TWI718869B - Electronic device housings with chamfered edges - Google Patents

Abstract

In one example, an electronic device housing may include a metal substrate having a peripheral edge and a non-metal layer formed on a first side of the metal substrate. The first side of the metal substrate facing an interior of the electronic device housing. Further, the electronic device housing may further include a paint coating formed on the non-metal layer. Furthermore, the electronic device housing may include an oxide layer formed on a second side of the metal substrate. The second side of the metal substrate facing an exterior of the electronic device housing. Also, the electronic device housing may include a chamfer formed on the peripheral edge of the metal substrate and a transparent protective passivation layer formed on the chamfer.

Description

Electronic device housing with chamfered edges

The present invention relates to an electronic device housing with chamfered edges.

In recent years, as portable electronic products have been developed to be lighter and smaller, metal housings with light weight and high rigidity are very popular. In these needs, the technology of combining metal shell and plastic component or carbon fiber component composite material has become the focus in the industry. The composite material may be a material formed of two or more constituent materials with different physical properties. Shells made of these composite materials can have high strength and low density.

In the following detailed description, a number of examples are described with reference to the drawings, among which: According to an embodiment of the present invention, an electronic device housing is specifically provided, which includes: a metal substrate having a peripheral edge; a non-metal layer formed on a first side of the metal substrate, the The first side of the metal substrate faces the inside of the electronic device casing; a lacquer coating formed on the non-metal layer; an oxide layer formed on a second side of the metal substrate, The second side surface of the metal substrate faces an outside of the electronic device casing; a chamfer formed on the periphery of the metal substrate; and a transparent protective passivation layer formed on the chamfer.

100: electronic device housing

102: Metal substrate

104: Non-metallic layer

106: Lacquer coating

108: oxide layer

110: chamfer

112: Transparent protective passivation layer

114: Perimeter

152: Electrophoretic Deposition Layer

154: Primer coating

156: Base coating

158: UV top coat

200,300: flow chart

202,204,206,302,304,306,308,310,402,404,406,408,410,412,414,416,502,504,506, 508,510,512,514,516,602,604,606,608,610,612,614,616,702,704,706,708,710,712,714,716: steps

400,500,600,700: process

1A shows a cross-sectional side view of an electronic device housing example and shows a transparent protective passivation layer on a chamfer; 1B shows a cross-sectional side view of the electronic device housing example of FIG. 1A and shows other topography; FIG. 1C shows a top view of the electronic device housing example of FIG. 1A and shows the chamfer; FIG. 2 shows a manufacturing method for an electronic device An example of a flow chart of the outer cover; Figure 3 shows another example of a flow chart for manufacturing an electronic device housing; Figures 4 and 5 show a transparent protection used to form a chamfered surface on a peripheral edge of a metal-plastic composite frame An example of the process of passivation layer and an electrophoretic deposition layer; and FIGS. 6 and 7 show an example of the process of forming a transparent protective passivation layer and an electrophoretic deposition layer on a chamfered surface of a peripheral edge of a metal-carbon fiber composite frame.

The housings for electronic devices such as mobile phones, laptop computers, music players, personal digital assistants and global positioning system devices can be formed of plastic or metal. The metal shell has better mechanical strength, but can conduct electricity, which will attenuate the communication signal. The plastic shell is not conductive, but the mechanical strength is insufficient. Some shells may have a composite material such as a combination of plastic material and metal. For example, a housing may include a plastic layer and a metal layer assembled into a whole to obtain good communication and mechanical strength. For example, an outer layer of a housing part may be formed by a metal layer, and the metal layer is supported by an inner plastic. The outer metal layer can provide the shell with a wear-resistant, strong and aesthetic appearance.

An example of the metal layer may be a magnesium or magnesium alloy layer. Because of its light weight and high mechanical strength, magnesium alloys are suitable for use in housings for electronic devices. However, the magnesium alloy layer has poor color stability, hardness and chemical resistance. Therefore, the magnesium alloys are oxidized on the surface, and it is difficult to produce a metallic luster feeling on the peripheral surface of the magnesium alloy shells.

The example described here can provide an electronic device housing, which includes a composite material such as a combination of a metal substrate and a non-metal layer (for example, a plastic layer or a carbon fiber composite layer). The metal substrate may have a peripheral edge. In addition, the electronic device housing may include one formed on the non-metal layer The lacquer coating and an oxide layer formed on the metal substrate. The electronic device housing may include a chamfer formed on the periphery of the metal substrate. The electronic device housing may further include a transparent protective passivation layer formed on the chamfer. In addition, the electronic device housing may include an electrophoretic deposition layer formed on the transparent protective passivation layer and the oxide layer. The transparent protective passivation layer and the electrophoretic deposition layer thus formed on the chamfer can pass a 96-hour salt spray test.

The example described here can provide a metallic luster chamfering and aesthetic surface on the periphery of a plastic-metal alloy shell and a carbon fiber composite metal alloy shell. The examples described here can increase the mechanical strength (ie, rigidity) of the plastic or carbon fiber composite shell by combining with the magnesium alloy layer. The examples described here can provide a lighter and stronger metal-plastic composite structure or metal-carbon fiber composite structure.

In the following description, for the convenience of description, many specific details are presented to thoroughly understand the technology. However, those with ordinary knowledge in the technical field can understand that this equipment, device, and system can be implemented without these specific details. The term "an example" or similar language in the specification means that a specific morphology, structure, or characteristic is included in at least this example, but not necessarily in other examples.

Please refer to the drawings below. FIG. 1A shows a cross-sectional side view of an example of an electronic device housing and shows a transparent protective passivation layer 112 on a chamfer 110. The electronic device housing 100 may include a smart phone housing, a tablet or notebook personal computer housing, a digital camera housing, and the like.

An example of the electronic device housing 100 may include a metal substrate 102 having a peripheral edge 114. Examples of the metal substrate 102 may include aluminum, magnesium, aluminum alloy, magnesium alloy, or any combination thereof. The electronic device housing 100 may include a non-metallic layer 104 formed on a first side of the metal substrate 102. The first side of the metal substrate 102 may face the inside of one of the electronic device housings 100. Examples of the non-metallic layer may include: plastic, carbon fiber composite material, or a combination thereof.

In addition, the electronic device housing 100 may include a lacquer coating 106 formed on the non-metallic layer 104. 106 examples of lacquer coating are described with reference to FIG. 1B. In addition, the electronic device housing 100 may include It is an oxide layer 108 on a second side of the substrate 102. The second side of the metal substrate 102 can face an outside of the electronic device housing 100. For example, the oxide layer 108 may be a micro-arc oxide layer or a passivation layer.

In addition, the electronic device housing 100 may include a chamfer 110 formed on the peripheral edge 114 of the metal substrate 102. In an example, the chamfer 110 may be formed on the sidewall of the metal substrate 102. In addition, the chamfer 110 may have any suitable shape (for example, chamfered, rounded or double-curved, etc.), thus giving the peripheral edge 114 (for example, an outer periphery) of the metal substrate 102 any suitable cross-sectional shape. The chamfer 110 can be an aesthetically and tactilely pleasing shape of the electronic device housing 100.

In addition, the electronic device housing 100 may include a transparent protective passivation layer 112 formed on the chamfer 110. An example of the transparent protective passivation layer 112 may include a complex of a metal ion and a chelating agent. Examples of chelating agents may include: ethylenediaminetetraacetic acid (EDTA), ethylenediamine, nitrilotriacetic acid (NTA), diethylenetriaminepenta(methylenephosphonic acid) (DTPPH), nitrogen ginseng (methylene phosphonic acid) Phosphonic acid (NTMP), 1-hydroxyethane-1,1-diphosphonic acid (HEDP), sulfuric acid, phosphoric acid, or any combination thereof. Examples of metal ions can be: aluminum ion, nickel ion, tin ion, indium ion, chromium ion, zinc ion or any combination thereof. In an example, the transparent protective passivation layer 112 may have a thickness in the range of 30 nm to 3 μm.

FIG. 1B shows a cross-sectional side view of the electronic device housing 100 of FIG. 1A and shows other shapes. FIG. 1C shows a top view of the electronic device housing 100 of FIG. 1A and shows a chamfer 110 (ie, a chamfered edge). For example, the structure and/or function of similarly named elements in FIGS. 1B and 1C are similar to those of the named elements in FIG. 1A. The chamfer 100 can form an outwardly curved shape or an inwardly curved substrate at a boundary portion of the metal substrate 102. As shown in FIG. 1B, the electronic device housing 100 may include an electrophoretic deposition layer 152 formed on the transparent protective passivation layer 112 and the oxide layer 108. An example of the electrophoretic deposition layer 152 may include a polymer combined with organic and/or metal particles, such as polyacrylate polymer or epoxy polymer. In an example, the electrophoretic deposition layer 152 may have a thickness in the range of 5 to 40 μm.

In the example shown in FIG. 1B, the lacquer coating 106 may include a primer coating 154 formed on a surface of the non-metallic layer 104. 154 examples of the primer coating layer may include polyurethane. In one example, the bottom The lacquer coating 154 may have a thickness in the range of 5 to 20 μm. In addition, the lacquer coating 106 may include a base coating 156 formed on the primer coating 154. 156 examples of the base coating layer may include polyurethane combined with at least one pigment selected from the group consisting of carbon black, titanium dioxide, clay, mica, talc, barium sulfate, calcium carbonate, synthetic pigments, and metals. A group consisting of powder, alumina, an organic powder, an inorganic powder, plastic beads, colored pigments and dyes. In an example, the base coating 156 may have a thickness in the range of 10 to 20 μm.

In addition, the lacquer coating 106 may include an ultraviolet top coating 158 formed on the base coating 156. 158 examples of the ultraviolet top coat layer may include: polyacrylate, polyurethane, urethane acrylate, acrylic acrylate, epoxy acrylate, or any combination thereof. In an example, the ultraviolet top coat 158 may have a thickness in the range of 10 to 25 μm. For example, the ultraviolet top coat 158 may be a transparent polyurethane top coat and may be formed by thermal curing at 60 to 80°C.

In the example shown in FIG. 1B, the oxide layer 108 may be formed on the second side of the metal substrate 102, the transparent protective passivation layer 112 may be formed on the chamfer 110 along the periphery 114, and the electrophoretic deposition layer 152 may be formed On the transparent protective passivation layer 112 and the oxide layer 108. The transparent protective passivation layer 112 and the electrophoretic deposition layer 152 thus formed on the chamfer 110 can pass the 96-hour salt spray test. In addition, the transparent protective passivation layer 112 and the electrophoretic deposition layer 152 on the chamfer 110 can provide the peripheral edge 114 with a shiny, flat and smooth metallic appearance. Therefore, the peripheral edge 114 including the chamfer 110 can provide the electronic device housing 100 with an aesthetically attractive appearance.

FIG. 2 shows an example of a flowchart 200 for manufacturing a cover for an electronic device. Examples of the outer cover may be a display housing housing a display, a keyboard housing housing a keyboard, or a part of a combination thereof. In step 202, a lacquer coating can be applied to a composite metal substrate. An example of the composite metal substrate can be a metal-plastic composite substrate or a metal-carbon fiber composite substrate. Examples of metals may include: aluminum, magnesium, aluminum alloy, magnesium alloy, or any combination thereof. An example for applying the lacquer coating is illustrated in FIG. 3.

In step 204, a peripheral edge of the composite metal substrate may be chamfered to form the composite metal One of the substrates exposes part of the surface. After forming the chamfer on the periphery, the metal substrate can be exposed to one or more other finishing processes, such as transparent passivation treatment and electrophoretic deposition. In step 206, a transparent passivation treatment may be applied to the exposed surface portion of the periphery to form a transparent protective passivation layer. In one example, the transparent passivation treatment can be applied by applying a passivation solution containing a metal ion and a complex of a chelating agent on the exposed surface portion. In addition, an electrophoretic deposition can be applied on the composite metal substrate including the transparent protective passivation layer.

FIG. 3 shows another example of a flowchart 300 for manufacturing an electronic device housing. The electronic device housing can be a display housing, a keyboard housing, or any combination thereof. In step 302, a non-metallic layer can be formed on a first side of a metal substrate. The first side of the metal substrate can face an inside of the electronic device casing. In one example, the non-metallic layer may include plastic. In this example, an insert molding process can be used to form a plastic layer on the first side of the metal substrate. Examples of plastic layers may include those selected from: polyacrylonitrile, polyethylene, polypropylene, polystyrene, polyvinyl acetate, poly(meth)acrylate, polyvinyl chloride, fluoropolymer, chlorinated polyether , Polyurethane, polyamide, polycarbonate, polyester, polyimide, polyphthalamide, polyphenylene sulfide and at least one material in the group consisting of polysulfide. In another example, the non-metallic layer may include a carbon fiber composite material. In this example, a compression molding process can be used to form a carbon fiber composite layer on the surface of the metal substrate.

In step 304, an oxide layer can be formed on a second side of the metal substrate. The second side of the metal substrate can face an outside of the electronic device casing. Examples of metal substrates may include: aluminum, magnesium, aluminum alloy, magnesium alloy, or any combination thereof. In other examples, the metal substrate may include lithium, zinc, titanium, lithium alloy, zinc alloy, titanium alloy, or a combination thereof. In one example, by applying one of a micro-arc oxidation process and a passivation process, which can be an electrochemical surface treatment process for producing an oxide coating on a metal, on the second side of the metal substrate The oxide layer is formed thereon.

For example, the micro-arc oxidation process may be a process used to produce an oxide coating on a metal substrate. In the micro-arc oxidation process, the metal substrate can be placed in an electrolyte solution including an electrolyte. In the liquid, the electrolyte is selected from: sodium silicate, sodium phosphate, potassium fluoride, potassium hydroxide, sodium hydroxide, fluorozirconate, sodium hexametaphosphate, sodium fluoride, alumina, silicon dioxide , Ferric ammonium oxalate, phosphate and polyethylene oxide alkylphenol ether form a group. The electrolyte can exist in a concentration of 0.05 to 15% by weight based on the total weight of the electrolyte solution and a voltage in the range of 200 to 600V can pass through the electrolyte solution and the metal substrate (for example, magnesium alloy substrate ) Is placed in the electrolyte solution to form a micro-arc oxidation layer (ie, the oxide layer). In one example, the voltage can be applied for about 3 to 20 minutes and the micro-arc oxidation process can be performed at a temperature between room temperature and 45°C. The thickness of the micro-arc oxidation layer can be in the range of 3 to 15 μm. The micro-arc oxidation properties may include wear resistance, corrosion resistance, high hardness, and electrical insulation.

Similarly, the passivation treatment can be a process of treating or coating the metal substrate to reduce the chemical reactivity of a surface of the metal substrate. For example, the passivation treatment may include creating an outer layer of shielding material surrounding the metal substrate to "passivate" the metal substrate, that is, less environmentally affected or corroded. The non-metallic layer can substantially cover the entire first side of the metal substrate so that after the micro-arc oxidation or passivation treatment is performed, the first side may not be covered by the oxide layer.

In step 306, a lacquer coating may be applied on the non-metallic layer. In an example, applying the lacquer coating on the non-metallic layer may include: applying a primer coating on a surface of the non-metallic layer; applying a base coating on the primer coating; and applying a base coating on the substrate An ultraviolet top coat is applied to the coating.

For example, applying the primer coating on the surface of the non-metallic layer may include: applying a polyurethane mixture on the surface of the non-metallic layer; and then drying the polyurethane at a temperature of 60 to 80°C The mixture is about 15 to 40 minutes. The primer coating may have a thickness in the range of 5 to 20 μm.

In addition, applying the base coating on the primer coating may include: applying a mixture of polyurethane and at least one pigment combination, the at least one pigment is selected from: carbon black, titanium dioxide, clay, mica , Talc, barium sulfate, calcium carbonate, synthetic pigments, metal powder, alumina, an organic The group consisting of powder, an inorganic powder, plastic beads, colored pigments and dyes; and then the mixture is dried at a temperature of 60 to 80°C for about 15 to 40 minutes. The base coating may have a thickness in the range of 10 to 20 μm.

In addition, applying the UV top coat on the base coat may include: applying a mixture selected from the group consisting of: polyacrylate, polyurethane, urethane acrylate, acrylic acrylate and The group consisting of epoxy acrylate; and then the mixture is dried at a temperature of 50 to 60° C. for about 10 to 15 minutes, and then UV exposure is performed in the range of ^{700 to 1,200 mJ/cm 2 for 10 to 30 seconds.} The ultraviolet top coat may have a thickness in the range of 10 to 25 μm.

In step 308, a peripheral edge of the metal substrate may be chamfered to form an exposed surface portion of the metal substrate. In one example, a computer numerical control (CNC) cutting or a laser engraving program can be used to chamfer the periphery. In step 310, a transparent protective passivation layer may be formed on the exposed surface portion of the periphery. In one example, the transparent protective passivation layer can be formed on the exposed surface portion by applying a passivation solution containing a metal ion and a complex compound of a chelating agent. Examples of metal ions and chelating agents are illustrated in Figure 1A. The transparent protective passivation layer can prevent corrosion of the exposed metal substrate through the exposed surface portion.

In addition, an electrophoretic deposition layer can be formed on the transparent protective passivation layer and the oxide layer by applying electrophoretic deposition. Electrophoretic deposition can be a process in which the metal substrate is placed in a fluid and a potential difference is applied to deposit the charged particles in the fluid on the metal substrate. Electrophoretic deposition can be used to give the substrate certain desired properties, such as hardness and toughness, or a certain desired appearance. The lacquer coating may substantially cover a first surface of the non-metallic layer so that after transparent passivation treatment or electrophoretic deposition is performed, the first surface may not be covered by the transparent protective passivation layer or the electrophoretic deposition layer.

4 shows a 400 example of a process for forming a transparent protective passivation layer and an electrophoretic deposition layer on a chamfered surface of a peripheral edge of a metal-plastic composite frame. In step 402, a metal alloy frame may be preformed. For example, pre-forming the metal alloy frame may include: forging, die casting or CNC cutting The metal substrate is cut into a desired shape and then the forged, die-cast or CNC-cut metal alloy frame is cleaned. The cleaning of the metal substrate includes a pre-cleaning process, such as an alkali cleaning process, a degreasing cleaning process, an acid cleaning process, or any combination thereof.

In step 404, an insert molding process can be used to form a plastic layer on one side of the metal substrate. Insert molding can be a process of injecting plastic into a mold containing the preset metal substrate. In step 406, the plastic layer can be trimmed to remove the extra plastic material extending beyond the metal substrate to obtain a desired shape. In step 408, a passivation treatment may be applied to the other side of the metal substrate including the peripheral edge. In step 410, a lacquer coating can be formed on the plastic layer. Examples of lacquer coatings can be illustrated in Figure 3.

In step 412, the periphery of the metal substrate may be chamfered to form an exposed surface portion of the metal substrate. In step 414, a transparent protective passivation layer may be formed on the exposed surface portion of the periphery. In step 416, an electrophoretic deposition layer can be formed on the transparent protective passivation layer and the oxide layer by applying electrophoretic deposition. The electrophoretic deposition may include a polymer combined with particles selected from the group including inorganic and metal particles.

FIG. 5 shows another 500 example of a process for forming a transparent protective passivation layer and an electrophoretic deposition layer on a chamfered surface of a peripheral edge of a metal-plastic composite frame. In step 502, a metal alloy frame may be preformed.

In step 504, an insert molding process can be used to form a plastic layer on one side of the metal substrate. In step 506, the plastic layer can be trimmed to remove additional plastic material to obtain a desired shape. In step 508, a micro-arc oxidation may be applied to the other side of the metal substrate including the peripheral edge. In step 510, a lacquer coating can be formed on the plastic layer.

In step 512, the periphery of the metal substrate may be chamfered to form an exposed surface portion of the metal substrate. In step 514, a transparent protective passivation layer may be formed on the exposed surface portion of the periphery. In step 516, an electrophoretic deposition layer can be formed on the transparent protective passivation layer and the oxide layer by applying electrophoretic deposition.

FIG. 6 shows 600 examples of a process for forming a transparent protective passivation layer and an electrophoretic deposition layer on a chamfered surface of a peripheral edge of a metal-carbon fiber composite frame.

In step 602, a metal alloy frame may be preformed. In step 604, a compression molding process may be used to form a carbon fiber composite layer on one side of the metal substrate. The carbon fiber composite layer can be directly adhered to the metal substrate using the compression molding process. Compression molding can be a forming process in which the carbon fiber composite material can be directly put into a heated metal mold, heated to soften, and then forced to conform to the shape of the mold when the mold is closed.

In step 606, the carbon fiber composite layer may be trimmed to remove extra carbon fiber composite material (ie, unnecessary parts) to obtain a desired shape. In step 608, a passivation treatment may be applied to the other side of the metal substrate including the peripheral edge. In step 610, a lacquer coating can be formed on the carbon fiber composite layer. Examples of lacquer coatings can be illustrated in Figure 3.

In step 612, the periphery of the metal substrate may be chamfered to form an exposed surface portion of the metal substrate. In step 614, a transparent protective passivation layer can be formed on the exposed surface portion of the periphery by applying a transparent passivation treatment. In step 616, an electrophoretic deposition layer can be formed on the transparent protective passivation layer and the oxide layer by applying electrophoretic deposition.

FIG. 7 shows another 700 example of a process for forming a transparent protective passivation layer and an electrophoretic deposition layer on a chamfered surface of a peripheral edge of a metal-carbon fiber composite frame. In step 702, a metal alloy frame may be preformed.

In step 704, a compression molding process may be used to form a carbon fiber composite layer on one side of the metal substrate. In step 706, the carbon fiber composite layer can be trimmed to remove extra carbon fiber composite material (ie, unnecessary parts) to obtain a desired shape. In step 708, a micro-arc oxidation may be applied to the other side of the metal substrate including the peripheral edge. In step 710, a lacquer coating may be formed on the carbon fiber composite layer.

In step 712, the periphery of the metal substrate may be chamfered to form a pattern of the metal substrate. Expose the surface part. In step 714, a transparent protective passivation layer may be formed on the exposed surface portion of the periphery. In step 716, an electrophoretic deposition layer can be formed on the transparent protective passivation layer and the oxide layer by applying electrophoretic deposition.

In this way, the present application discloses a metal-plastic composite shell or a metal-carbon fiber composite shell, wherein the peripheral surface of the metal alloy shell can have a metallic luster feeling.

The above description has a metal-plastic composite shell or a metal-carbon fiber composite shell with a metallic luster on the peripheral surface. Although the above-mentioned application is shown and explained with reference to the aforementioned examples, it should be understood that other forms, details and embodiments can be made without departing from the spirit and scope of this application.

100: electronic device housing

102: Metal substrate

104: Non-metallic layer

106: Lacquer coating

108: oxide layer

110: chamfer

112: Transparent protective passivation layer

114: Perimeter

Claims (12)

An electronic device housing, comprising: a metal substrate having a peripheral edge; a non-metal layer formed on a first side of the metal substrate, the first side of the metal substrate facing the electronic The inside of one of the device casings; a lacquer coating formed on the non-metal layer; an oxide layer formed on a second side of the metal substrate, the second side of the metal substrate facing the An exterior of an electronic device housing; a chamfer formed on the periphery of the metal substrate; a transparent protective passivation layer formed on the chamfer; and an electrophoretic deposition layer formed on the transparent protective On the passivation layer and the oxide layer. According to the electronic device housing of claim 1, wherein the metal substrate comprises: aluminum, magnesium, aluminum alloy, magnesium alloy or any combination thereof. For example, the electronic device housing of claim 1, wherein the non-metallic layer includes: plastic, carbon fiber composite material, or a combination thereof. The electronic device housing of claim 1, wherein the paint coating comprises: a primer coating formed on a surface of the non-metallic layer; a base coating formed on the primer coating; and An ultraviolet top coat is formed on the base coat. The electronic device housing of claim 1, wherein the transparent protective passivation layer includes a complex compound of a metal ion and a chelating agent. The electronic device housing of claim 5, wherein the chelating agent comprises: ethylenediaminetetraacetic acid (EDTA), ethylenediamine, nitrilotriacetic acid (NTA), ethylenetriaminepenta(methylenephosphonic acid) ) (DTPPH), nitrogen ginseng (methylene phosphonic acid) (NTMP), 1-hydroxyethane-1,1-diphosphonic acid (HEDP), sulfuric acid, phosphoric acid or any combination. A method of manufacturing a housing for an electronic device, the method comprising the following steps: applying a paint coating on a surface of a composite metal substrate; chamfering a peripheral edge of the composite metal substrate to form the composite metal substrate One of the exposed surface parts of the material; applying a transparent passivation treatment on the exposed surface part of the periphery to form a transparent protective passivation layer; and applying an electrophoretic deposition on the composite metal substrate including the transparent protective passivation layer . The method of claim 7, wherein applying the transparent passivation treatment comprises applying a passivation solution containing a metal ion and a complex of a chelating agent on the exposed surface portion. A method for manufacturing an electronic device housing, comprising the following steps: forming a non-metallic layer on a first side of a metal substrate, and the first side of the metal substrate faces one of the electronic device housings Inside; forming an oxide layer on a second side of the metal substrate, the second side of the metal substrate facing an outside of the electronic device housing; applying a lacquer coating on the non-metallic layer; A peripheral edge of the metal substrate is chamfered to form an exposed surface portion of the metal substrate; a transparent protective passivation layer is formed on the exposed surface portion of the peripheral edge; and the transparent protective passivation layer and the oxide are formed An electrophoretic deposition layer is formed on the layer. The method of claim 9, wherein applying the lacquer coating on the non-metallic layer comprises the following steps: applying a primer coating on a surface of the non-metallic layer; applying a base coating on the primer coating; And applying an ultraviolet top coat on the base coat. The method of claim 9, wherein the oxide layer is formed on the second side of the metal substrate by applying one of a micro-arc oxidation process and a passivation process. The method of claim 9, wherein the transparent protective passivation layer is formed on the exposed surface portion by applying a passivation solution containing a metal ion and a complex compound of a chelating agent.

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