CN106322819A - Solder strip semiconductor cooling device - Google Patents
Solder strip semiconductor cooling device Download PDFInfo
- Publication number
- CN106322819A CN106322819A CN201510381804.5A CN201510381804A CN106322819A CN 106322819 A CN106322819 A CN 106322819A CN 201510381804 A CN201510381804 A CN 201510381804A CN 106322819 A CN106322819 A CN 106322819A
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- CN
- China
- Prior art keywords
- semiconductor
- condenser
- fan
- solder strip
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a solder strip semiconductor cooling device which comprises a cooling air bellow, a semiconductor refrigeration assembly, evaporator fins, a fan, condenser fins, a condenser fan, a solder strip, a semiconductor and a tin coating machine. The solder strip semiconductor cooling device is characterized in that the evaporator fins are arranged in the cooling air bellow, the fan is arranged at the bottom of the cooling air bellow, the refrigeration semiconductor, the evaporator fins, the condenser fins and the condenser fan are fastened together to form the semiconductor refrigeration assembly, cold air is formed on an evaporator to be blown into the cooling air bellow by the fan, and cold air is absorbed by the solder strip. The solder strip absorbs heat quickly so as to achieve a heat dissipation effect. In the whole process, cooling performance is stable, quality is reliable, and the product percent of pass reaches 99.98% or more.
Description
Technical field
The present invention relates to a kind of solar energy tin-coated machine for solder strip, cold especially with respect to after a kind of solar energy solder strip tinning
But process.
Background technology
Solar energy industry develops rapidly so that the welding process technology in solar battery sheet has become as this row
Industry product is eventually striking to the important step of consumer, and the processing effect of welding directly determines the use of cell piece
Life-span and energy conversion efficiency.The painting stannum of welding is the necessary operation before welding, owing to present welding processes skill
Art calendering, be coated with stannum and be integrally forming, and take-up speed reached per second 50 meters upwards, be coated with after stannum above welding
Temperature has little time to cool down just to be packed up by take-up pulley in atmosphere, thus affects the quality of welding.
Summary of the invention:
For the shortcoming of existing solder strip tinning process cooling, the present invention provides a kind of welding semiconductor cooling device,
Described refrigeration semiconductor and evaporator fin and condenser fin and condenser fan firm together with formed and partly lead
Body cooling assembly, described vaporizer is formed cold air and is blown out in cool wind box by blower fan, when in cool wind box
On vaporizer, cold air produces and is blown out by blower fan, and welding quickly absorbs heat thus plays radiating effect, and whole process is cold
But stable performance, reliable in quality, conforming product rate reaches more than 99.98%.
The present invention is achieved in that a kind of welding semiconductor cooling device, and it includes: cool wind box,
Semiconductor refrigerating assembly, evaporator fin, blower fan, condenser fin, condenser fan, welding, partly lead
Body, painting stannum machine composition, it is characterised in that: being provided with evaporator fin in described cool wind box, described blower fan sets
Bottom cool wind box, described refrigeration semiconductor, evaporator fin, condenser fin and condenser fan are tight
Gu form semiconductor refrigerating assembly together, described vaporizer is formed cold air and is blown out at cool wind box by blower fan
In, cold air is absorbed by welding.
It is an advantage of the invention that welding cools down in cool wind box, speed is fast, and efficiency is high, and take-up speed is the highest
Up to 90 metre per second (m/s)s, thus improve production efficiency, and welding cools down in cool wind box, welding dry tack free.
Accompanying drawing explanation
Fig. 1, welding cool down schematic diagram in cool wind box
Fig. 2, quasiconductor are contained in enlarged drawing on cool wind box
In figure: 1-is coated with stannum machine, 2-welding, 3-cool wind box, 4-semiconductor refrigerating assembly, 41-condenser fan,
42-condenser fin, 43-evaporator fin, 44-quasiconductor, 5-blower fan.
Detailed description of the invention
Embodiment is further described below in conjunction with accompanying drawing
Seeing accompanying drawing 1: be provided with evaporator fin 43 in cool wind box 3, blower fan 5 is located at cool wind box 3 end
Portion, refrigeration semiconductor 44, evaporator fin 43, condenser fin 42 and condenser fan 41 are fastened on one
Rise and form semiconductor refrigerating assembly 4, evaporator fin 43 is formed cold air and is blown in cool wind box by blower fan 5,
Welding 2 is absorbed by welding 2 through supercooling bellows 3, cold air after being coated with stannum machine 1 and being coated with stannum, thus welding 2 plays
The effect of cooling, this kind of method good heat dissipation effect speed is fast, can reach the speed of 90 metre per second (m/s)s by take-up
Wheel is packed up.
Claims (1)
1. a welding semiconductor cooling device, it includes: cool wind box, semiconductor refrigerating assembly,
Evaporator fin, blower fan, condenser fin, condenser fan, welding, quasiconductor, painting stannum unit
Become, it is characterised in that: being provided with evaporator fin in described cool wind box, described blower fan is located at cooling wind
Bottom portion, described refrigeration semiconductor and evaporator fin and condenser fin and condenser fan are fastened on
Form semiconductor refrigerating assembly together, described vaporizer is formed cold air and is blown out at cool wind box by blower fan
In, cold air is absorbed by welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510381804.5A CN106322819A (en) | 2015-06-29 | 2015-06-29 | Solder strip semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510381804.5A CN106322819A (en) | 2015-06-29 | 2015-06-29 | Solder strip semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106322819A true CN106322819A (en) | 2017-01-11 |
Family
ID=57726281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510381804.5A Pending CN106322819A (en) | 2015-06-29 | 2015-06-29 | Solder strip semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106322819A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2497243Y (en) * | 2001-09-11 | 2002-06-26 | 李生铭 | Electronic refrigerator |
| CN2867185Y (en) * | 2006-01-13 | 2007-02-07 | 珠海佳一电子技术有限公司 | Semiconductor air-conditioner |
| CN102206796A (en) * | 2010-03-30 | 2011-10-05 | 无锡市斯威克科技有限公司 | Tin coated copper ribbon cooling device for tin coating machine |
| CN202415673U (en) * | 2011-12-16 | 2012-09-05 | 苏州宇邦新型材料有限公司 | Device for cooling tin-plated copper strip of photovoltaic assembly after tin plating process |
| CN104329858A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Mixed refrigeration refrigerator with cold storage and refrigeration functions |
-
2015
- 2015-06-29 CN CN201510381804.5A patent/CN106322819A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2497243Y (en) * | 2001-09-11 | 2002-06-26 | 李生铭 | Electronic refrigerator |
| CN2867185Y (en) * | 2006-01-13 | 2007-02-07 | 珠海佳一电子技术有限公司 | Semiconductor air-conditioner |
| CN102206796A (en) * | 2010-03-30 | 2011-10-05 | 无锡市斯威克科技有限公司 | Tin coated copper ribbon cooling device for tin coating machine |
| CN202415673U (en) * | 2011-12-16 | 2012-09-05 | 苏州宇邦新型材料有限公司 | Device for cooling tin-plated copper strip of photovoltaic assembly after tin plating process |
| CN104329858A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Mixed refrigeration refrigerator with cold storage and refrigeration functions |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170111 |