresis liquid is 13 weight %), the condition of electrophoresis is that voltage is 140V, and time 1min, temperature is 30 DEG C, pH
It is 7.8.
5) insulating tape of the outer surface of the metal substrate is removed, and by electrophoresis in the outer surface of the metal substrate
Form the decorative layer with a thickness of 30 μm.Wherein, electrophoresis liquid are as follows: the dumb light paint (WNO-1) of Japanese clear water Co., Ltd.: Japanese clear water
Polish lacquer (the NNO-4)=7:3 (weight ratio, the solid content of electrophoresis liquid are 13 weight %) of Co., Ltd., the condition of electrophoresis are as follows: temperature
Degree is 30 DEG C, voltage 160V, time 2min, pH 7.8.
6) 30 μm of wide openings are formed on the protective layer of bottom portion of groove to expose the metal (In of metal substrate by laser
The length of the opening formed in groove is identical as the length of groove)；Wherein, the condition of laser are as follows: power 70% walks ray velocity
3000mm/s, frequency 80KHz.
7) metal substrate exposed to 30 μm described in step 6) wide of opening carries out alkaline etching liquid etching and removes 30 μm
The remaining metal of wide opening, the slit for being 30 μm with formation width, wherein the alkaline etching liquid is to contain 50g/L hydrogen
The solution of sodium oxide molybdena, 50g/L sodium carbonate and 50g/L sodium nitrate, it is 40 DEG C that the condition of the alkalies etching, which includes: temperature,
Time is 12 minutes.
8) glue is filled in the groove and slit of the metal substrate (be purchased from the UV glue of 3211 models of Le Tai company
Water) after ultraviolet light intensity be 800mJ/cm2Under conditions of solidified, thus obtain communication apparatus metal shell.
Shown in (h) of the structure of the above-mentioned communication apparatus metal shell being prepared as shown in figure 1: communication apparatus metal shell
Outer surface is covered with decorative layer 6, and the inner surface of metal substrate 1 opens up fluted 3, and the inner surface of metal substrate 1 is formed with second
Protective layer 4 offers the slit 8 through metal substrate 1 in 3 bottom of groove, and has filling member 9 in groove 3 and slit 8.It should
Its slit (i.e. antenna slot) appearance of communication apparatus metal shell is invisible, and metal shell is apparent clean and tidy smooth consistent.
Embodiment 2
1) aluminium alloy (is purchased from Dongguan City port ancient sacrificial bronze ware and belongs to company, Materials Co., Ltd, the trade mark 6063, with a thickness of 0.4mm)
The size of 15mm x 80mm is cut into as metal substrate.After metal substrate surface spraying 5680 is UV ink, then 80
After toasting 25 minutes at DEG C, carrying out uv-exposure, (conditions of exposure is time 2min, luminous intensity 800mJ/cm2), form 2
The ground band of 3mm wide, wherein the length of the ground band is 75mm, and the spacing between adjacent two ground bands is 3mm.In addition,
The UV ink layer of formation with a thickness of 20 μm.
2) after the metal substrate for obtaining step 1) carries out acidic etching liquid etching, alkaline etching liquid etching is being carried out.Its
In, the acidic etching liquid is the mixed solution of the water of the ferric trichloride of 550g, the hydrochloric acid of 30g and 100g, the acid etching
The condition of liquid etching are as follows: temperature is 30 DEG C, and the time is 10 clocks；The alkaline etching liquid is to contain 50g/L sodium hydroxide, 50g/L
The solution of sodium carbonate and 50g/L sodium nitrate, the condition of the alkaline etching liquid etching are as follows: temperature is 40 DEG C, and the time is 27 points
Clock.It obtains opening up reeded metal substrate in the inner surface of metal substrate as a result, wherein the width of the groove is 3mm left
The right side, the metal substrate of recess region is with a thickness of 0.12mm or so, and the length of groove is 75mm, and the spacing between adjacent grooves is
3mm。
3) pass through the soaking in the paint stripper for being purchased from the SH-665 model that four brightness of Dongguan City is surface-treated Science and Technology Ltd.
10min removes the ink layer on the metal substrate surface.
4) outer surface of the metal substrate is covered with insulating tape, and passes through electrophoresis in the interior table of the metal substrate
The protective layer that face is formed with a thickness of 10 μm；Wherein, electrophoresis liquid are as follows: the dumb light paint (WNO-1) of Japanese clear water Co., Ltd.: Japan is clear
Polish lacquer (NNO-4)=7:3 (weight ratio, the solid content of electrophoresis liquid are 13 weight %) of Water Co., Ltd, the item of the electrophoresis
Part is that voltage is 140V, and time 1min, temperature is 30 DEG C, pH 7.8.
5) insulating tape of the outer surface of the metal substrate is removed, and aoxidizes to obtain with a thickness of 20 μm by common anode
Decorative layer.Wherein, the condition of common anode oxidation are as follows: anode voltage 15V, temperature are 19 DEG C, oxidization time 50min.
In addition, anodizing solution is 190g/L sulfuric acid.
6) 50 μm of wide openings are formed on the protective layer of bottom portion of groove to expose the metal (In of metal substrate by laser
The length of the opening formed in groove is identical as the length of groove)；Wherein, the condition of laser are as follows: power 70% walks ray velocity
3000mm/s, frequency 80KHz.
7) metal substrate exposed to 50 μm described in step 6) wide of opening carries out alkaline etching liquid etching and removes 50 μm
The remaining metal of wide opening, the slit for being 50 μm with formation width, wherein the alkaline etching liquid is to contain 50g/L hydrogen
The solution of sodium oxide molybdena, 50g/L sodium carbonate and 50g/L sodium nitrate, it is 40 DEG C that the condition of the alkalies etching, which includes: temperature,
Time is 17 minutes.
8) glue is filled in the groove and slit of the metal substrate (be purchased from the UV glue of 3211 models of Le Tai company
Water) after ultraviolet light intensity be 800mJ/cm2Under conditions of solidified, thus obtain communication apparatus metal shell.
Shown in (h) of the structure of the above-mentioned communication apparatus metal shell being prepared as shown in figure 1: communication apparatus metal shell
Outer surface is covered with decorative layer 6, and the inner surface of metal substrate 1 opens up fluted 3, and the inner surface of metal substrate 1 is formed with second
Protective layer 4 offers the slit 8 through metal substrate 1 in 3 bottom of groove, and has filling member 9 in groove 3 and slit 8.It should
Its slit (i.e. antenna slot) appearance of communication apparatus metal shell is invisible, and metal shell is apparent clean and tidy smooth consistent.
Embodiment 3
1) aluminium alloy (is purchased from Dongguan City port ancient sacrificial bronze ware and belongs to company, Materials Co., Ltd, the trade mark 6063, with a thickness of 0.4mm)
The size of 15mm x 80mm is cut into as metal substrate.After metal substrate surface spraying 5680 is UV ink, then 80
After toasting 25 minutes at DEG C, carrying out uv-exposure, (conditions of exposure is time 2min, luminous intensity 800mJ/cm2), form 2
The ground band of 5mm wide, wherein the length of the ground band is 75mm, the spacing between adjacent two ground bands is 3mm.In addition,
The UV ink layer of formation with a thickness of 20 μm.
2) after the metal substrate for obtaining step 1) carries out acidic etching liquid etching, alkaline etching liquid etching is being carried out.Its
In, the acidic etching liquid is the mixed solution of the water of the ferric trichloride of 550g, the hydrochloric acid of 30g and 100g, the acid etching
The condition of liquid etching are as follows: temperature is 30 DEG C, and the time is 10 minutes；The alkaline etching liquid is to contain 50g/L sodium hydroxide, 50g/
The solution of L sodium carbonate and 50g/L sodium nitrate, the condition of the alkaline etching liquid etching are as follows: temperature is 40 DEG C, and the time is 24 points
Clock.It obtains opening up reeded metal substrate in the inner surface of metal substrate as a result, wherein the width of the groove is 5mm left
The right side, the metal substrate of recess region is with a thickness of 0.15mm or so, and the length of groove is 75mm, and the spacing between adjacent grooves is
3mm。
3) pass through the soaking in the paint stripper for being purchased from the SH-665 model that four brightness of Dongguan City is surface-treated Science and Technology Ltd.
10min removes the ink layer on the metal substrate surface.
4) outer surface of the metal substrate is covered with insulating tape, and passes through electrophoresis in the interior table of the metal substrate
The protective layer that face is formed with a thickness of 10 μm；Wherein, electrophoresis liquid are as follows: the dumb light paint (WNO-1) of Japanese clear water Co., Ltd.: Japan is clear
Polish lacquer (NNO-4)=7:3 (weight ratio, the solid content of electrophoresis liquid are 13 weight %) of Water Co., Ltd, the item of the electrophoresis
Part is that voltage is 140V, and time 1min, temperature is 30 DEG C, pH 7.8.
5) insulating tape of the outer surface of the metal substrate is removed, and is obtained by enamelled anodizing with a thickness of 35 μm
Decorative layer.Wherein, it is 100V that the condition of enamelled anodizing, which is voltage, and oxidization time 50min, oxidizing temperature is 40 DEG C.
In addition, porcelain anolyte is 15g/L titanium potassium oxalate, 9g/L oxalic acid, 8g/L boric acid and 1g/L citric acid.
6) 60 μm of wide openings are formed on the protective layer of bottom portion of groove to expose the metal (In of metal substrate by laser
The length of the opening formed in groove is identical as the length of groove)；Wherein, the condition of laser are as follows: power 70% walks ray velocity
3000mm/s, frequency 80KHz.
7) metal substrate exposed to 60 μm described in step 6) wide of opening carries out alkaline etching liquid etching and removes 60 μm
The remaining metal of wide opening, the slit for being 60 μm with formation width, wherein the alkaline etching liquid is to contain 50g/L hydrogen
The solution of sodium oxide molybdena, 50g/L sodium carbonate and 50g/L sodium nitrate, it is 40 DEG C that the condition of the alkalies etching, which includes: temperature,
Time is 20 minutes.
8) glue is filled in the groove and slit of the metal substrate (be purchased from the UV glue of 3211 models of Le Tai company
Water) after ultraviolet light intensity be 800mJ/cm2Under conditions of solidified, thus obtain communication apparatus metal shell.
Shown in (h) of the structure of the above-mentioned communication apparatus metal shell being prepared as shown in figure 1: communication apparatus metal shell
Outer surface is covered with decorative layer 6, and the inner surface of metal substrate 1 opens up fluted 3, and the inner surface of metal substrate 1 is formed with second
Protective layer 4 offers the slit 8 through metal substrate 1 in 3 bottom of groove, and has filling member 9 in groove 3 and slit 8.It should
Its slit (i.e. antenna slot) appearance of communication apparatus metal shell is invisible, and metal shell is apparent clean and tidy smooth consistent.
Embodiment 4
It carries out according to the method for embodiment 1, unlike, in step 5), obtained by differential arc oxidation with a thickness of 20 μm
Decorative layer.Wherein, the condition of differential arc oxidation are as follows: oxidizing temperature is 30 DEG C, and oxidation forward voltage is 600V, and oxidization time is
30min.In addition, the composition of micro-arc oxidation electrolyte are as follows: 0.03mol/L sodium metasilicate and 0.05mol/L sodium hydroxide.Similarly
To communication apparatus metal shell.
Shown in (h) of the structure of the above-mentioned communication apparatus metal shell being prepared as shown in figure 1: communication apparatus metal shell
Outer surface is covered with decorative layer 6, and the inner surface of metal substrate 1 opens up fluted 3, and the inner surface of metal substrate 1 is formed with second
Protective layer 4 offers the slit 8 through metal substrate 1 in 3 bottom of groove, and has filling member 9 in groove 3 and slit 8.It should
Its slit (i.e. antenna slot) appearance of communication apparatus metal shell is invisible, and metal shell is apparent clean and tidy smooth consistent.
Embodiment 5
It carries out according to the method for embodiment 1, unlike, in step 5), obtained by differential arc oxidation with a thickness of 30 μm
Decorative layer.Wherein, the condition of differential arc oxidation are as follows: oxidizing temperature is 30 DEG C, and oxidation forward voltage is 600V, and oxidization time is
40min.In addition, the composition of micro-arc oxidation electrolyte are as follows: 0.03mol/L sodium metasilicate and 0.05mol/L sodium hydroxide.Similarly
To communication apparatus metal shell.
Shown in (h) of the structure of the above-mentioned communication apparatus metal shell being prepared as shown in figure 1: communication apparatus metal shell
Outer surface is covered with decorative layer 6, and the inner surface of metal substrate 1 opens up fluted 3, and the inner surface of metal substrate 1 is formed with second
Protective layer 4 offers the slit 8 through metal substrate 1 in 3 bottom of groove, and has filling member 9 in groove 3 and slit 8.It should
Its slit (i.e. antenna slot) appearance of communication apparatus metal shell is invisible, and metal shell is apparent clean and tidy smooth consistent.
Embodiment 6
It carries out according to the method for embodiment 1, unlike, in step 5), obtained by differential arc oxidation with a thickness of 25 μm
Decorative layer.Wherein, the condition of differential arc oxidation are as follows: oxidizing temperature is 30 DEG C, and oxidation forward voltage is 600V, and oxidization time is
35min.In addition, the composition of micro-arc oxidation electrolyte are as follows: 0.03mol/L sodium metasilicate and 0.05mol/L sodium hydroxide.Similarly
To communication apparatus metal shell.
Shown in (h) of the structure of the above-mentioned communication apparatus metal shell being prepared as shown in figure 1: communication apparatus metal shell
Outer surface is covered with decorative layer 6, and the inner surface of metal substrate 1 opens up fluted 3, and the inner surface of metal substrate 1 is formed with second
Protective layer 4 offers the slit 8 through metal substrate 1 in 3 bottom of groove, and has filling member 9 in groove 3 and slit 8.It should
Its slit (i.e. antenna slot) appearance of communication apparatus metal shell is invisible, and metal shell is apparent clean and tidy smooth consistent.
Through the foregoing embodiment it is found that its slit (i.e. day of the communication apparatus metal shell obtained by means of the present invention
Wire casing) appearance is invisible, and metal shell is apparent clean and tidy smooth consistent.Also, pass through electrophoresis, common anode oxidation, porcelain
One of anodic oxidation, differential arc oxidation and spraying or a variety of surfaces in metal substrate form decorative layer, are filled in slit
Filling member can significantly improve its hardness, wear-resisting, antidetonation and corrosion resisting property.
The preferred embodiment of the present invention has been described above in detail, still, during present invention is not limited to the embodiments described above
Detail within the scope of the technical concept of the present invention can be with various simple variants of the technical solution of the present invention are made, this
A little simple variants all belong to the scope of protection of the present invention.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case where shield, can be combined in any appropriate way, in order to avoid unnecessary repetition, the present invention to it is various can
No further explanation will be given for the combination of energy.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should also be regarded as the disclosure of the present invention.
Claims (40)
1. a kind of communication apparatus metal shell, which is characterized in that the communication apparatus metal shell includes metal substrate and decoration
Layer；The decorative layer covers the metal substrate outer surface；The inner surface of the metal substrate open up it is fluted, the groove
Bottom offers the slit through the metal substrate, and the decorative layer covers the slit, and the decorative layer by electrophoresis,
One of common anode oxidation, enamelled anodizing, hard anodizing and differential arc oxidation or a variety of formation, the communication are set
Standby metal shell further includes filling member, and the filling member is located in the groove and the slit.
2. communication apparatus metal shell according to claim 1, wherein the depth of the groove is 0.22-0.5mm；Institute
The width for stating groove is 2-5mm；The length of the groove is 10-100mm.
3. communication apparatus metal shell according to claim 2, wherein the depth of the groove is 0.22-0.4mm；Institute
The width for stating groove is 3-4mm；The length of the groove is 10-60mm.
4. communication apparatus metal shell according to claim 3, wherein the depth of the groove is 0.22-0.3mm.
5. the communication apparatus metal shell according to any one of claim 2-4, wherein when groove is a plurality of, phase
Spacing between adjacent two grooves is 2-5mm.
6. communication apparatus metal shell described in any one of -4 according to claim 1, wherein the depth of the slit is
0.08-0.15mm；The width of the slit is 30-60 μm；The length of the slit is 10-100mm.
7. communication apparatus metal shell according to claim 6, wherein the depth of the slit is 0.08-0.12mm；Institute
The width for stating slit is 40-50 μm；The length of the slit is 10-60mm.
8. communication apparatus metal shell according to claim 7, wherein the depth of the slit is 0.08-0.1mm.
9. communication apparatus metal shell according to claim 1, wherein the decorative layer with a thickness of 15-35 μm.
10. communication apparatus metal shell according to claim 1, wherein the communication apparatus metal shell further includes protecting
Sheath, the protective layer cover the region in addition to slit of the metal substrate inner surface.
11. communication apparatus metal shell according to claim 10, wherein the protective layer with a thickness of 5-25 μm.
12. communication apparatus metal shell according to claim 1, wherein the metal substrate be aluminium alloy, stainless steel,
Magnesium alloy or titanium alloy.
13. communication apparatus metal shell according to claim 12, wherein the metal substrate with a thickness of 0.3-
0.6mm。
14. communication apparatus metal shell according to claim 13, wherein the metal substrate with a thickness of 0.3-
0.5mm。
15. communication apparatus metal shell according to claim 14, wherein the metal substrate with a thickness of 0.3-
0.4mm。
16. communication apparatus metal shell according to claim 1, wherein the filling member is formed by UV glue curing.
17. communication apparatus metal shell according to claim 10, wherein the protective layer passes through electrophoresis and/or spraying
It is formed.
18. communication apparatus metal shell according to claim 1, wherein the communication apparatus metal shell is mobile phone gold
Belong to shell.
19. a kind of preparation method of communication apparatus metal shell, which is characterized in that method includes the following steps:
1) the step of metal substrate surface forms the first protective layer；
2) the step of the inner surface side of metal substrate forms the groove through first protective layer and part metals ground；
3) first protective layer is removed, and the step of the inner surface of the metal substrate forms the second protective layer；
4) pass through one of electrophoresis, common anode oxidation, enamelled anodizing, hard anodizing, differential arc oxidation and spraying
Or it is a variety of the step of the metal substrate outer surface forms decorative layer；
5) the step of the bottom portion of groove forms the slit for running through metal substrate.
20. according to the method for claim 19, wherein in step 1), first protective layer is UV ink layer.
21. according to the method for claim 20, wherein the UV ink layer with a thickness of 10-30 μm.
22. according to the method for claim 19, wherein in step 2), pass through the outer surface exposure development in metal substrate
Out after 1 or more ground band, the groove is formed by etching.
23. according to the method for claim 22, wherein in step 2), by etching, so that the gold of the ground region
Belong to ground with a thickness of 0.08-0.15mm.
24. the method according to claim 22 or 23, wherein the width of the ground band is 2-5mm.
25. according to the method for claim 24, wherein the length of the ground band is 10-100mm.
26. according to the method for claim 25, wherein when the ground band is a plurality of, between adjacent two ground bands
Spacing be 2-5mm.
27. the method according to claim 22 or 23, wherein in step 2), the etching includes that acidic etching liquid etches
It is etched with alkaline etching liquid.
28. according to the method for claim 27, wherein the acidic etching liquid is the mixing of ferric trichloride, hydrochloric acid and water
Solution, it is 10-35 DEG C that the condition of the acidic etching liquid etching, which includes: temperature, and the time is 8-12 minutes；
The alkaline etching liquid is to contain the molten of 50-60g/L sodium hydroxide, 50-60g/L sodium carbonate and 50-60g/L sodium nitrate
The condition of liquid, the alkaline etching liquid etching includes: 35-45 DEG C of temperature, time 20-40min.
29. according to the method for claim 19, wherein in step 3), after the outer surface of the metal substrate is covered, lead to
It crosses electrophoresis and/or spraying forms second protective layer.
30. according to the method for claim 29, wherein second protective layer with a thickness of 5-25 μm.
31. according to the method for claim 19, wherein the decorative layer with a thickness of 15-35 μm.
32. according to the method for claim 19, wherein in step 5), formed in the bottom portion of groove and run through metal substrate
Slit the step of include:
(1) opening is formed on the second protective layer of the bottom portion of groove with the metal of the exposure metal substrate；
(2) alkaline etching liquid etching is carried out to exposed metal substrate, to form slit.
33. according to the method for claim 32, wherein the width of the opening is 30-60 μm.
34. according to the method for claim 33, wherein described in being formed on the protective layer of the bottom portion of groove by laser
Opening.
35. according to the method for claim 32, wherein the alkaline etching liquid is to contain 50-60g/L sodium hydroxide, 50-
The solution of 60g/L sodium carbonate and 50-60g/L sodium nitrate.
36. according to the method for claim 35, wherein it is 35-45 that the condition of the alkaline etching liquid etching, which includes: temperature,
DEG C, the time is 10-20 minutes.
37. according to the method for claim 19, wherein this method further includes filling UV in the groove and the slit
Glue and the step of solidify.
38. according to the method for claim 19, wherein the metal substrate is that aluminium alloy, stainless steel, magnesium alloy or titanium close
Gold.
39. according to the method for claim 38, wherein the metal substrate with a thickness of 0.3-0.6mm.
40. according to the method for claim 19, wherein the communication apparatus metal shell is mobile phone metal shell.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510416993.5A CN106358409B (en) | 2015-07-15 | 2015-07-15 | A kind of communication apparatus metal shell and preparation method thereof |
| PCT/CN2015/098292 WO2017008443A1 (en) | 2015-07-15 | 2015-12-22 | Communication device metal housing and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510416993.5A CN106358409B (en) | 2015-07-15 | 2015-07-15 | A kind of communication apparatus metal shell and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106358409A CN106358409A (en) | 2017-01-25 |
| CN106358409B true CN106358409B (en) | 2019-11-22 |
Family
ID=57756776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510416993.5A Active CN106358409B (en) | 2015-07-15 | 2015-07-15 | A kind of communication apparatus metal shell and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106358409B (en) |
| WO (1) | WO2017008443A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109501503A (en) * | 2017-09-15 | 2019-03-22 | 昇印光电（昆山）股份有限公司 | Decorating film and deckboard |
| WO2019084708A1 (en) * | 2017-10-30 | 2019-05-09 | 深圳传音通讯有限公司 | Pressure holding fixture, mobile phone back cover and manufacturing method therefor |
| CN109747105A (en) * | 2017-11-02 | 2019-05-14 | 比亚迪股份有限公司 | Shell and preparation method thereof and electronic product |
| US11330734B2 (en) | 2020-05-28 | 2022-05-10 | Htc Corporation | Case assembly and electronic device |
| CN114107904B (en) * | 2020-08-25 | 2024-03-12 | 荣耀终端有限公司 | Manufacturing method of structural part, structural part and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540341A (en) * | 2014-10-23 | 2015-04-22 | 深圳富泰宏精密工业有限公司 | Shell, electronic device employing shell and manufacture method of shell |
| CN104735942A (en) * | 2013-12-20 | 2015-06-24 | 惠州比亚迪电子有限公司 | Communication equipment metal shell and manufacturing method thereof |
| CN104735941A (en) * | 2013-12-20 | 2015-06-24 | 比亚迪股份有限公司 | Communication equipment metal shell and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101497251A (en) * | 2008-02-01 | 2009-08-05 | 深圳富泰宏精密工业有限公司 | Housing |
| US9484621B2 (en) * | 2012-11-02 | 2016-11-01 | Nokia Technologies Oy | Portable electronic device body having laser perforation apertures and associated fabrication method |
| US9716307B2 (en) * | 2012-11-08 | 2017-07-25 | Htc Corporation | Mobile device and antenna structure |
| CN104540364A (en) * | 2014-12-30 | 2015-04-22 | 天津三星通信技术研究有限公司 | Electronic device shell assembly and manufacturing method thereof |
-
2015
- 2015-07-15 CN CN201510416993.5A patent/CN106358409B/en active Active
- 2015-12-22 WO PCT/CN2015/098292 patent/WO2017008443A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104735942A (en) * | 2013-12-20 | 2015-06-24 | 惠州比亚迪电子有限公司 | Communication equipment metal shell and manufacturing method thereof |
| CN104735941A (en) * | 2013-12-20 | 2015-06-24 | 比亚迪股份有限公司 | Communication equipment metal shell and manufacturing method thereof |
| CN104540341A (en) * | 2014-10-23 | 2015-04-22 | 深圳富泰宏精密工业有限公司 | Shell, electronic device employing shell and manufacture method of shell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106358409A (en) | 2017-01-25 |
| WO2017008443A1 (en) | 2017-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106358409B (en) | A kind of communication apparatus metal shell and preparation method thereof | |
| CN106413321B (en) | A kind of communication apparatus metal shell and preparation method thereof | |
| JP6438586B2 (en) | Electronic product metal shell with antenna groove, and electronic product metal shell manufacturing method | |
| CN105530785B (en) | A kind of electronic product metal shell being formed with antenna slot and preparation method thereof | |
| CN106061153B (en) | Method for electrically isolating regions of a metal body | |
| KR101999307B1 (en) | Communication equipment metal shell and preparation method therefor | |
| CN107295765B (en) | A kind of plastics mobile terminal shell of metal-like | |
| TWI608782B (en) | Communication device metal housing, manufacturing method and application thereof | |
| CN109121331A (en) | Communication apparatus metal shell and preparation method thereof | |
| CN101730414B (en) | Housing and method for making same | |
| CN106061173A (en) | Metal casing and manufacture method thereof and mobile terminal | |
| CN103732804A (en) | Anodization and plating surface treatments | |
| CN106572208B (en) | Shell, method for producing shell and mobile terminal | |
| CN106358408B (en) | A kind of communication apparatus metal shell and preparation method thereof | |
| CN106882924A (en) | One type of metal glass cover-plate manufacture craft and electronic product | |
| CN107567217A (en) | A kind of housing and its preparation method and application | |
| KR100846037B1 (en) | Cover structure for electronic device and method of manufacturing same | |
| CN104882671B (en) | A kind of method of the plastic cement shells realizationization plating antenna of embedded metal | |
| ES2718250T3 (en) | Metal housing, method of manufacturing the same and mobile terminal comprising the same | |
| TWI655085B (en) | Aluminum alloy casing, preparation method thereof and personal electronic device | |
| US10205246B2 (en) | Metal shell of communication equipment | |
| TWI718869B (en) | Electronic device housings with chamfered edges | |
| CN106048681A (en) | Electronic part, manufacturing method of electronic part and mobile terminal | |
| CN104694995A (en) | Surface treatment method for conductive substrate | |
| CN204406922U (en) | A kind of display screen frame structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |