CN106298623A - 一种可调节高度的晶圆承托机构 - Google Patents

一种可调节高度的晶圆承托机构 Download PDF

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CN106298623A
CN106298623A CN201510367886.8A CN201510367886A CN106298623A CN 106298623 A CN106298623 A CN 106298623A CN 201510367886 A CN201510367886 A CN 201510367886A CN 106298623 A CN106298623 A CN 106298623A
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ceramics pole
height
hot plate
ceramic jacket
spanner
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柴智
刘忆军
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Piotech Inc
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Piotech Shenyang Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种可调节高度的晶圆承托机构，解决了现有晶圆承托机构不可调节的问题。该机构包括热盘、陶瓷套、陶瓷柱及调整扳手。所述陶瓷柱制有外螺纹，陶瓷套制有内螺纹，陶瓷套与陶瓷柱螺纹连接。上述热盘加工有圆形沉孔，将陶瓷套放入沉孔，再将陶瓷柱用调整扳手旋入陶瓷套。陶瓷柱顶端制有球面凸起，球面凸起与调整扳手底部的凹面相匹配。所述陶瓷柱顶端的球面凸起用于承托晶圆，用高度尺测量陶瓷柱球面凸起与热盘上表面的高度，用调整扳手微调陶瓷柱使其达到所需高度，用同样方法将热盘上的全部承托机构调至同一高度即可。具有结构简单，调节、拆装方便，定位精度高及安全可靠的特点。主要用于半导体薄膜沉积技术领域。

Description

一种可调节高度的晶圆承托机构
技术领域
本发明涉及一种半导体镀膜设备用的晶圆承托机构，此机构主要应用于半导体镀膜设备反应腔内常温或高温工艺过程中，属于半导体薄膜沉积的应用技术领域。
背景技术
半导体镀膜设备的晶圆与热盘之间需要有一定的间隙，间隙的大小对工艺结果有很大影响。目前的晶圆承托机构不可调节，完全依靠机械加工来保证此间隙，由于加工过程中存在误差，使承托机构的高度不一致，当误差过大时会对工艺结果产生负面影响，而且负面影响不能被消除。
发明内容
本发明以解决上述问题为目的，设计了可调节高度的晶圆承托机构，解决了现有晶圆承托机构不可调节的问题。
为实现上述目的，本发明采用下述技术方案：一种可调节高度的晶圆承托机构，利用陶瓷随温度变化形变小，再通过螺纹调整高度，使晶圆与热盘之间的间隙保持一致。该机构包括热盘(1)、陶瓷套(2)、陶瓷柱(3)及调整扳手(4)。所述陶瓷柱(3)制有外螺纹，陶瓷套(2)制有内螺纹，陶瓷套(2)与陶瓷柱(3)通过螺纹连接。
上述热盘(1)加工有圆形沉孔，将陶瓷套(2)放入沉孔，再将陶瓷柱(3)用调整扳手(4)旋入陶瓷套(2)。陶瓷柱(3)顶端制有球面凸起，球面凸起与调整扳手(4)底部的凹面相匹配。
所述陶瓷柱(3)顶端的球面凸起用于承托晶圆，用高度尺测量陶瓷柱(3)球面凸起与热盘(1)上表面的高度，用调整扳手(4)微调陶瓷柱(3)使其达到所需高度，用同样方法将热盘(1)上的全部承托机构调至同一高度即可。如需改变间隙，只需用调整扳手(4)重新微调陶瓷柱(3)至所需高度。
上述高度调节是在常温条件下进行的但是使用却是在高温条件下，因考虑到物体都有热胀冷缩的效应，而陶瓷的热变形非常小，温度变化造成的变形量可忽略不计，因此可以满足常温调整而在高温下使用的技术要求。
本发明的有益效果及特点在于：
本发明由于采用了新的结构设计，降低了对机械加工精度的要求，解决了现有晶圆承托机构不可调节的问题。通过使用调整扳手微调陶瓷柱使其达到所需高度，用同样方法将热盘上的全部承托机构调至同一高度即可。如需改变间隙，只需用调整扳手重新微调陶瓷柱至所需高度。具有结构简单，调节、拆装方便，定位精度高及安全可靠的特点。可广泛应用于半导体薄膜沉积技术领域。
附图说明
图1是本发明的结构示意图。
图中零件标号分别代表:
1、热盘；2、陶瓷套；3、陶瓷柱；4、调整扳手。
具体实施方式
实施例
参照图1，一种可调节高度的晶圆承托机构，包括热盘1、陶瓷套2、陶瓷柱3及调整扳手4。所述陶瓷柱3制有外螺纹；所述陶瓷套2制有内螺纹，陶瓷套2与陶瓷柱3螺纹连接。
上述热盘1加工有圆形沉孔，将陶瓷套2放入沉孔，再将陶瓷柱3用调整扳手4旋入陶瓷套2。陶瓷柱3顶端制有球面凸起，球面凸起与调整扳手4底部的凹面相匹配。
所述陶瓷柱3顶端的球面凸起用于承托晶圆，用高度尺测量陶瓷柱3球面凸起与热盘1上表面的高度，用调整扳手4微调陶瓷柱3使其达到所需高度，用同样方法将热盘1上的全部承托机构调至同一高度即可。如需改变间隙，只需用调整扳手4重新微调陶瓷柱3至所需高度。

Claims (2)

1.一种可调节高度的晶圆承托机构，其特征在于：该机构包括热盘(1)、陶瓷套(2)、陶瓷柱(3)及调整扳手(4)，所述陶瓷柱(3)制有外螺纹；所述陶瓷套(2)制有内螺纹，陶瓷套(2)与陶瓷柱(3)螺纹连接，上述热盘(1)加工有圆形沉孔，将陶瓷套(2)放入沉孔，再将陶瓷柱(3)用调整扳手(4)旋入陶瓷套(2)，陶瓷柱(3)顶端制有球面凸起，球面凸起与调整扳手(4)底部的凹面相匹配。
2.如权利要求1所述的可调节高度的晶圆承托机构，其特征在于：所述陶瓷柱(3)顶端的球面凸起用于承托晶圆，用高度尺测量陶瓷柱(3)球面凸起与热盘(1)上表面的高度，用调整扳手(4)微调陶瓷柱(3)使其达到所需高度，用同样方法将热盘(1)上的全部承托机构调至同一高度即可，如需改变间隙，只需用调整扳手(4)重新微调陶瓷柱(3)至所需高度。
CN201510367886.8A 2015-06-29 2015-06-29 一种可调节高度的晶圆承托机构 Pending CN106298623A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113684470A (zh) * 2021-08-20 2021-11-23 长鑫存储技术有限公司 硅片载台、沉积方法、及薄膜沉积设备
CN116536639A (zh) * 2023-04-21 2023-08-04 拓荆科技(上海)有限公司 一种支撑柱及加热盘组件

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113684470A (zh) * 2021-08-20 2021-11-23 长鑫存储技术有限公司 硅片载台、沉积方法、及薄膜沉积设备
CN113684470B (zh) * 2021-08-20 2024-03-26 长鑫存储技术有限公司 硅片载台、沉积方法、及薄膜沉积设备
CN116536639A (zh) * 2023-04-21 2023-08-04 拓荆科技(上海)有限公司 一种支撑柱及加热盘组件

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