CN106298619B - A kind of silicon chip placement fixed mechanism - Google Patents
A kind of silicon chip placement fixed mechanism Download PDFInfo
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- CN106298619B CN106298619B CN201610709923.3A CN201610709923A CN106298619B CN 106298619 B CN106298619 B CN 106298619B CN 201610709923 A CN201610709923 A CN 201610709923A CN 106298619 B CN106298619 B CN 106298619B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 52
- 239000010703 silicon Substances 0.000 title claims abstract description 52
- 238000013519 translation Methods 0.000 claims abstract description 116
- 230000014616 translation Effects 0.000 claims description 105
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 9
- 238000013461 design Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Weting (AREA)
- Silicon Compounds (AREA)
- Photovoltaic Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a kind of silicon chips to place fixed mechanism, belongs to photovoltaic processing mechanical apparatus field.The invention includes translation sleeve, translation plates, translate hydraulic cylinder, adjust sleeve, adjustable plate and fixed mechanism, translation hydraulic cylinder is horizontally set on the downside of translation sleeve, translation hydraulic cylinder both sides output end is connected and fixed on the downside of the translation plates of translation sleeve both sides respectively, it is symmetrically arranged fixed mechanism on the upside of the translation plates of translation sleeve both sides, a piece translation sleeve side both ends are horizontally disposed with respectively adjusting sleeve, another translation sleeve side both ends are horizontally disposed with respectively adjustable plate compatible with sleeve is adjusted, it adjusts and is vertically arranged with lock plunger between sleeve and adjustable plate.Structure of the invention reasonable design can smoothly place the silicon chip of sizes specification, and can firmly be fixed silicon chip, improve the production and processing efficiency of silicon chip, meet the needs of production and application.
Description
Technical field
The invention belongs to photovoltaic processing mechanical apparatus fields more particularly to a kind of silicon chip to place fixed mechanism.
Background technology
Photovoltaic generation is the abbreviation of solar photovoltaic generation system, is a kind of photovoltaic using solar cell semi-conducting material
Solar radiation energy is converted directly into a kind of new power generating system of electric energy by effect, is had independent operating and is incorporated into the power networks two kinds,
Existing photovoltaic generation material is mainly silicon chip, in the production process of crystal-silicon solar cell, is needed silicon chip according to technique
The sequence of processing passes through the processing technologys such as making herbs into wool, High temperature diffusion and etching successively all to be needed in these production technology process
Silicon chip is fixed, existing silicon chip placement fixed mechanism is complicated and troublesome in poeration, cannot be by sizes specification
Silicon chip smoothly placed, and after silicon chip is placed, it is difficult to accurately firmly be fixed silicon chip so that silicon chip
It often will produce offset in process of manufacture, influence the processing quality and efficiency of silicon chip, and silicon chip is in placement process,
Silicon chip surface often generates friction with placement mechanism, causes silicon chip surface to generate cut, reduces the quality of production of silicon chip, cannot
Meet the needs of production and processing.
Invention content
The technical problem to be solved by the present invention is to overcome the above-mentioned deficiency in the presence of the prior art, and provide a kind of knot
Structure reasonable design can smoothly place the silicon chip of sizes specification, and can firmly carry out silicon chip to compress solid
Fixed silicon chip places fixed mechanism.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention is：A kind of silicon chip placement fixed mechanism,
It is characterized in that：The silicon chip place fixed mechanism include translation sleeve, translation plates, translation hydraulic cylinder, adjust sleeve, adjustable plate and
Fixed mechanism, the translation sleeve are provided with two, and being horizontally disposed with respectively in two translation sleeves has translation channel, translates sleeve
Horizontal symmetrical is provided with translation plates compatible with translation channel respectively for both sides, and translation hydraulic cylinder is horizontally set under translation sleeve
Side, translation hydraulic cylinder are hydraulic cylinder with double piston rods, translate translation plates of the hydraulic cylinder both sides output end respectively with translation sleeve both sides
Downside is connected and fixed, and fixed mechanism, two translations sleeve have been symmetrically arranged on the upside of the translation plates of translation sleeve both sides
In a translation sleeve side both ends be horizontally disposed with have an adjusting sleeve respectively, another translation sleeve side both ends are horizontal respectively
It is provided with adjustable plate compatible with sleeve is adjusted, sleeve upper edge horizontal direction is adjusted and is evenly arranged with multiple mounting holes successively,
It adjusts and is vertically arranged with lock plunger between sleeve and adjustable plate；The fixed mechanism includes firm banking, rotating bracket, compresses gas
Cylinder, fixing bracket and clamping screw, firm banking are horizontally set on the upside of translation plates, and rotating bracket is L-type support, rotating bracket
On both sides of the middle is hinged respectively to be connected at the upper side of firm banking, and it is another above firm banking that fixing bracket tilts upward setting
Side, fixing bracket upper end are provided with connecting plate, and connecting plate on both sides of the middle is hinged respectively to be connected on the upside of fixing bracket, and compression cylinder is set
It sets in connecting plate side, compression cylinder output end hinge is connected to rotating bracket upper end, and the rotating bracket other side is vertically arranged with pressure
Tight lead screw, rotating bracket up and down both sides clamping screw on be threaded with fixing nut respectively, clamping screw lower end is provided with
Compact heap, being horizontally disposed in the translation plates on the downside of the compact heap has stock supporting plate.
Further, the translation sleeve upper horizontal is provided with soft rubber layer.
Further, two translation hydraulic cylinders on the downside of two translations sleeve use same road binders road parallel drive.
Compared with prior art, the present invention haing the following advantages and effect：The configuration of the present invention is simple, by translating sleeve two
Horizontal symmetrical is provided with translation plates compatible with translation channel respectively for side, and translation hydraulic cylinder is horizontally set under translation sleeve
Side, translation hydraulic cylinder both sides output end are connected and fixed on the downside of the translation plates of translation sleeve both sides respectively, utilize translation hydraulic cylinder
Two pieces of translation plates of synchronous driving so that two pieces of translation plates can accurately synchronize opposite shifting according to the dimensions level of silicon chip
Dynamic, being horizontally disposed with respectively using a translation sleeve side both ends in two translation sleeves has adjusting sleeve, another translation
Sleeve side both ends are horizontally disposed with respectively adjustable plate compatible with sleeve is adjusted, and adjusts and is set vertically between sleeve and adjustable plate
It is equipped with lock plunger, enables accurately to adjust the spacing between two translation sleeves according to the dimensions of silicon chip, by translating sleeve
It has been symmetrically arranged fixed mechanism on the upside of the translation plates of both sides, has driven rotating bracket using compression cylinder so that compact heap energy
It is enough to be firmly fixed silicon chip, using being threaded with fixed spiral shell respectively on the clamping screw of both sides above and below rotating bracket
It is female so that clamping screw vertically can be adjusted and fix according to the thickness of silicon chip, utilize water on the upside of translation sleeve
It is flat to be provided with soft rubber layer, make to be avoided that silicon chip generates cut in placement process, it is ensured that silicon chip can efficiently firmly into
Row is fixed, and is improved the efficiency and quality of silicon chip processing, is met the needs of production and application.
Description of the drawings
Fig. 1 is the front view that a kind of silicon chip of the present invention places fixed mechanism.
Fig. 2 is the vertical view that a kind of silicon chip of the present invention places fixed mechanism.
In figure：1. translating sleeve, 2. translation plates, 3. translation hydraulic cylinders, 4. adjust sleeve, and 5. adjustable plates, 6. translate channels,
7. mounting hole, 8. lock plungers, 9. firm bankings, 10. rotating brackets, 11. compression cylinders, 12. fixing brackets, 13. clamping screws,
14. connecting plate, 15. fixing nuts, 16. compact heaps, 17. stock supporting plates, 18. soft rubber layers.
Specific implementation mode
In order to further describe the present invention, a kind of silicon chip is expanded on further below in conjunction with the accompanying drawings and places the specific of fixed mechanism
Embodiment, following embodiment is explanation of the invention and the invention is not limited in following embodiments.
As shown in Figure 1 and Figure 2, a kind of silicon chip of the present invention places fixed mechanism, including translation sleeve 1, translation plates 2, translation liquid
Cylinder pressure 3 adjusts sleeve 4, adjustable plate 5 and fixed mechanism, and translation sleeve 1 is provided with two, and difference is horizontal in two translation sleeves 1
It is provided with translation channel 6, horizontal symmetrical is provided with translation plates 2 compatible with translation channel 6 to 1 both sides of translation sleeve respectively, puts down
Liquid relief cylinder pressure 3 is horizontally set on 1 downside of translation sleeve, and translation hydraulic cylinder 3 is hydraulic cylinder with double piston rods, 3 both sides of translation hydraulic cylinder
Output end is connected and fixed with 2 downside of the translation plates of 1 both sides of translation sleeve respectively, and 2 upside of translation plates of 1 both sides of translation sleeve is respectively
It is symmetrically arranged with fixed mechanism, a 1 side both ends of translation sleeve in two translation sleeves 1 are horizontally disposed with respectively adjusting set
Cylinder 4, another 1 side both ends of translation sleeve are horizontally disposed with respectively adjustable plate 5 compatible with sleeve 4 is adjusted, and adjusts sleeve 4
On be evenly arranged with multiple mounting holes 7 successively in the horizontal direction, adjust and be vertically arranged with lock plunger between sleeve 4 and adjustable plate 5
8。
The fixed mechanism of the present invention includes firm banking 9, rotating bracket 10, compression cylinder 11, fixing bracket 12 and compresses
Lead screw 13, firm banking 9 are horizontally set on 2 upside of translation plates, and rotating bracket 10 is L-type support, 10 on both sides of the middle of rotating bracket
It being hinged respectively and is connected to 9 upper side of firm banking, fixing bracket 12, which tilts upward, is arranged above firm banking 9 other side, Gu
12 upper end of fixed rack is provided with connecting plate 14, and 14 on both sides of the middle of connecting plate is hinged respectively is connected to 12 upside of fixing bracket, compresses gas
The setting of cylinder 11 is connected to 10 upper end of rotating bracket in 14 side of connecting plate, 11 output end of compression cylinder hinge, and rotating bracket 10 is another
Side is vertically arranged with clamping screw 13, and fixing nut is threaded with respectively on the clamping screw 13 of about 10 both sides of rotating bracket
15,13 lower end of clamping screw is provided with compact heap 16, and being horizontally disposed in the translation plates 2 of 16 downside of compact heap has stock supporting plate 17.
1 upper horizontal of translation sleeve of the present invention is provided with soft rubber layer 18, makes to be avoided that silicon chip in placement process
Generate cut.Two translation hydraulic cylinders 3 of two 1 downsides of translation sleeve of the present invention use same road binders road parallel drive, make
The translation plates 2 of two translation sleeve 1 both sides can synchronize and translated, it is ensured that silicon chip is capable of exactly and place.
Using above-mentioned technical proposal, a kind of silicon chip of the present invention places fixed mechanism when in use, by translating sleeve 1
Horizontal symmetrical is provided with translation plates 2 compatible with translation channel 6 respectively for both sides, and translation hydraulic cylinder 3 is horizontally set on translation set
1 downside of cylinder, translation hydraulic cylinder 3 both sides output end are connected and fixed with 2 downside of the translation plates of 1 both sides of translation sleeve respectively, using flat
Liquid relief cylinder pressure 3 synchronizes two pieces of translation plates 2 of driving so that two pieces of translation plates 2 can be horizontal accurately according to the dimensions of silicon chip
It synchronizes and moves towards, being horizontally disposed with respectively using a 1 side both ends of translation sleeve in two translation sleeves 1 has adjusting sleeve
4, another translation sleeve 1 side both ends are horizontally disposed with respectively adjustable plate 5 compatible with sleeve 4 is adjusted, adjust sleeve 4 and
Lock plunger 8 is vertically arranged between adjustable plate 5, the enabled dimensions according to silicon chip is accurately adjusted between two translation sleeves 1
Spacing, 2 upside of translation plates by translating sleeve 1 both sides has been symmetrically arranged fixed mechanism, compression cylinder 11 is utilized to drive
Dynamic rotating bracket 10 so that silicon chip can be firmly fixed by compact heap 16, utilize the pressure of about 10 both sides of rotating bracket
It is threaded with fixing nut 15 respectively on tight lead screw 13 so that clamping screw 13 can be according to the thickness of silicon chip vertically
It is adjusted and fixes, translation 1 upper horizontal of sleeve is provided with soft rubber layer 18, makes to be avoided that silicon chip in placement process
Middle generation cut, it is ensured that silicon chip efficiently can be firmly fixed.Through this structure, structure of the invention design is closed
Reason, the silicon chip of sizes specification can smoothly be placed, and can firmly be fixed silicon chip, improve
The production and processing efficiency of silicon chip, meets the needs of production and application.
Described in this specification above content is only illustrations made for the present invention.Technology belonging to the present invention
The technical staff in field can make various modifications or additions to the described embodiments or by a similar method
It substitutes, content without departing from description of the invention or beyond the scope defined by this claim should all belong to this
The protection domain of invention.
Claims (3)
1. a kind of silicon chip places fixed mechanism, it is characterised in that：It includes translation sleeve, translation that the silicon chip, which places fixed mechanism,
Plate, translation hydraulic cylinder adjust sleeve, adjustable plate and fixed mechanism, and the translation sleeve is provided with two, and two translate in sleeves
Being horizontally disposed with respectively has translation channel, and horizontal symmetrical is provided with translation compatible with translation channel respectively for translation sleeve both sides
Plate, translation hydraulic cylinder are horizontally set on the downside of translation sleeve, and translation hydraulic cylinder is hydraulic cylinder with double piston rods, translation hydraulic cylinder both sides
Output end is connected and fixed on the downside of the translation plates of translation sleeve both sides respectively, on the upside of the translation plates of translation sleeve both sides respectively symmetrically
It is provided with fixed mechanism, a translation sleeve side both ends in two translations sleeve are horizontally disposed with respectively adjusting set
Cylinder, another translation sleeve side both ends are horizontally disposed with respectively adjustable plate compatible with sleeve is adjusted, and adjusts sleeve upper edge
Horizontal direction is evenly arranged with multiple mounting holes successively, adjusts and is vertically arranged with lock plunger between sleeve and adjustable plate；It is described solid
It includes firm banking, rotating bracket, compression cylinder, fixing bracket and clamping screw to determine mechanism, and firm banking is horizontally set on flat
It moves on the upside of plate, rotating bracket is L-type support, and rotating bracket on both sides of the middle is hinged respectively to be connected at the upper side of firm banking, fixed
Riding sets up the other side above firm banking, and fixing bracket upper end is provided with connecting plate, connecting plate on both sides of the middle
It is hinged and is connected on the upside of fixing bracket respectively, compression cylinder setting is connected to rotation in connecting plate side, compression cylinder output end hinge
Pedestal upper end, the rotating bracket other side are vertically arranged with clamping screw, distinguish spiral shell on the clamping screw of the upper and lower both sides of rotating bracket
Line is connected with fixing nut, and clamping screw lower end is provided with compact heap, and being horizontally disposed in the translation plates on the downside of the compact heap has
Stock supporting plate.
2. a kind of silicon chip according to claim 1 places fixed mechanism, it is characterised in that：The translation sleeve upper horizontal
It is provided with soft rubber layer.
3. a kind of silicon chip according to claim 1 places fixed mechanism, it is characterised in that：On the downside of two translations sleeve
Two translation hydraulic cylinders use same road binders road parallel drive.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810912493.4A CN109087972B (en) | 2016-08-24 | 2016-08-24 | Working method of silicon wafer placing and fixing mechanism for crystalline silicon solar cell production |
| CN201810912484.5A CN109037400A (en) | 2016-08-24 | 2016-08-24 | A kind of crystal-silicon solar cell production silicon wafer placement fixed mechanism |
| CN201610709923.3A CN106298619B (en) | 2016-08-24 | 2016-08-24 | A kind of silicon chip placement fixed mechanism |
| CN201811028022.3A CN109390269A (en) | 2016-08-24 | 2016-08-24 | A kind of silicon wafer placement fixed mechanism improving processing efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610709923.3A CN106298619B (en) | 2016-08-24 | 2016-08-24 | A kind of silicon chip placement fixed mechanism |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810912484.5A Division CN109037400A (en) | 2016-08-24 | 2016-08-24 | A kind of crystal-silicon solar cell production silicon wafer placement fixed mechanism |
| CN201810912493.4A Division CN109087972B (en) | 2016-08-24 | 2016-08-24 | Working method of silicon wafer placing and fixing mechanism for crystalline silicon solar cell production |
| CN201811028022.3A Division CN109390269A (en) | 2016-08-24 | 2016-08-24 | A kind of silicon wafer placement fixed mechanism improving processing efficiency |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106298619A CN106298619A (en) | 2017-01-04 |
| CN106298619B true CN106298619B (en) | 2018-09-28 |
Family
ID=57614701
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810912484.5A Pending CN109037400A (en) | 2016-08-24 | 2016-08-24 | A kind of crystal-silicon solar cell production silicon wafer placement fixed mechanism |
| CN201810912493.4A Expired - Fee Related CN109087972B (en) | 2016-08-24 | 2016-08-24 | Working method of silicon wafer placing and fixing mechanism for crystalline silicon solar cell production |
| CN201610709923.3A Active CN106298619B (en) | 2016-08-24 | 2016-08-24 | A kind of silicon chip placement fixed mechanism |
| CN201811028022.3A Withdrawn CN109390269A (en) | 2016-08-24 | 2016-08-24 | A kind of silicon wafer placement fixed mechanism improving processing efficiency |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810912484.5A Pending CN109037400A (en) | 2016-08-24 | 2016-08-24 | A kind of crystal-silicon solar cell production silicon wafer placement fixed mechanism |
| CN201810912493.4A Expired - Fee Related CN109087972B (en) | 2016-08-24 | 2016-08-24 | Working method of silicon wafer placing and fixing mechanism for crystalline silicon solar cell production |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811028022.3A Withdrawn CN109390269A (en) | 2016-08-24 | 2016-08-24 | A kind of silicon wafer placement fixed mechanism improving processing efficiency |
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| CN (4) | CN109037400A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108538770B (en) * | 2018-03-12 | 2020-04-03 | 金华美诺机电有限公司 | Environment-friendly electric power component laying machine |
| CN109559970A (en) * | 2019-01-21 | 2019-04-02 | 苏州赛森电子科技有限公司 | A kind of radio frequency plasma etching fixing device for silicon piece and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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- 2016-08-24 CN CN201810912493.4A patent/CN109087972B/en not_active Expired - Fee Related
- 2016-08-24 CN CN201610709923.3A patent/CN106298619B/en active Active
- 2016-08-24 CN CN201811028022.3A patent/CN109390269A/en not_active Withdrawn
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| CN102368897A (en) * | 2011-09-30 | 2012-03-07 | 东莞市新泽谷机械有限公司 | Long plate workbench for plug-in inserter |
| CN102730469A (en) * | 2012-07-16 | 2012-10-17 | 建科机械（天津）股份有限公司 | Electrodeless adjusting and aligning device of welded nets |
| CN104291135A (en) * | 2014-09-15 | 2015-01-21 | 南通凯迪自动机械有限公司 | Automatic correction platform for multi-dimension base materials |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109390269A (en) | 2019-02-26 |
| CN109037400A (en) | 2018-12-18 |
| CN109087972A (en) | 2018-12-25 |
| CN106298619A (en) | 2017-01-04 |
| CN109087972B (en) | 2020-03-17 |
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