CN205466797U - Set up silicon chip cutting equipment of long structure of adjustable material - Google Patents
Set up silicon chip cutting equipment of long structure of adjustable material Download PDFInfo
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- CN205466797U CN205466797U CN201620198756.6U CN201620198756U CN205466797U CN 205466797 U CN205466797 U CN 205466797U CN 201620198756 U CN201620198756 U CN 201620198756U CN 205466797 U CN205466797 U CN 205466797U
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Abstract
The utility model provides a set up silicon chip cutting equipment of long structure of adjustable material. The utility model discloses a frame, device control room and cutting pond set up control system in the frame in the control room, and the cutting sets up cutting mechanism and charging mechanism in the pond, and charging mechanism is located cutting mechanism's top, its characterized in that, cutting mechanism include the steel wire, and the steel wire twines in proper order on unwrapping wire roller, drive roll, driven voller, idle roller and spiral roller, and the drive roll is connected by motor drive, charging mechanism includes main work piece pipe, and the bottom side of main work piece pipe links firmly the main glass board of the silico briquette that is used for bonding, and two sections lumens about main work piece pipe has slide in and penetrate flexible looped pipeline, and flexible looped pipeline includes the pipeline section that the multisection was cup jointed step by step, and the bottom side of pipeline section is through spring coupling be used for the bonding vice glass board of silico briquette, and there is main scale on the top of main work piece pipe along last portrayal, and last portrayal is followed on the top of flexible looped pipeline has the complementary scale. The utility model discloses realize that a pole is multi -purpose, promote the processing volume, improve work efficiency.
Description
Technical field
This utility model belongs to cutting mechanics technical field, relates to a kind of silicon wafer cutting equipment, a kind of silicon wafer cutting equipment arranging scalable material long structure.
Background technology
Multi-wire wafer cutting technique is one of at present advanced silicon chip cutting process method, and it is and traditional cutting mode, and as knife saw, grinding wheel etc. are different, also more advanced with advanced person cutting technique, such as cut or inner circle is cut with difference.Crystal bar to be cut in terms of the Macro Mechanism sketch of Multi-wire wafer cutting equipment is fixed on stainless workpiece by glass plate, then it is placed on the corresponding site of cutting machine, guide wheel processes to accurate wire casing through grooving processes, and what steel wire was orderly be wrapped on four guide wheels defines upper and lower two gauzes parallel to each other.When driven by engine guide wheel starts to rotate, guide wheel also drives gauze to move, and linear speed is typically up to about 15m/s.When being uniformly sprayed on gauze by mortar, mortar will enter monocrystal rod along with line of cut, thus carry out cutting operation.
The control mode of Multi-wire wafer cutting equipment mainly has industrial control computer, motion control card, control unwrapping wire motor, unwrapping wire take-up guiding movement motor, start and shut down and table drive motor regulation etc..During work, first sample from tension pick-up, obtain output order after testing afterwards and calculating for controlling the motor rotation on each road.Set cut mode, the condition detecting cutting and the working order regulating each road motor and mortar flow and temperature.
Line cutting technology is a kind of novel silicon chip process technology, and line cutting technology has efficiency height, precision advantages of higher.Its principle is to drive the cutting blade material being attached on steel wire to rub the hard brittle materials such as quasiconductor by the steel wire of high-speed motion, thus reaches to cut purpose.Use line cutting technology to carry out in cutting process to workpiece, by flusher coating materials abrasive material on steel wire, steel wire drive the motion of slurry abrasive material, it is achieved line cutting purpose.The device of existing fixing silico briquette is single structure, and its length is fixing, and each device can only assemble for a kind of silico briquette length.Thus cause motility extreme difference, it is impossible to make full use of space and carry out longer silico briquette cutting, have impact on production efficiency.
Utility model content
The purpose of this utility model is to there are the problems referred to above for existing technology, propose a kind of by arranging telescopic body of rod mechanism, to reach the controllability of length, the different processing space of reply, it is provided that the silicon wafer cutting equipment that scalable material long structure is set of maximum single processing capacity.
The purpose of this utility model can be realized by following technical proposal: a kind of silicon wafer cutting equipment arranging scalable material long structure, including frame, control room and cutup pool are set in described frame, in described control room, control system is set, cutting mechanism and charge mechanism are set in described cutup pool, described charge mechanism is positioned at the top of cutting mechanism, it is characterized in that, described cutting mechanism includes steel wire, described steel wire is wrapped on unwrapping wire roller, drive roll, driven voller, idle rollers and spiral roller successively, and described drive roll is by motor drive connection；Described charge mechanism includes main workpiece tube, the bottom side of described main workpiece tube is connected for the main glass plate of bonding silicon block, described main workpiece tube has the two sections of tube chambers in left and right, slide in described tube chamber and penetrate flexible looped pipeline, described flexible looped pipeline includes the pipeline section that more piece is socketed step by step, the bottom side of described pipeline section is connected to the secondary glass plate of bonding silicon block by spring, and main scale has been portrayed on the edge, top of described main workpiece tube, and complementary scale has been portrayed on the edge, top of described flexible looped pipeline.
This arranges the silicon wafer cutting equipment of scalable material long structure, according to actual cutting room, can be pulled out by flexible looped pipeline by two sections, the left and right tube chamber of main workpiece tube, and the more piece pipeline section of flexible looped pipeline can pull out equally, until it reaches required length.After the pipeline section of flexible looped pipeline pulls out, the spring release of pipeline section bottom side is to eject pair glass plate so that it is be positioned on straight line with main glass plate.Coordinate the accurate length of grasp silico briquette, and the cutting thickness of silicon chip with complementary scale according to main scale.
In the above-mentioned silicon wafer cutting equipment arranging scalable material long structure, the outer end of described flexible looped pipeline is connected mouthpiece cover, and described mouthpiece cover can be formed with the end of main workpiece tube and cover.
In the above-mentioned silicon wafer cutting equipment arranging scalable material long structure, the fixed limiting plate in bottom of described mouthpiece cover, the medial surface of described limiting plate is and the bonding plane of silico briquette laminating, and the thickness of described limiting plate is 5mm～10mm.By being resisted against the limiting plate of two outer faces of silico briquette, can be that silico briquette two ends provide dependence, one power in opposite direction with the side force that silico briquette is subject to is provided in cutting process simultaneously, the silicon chip that cutting is formed is no longer influenced by unidirectional side force, thus avoids silicon chip and collapse the major accident of limit or part.
In the above-mentioned silicon wafer cutting equipment arranging scalable material long structure, the centre position of described main scale is zero graduation, increases scale value for basic point to both sides with zero graduation, and described complementary scale includes several unit scale values.Can comprise several down scales in unit scale value, unit scale value does not has the accumulation of concrete numerical value, is only used as the sign of element length.
In the above-mentioned silicon wafer cutting equipment arranging scalable material long structure, the two ends mouth of pipe of described main workpiece tube has the gear edge of inwardly rollover folding, and the inner mouth of pipe of described flexible looped pipeline has the block of evagination, and described block can be with gear along being formed against clamping.By block with gear edge against clamping effect, to avoid departing between main workpiece tube and flexible looped pipeline.Same structure can be used to reach effect same between the pipeline section of the more piece socket of flexible looped pipeline.
In the above-mentioned silicon wafer cutting equipment arranging scalable material long structure, the medial wall of described main workpiece tube arranging protruding rail, the lateral wall of described flexible looped pipeline arranges groove, described protruding rail is formed in embedding groove and is slidably connected.Coordinated with the guiding sliding of groove by protruding rail, in order to improve the flexible looped pipeline stability when pull-out or retracting action, further ensure that the accuracy of regulation length.Same structure can be used to reach effect same between the pipeline section of the more piece socket of flexible looped pipeline.
Compared with prior art, the length that this silicon wafer cutting equipment arranging scalable material long structure uses stretching structure to realize mobile jib two ends extends, to reach length adjustment flexibly, realize multi-use, take full advantage of processing space, promote the workload of single process, significantly improve work efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of charge mechanism in this silicon wafer cutting equipment.
In figure, 1, main workpiece tube；2, main glass plate；3, flexible looped pipeline；4, spring；5, secondary glass plate；6, mouthpiece cover；7, limiting plate；8, silico briquette.
Detailed description of the invention
The following is specific embodiment of the utility model and combine accompanying drawing, the technical solution of the utility model is further described, but this utility model is not limited to these embodiments.
As shown in Figure 1, this arranges the silicon wafer cutting equipment of scalable material long structure, including frame, frame arranges control room and cutup pool, control system is set in control room, cutting mechanism and charge mechanism are set in cutup pool, charge mechanism is positioned at the top of cutting mechanism, it is characterised in that cutting mechanism includes steel wire, steel wire is wrapped on unwrapping wire roller, drive roll, driven voller, idle rollers and spiral roller successively, and drive roll is by motor drive connection；Charge mechanism includes main workpiece tube 1, the bottom side of main workpiece tube 1 is connected for the main glass plate 2 of bonding silicon block 8, main workpiece tube 1 has the two sections of tube chambers in left and right, slide in tube chamber and penetrate flexible looped pipeline 3, flexible looped pipeline 3 includes the pipeline section that more piece is socketed step by step, the bottom side of pipeline section is connected to the secondary glass plate 5 of bonding silicon block 8 by spring 4, and main scale has been portrayed on the edge, top of main workpiece tube 1, and complementary scale has been portrayed on the edge, top of flexible looped pipeline 3.
The outer end of flexible looped pipeline 3 is connected mouthpiece cover 6, and mouthpiece cover 6 can be formed with the end of main workpiece tube 1 and cover.
The fixed limiting plate in bottom 7 of mouthpiece cover 6, the medial surface of limiting plate 7 is and the bonding plane of silico briquette 8 laminating, and the thickness of limiting plate is 5mm～10mm.By being resisted against the limiting plate 7 of 8 two outer faces of silico briquette, can be that silico briquette 8 two ends provide dependence, one power in opposite direction with the side force that silico briquette 8 is subject to is provided in cutting process simultaneously, the silicon chip that cutting is formed is no longer influenced by unidirectional side force, thus avoids silicon chip and collapse the major accident of limit or part.
The centre position of main scale is zero graduation, increases scale value for basic point to both sides with zero graduation, and complementary scale includes several unit scale values.Can comprise several down scales in unit scale value, unit scale value does not has the accumulation of concrete numerical value, is only used as the sign of element length.
The two ends mouth of pipe of main workpiece tube 1 has the gear edge of inwardly rollover folding, and the inner mouth of pipe of flexible looped pipeline 3 has the block of evagination, and block can be with gear along being formed against clamping.By block with gear edge against clamping effect, to avoid departing between main workpiece tube 1 and flexible looped pipeline 3.Same structure can be used to reach effect same between the pipeline section of the more piece socket of flexible looped pipeline 3.
Arranging protruding rail on the medial wall of main workpiece tube 1, the lateral wall of flexible looped pipeline 3 arranges groove, protruding rail is formed in embedding groove and is slidably connected.Coordinated with the guiding sliding of groove by protruding rail, in order to improve the flexible looped pipeline 3 stability when pull-out or retracting action, further ensure that the accuracy of regulation length.Same structure can be used to reach effect same between the pipeline section of the more piece socket of flexible looped pipeline 3.
This arranges the silicon wafer cutting equipment of scalable material long structure, according to actual cutting room, can be pulled out by flexible looped pipeline 3 by two sections, the left and right tube chamber of main workpiece tube 1, and the more piece pipeline section of flexible looped pipeline 3 can pull out equally, until it reaches required length.After the pipeline section of flexible looped pipeline 3 pulls out, the spring 4 of pipeline section bottom side discharges to be ejected by pair glass plate 5 so that it is be positioned on straight line with main glass plate 2.Coordinate the accurate length of grasp silico briquette 8, and the cutting thickness of silicon chip with complementary scale according to main scale.
The length that this silicon wafer cutting equipment arranging scalable material long structure uses stretching structure to realize mobile jib two ends extends, and to reach length adjustment flexibly, it is achieved multi-use, takes full advantage of processing space, promotes the workload of single process, significantly improve work efficiency.
Specific embodiment described herein is only to this utility model spirit explanation for example.Described specific embodiment can be made various amendment or supplements or use similar mode to substitute by this utility model person of ordinary skill in the field, but without departing from spirit of the present utility model or surmount scope defined in appended claims.
Although the most more employing main workpiece tube 1；Main glass plate 2；Flexible looped pipeline 3；Spring 4；Secondary glass plate 5；Mouthpiece cover 6；Limiting plate 7；Silico briquette 8 term such as grade, but it is not precluded from using the probability of other term.Use these terms to be only used to more easily and describe and explain essence of the present utility model；It is all contrary with this utility model spirit for being construed as any additional restriction.
Claims (6)
1. the silicon wafer cutting equipment that scalable material long structure is set, including frame, control room and cutup pool are set in described frame, arranging control system in described control room, arrange cutting mechanism and charge mechanism in described cutup pool, described charge mechanism is positioned at the top of cutting mechanism, it is characterized in that, described cutting mechanism includes that steel wire, described steel wire are wrapped on unwrapping wire roller, drive roll, driven voller, idle rollers and spiral roller successively, and described drive roll is by motor drive connection；Described charge mechanism includes main workpiece tube, the bottom side of described main workpiece tube is connected for the main glass plate of bonding silicon block, described main workpiece tube has the two sections of tube chambers in left and right, slide in described tube chamber and penetrate flexible looped pipeline, described flexible looped pipeline includes the pipeline section that more piece is socketed step by step, the bottom side of described pipeline section is connected to the secondary glass plate of bonding silicon block by spring, and main scale has been portrayed on the edge, top of described main workpiece tube, and complementary scale has been portrayed on the edge, top of described flexible looped pipeline.
The silicon wafer cutting equipment arranging scalable material long structure the most according to claim 1, it is characterised in that the outer end of described flexible looped pipeline is connected mouthpiece cover, described mouthpiece cover can be formed with the end of main workpiece tube and cover.
The silicon wafer cutting equipment arranging scalable material long structure the most according to claim 2, it is characterised in that the fixed limiting plate in bottom of described mouthpiece cover, the medial surface of described limiting plate is and the bonding plane of silico briquette laminating, and the thickness of described limiting plate is 5mm～10mm.
The silicon wafer cutting equipment arranging scalable material long structure the most according to claim 1, it is characterised in that the centre position of described main scale is zero graduation, increases scale value for basic point to both sides with zero graduation, and described complementary scale includes several unit scale values.
The silicon wafer cutting equipment that scalable material long structure is set the most according to claim 1, it is characterized in that, the two ends mouth of pipe of described main workpiece tube has the gear edge of inwardly rollover folding, and the inner mouth of pipe of described flexible looped pipeline has the block of evagination, and described block can be with gear along being formed against clamping.
The silicon wafer cutting equipment arranging scalable material long structure the most according to claim 1, it is characterised in that arrange protruding rail on the medial wall of described main workpiece tube, the lateral wall of described flexible looped pipeline arranges groove, and described protruding rail is formed in embedding groove and is slidably connected.
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| CN201620198756.6U CN205466797U (en) | 2016-03-15 | 2016-03-15 | Set up silicon chip cutting equipment of long structure of adjustable material |
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| CN201620198756.6U CN205466797U (en) | 2016-03-15 | 2016-03-15 | Set up silicon chip cutting equipment of long structure of adjustable material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037400A (en) * | 2016-08-24 | 2018-12-18 | 于伟 | A kind of crystal-silicon solar cell production silicon wafer placement fixed mechanism |
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2016
- 2016-03-15 CN CN201620198756.6U patent/CN205466797U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037400A (en) * | 2016-08-24 | 2018-12-18 | 于伟 | A kind of crystal-silicon solar cell production silicon wafer placement fixed mechanism |
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