CN106340476A - Full-automatic silicon chip loading machine - Google Patents
Full-automatic silicon chip loading machine Download PDFInfo
- Publication number
- CN106340476A CN106340476A CN201610740521.XA CN201610740521A CN106340476A CN 106340476 A CN106340476 A CN 106340476A CN 201610740521 A CN201610740521 A CN 201610740521A CN 106340476 A CN106340476 A CN 106340476A
- Authority
- CN
- China
- Prior art keywords
- sucker
- full
- loading machine
- basket tool
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 35
- 239000010703 silicon Substances 0.000 title claims abstract description 35
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000002604 ultrasonography Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 241000252254 Catostomidae Species 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a full-automatic silicon wafer loading machine, which comprises a machine body, a basket tool, a guide device, an operating rod, a second sucker, a fourth sucker, an indicator light, a bottom box, a baffle, an ultrasonic device and a loading frame, wherein an operating platform is arranged on the machine body, and the upper end of the left side is connected with a control panel, a basket tool is arranged on the operating platform, two ends of the basket tool are provided with guiding devices, an operating rod is arranged at the rear end of the guide device, a loader is arranged on the guide device, a first sucker, a second sucker, a third sucker and a fourth sucker are arranged on the periphery of the outer surface of the operating rod, the rear end of the control panel is provided with an indicator light, the lower end of the electric actuator is provided with a bottom box, the inner mounting of bottom case has basket utensil rising device, both ends are settled there is the baffle about the basket utensil, and its lower extreme is provided with the work or material rest, install ultrasonic device on the baffle. The full-automatic silicon wafer loading machine has the advantages that the functionality is increased, and the working efficiency of the machine is improved.
Description
Technical field
The present invention relates to silicon chip loading machine technical field, specially a kind of full-automatic silicon wafer loading machine.
Background technology
Solar battery sheet is divided into single crystal battery piece and polycrystalline cell piece, and property is crystal, current solaode manufacture
During, include multiple operations, such as Wafer Cleaning, making herbs into wool etc., it is required for loading in basket tool by silicon chip in above-mentioned operation,
Then carry out lower one technique, rely on the technological accumulation of Chinese semiconductor equipment industry recent decades, by with first-class photovoltaic electric
The depth cooperation of pond enterprise, through unremitting effort for years, Chinese photovoltaic apparatus enterprise has possessed solaode substantially
The whole line equipment capability of manufacturing equipment, builds in line scheme in the mashed up main flow of home equipment and import equipment, home equipment is counting
Occupy the majority in amount, Chinese photovoltaic apparatus enterprise from silicon materials produce, silicon chip be worked into solar battery chip production and
Corresponding pure water preparation, environmental protection treatment, the construction of cleaning project, have tentatively possessed supply in full sets ability.
When silicon chip is carried out coated with antireflection film, need to put silicon chip in basket tool into although using silicon chip loading machine by silicon
Piece is put in carrier, but creates secondary pollution to silicon chip in operation before, and the silicon chip loading machine on market
Silicon chip can not be carried out, efficiency has much room for improvement simultaneously.
Content of the invention
It is an object of the invention to provide a kind of full-automatic silicon wafer loading machine, to solve to propose market in above-mentioned background technology
On silicon chip loading machine silicon chip can not be carried out, the problem that efficiency has much room for improvement simultaneously.
For achieving the above object, the present invention provides a kind of full-automatic silicon wafer loading machine of following technical scheme, including body, behaviour
Station, basket tool, carrier, guider, action bars, the first sucker, the second sucker, the 3rd sucker, the 4th sucker, chain of command
Plate, display lamp, YE, under casing, basket tool riser, baffle plate, ultrasonic unit and stock shelf, described body is arranged
There is operating board, and on the left of it, upper end is connected with control panel, described operating board is provided with basket tool, the two ends of described basket tool dispose
There is guider, and its rear end is provided with action bars, described guider is provided with carrier, the outer surface of described action bars
Surrounding is provided with the first sucker, the second sucker, the 3rd sucker and the 4th sucker, and the rear end of described control panel is provided with instruction
Lamp, the lower end of described YE is provided with casing, and the inside of described under casing is provided with basket tool riser, described basket tool
Left and right two ends are mounted with baffle plate, and its lower end is provided with stock shelf, and described baffle plate is provided with ultrasonic unit.
Preferably, described action bars is horizontal rotation apparatus, and its anglec of rotation is 0 ° -90 °.
Preferably, described carrier and guider are provided with four altogether, and carrier is detachably to connect with guider
Connection device.
Preferably, described baffle plate is connected one entirety of formation with ultrasonic unit, and it is provided with two groups.
Preferably, described first sucker, the second sucker, the 3rd sucker and the 4th sucker are that " ten " font is installed.
Compared with prior art, the invention has the beneficial effects as follows: this full-automatic silicon wafer loading machine sets on the baffle plate that basket has
Put ultrasonic unit, using the incoming solution of ultrasonic wave acoustic energy, wash pollution on silicon chip off by cavitation effect it is ensured that under entrance
The effectiveness of the silicon chip before one technique, increased the feature of full-automatic silicon wafer loading machine simultaneously, arranges on action bars
There are four suckers, and it is arranged on action bars for " ten " font, can improve the work efficiency of machine.
Brief description
Fig. 1 is present configuration schematic diagram；
Fig. 2 is basket lamps structure schematic diagram of the present invention.
In figure: 1, body, 2, operating board, 3, basket tool, 4, carrier, 5, guider, 6, action bars, the 7, first sucker,
8th, the second sucker, the 9, the 3rd sucker, the 10, the 4th sucker, 11, control panel, 12, display lamp, 13, YE, 14, bottom
Case, 15, basket tool riser, 16, baffle plate, 17, ultrasonic unit, 18, stock shelf.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation description is it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of not making creative work
Embodiment, broadly falls into the scope of protection of the invention.
Refer to Fig. 1-2, the present invention provides a kind of a kind of technical scheme: full-automatic silicon wafer loading machine, including body 1, behaviour
Station 2, basket tool 3, carrier 4, guider 5, action bars 6, the first sucker 7, the second sucker 8, the 3rd sucker 9, the 4th sucker
10th, control panel 11, display lamp 12, YE 13, under casing 14, basket tool riser 15, baffle plate 16, ultrasonic unit 17
With stock shelf 18, body 1 is provided with operating board 2, and on the left of it, upper end is connected with control panel 11, and operating board 2 is provided with
So as to cleaning performance becomes apparent from, the two ends of basket tool 3 are mounted with guider 5 to basket tool 3, and its rear end is provided with action bars 6,
Action bars 6 is horizontal rotation apparatus, and its anglec of rotation is 0 ° -90 °, and guider 5 is provided with carrier 4, carrier 4 He
Guider 5 is provided with four altogether, and carrier 4 is detachable connecting device with guider 5, the outer surface four of action bars 6
First sucker 7, the second sucker 8, the 3rd sucker 9 and the 4th sucker 10 are installed, the first sucker 7, the second sucker the 8, the 3rd are inhaled week
Disk 9 and the 4th sucker 10 are that " ten " font is installed, and can be advantageously implemented the first sucker 7 and the 3rd sucker 9, the second sucker 8 and the
Four suckers 10 are operated simultaneously, improve work efficiency, the rear end of control panel 11 is provided with display lamp 12, YE 13
Lower end be provided with casing 14, the inside of under casing 14 is provided with basket tool riser 15, and the left and right two ends of basket tool 3 are mounted with baffle plate
16, and its lower end is provided with stock shelf 18, and baffle plate 16 is provided with ultrasonic unit 17, baffle plate 16 is with ultrasonic unit 17 even
Connect one entirety of formation, and it is provided with two groups.
Operation principle: before using this full-automatic silicon wafer loading machine, need the structure to whole device to carry out simply
Understand, silicon chip is placed on basket tool 3, operational control panel 11, the silicon chip that basket is had on 3 by the first sucker 7 on action bars 6 is inhaled
Rise and rotate at guider 5, the 3rd sucker 9 carries out same work simultaneously, silicon chip is sent to carrier by guider 5
On 4, and the second sucker 8 and the 4th sucker 10 carry out drawing the silicon chip on basket tool 3, until silicon chip will be filled on carrier 4, operation
Bar 6 quits work, and takes out carrier 4.
Although being described in detail to the present invention with reference to the foregoing embodiments, for a person skilled in the art,
It still can be modified to the technical scheme described in foregoing embodiments, or wherein some technical characteristics are carried out etc.
With replacement, all any modification, equivalent substitution and improvement within the spirit and principles in the present invention, made etc., should be included in this
Within the protection domain of invention.
Claims (5)
1. a kind of full-automatic silicon wafer loading machine, including body (1), operating board (2), basket tool (3), carrier (4), guider
(5), action bars (6), the first sucker (7), the second sucker (8), the 3rd sucker (9), the 4th sucker (10), control panel (11),
Display lamp (12), YE (13), under casing (14), basket tool riser (15), baffle plate (16), ultrasonic unit (17) and
Stock shelf (18) it is characterised in that: be provided with operating board (2) on described body (1), and on the left of it, upper end be connected with control panel
(11), described operating board (2) is provided with basket tool (3), the two ends of described basket tool (3) are mounted with guider (5), and its rear end
Action bars (6) is installed, described guider (5) is provided with carrier (4), the outer surface surrounding peace of described action bars (6)
Equipped with the first sucker (7), the second sucker (8), the 3rd sucker (9) and the 4th sucker (10), the rear end of described control panel (11)
It is provided with display lamp (12), the lower end of described YE (13) is provided with casing (14), the inside peace of described under casing (14)
Equipped with basket tool riser (15), the left and right two ends of described basket tool (3) are mounted with baffle plate (16), and its lower end is provided with stock shelf
(18), described baffle plate (16) is provided with ultrasonic unit (17).
2. a kind of full-automatic silicon wafer loading machine according to claim 1 it is characterised in that: described action bars (6) be level
Rotary apparatuss, and its anglec of rotation is 0 ° -90 °.
3. a kind of full-automatic silicon wafer loading machine according to claim 1 it is characterised in that: described carrier (4) and guiding
Device (5) is provided with four altogether, and carrier (4) is detachable connecting device with guider (5).
4. a kind of full-automatic silicon wafer loading machine according to claim 1 it is characterised in that: described baffle plate (16) and ultrasound wave
Device (17) connects one entirety of formation, and it is provided with two groups.
5. a kind of full-automatic silicon wafer loading machine according to claim 1 it is characterised in that: described first sucker (7), second
Sucker (8), the 3rd sucker (9) and the 4th sucker (10) are that " ten " font is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610740521.XA CN106340476B (en) | 2016-08-26 | 2016-08-26 | Full-automatic silicon chip loading machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610740521.XA CN106340476B (en) | 2016-08-26 | 2016-08-26 | Full-automatic silicon chip loading machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106340476A true CN106340476A (en) | 2017-01-18 |
| CN106340476B CN106340476B (en) | 2018-11-30 |
Family
ID=57822344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610740521.XA Active CN106340476B (en) | 2016-08-26 | 2016-08-26 | Full-automatic silicon chip loading machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106340476B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5793826A (en) * | 1980-11-28 | 1982-06-11 | Mitsubishi Electric Corp | Basket automatic transporter |
| CN201117644Y (en) * | 2007-09-20 | 2008-09-17 | 中国电子科技集团公司第二研究所 | Full-automatic silicon chip charging-discharging machine |
| CN201559823U (en) * | 2009-05-15 | 2010-08-25 | 东莞市启天自动化设备有限公司 | Full automatic silicon chip loading machine |
| CN201663151U (en) * | 2009-03-06 | 2010-12-01 | 东莞市启天自动化设备有限公司 | Full automatic silicon chip loading and unloading machine |
| CN201999522U (en) * | 2010-12-21 | 2011-10-05 | 苏州阿特斯阳光电力科技有限公司 | Full-automatic silicon chip feeding machine |
| CN203281548U (en) * | 2013-05-31 | 2013-11-13 | 浙江金乐太阳能科技有限公司 | Solar silicon wafer ultrasonic cleaning groove |
| CN204179097U (en) * | 2014-09-03 | 2015-02-25 | 天津潮能科技发展有限公司 | Solar cell plug-in sheet machine |
-
2016
- 2016-08-26 CN CN201610740521.XA patent/CN106340476B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5793826A (en) * | 1980-11-28 | 1982-06-11 | Mitsubishi Electric Corp | Basket automatic transporter |
| CN201117644Y (en) * | 2007-09-20 | 2008-09-17 | 中国电子科技集团公司第二研究所 | Full-automatic silicon chip charging-discharging machine |
| CN201663151U (en) * | 2009-03-06 | 2010-12-01 | 东莞市启天自动化设备有限公司 | Full automatic silicon chip loading and unloading machine |
| CN201559823U (en) * | 2009-05-15 | 2010-08-25 | 东莞市启天自动化设备有限公司 | Full automatic silicon chip loading machine |
| CN201999522U (en) * | 2010-12-21 | 2011-10-05 | 苏州阿特斯阳光电力科技有限公司 | Full-automatic silicon chip feeding machine |
| CN203281548U (en) * | 2013-05-31 | 2013-11-13 | 浙江金乐太阳能科技有限公司 | Solar silicon wafer ultrasonic cleaning groove |
| CN204179097U (en) * | 2014-09-03 | 2015-02-25 | 天津潮能科技发展有限公司 | Solar cell plug-in sheet machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106340476B (en) | 2018-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201230 Address after: 311800 unit 2, building 3, Anping community, Jiyang street, Zhuji City, Shaoxing City, Zhejiang Province Patentee after: Chen Ximei Address before: No. 1677, Binhai 1st Road, Wenzhou Economic and Technological Development Zone, Zhejiang 325000 Patentee before: WENZHOU SERAPHIM ENERGY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211216 Address after: 276000 Longhu Software Park, 279 shuangyueyuan Road, high tech Industrial Development Zone, Linyi City, Shandong Province Patentee after: Linyi Longruan Information Technology Co.,Ltd. Address before: 311800 unit 2, building 3, Anping community, Jiyang street, Zhuji City, Shaoxing City, Zhejiang Province Patentee before: Chen Ximei |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220921 Address after: Longhu Software Park, No. 276, Shuangyueyuan Road, High-tech Industrial Development Zone, Linyi City, Shandong Province, 276000 Patentee after: Shandong Longfor Information Industry Group Co.,Ltd. Address before: 276000 Longhu Software Park, 279 shuangyueyuan Road, high tech Industrial Development Zone, Linyi City, Shandong Province Patentee before: Linyi Longruan Information Technology Co.,Ltd. |