CN106298720B - 一种封装键合用银合金丝及其制备方法 - Google Patents

一种封装键合用银合金丝及其制备方法 Download PDF

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CN106298720B
CN106298720B CN201610626895.9A CN201610626895A CN106298720B CN 106298720 B CN106298720 B CN 106298720B CN 201610626895 A CN201610626895 A CN 201610626895A CN 106298720 B CN106298720 B CN 106298720B
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silver
alloy
preparation
palladium
wire
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CN106298720A (zh
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李康
李松林
李扣民
曹鹏
谭佃龙
余新泉
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Jiangsu Tiankang Electronic Synthetic Materials Co Ltd
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Abstract

本发明涉及一种封装键合用银合金丝及其制备方法，属于键合线加工工艺技术领域，银合金丝由以下重量比(wt％)的金属材料组成：Au<1％,Pd1000‑10000ppm，Pb10‑200ppm，Mg5ppm，其余为Ag。其制备方法包括：备料；制作中间合金；真空熔炼与拉铸；将合金棒材用粗拉抽线机组制成2‑4mm的合金母线；将合金母线进行中间在线退火；将中间在线退火后的合金母线通过连拉机组拉制成直径为0.015‑0.030mm的微丝；将拉制成的微丝进行稳定化在线退火，制成银合金丝。本发明从冶金物理化学原理出发，设计出简单易行合金成分，大幅提高金属钯含量，采用中间合金融入液态银中，显著提高银合金抗氧化性，通过中间合金的方法加入不同数量镁调节银合金丝的强塑性，加入微量铅元素增强成球稳定性。

Description

一种封装键合用银合金丝及其制备方法
技术领域
本发明涉及一种封装键合用银合金丝及其制备方法，属于键合线加工工艺技术领域。
背景技术
键合用微丝目前有多种，金丝、银丝、铜丝、镀钯铜丝、银镀金等，但综合性能仍以金丝为佳，特别是多年来各种键合设备也适应金丝的使用，金丝的稳定性也得到认可。近几年新开发的单晶铜丝虽然和金丝相比成本下降很多，但由于铜丝强韧性配合，特别是抗氧化性较差，目前推广应用也比较困难。镀钯铜丝、银镀金等解决了键合丝的氧化问题，但电镀对环境造成污染，同时在使用过程中仍然存在球焊不稳等问题。
银丝导电、导热性比金丝好，而机械性能与金丝相近，特别是成本要比金丝下降很多，是代替金丝的比较接近的材料，但在老式焊线设备上应用不成熟，或要加装氮气保护才能使用，二是对厂商技术要求较高，为达到理想效果，前期通常需要长时间设备调试。银丝使用时成球不稳定，易氧化成为银丝推广应用的阻碍。
目前关于铜银合金方面的研究很多，如北京科技大学刘雪峰等人采用温型连铸方法制备出具有沿长度方向取向度高的柱状晶组织、直径1～30mm的铜银合金线坯，温型连铸的拉坯速度为1～600mm/min；在室温或低于线坯再结晶温度20～50℃的温度下对线坯进行轧制或粗拉，再精拉到直径为10～50μm的线材。但本发明涉及一种温型铸造方法，未体现键合用丝的成分设计与要求。河南优克电子材料有限公司等公开了一种微细铜银合金线的制造方法，包括铜银合金坯料的冶炼与连铸；铜银合金杆的拉制；铜银合金线的中间热处理以及中间热处理的铜银合金线经中拉机拉制成直径0.1-0.25mm的铜银合金线。这些合金成分以铜为基体，银为添加成分且银含量较高，产品主要用于导线和电声等，不适合作为键合导线用。
目前开发的银合金键合线中金含量达到20-55％，如CN102776405A专利其金含量达20-30％，CN104388861A专利其金含量达到35-55％，这些材料中也添加其他微量元素，制造成本相对较高。也有发明提出采用电镀方法在纯银丝材表面镀金以提高材料性能，但镀层稳定性以及环保要求制约材料的使用与发展。
发明内容
本发明的目的在于克服现有技术中存在的缺陷，提供一种封装键合用银合金丝及其制备方法。
为实现上述目的，本发明的技术方案是一种封装键合用银合金丝，由以下重量比(wt％)的金属材料组成：Au<1％,Pd1000-10000ppm，Pb10-200ppm，Mg5ppm，其余为Ag。
同时提供一种封装键合用银合金丝的制备方法，包括以下步骤：。
1)备料：准备纯度不低于99.99％的银锭，纯度不低于99.99％的金、工业纯钯片、纯镁粒和铅粒；
2)制作中间合金，所述中间合金是指银-钯中间合金和银-镁中间合金；
3)真空熔炼与拉铸：将银锭放入真空炉内加热至1000摄氏度直至完全熔化，而后分别加入银钯中间合金、银镁中间合金、金粒和铅粒，在真空下搅拌，全部溶化后继续搅拌8-12分钟后进行拉铸成直径为8-12mm的合金棒材；
4)将合金棒材用粗拉抽线机组制成2-4mm的合金母线，所述拉丝工艺如下表所示：
附表1：粗拉配模及工艺参数
附表2：中拉配模及工艺参数
5)将合金母线进行中间在线退火；
6)将中间在线退火后的合金母线通过连拉机组拉制成直径为0.015-0.030mm的微丝，最终产品根据规定的拉丝步骤完成，具体如下设备配模表：
LZDM-120/15配模表
序号 直径(mm) 延伸率(％) 直径(mm) 延伸率(％)
1 0.2125 10.0±3％ 0.09090 10.0±3％
2 0.1976 10.0±3％ 0.08630 10.0±3％
3 0.1838 10.0±3％ 0.08190 10.0±3％
4 0.1710 10.0±3％ 0.07772 10.0±3％
5 0.1590 10.0±3％ 0.07380 10.0±3％
6 0.1479 10.0±3％ 0.07000 10.0±3％
7 0.1376 10.0±3％ 0.06640 10.0±3％
8 0.1279 10.0±3％ 0.06308 10.0±3％
9 0.1190 10.0±3％ 0.05990 10.0±3％
10 0.1107 10.0±3％ 0.05685 10.0±3％
11 0.1029 10.0±3％ 0.05395 10.0±3％
12 0.0957 10.0±3％ 0.05120 10.0±3％
13 0.04853 6.55±3％
LZDM-60/15配模
序号 直径(mm) 延伸率％ 直径(mm) 延伸率％
1 0.04703 6.55±3％ 0.03125 6.55±3％
2 0.04558 6.55±3％ 0.03028 6.55±3％
3 0.04417 6.55±3％ 0.02934 6.55±3％
4 0.04280 6.55±3％ 0.02843 6.55±3％
5 0.04148 6.55±3％ 0.02753 6.55±3％
6 0.04020 6.55±3％ 0.02668 6.55±3％
7 0.03895 6.55±3％ 0.02585 6.55±3％
8 0.03775 6.55±3％ 0.02505 6.55±3％
9 0.03658 6.55±3％ 0.02427 6.55±3％
10 0.03545 6.55±3％ 0.02352 6.55±3％
11 0.03435 6.55±3％ 0.02279 6.55±3％
12 0.03328 6.55±3％ 0.02208 6.55±3％
13 0.03225 6.55±3％ 0.02140 6.55±3％
LZDM-40/11配模表
序号 直径(mm) 延伸率(％)
1 0.02074 6.55±3％
2 0.02009 6.55±3％
3 0.01947 6.55±3％
4 0.01887 6.55±3％
5 0.01828 6.55±3％
6 0.01772 6.55±3％
7)将拉制成的微丝进行稳定化在线退火，制成银合金丝。
具体地，制作中间合金包括以下步骤：
1)将钯片放入坩埚中，在真空条件下加热至1600摄氏度，待钯片全部融化后，将银锭放入熔融钯液中，直至银锭全部融化，停止加热，而后温度降至1450摄氏度，再将部分银锭放入熔体中直至全部熔化后温度降至1300摄氏度，搅拌均匀后在保护气氛的保护下浇注到金属模具中形成银-钯中间合金；
2)按照权利要求1中的重量配比，将剩余银锭放入坩埚内，在真空条件下加热至1000-1100摄氏度，待全部融化后，在保护气氛下，按重量配比加入镁粒搅拌，全部融化后进行真空处理，在保护气氛下浇注到铸模中形成银-镁中间合金。
具体地，所述银-钯中间合金中钯含量为1％-50％，所述银-镁中间合金中镁含量为0.5％-30％。
具体地，所述真空熔炼时首先将银锭融化，其他合金的添加顺序依次为银-钯中间合金、金粒、银-镁中间合金和铅。
具体地，所述中间在线退火的退火温度为400-500摄氏度，线速度为400-800mm/min。
具体地，所述稳定化在线退火的退火温度为400-450摄氏度，线速度为200-400m/min。
具体地，所述制备方法还包括：将稳定化在线退火后的银合金丝进行常规复绕真空吸塑包装入库。
具体地，所述保护气氛为氮气或氩气
本发明从冶金物理化学原理出发，设计出简单易行合金成分，大幅提高金属钯含量，采用中间合金融入液态银中，显著提高银合金抗氧化性，通过中间合金的方法加入不同数量镁调节银合金丝的强塑性，加入微量铅元素增强成球稳定性。在拉伸过程中，根据合金特点采用低于一般银合金退火温度的中间退火工艺，既保证了银合金丝的性能，也保证银合金丝拉拔性能以及使用时放线顺畅性。
本发明的有益效果是：
一，成本优势比较大，和金丝相比可以降低成本约80％。
二，封装行业支架为全镀银层，银与银之间的结合强度大大提高，焊接性能更加优越，焊点推力是金线的1.5倍。
三，目前我国LED照明发光光源为暖白和纯白两种，银色具有发光效应，不吸光，大大提高LED发光亮度，与目前的金线相比可以提高10％的亮度.
四，导电性能优越，散热快，可提高减少LED发光衰减效率。
五，此合金线的延展性能优异，可以通过热处理来控制BL/EL之间强度，采用超声波球焊可形成球圆，可焊性强操作方便，无需在封装过程中用氮气保护、助燃、操作简单，适用于封装行业的各种超声波焊线机器。
附图说明
图1是本发明的一种低成本封装键合用银合金丝的制备方法的流程图；
具体实施方式
下面结合附图，对本发明的具体实施方式作进一步描述。以下实施例仅用于更加清楚地说明本发明的技术方案，而不能以此来限制本发明的保护范围。
实施例1：
本发明一种低成本高稳定性封装用键合银合金丝及其制备方法，其中键合银合金丝的成分为：Au<1％,Pd 1000-10000ppm,Pb 10-200ppm,Mg 5ppm,其余为Ag。
其制备方法包括以下步骤：1、备料；2、制备中间合金；3、真空熔炼与拉铸；4、粗拉；5、中间退火、6、中细拉；7、稳定化退火、8包装。
1、备料。称取99.99％银锭若干,纯度不低于99.99％金500g，工业纯钯片2kg及纯镁粒500g，铅粒500g。
2、制备中间合金。
a将1.5kg钯片放入坩埚内，在真空下将温度加热至1600度，钯片全部融化后将1kg银锭分放入熔融钯液中，银全部融化停止加热，温度将至1450度时将2.5kg银锭放入熔体中直至全部融化后温度降至1300度，搅拌均匀后在氩气或氮气保护下浇注到金属模中成型备用。
b将4.5kg银锭放入坩埚内，在真空下将温度加热至1000度-1100度，观察全部融化后在保护气氛下加入500g镁粒搅拌，全部融化后进行真空处理，在保护气氛下浇注到铸模中形成含10％Mg银镁中间合金，由于烧损实际测量镁含量为9％。
3、真空熔炼与拉铸。将4942g银锭放入真空内加热到1000度熔化，在保护气氛下依次加入33g银钯中间合金、0.28g银镁中间合金、25g金粒，0.05g铅粒。在真空下搅拌，全部融化后继续搅拌10分钟后进行拉铸成8mm直径合金棒。
4、粗拉。将合金棒通过多次拉拔至3.0mm。
5、中间退火。将3.0mm线材在保护气氛下进行退火，退火温度控制在400-450度，线速度控制在500mm/min左右。
6、中细拉。将退火后的线材经多道次拉拔至0.02mm。
7、稳定化退火。将0.018mm微丝进行稳定化退火，退火温度控制在400-450摄氏度，线速度为400m/min左右。
8、包装。将退火后微丝分装在真空包装袋中入库。
所得到的银合金线性能如下：
实施例2
真空熔炼与拉铸。将4930g银锭放入真空炉内加热到1000度左右熔化，在保护气氛下依次加入50g实施例1所述银钯中间合金、0.5g银镁中间合金、20g金粒，0.05g铅粒。在真空下搅拌，全部融化后继续搅拌10分钟后进行拉铸成8mm直径合金棒。
2)、粗拉。将合金棒通过多次拉拔至3.0mm。
3)、中间退火。将3.0mm线材在保护气氛下进行退火，退火温度控制在400-450度，线速度控制在500mm/min左右。
4)、中细拉。将退火后的线材经多道次拉拔至0.025mm。
5)、稳定化退火。将0.025mm微丝进行稳定化退火，退火温度控制在400-450摄氏度，线速度为300m/min左右。
6)、包装。将退火后微丝分装在真空包装袋中入库。
所得到的银合金线性能如下：
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (8)

1.一种封装键合用银合金丝的制备方法，封装键合用银合金丝，由以下重量比(wt% )的金属材料组成:Au<1%， Pd1000-10000ppm， Pb10-200ppm， Mg5ppm，其余为Ag，其特征在于，包括以下步骤：
1)备料:准备纯度不低于99.99% 的银锭，纯度不低于99.99% 的金、工业纯钯片、纯镁粒和铅粒；
2) 制作中间合金，所述中间合金是指银-钯中间合金和银-镁中间合金；
3) 真空熔炼与拉铸：将银锭放入真空炉内加热至1000摄氏度直至完全熔化，而后分别加入银-钯中间合金、银-镁中间合金、金粒和铅粒，在真空下搅拌，全部熔化后继续搅拌8-12分钟后进行拉铸成直径为8-12mm的合金棒材；
4) 将合金棒材用粗拉抽线机组制成2-4mm的合金母线；
5) 将合金母线进行中间在线退火；
6) 将中间在线退火后的合金母线通过连拉机组拉制成直径为0.015-0.030mm的微丝；
7)将拉制成的微丝进行稳定化在线退火，制成银合金丝。
2.如权利要求1所述的封装键合用银合金丝的制备方法，其特征在于，制作中间合金包括以下步骤：
1)将钯片放入坩埚中，在真空条件下加热至1600摄氏度，待钯片全部融化后，将银锭放入熔融钯液中，直至银锭全部融化，停止加热，而后温度降至1450摄氏度，再将部分银锭放入熔体中直至全部熔化后温度降至1300摄氏度，搅拌均匀后在保护气氛的保护下浇注到金属模具中形成银-钯中间合金；
2) 按照金属材料组成重量配比，将剩余银锭放入坩埚内，在真空条件下加热至1000-1100摄氏度，待全部融化后，在保护气氛下，按重量配比加入镁粒搅拌，全部融化后进行真空处理，在保护气氛下浇注到铸模中形成银-镁中间合金。
3.如权利要求2所述的封装键合用银合金丝的制备方法，其特征在于，所述银-钯中间合金中钯含量为1 %-50%，所述银-镁中间合金中镁含量为0.5%-30% 。
4.如权利要求1、2所述的封装键合用银合金丝的制备方法，其特征在于，所述真空熔炼时首先将银锭融化，其他合金的添加顺序依次为银-钯中间合金、金粒、银-镁中间合金和铅。
5.如权利要求4所述的封装键合用银合金丝的制备方法，其特征在于，所述中间在线退火的退火温度为400-500摄氏度，线速度为400-800mm/min 。
6.如权利要求1 或5所述的封装键合用银合金丝的制备方法，其特征在于，所述稳定化在线退火的退火温度为400-450摄氏度，线速度为200-400m/min 。
7.如权利要求1所述的封装键合用银合金丝的制备方法，其特征在于，所述制备方法还包括：将稳定化在线退火后的银合金丝进行常规复绕真空吸塑包装入库。
8.如权利要求2、3所述的封装键合用银合金丝的制备方法，其特征在于，所述保护气氛为氮气或氩气。
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