CN104540364A - Electronic device shell assembly and manufacturing method thereof - Google Patents
Electronic device shell assembly and manufacturing method thereof Download PDFInfo
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- CN104540364A CN104540364A CN201410837409.9A CN201410837409A CN104540364A CN 104540364 A CN104540364 A CN 104540364A CN 201410837409 A CN201410837409 A CN 201410837409A CN 104540364 A CN104540364 A CN 104540364A
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Abstract
The invention discloses an electronic device shell assembly and a manufacturing method of the electronic device shell assembly. The method comprises the first step of acquiring a metal shell, wherein the metal shell is composed of at least two metal segmenting components, and the adjacent metal segmenting components are connected through metal connecting components, the second step of combining the metal shell and insulating components, wherein the adjacent metal segmenting components are also connected through the insulating components, and the third step of conducting electrochemical treatment on the metal shell and then removing the metal connecting components to obtain the electronic device shell assembly. By means of the method, the metal shell is subjected to electrochemical treatment, and the communication performance of an electronic device is not influenced.
Description
Technical field
The application relates to manufacturing process field, is specifically related to casting of electronic device assembly manufacturing process field.
Background technology
The plurality of advantages such as it is good that metal material has appearance tactile impression, and thermal diffusivity is good, and hardness is strong, resistance to wear, thus it is used on the shell of the electronic equipments such as mobile phone as a kind of new structure part more and more.In order to not affect the communication performance of mobile phone, metal shell merogenesis can be become multiple metal merogenesis parts be not connected, making metal shell cannot form the structure closed and connect.Can be connected by plastic components between multiple metal merogenesis parts, to form complete phone housing.
Can comprising the following steps of existing production phone housing: molten metal is cast, obtains metal shell, this metal shell is made up of multiple metal merogenesis parts be not connected; Metal shell is embedded in the die cavity of injection mold and carry out injection moulding; Carry out painted to the metal shell after injection moulding, obtain casting of electronic device assembly.Now, connected by the plastic components formed after injection moulding between multiple metal merogenesis parts of metal shell.Common, spraying technology can be adopted to carry out painted.
But, owing to being separated from each other between each metal merogenesis parts, cannot conduct electricity, therefore, electrochemical treatments cannot be carried out to metal shell.
Summary of the invention
For the problems referred to above, this application provides a kind of casting of electronic device assembly and manufacture method thereof.
First aspect, provides a kind of manufacture method of casting of electronic device assembly, comprising: obtain metal shell, described metal shell is made up of at least two metal merogenesis parts, is connected between adjacent metal merogenesis parts by metal connection parts; Described metal shell and insulating element are combined, is also connected by described insulating element between adjacent metal merogenesis parts; After electrochemical treatments is carried out to described metal shell, remove described metal connection parts, obtain described casting of electronic device assembly.
In some embodiments, described at least two metal merogenesis parts and described metal connection parts are integrated.
In some embodiments, form groove structure between adjacent metal merogenesis parts and metal connection parts, in described groove structure, be provided with described insulating element.
In some embodiments, described acquisition metal shell, comprises following any one: obtain described metal shell by stamping technology; Described metal shell is obtained by die-casting technique.
In some embodiments, described metal shell comprises following at least one item: metal center, metal back cover.
In some embodiments, described metal shell is aluminium casing.
In some embodiments, described described metal shell and insulating element to be combined, comprise following any one: described metal shell is embedded in injection mold and carries out injection moulding; Insulating element is inlayed in the precalculated position of metal shell.
In some embodiments, described electrochemical treatments comprises: electrochemical coloring.
In some embodiments, the described metal connection parts of described removal, comprising: remove described metal connection parts by Digit Control Machine Tool.
Second aspect, provides a kind of casting of electronic device assembly, comprises at least two metal merogenesis parts and insulating element, and described casting of electronic device assembly is formed by the method manufacture described in above-mentioned first aspect.
In this programme, the metal shell of acquisition is made up of at least two metal merogenesis parts, and adjacent metal merogenesis parts are connected by metal connection parts, makes can conduct electricity between each metal merogenesis parts.Like this, ensure that metal shell is under the condition of energising, can carry out electrochemical treatments to metal shell.In addition, under can carrying out the prerequisite of electrochemical treatments to metal shell in guarantee, also do not affect the communication performance of mobile phone, described metal shell and insulating element can also be combined, make also to be connected by described insulating element between adjacent metal merogenesis parts; Further, after electrochemical treatments is carried out to metal shell, remove metal connection parts, make each metal merogenesis parts be in the state of being separated from each other, and then make metal shell cannot form the structure closed and connect.
Accompanying drawing explanation
By reading the detailed description done non-limiting example done with reference to the following drawings, the other features, objects and advantages of the application will become more obvious:
Fig. 1 shows the flow chart of a kind of embodiment of the manufacture method of the casting of electronic device assembly that the application provides;
Fig. 2 a shows the structural representation of a kind of metal shell that the application provides;
Fig. 2 b shows the left view of the metal shell shown in Fig. 2 a and the partial enlarged drawing of left view;
Fig. 3 shows A-A sectional view and the partial enlarged drawing thereof of a kind of metal shell that the application provides;
Fig. 4 shows a kind of structural representation only including the metal shell of metal center that the application provides;
The structural representation of the metal shell after a kind of and insulating element that Fig. 5 shows the application to be provided combines;
The left view of the metal shell after a kind of and insulating element that Fig. 6 shows the application to be provided combines;
The F-F sectional view of the metal shell after a kind of and insulating element that Fig. 7 shows the application to be provided combines and partial enlarged drawing thereof;
Fig. 8 shows the schematic diagram after the metal connection parts eliminated in the metal shell shown in Fig. 7;
Fig. 9 shows the flow chart of the another kind of embodiment of the manufacture method of the casting of electronic device assembly that the application provides.
Embodiment
Below in conjunction with drawings and Examples, the application is described in further detail.Be understandable that, specific embodiment described herein is only for explaining related invention, but not the restriction to this invention.It also should be noted that, for convenience of description, in accompanying drawing, illustrate only the part relevant to Invention.
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below with reference to the accompanying drawings and describe the application in detail in conjunction with the embodiments.
The manufacture method that this application provides a kind of casting of electronic device assembly and the casting of electronic device assembly manufactured by the method.Electronic equipment can be the various electronic equipments that can use metal shell, includes but not limited to mobile phone, desktop computer, panel computer etc.
Fig. 1 shows the flow chart of a kind of embodiment of the manufacture method of the casting of electronic device assembly that the application provides.
As shown in Figure 1, in step 110, obtain metal shell, metal shell is made up of at least two metal merogenesis parts, is connected between adjacent metal merogenesis parts by metal connection parts.
In the present embodiment, first, can obtain and comprise at least two metal merogenesis parts be separated from each other, then, metal connection parts and metal merogenesis parts are combined, makes to be connected by metal connection parts between adjacent metal merogenesis parts, and then obtain metal shell.Wherein, metal merogenesis parts and metal connection parts can adopt identical metal material or adopt different metal materials.But the step of above-mentioned acquisition metal shell is comparatively loaded down with trivial details.
Further, in order to solve the problem, simplify the step obtaining metal shell, metal shell can be obtained by following either type: obtain metal shell by stamping technology; Metal shell is obtained by die-casting technique.Thus, at least two metal merogenesis parts and metal connection parts is made to be integrated.
Wherein, die casting is a kind of metal casting technique, is characterized in utilizing the die cavity of die casting to apply high pressure to the metal melted.Die casting normally processes with the alloy that intensity is higher, a bit similar injection mo(u)lding of this process.When carrying out die casting, the metal shell of given shape can be formed with die casting to type intra-bladder instillation molten metal.The shape of the die cavity of different die casting can be different.Can choose corresponding die casting according to metal shell required form in the present embodiment, the shape forming metal shell after making die casting is required form.
Punching press is that depended on pressure machine and mould apply external force to sheet material, band, tubing and section bar etc., makes it to produce plastic deformation or separation, thus obtains the forming and machining method of the stamping parts of required form and size.Punching press is the power by means of conventional or special pressing equipment, makes plate in mould, directly be subject to deformation force and be out of shape, thus obtains definite shape, the production technology of the product parts of size and performance.
The present embodiment is not construed as limiting obtaining the method for integrated metal shell, is not limited to the above-mentioned die casting enumerated and punching press, can also comprises additive method, specifically can set according to actual needs.In addition, concrete die casting and stamping technology are technology well known to those skilled in the art, and therefore not to repeat here.
In the present embodiment, Fig. 2 a shows the structural representation of a kind of metal shell that the application provides.As shown in Figure 2, metal shell 200 is made up of metal merogenesis parts 210, metal merogenesis parts 220 and metal merogenesis parts 230, adjacent metal merogenesis parts 210 can be connected by metal connection parts 240 with metal merogenesis parts 220, and adjacent metal merogenesis parts 220 can be connected by metal connection parts 250 with metal merogenesis parts 230.
For the purpose of directly perceived, Fig. 2 b shows the left view of the metal shell shown in Fig. 2 a and the partial enlarged drawing of left view.As shown in Figure 2 b, metal shell 200 is the left view of the metal shell 200 shown in Fig. 2 a, Fig. 2 b also show the partial enlarged drawing of electronic equipment 200 position c, according to this partial enlarged drawing, adjacent metal merogenesis parts 210 are connected by metal connection parts 240 with metal merogenesis parts 220.
In the present embodiment, each metal merogenesis parts are not limited to be the position relationship according to the above-below direction shown in Fig. 2 a, can also for but be not limited to the position relationship of left and right directions, specifically can set according to actual needs.
Further, groove structure is formed between adjacent metal merogenesis parts and metal connection parts.
Concrete, Fig. 3 shows A-A sectional view and the partial enlarged drawing thereof of a kind of metal shell that the application provides.As shown in Figure 3, it illustrates the A-A sectional view of metal shell 300, and the partial enlarged drawing of B position in A-A sectional view.According to this partial enlarged drawing, metal merogenesis parts 310 in metal shell 300 are connected by metal connection parts 320 with metal merogenesis parts 330, and form groove structure 340 between metal merogenesis parts metals merogenesis parts 310, metal merogenesis parts 330 and metal connection parts 320.
Groove structure in the present embodiment is not limited to the groove structure 340 shown in Fig. 3, and can also be specifically the groove structure of other forms, therefore not to repeat here.
Further, metal shell can comprise following at least one item: metal center, metal back cover.Metal shell can be but be not limited to aluminium casing.Such as, the metal shell shown in Fig. 2 a, Fig. 2 b and Fig. 3 is the metal shell comprising metal center and metal shell; Fig. 4 shows a kind of structural representation only including the metal shell of metal center.As shown in Figure 4, metal shell 400 comprises metal merogenesis parts 410 to 440, and adjacent metal merogenesis parts can be connected by metal connection parts 450.
Return Fig. 1, in the step 120, metal shell and insulating element are combined, be also connected by insulating element between adjacent metal merogenesis parts.
In the present embodiment, insulating element can be provided with in groove structure.
Further, metal shell and insulating element are combined, following any one can be included but not limited to: metal shell is embedded in injection mold and carry out injection moulding; Insulating element is inlayed in the precalculated position of metal shell.
When carrying out injection moulding to metal shell, metal shell can be embedded in injection mold and carrying out injection moulding, make to be injected with plastic components in the groove structure of metal shell, can also make also to be connected by plastic components between adjacent metal merogenesis parts simultaneously.When inlaying insulating element to the precalculated position of metal shell, its precalculated position at least can comprise following at least one item: the non-junction etc. in the groove structure of metal shell, between adjacent metal merogenesis parts.
In the present embodiment, Fig. 5 show and to combine with insulating element after the structural representation of metal shell.As shown in Figure 5, it illustrates inner surface 510 and the outer surface 520 of the metal shell after combining with insulating element.
For the purpose of directly perceived, the left view of the metal shell after Fig. 6 shows and to combine with insulating element.As shown in Figure 6, be provided with insulating element 610 between metal merogenesis parts 620 and metal merogenesis parts 630, and be connected by insulating element 610.The F-F sectional view of the metal shell after Fig. 7 shows and to combine with insulating element.As shown in Figure 7, metal merogenesis parts 710 are connected by metal connection parts 730 with metal merogenesis parts 720, and three forms groove structure 740, injection moulding or inlayed insulating element 750 in groove structure 740 and other assigned addresses, metal merogenesis parts 710 are also connected by insulating element 750 with metal merogenesis parts 720.
Return Fig. 1, in step 130, after electrochemical treatments is carried out to metal shell, remove metal connection parts, obtain casting of electronic device assembly.
After electrochemical treatments is carried out to metal shell, in order to the communication performance making metal shell not affect electronic equipment, need to carry out respective handling to metal shell, make metal shell cannot form the structure closed and connect, thus, after carrying out electrochemical treatments to metal shell, need to remove metal connection parts.
Such as, the metal connection parts 730 shown in Fig. 7 is removed.For the purpose of directly perceived, Fig. 8 shows the partial enlarged drawing of the position G after removing the metal connection parts 730 shown in Fig. 7, as shown in Figure 8, after removal metal connection parts 730, metal merogenesis parts 710 can be at least connected by insulating element 750 with metal merogenesis parts 720.
Further, can be, but not limited to remove metal connection parts by Digit Control Machine Tool (Computer numericalcontrol, CNC).Specific implementation process is technology well known to those skilled in the art, and therefore not to repeat here.
In the present embodiment, the metal shell of acquisition is made up of at least two metal merogenesis parts, and adjacent metal merogenesis parts are connected by metal connection parts, makes can conduct electricity between each metal merogenesis parts.Like this, ensure that metal shell is under the condition of energising, can carry out electrochemical treatments to metal shell.In addition, under can carrying out the prerequisite of electrochemical treatments to metal shell in guarantee, also do not affect the communication performance of mobile phone, metal shell and insulating element can also be combined, make also to be connected by insulating element between adjacent metal merogenesis parts; Further, after electrochemical treatments is carried out to metal shell, remove metal connection parts, make each metal merogenesis parts be in the state of being separated from each other, and then make metal shell cannot form the structure closed and connect.
Further, the electrochemical treatments in step 130 can include but not limited to electrochemical coloring.Fig. 9 shows the flow chart of the another kind of embodiment of the manufacture method of the casting of electronic device assembly that the application provides.As shown in Figure 9, the method shown in Fig. 1 can comprise step 910 further, and step 130 can be replaced by step 920.
In step 910, electrochemical coloring is carried out to metal shell.
In prior art, because the metal merogenesis parts of metal shell are separated from each other, cannot conduct electricity, therefore, usually adopt spraying coating process to carry out painted to metal shell, but, adopt spraying coating process to carry out painted to shell, the color of each metal merogenesis parts may be caused inconsistent.
And in the present embodiment, because each metal merogenesis parts in the metal shell that gets can conduct electricity mutually, therefore electrochemical coloring can be carried out to metal shell, like this, ensure that metal shell is under the condition of energising, can carry out painted to multiple metal merogenesis parts by electrochemical coloring process is disposable, ensure the solid colour of each metal merogenesis parts.
Further, electrochemical coloring can include but not limited to following any one: anodic oxidation, electrophoretic painting.
Anodic oxidation, refers to the electrochemical oxidation of metal or alloy.Aluminum-aluminum alloy, under corresponding electrolyte and specific process conditions, due under the effect of impressed current, above forms the process of layer oxide film at aluminum products (anode).If do not specialized, anodic oxidation typically refers to sulphuric acid anodizing.Adopt anode oxidation method to carry out painted to metal shell, metal skin hardness, mar proof can be increased, increase the service life.Electrophoretic painting, is the particulate directional migration such as pigment and resin that utilizes extra electric field to make to be suspended in electrophoresis liquid and is deposited on the coating process of the substrate surface of one of electrode.After logical direct current, acid radical anion anode moves, and the pigment particles of resin ion and parcel thereof is positively charged to movable cathode, and is deposited on negative electrode.Anodic oxidation and electrophoretic painting are technology well known to those skilled in the art, and therefore not to repeat here.
In step 920, after electrochemical coloring is carried out to metal shell, remove metal connection parts, obtain casting of electronic device assembly.
The embodiment of this step and the embodiment of step 130 similar, specifically can see the content below step 130, therefore not to repeat here.
Present invention also provides a kind of casting of electronic device assembly, comprise at least two metal merogenesis parts and insulating element.This casting of electronic device assembly is formed by the manufacture method manufacture of the casting of electronic device assembly shown in Fig. 1 or Fig. 9.
This application provides above-mentioned casting of electronic device assembly, each class of electronic devices can be applied to, include but not limited to smart mobile phone, panel computer, E-book reader, digital player, personal digital assistant and Wearable etc.
In the present embodiment, casting of electronic device assembly not only can be obtained by electrochemical treatments, and be separated from each other between the metal merogenesis parts of hardware housing wherein, the structure closed and connect cannot be formed, and then avoid the impact on its communication performance.
More than describe and be only the preferred embodiment of the application and the explanation to institute's application technology principle.Those skilled in the art are to be understood that, invention scope involved in the application, be not limited to the technical scheme of the particular combination of above-mentioned technical characteristic, also should be encompassed in when not departing from described inventive concept, other technical scheme of being carried out combination in any by above-mentioned technical characteristic or its equivalent feature and being formed simultaneously.The technical characteristic that such as, disclosed in above-mentioned feature and the application (but being not limited to) has similar functions is replaced mutually and the technical scheme formed.
Claims (10)
1. a manufacture method for casting of electronic device assembly, is characterized in that, comprising:
Obtain metal shell, described metal shell is made up of at least two metal merogenesis parts, is connected between adjacent metal merogenesis parts by metal connection parts;
Described metal shell and insulating element are combined, is also connected by described insulating element between adjacent metal merogenesis parts;
After electrochemical treatments is carried out to described metal shell, remove described metal connection parts, obtain described casting of electronic device assembly.
2. method according to claim 1, is characterized in that, described at least two metal merogenesis parts and described metal connection parts are integrated.
3. method according to claim 1 and 2, is characterized in that, forms groove structure, be provided with described insulating element in described groove structure between adjacent metal merogenesis parts and metal connection parts.
4. method according to claim 3, is characterized in that, described acquisition metal shell, comprises following any one:
Described metal shell is obtained by stamping technology;
Described metal shell is obtained by die-casting technique.
5. method according to claim 3, is characterized in that, described metal shell comprises following at least one item: metal center, metal back cover.
6. method according to claim 3, is characterized in that, described metal shell is aluminium casing.
7. method according to claim 1, is characterized in that, describedly described metal shell and insulating element is combined, and comprises following any one:
Described metal shell is embedded in injection mold and carries out injection moulding;
Insulating element is inlayed in the precalculated position of metal shell.
8. method according to claim 1, it is characterized in that, described electrochemical treatments comprises: electrochemical coloring.
9. method according to claim 1, it is characterized in that, the described metal connection parts of described removal, comprising:
Described metal connection parts is removed by Digit Control Machine Tool.
10. a casting of electronic device assembly, comprises at least two metal merogenesis parts and insulating element, it is characterized in that:
Described casting of electronic device assembly is formed by the method manufacture described in any one of claim 1 to 9.
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| CN201410837409.9A CN104540364A (en) | 2014-12-30 | 2014-12-30 | Electronic device shell assembly and manufacturing method thereof |
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| CN105007342A (en) * | 2015-06-30 | 2015-10-28 | 魅族科技（中国）有限公司 | Shell and manufacturing method thereof |
| CN105979741A (en) * | 2016-06-30 | 2016-09-28 | 东莞劲胜精密组件股份有限公司 | 3C electronic product shell and manufacturing method thereof |
| CN106304715A (en) * | 2015-06-08 | 2017-01-04 | 小米科技有限责任公司 | The framework packaging technology of mobile device and the framework of mobile device |
| WO2017008443A1 (en) * | 2015-07-15 | 2017-01-19 | 比亚迪股份有限公司 | Communication device metal housing and manufacturing method therefor |
| CN106816708A (en) * | 2015-11-30 | 2017-06-09 | 东莞酷派软件技术有限公司 | A kind of metal center and its manufacture method |
| CN108476250A (en) * | 2016-11-02 | 2018-08-31 | 永进电气株式会社 | The metal frame manufacturing method of portable terminal |
| CN109067940A (en) * | 2018-06-29 | 2018-12-21 | Oppo广东移动通信有限公司 | Center production method, center and electronic equipment |
| CN112654456A (en) * | 2017-07-27 | 2021-04-13 | 凯赫威 | Method for manufacturing frame structure for portable terminal |
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| CN112654456A (en) * | 2017-07-27 | 2021-04-13 | 凯赫威 | Method for manufacturing frame structure for portable terminal |
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Application publication date: 20150422 |