CN109559970A - A kind of radio frequency plasma etching fixing device for silicon piece and method - Google Patents
A kind of radio frequency plasma etching fixing device for silicon piece and method Download PDFInfo
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- CN109559970A CN109559970A CN201910050960.1A CN201910050960A CN109559970A CN 109559970 A CN109559970 A CN 109559970A CN 201910050960 A CN201910050960 A CN 201910050960A CN 109559970 A CN109559970 A CN 109559970A
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- radio frequency
- fixing device
- plasma etching
- frequency plasma
- silicon wafer
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 130
- 239000010703 silicon Substances 0.000 title claims abstract description 130
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 129
- 238000001020 plasma etching Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title abstract description 15
- 238000005266 casting Methods 0.000 claims description 39
- 238000003860 storage Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 abstract description 12
- 230000033001 locomotion Effects 0.000 description 16
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000001360 synchronised effect Effects 0.000 description 6
- 239000003921 oil Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002045 lasting effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 210000003781 tooth socket Anatomy 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000222712 Kinetoplastida Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 239000010720 hydraulic oil Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The invention discloses a kind of radio frequency plasma etching fixing device for silicon piece, are related to silicon wafer processing equipment technical field, including extension sleeve, telescopic rod, swivel, compressed part, plummer.Extension sleeve has extendable room.Telescopic rod has rack gear, and rack gear is arranged in extendable room.Swivel has gear, gear pinion rack, and rack gear is located at the relative position of gear.The present invention uses rotation manually to turn to reach control telescopic rod synchronization telescope, it avoids using the automation equipments such as fluid cylinder, cylinder, electric cylinders because that telescopic rod relatively moves caused by various factors (details please refer to background technique) distance there is is uncontrollable, the distance for driving telescopic rod opposite that needs to make repeated attempts, which reaches, adapts to various specifications silicon wafer.Silicon wafer is put on plummer later, then silicon wafer is fixed with compressed part.
Description
Technical field
The present invention relates to silicon wafer processing equipment technical field, in particular to a kind of radio frequency plasma etching fixes dress with silicon wafer
It sets.
Background technique
Crystalline silicon material is that most important photovoltaic material needs in the production process of crystal-silicon solar cell according to work
The sequence of skill processing successively passes through the processing technologys such as making herbs into wool, High temperature diffusion and etching.
In above-mentioned technique process, require for silicon wafer to be fixed, and existing silicon wafer places fixed mechanism knot
Structure is complicated and troublesome in poeration, cannot firmly place the silicon wafer exactly of sizes specification.
In view of the above-mentioned problems, inventing a kind of silicon wafer placement fixed mechanism, the China such as notification number CN 106298619B is special
Benefit, including: translation sleeve, translation plates, translation hydraulic cylinder.Translation sleeve two sides are respectively arranged with translation sleeve, translate liquid
Cylinder pressure two sides output end is fixedly connected with translation plates respectively.Two pieces of translation plates are driven using translation hydraulic cylinder synchronous, so that two pieces
Translation plates can be moved towards according to horizontal accurately synchronize of dimensions of silicon wafer, reached and adapted to sizes specification silicon wafer
Purpose.But driving translation plates are synchronized using hydraulic cylinder and will appear problem, first, hydraulic-driven is work Jie using hydraulic oil
Matter will inevitably have leakage between relative motion surface, while oil liquid is also not absolutely incompressible, therefore is carrying out
(staff needs to adapt to telescopic rod repeatedly the distance of the relative movement of translation plates there may be uncontrollable when driving translation plates
Stretching speed), needing to make repeated attempts drives the distance of translation plates to achieve the purpose that adapt to various specifications silicon wafer；Second, hydraulic drive
Dynamic oil liquid is affected by temperature, due to oil viscosity with temperature change and change, therefore equally when carrying out driving translation plates put down
The distance of the relative movement of plate is moved there may be uncontrollable, needing to make repeated attempts drives the distance of translation plates to reach to adapt to various rule
The purpose of lattice silicon wafer；Third, the oil liquid of hydraulic-driven is easy to pollute, and after oil contamination, will affect the reliability of system work, therefore
Equally when carrying out driving translation plates, the distance of the relative movement of translation plates is there may be uncontrollable, and needing to make repeated attempts, it is flat to drive
The distance for moving plate achievees the purpose that adapt to various specifications silicon wafer.Driving translation plates are such as synchronized using cylinder, since air has
Have a compressibility, the movement speed of cylinder vulnerable to load variation and change, the opposite shifting of translation plates when carrying out driving translation plates
Dynamic distance there is it is uncontrollable, need to make repeated attempts drive the distance of translation plates achieve the purpose that adapt to various specifications silicon wafer.
Driving translation plates such as are synchronized using electric cylinders, this mode is motor via reducer to drive copper nut, is being used
It inevitably will increase the abrasion of the screw thread wall surface of nut in journey, it is low so as to cause transmission efficiency, technically can also it compare
It is more difficult to hold the relative distance that translation plates are controlled when driving translation plates, therefore need to make repeated attempts that the distance of translation plates is driven to reach suitable
Answer the purpose of various specifications silicon wafer.
Summary of the invention
The object of the invention first is that solve need to make repeated attempts in the prior art control silicon wafer place fixed mechanism it is opposite
Distance is to reach the problem of adapting to various specifications silicon wafer.
The second object of the present invention is to providing a kind of silicon wafer fixing means.
One of in order to achieve the above objectives, the invention adopts the following technical scheme: a kind of radio frequency plasma etching is solid with silicon wafer
Determine device, wherein include: extension sleeve, extension sleeve has extendable room；Telescopic rod, telescopic rod have rack gear, and rack gear has
Tooth socket, rack gear are arranged in extendable room；Swivel, swivel have gear, gear pinion rack, and rack gear is located at the opposite position of gear
It sets；Driving means, driving means have driving end；Fixed part, fixed part one end connect the driving end of driving means, and fixed part is another
One end connection expansion link；Force section, force section are flexibly connected telescopic rod, and driving means connects one end of force section；Clamping portion, is applied
The other end driving clamping portion in power portion is moved；Compressed part, compressed part connect clamping portion；Plummer, plummer, which has, to be put
Platform, plummer connection expansion link, plummer are located at compressed part relative position.
In the above-mentioned technical solutions, the embodiment of the present invention is first according to the dimensions of silicon wafer, rotation swivel, the tooth of swivel
Wheel drive rack gear synchronizes movement, and the side wall of the extendable room of telescopic rod fitting extension sleeve is promoted to carry out telescopic moving, into
One step driving telescopic rod synchronizes stable telescopic moving towards relative direction；Silicon wafer is placed on extension sleeve and carrying later
On platform；Finally starting driving means, driving means pushes force section to be rotated, and force section carries out rotation force to clamping portion,
Promote the compressed part in clamping portion to compress silicon wafer to be fixed.
Further, in embodiments of the present invention, extension sleeve outer surface side has elastic surface.Elastic surface is rubber bullet
Property face, avoid installation silicon wafer when, the sharp portion graduation of silicon wafer causes silicon wafer to damage to extension sleeve.
Further, in embodiments of the present invention, plummer has elasticity.Plummer material is rubber, is avoided limited
Space in (because there is compressed part in plummer relative position) install silicon wafer when, the sharp portion graduation of silicon wafer leads to silicon to plummer
Piece damages.
Further, in embodiments of the present invention, extension sleeve also has groove.
Further, in embodiments of the present invention, radio frequency plasma etching fixing device for silicon piece further include: locking master
Part, for the setting of latch fitting body normal in swivel side, locking main part includes elastic locking unit, and elastic locking unit has one to lack
Mouthful, notch geometry and swivel are adapted, and notch and swivel have certain distance.Rotation lock main part, so that the snap lock of swivel
The position that tight unit avoids the direction of rotation of swivel squeezes swivel, locks to swivel.In the process, because latch fitting main body is hung down
Straight setting is in swivel side, so the direction of rotation that can avoid swivel when locking swivel is locked, swivel is not in appoint
What rotation ensure that the precision of telescopic rod distance of stretch out and draw back, without adjusting the flexible distance of telescopic rod repeatedly to adapt to various rulers
The silicon wafer of very little specification.
Further, in embodiments of the present invention, there are two extension sleeve tools.
Further, in embodiments of the present invention, radio frequency plasma etching fixing device for silicon piece further include: reel set
Cylinder, reel sleeve one end and be vertically set on extension sleeve side, reel sleeve have reel space；Bar is reeled, bar one end is reeled
It is vertically set on another extension sleeve side, the bar other end is reeled and is arranged in reeling space.It pulls open first or shrinks two and stretch
The distance of contracting sleeve, so that reeling the side wall progress telescopic moving for reeling space that bar fitting reels sleeve, further driving is received
Pull rod synchronizes stable telescopic moving towards relative direction, to adapt to the width dimensions of silicon wafer.Meanwhile it adjusting two and stretching
The distance between sleeve makes silicon wafer a part not have support effect, provides part processing space for silicon wafer, expands processing
Range.
Further, in embodiments of the present invention, storage space has a channel, and channel connection is extraneous.
Further, in embodiments of the present invention, radio frequency plasma etching fixing device for silicon piece further include: pull pressure master
Body pulls pressure main body connection and reels sleeve, and pulling pressure main body has a hole；Pressure main body is pulled in rotor, rotor flexible connection；Pressure
Part, casting die are arranged in hole, and casting die and rotor are in relative position.Rotary motion part depresses casting die, so that the bullet of casting die
Property layer extruding fix and reel bar, allow reeling bar and can not move in reeling sleeve, further locked two extension sleeves
Distance.It prevents two extension sleeves mobile, the silicon wafer of various specifications can not be adapted to.
Further, in embodiments of the present invention, radio frequency plasma etching fixing device for silicon piece further includes pull piece, is pulled
Part connects rotor and pulls pressure main body junction.Pull piece is pulled to achieve the purpose that control rotor, wherein pull piece, which extends, to be turned
The arm of force of kinetoplast is conducive to laborsaving.
Further, in embodiments of the present invention, casting die has return springs.Return springs are spring, in nothing
In the case where extension sleeve distance need to be locked, rotary motion part, so that rotating member is no longer contacted with casting die, at this point, Flexible Reset
Part resets casting die using elasticity, and casting die is promoted to unlock far from reeling bar.
Further, in embodiments of the present invention, casting die has elastic layer.Elastic layer is soft rubber layer, elastic layer
Positioned at the relative position for reeling bar.When casting die promotes elastic layer to push down to reel bar, with the lasting pressure of casting die, elastic layer will
It can deform and extend to the surface for reeling bar, increase and reel the contact area of bar, prevent from reeling bar and be moved under external force factor, into
One step can not lock the distance of two extension sleeves, can not adapt to the silicon wafer of various specifications
Further, in embodiments of the present invention, casting die has arc groove, and arc groove and rotation shape are adapted.
The engaging to a certain extent of the arc groove of casting die or fitting rotating member, the wall surface of arc groove equally also block oneself of rotating member
Rotation has certain self-locking, and rotating member is prevented to be detached from casting die, leads to not the distance for locking two extension sleeves, nothing
The silicon wafer of method adaptation various specifications.
Further, in embodiments of the present invention, radio frequency plasma etching fixing device for silicon piece further include: elastic portion,
Elastic portion both ends are separately connected the other end of clamping portion and force section, and the opposing end surface shape of clamping portion and force section is arc,
Clamping portion is located at the force application movement direction of force section.First, force section is when exerting a force for the first time to clamping portion, because rotation carries out
It clamps, the sub-fraction for compressing end surface compresses silicon wafer first；Later during force section persistently exerts a force to clamping portion, because of pressure
Tight portion is stopped by silicon wafer, so clamping portion gradually becomes concordantly, compressing end surface gradually becomes uniform to the stress degree of silicon wafer
It is firm.Second, during force section continues to exert a force to clamping portion, because force section direction of rotation is so that force section and clamping portion
What distance shortened, the determining fixed silicon wafer of contact area of position or observation force section and clamping portion by observing clamping portion
Firmness has and visually indicates effect, and preventing force section from persistently exerting a force causes silicon wafer to damage.Third is judging needed for silicon wafer
Firmness mistake in the case where, force section persistently exerts a force to clamping portion, so that the contact surface of force section and clamping portion
Product is smaller and smaller, plays protection silicon wafer so that force section can not exert a force to clamping portion until force section is detached from clamping portion
Effect.Wherein, elastic portion buffers clamping portion after force section is detached from clamping portion, prevents the ejection of clamping portion from endangering work
The integrity degree of personnel safety and equipment.
Further, in embodiments of the present invention, clamping portion is bonded force section.
Further, in embodiments of the present invention, driving means is hydraulic cylinder.
The beneficial effects of the present invention are:
First, the present invention uses rotation manually to turn to reach control telescopic rod synchronization telescope, avoids using fluid cylinder, gas
The automation equipments such as cylinder, electric cylinders are just deposited because of the distance that telescopic rod relatively moves caused by various factors (details please refer to background technique)
Uncontrollable, the distance for driving telescopic rod opposite that needs to make repeated attempts, which reaches, adapts to various specifications silicon wafer.
Second, the present invention using gear by the way of synchronize transmission, because the thickness of the tooth of gear is very high, and because of gear
The relative wall of tooth there is certain tilt angle, have it is certain unload power effect, so gear is difficult to wear, in long-time
The distance that telescopic rod relative movement is controlled in work would not have uncontrollable phenomenon, also just drive telescopic rod without making repeated attempts
Opposite distance, which reaches, adapts to various specifications silicon wafer.
Third, the present invention use rotation manually to turn to reach control telescopic rod synchronization telescope, repeatedly without staff
Adapt to the automation equipments such as fluid cylinder, cylinder, electric cylinders driving telescopic rod stretching speed, prevent need make repeated attempts drive it is flexible
The opposite distance of bar, which reaches, adapts to various specifications silicon wafer.
In order to achieve the above objectives two, the invention adopts the following technical scheme: a kind of silicon wafer fixing means, including following step
It is rapid:
Telescopic adjustment, according to the dimensions of silicon wafer, rotation swivel, the gear driving rack of swivel synchronizes movement,
Promote the side wall of the extendable room of telescopic rod fitting extension sleeve to carry out telescopic moving, further drives telescopic rod towards opposite side
To synchronizing stable telescopic moving；
Locking, rotation lock main part, so that the position that the elastic locking unit of swivel avoids swivel direction of rotation squeezes and turns
Body locks swivel；
It places, silicon wafer is placed on extension sleeve and plummer；
It is fixed, start driving means, driving means pushes force section to be rotated, and force section carries out rotation to clamping portion and applies
Power promotes the compressed part in clamping portion to compress silicon wafer and is fixed.
Further, in embodiments of the present invention, after telescopic adjustment step, also have and reel regulating step, specifically
Steps are as follows: reeling adjusting, according to the width dimensions of silicon wafer, pulls open or shrink the distance of two extension sleeves first, so that receiving
The side wall for reeling space that pull rod fitting reels sleeve carries out telescopic moving, and further driving reels bar and carries out towards relative direction
The telescopic moving of synchronism stability.
Further, in embodiments of the present invention, after reeling adjusting, also there is lock step, specific steps are such as
Under: pull piece is pulled in locking, and rotating member is promoted to depress casting die, so that the elastic layer extruding of casting die is fixed and reels bar, is allowed and is reeled bar
It can not be moved in reeling sleeve, further lock the distance of two extension sleeves.
Further, in embodiments of the present invention, in lock step, the card to a certain extent of the arc groove of casting die
It closes or fitting rotating member, the wall surface of arc groove equally also blocks the spinning of rotating member.
Further, in embodiments of the present invention, in fixation procedure, force section is exerted a force for the first time to clamping portion
When, because rotation is clamped, the sub-fraction for compressing end surface compresses silicon wafer first；Persistently clamping portion is applied in force section later
During power, because compressed part is stopped by silicon wafer, so clamping portion gradually becomes concordantly, to compress end surface to the stress degree of silicon wafer
Gradually become uniformly firm；Finally during force section continues to exert a force to clamping portion, because force section direction of rotation is so that applying
What power portion and clamping portion distance shortened, it is true by the position in observation clamping portion or the contact area of observation force section and clamping portion
Surely the firmness of fixed silicon wafer；Needed for judging silicon wafer in the case where firmness mistake, force section is persistently to clamping portion
It exerts a force, so that the contact area of force section and clamping portion is smaller and smaller, until force section is detached from clamping portion.
Further, in embodiments of the present invention, during force section exerts a force to clamping portion, elastic portion is being applied
Power portion buffers clamping portion after being detached from clamping portion.
Detailed description of the invention
Fig. 1 is the main view that radio frequency plasma of embodiment of the present invention etching uses fixing device for silicon piece.
Fig. 2 is the top view that radio frequency plasma of embodiment of the present invention etching uses fixing device for silicon piece.
Fig. 3 is the A partial enlarged view of Fig. 1.
Fig. 4 is the partial 3 d schematic diagram that radio frequency plasma of embodiment of the present invention etching uses fixing device for silicon piece.
Fig. 5 is the schematic three dimensional views that the embodiment of the present invention turns and locks main part.
Fig. 6 is the planar structure schematic diagram that the embodiment of the present invention turns and locks main part.
Fig. 7 is the schematic three dimensional views that the embodiment of the present invention pulls pressure main body.
Fig. 8 is the structural schematic diagram that the embodiment of the present invention pulls pressure main body.
Fig. 9 is the detailed view of compressed part of the embodiment of the present invention.
Figure 10 is the first movement schematic diagram of compressed part of the embodiment of the present invention.
Figure 11 is the second movement schematic diagram of compressed part of the embodiment of the present invention.
Figure 12 is that the third of compressed part of the embodiment of the present invention moves schematic diagram.
In attached drawing
1, extension sleeve 2, telescopic rod 21, rack gear
3, elastic surface 4, plummer 5, swivel
6, driving means 7, fixed part 8, force section
9, clamping portion 10, elastic portion 11, compressed part
12, it reels sleeve 13, reel bar 14, groove
15, main part 151, elastic locking unit 1511, notch are locked
16, pressure main body 17, rotating member 18, pull piece are pulled
19, casting die 191, arc groove 192, return springs
193, elastic layer
Specific embodiment
The purpose of the present invention, technical solution are clearly and completely described and advantage is more clearly understood in order to make, with
The embodiment of the present invention is further elaborated in lower combination attached drawing.It should be appreciated that specific embodiment described herein is
A part of the embodiment of the present invention is only used to explain the embodiment of the present invention instead of all the embodiments, is not used to limit this
Inventive embodiments, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", " in " "upper", "lower", "left", "right",
The orientation or positional relationship of the instructions such as "inner", "outside", "top", "bottom", " side ", "vertical", "horizontal" is based on the figure
Orientation or positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.This
Outside, term " one ", " first ", " second ", " third ", " the 4th ", " the 5th ", " the 6th " are used for description purposes only, and cannot manage
Solution is indication or suggestion relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
For concise and explanation purpose, the principle of embodiment is described by referring mainly to example.In the following description,
Many details are suggested to provide a thorough understanding of embodiments.It will however be evident that.For ordinary skill
Personnel, these embodiments can be not limited to these details in practice.In some instances, it does not describe in detail known
Method and structure, to avoid unnecessarily making these embodiments become difficult to understand.In addition, all embodiments can be combined with each other
It uses.
Embodiment one:
A kind of radio frequency plasma etching fixing device for silicon piece, wherein as shown in Figs. 1-3, comprising: extension sleeve 1 stretches
Bar 2, swivel 5, driving means 6, fixed part 7, force section 8, clamping portion 9, compressed part 11, plummer 4.Extension sleeve 1, which has, to be stretched
Contracting space.Telescopic rod 2 has rack gear 21, and rack gear 21 has tooth socket, and rack gear 21 is arranged in extendable room.Swivel 5 has gear,
Gear pinion rack 21, rack gear 21 are located at the relative position of gear.Driving means 6 has driving end.The connection of 7 one end of fixed part pushes away
Send the driving end of device 6,7 other end connection expansion link 2 of fixed part.Force section 8 is flexibly connected telescopic rod 2, and driving means 6 connects
One end of force section 8.The other end driving clamping portion 9 of force section 8 is moved.Compressed part 11 connects clamping portion 9.Plummer 4
With platform for placing, 4 connection expansion link 2 of plummer, plummer 4 is located at 11 relative position of compressed part.
Work step: first according to the dimensions of silicon wafer, rotation swivel 5 turns 5 gear driving rack 21 and carries out together
Moved further, the side wall for promoting telescopic rod 2 to be bonded the extendable room of extension sleeve 1 carry out telescopic moving, further drive telescopic rod 2
Stable telescopic moving is synchronized towards relative direction.Silicon wafer is placed on extension sleeve 1 and plummer 4 later.Finally open
Dynamic driving means 6, driving means 6 push force section 8 to be rotated, and force section 8 carries out rotation force to clamping portion 9, promotes to fill
The compressed part 11 of folder portion 9 compresses silicon wafer and is fixed.
Specifically, as shown in Figure 1, 2,1 outer surface side of extension sleeve has elastic surface 3.Plummer 4 has elasticity.It holds
4 material of microscope carrier is rubber, when avoiding in a limited space the installation silicon wafer (because there is compressed part 11 in 4 relative position of plummer), silicon
The sharp portion graduation of piece causes silicon wafer to damage to plummer 4.When elastic surface 3 installs silicon wafer in order to prevent simultaneously, held
Limited spacial influence causes the sharp portion graduation of silicon wafer to extension sleeve 1 in microscope carrier 4, and silicon wafer is caused to damage.
Specifically, as seen in figures 3-6, extension sleeve 1 also has groove 14.Radio frequency plasma etching uses fixing device for silicon piece
It further include locking main part 15, the setting of latch fitting body normal is turning 5 sides, and locking main part 15 is with elastic locking unit 151, bullet
Property locking unit 151 there is a notch 1511,1511 shape of notch and swivel 5 are adapted, and notch 1511 and swivel 5 have certain
Distance.Locking main part 15 is located in groove 14.On the one hand it avoids when putting radio frequency plasma etching fixing device for silicon piece
Because locking main part 15 first contacts ground, causes radio frequency plasma etching to be put with fixing device for silicon piece unstable, influence silicon wafer and add
Work.On the other hand, rotation lock main part 15, so that the elastic locking unit 151 of swivel 5 avoids the position of the direction of rotation of swivel 5
Extruding swivel 5 is set, swivel 5 is locked.In the process, 5 sides are being turned because latch fitting body normal is arranged, so locking
The direction of rotation that swivel 5 can be avoided when tight swivel 5 is locked, and swivel 5 is not in any rotation, ensure that telescopic rod 2
The precision of distance of stretch out and draw back, without adjusting the flexible distance of telescopic rod 2 repeatedly to adapt to the silicon wafer of various sizes specification.
Specifically, as shown in Fig. 2,7, there are two the tools of extension sleeve 1.Radio frequency plasma etching is also wrapped with fixing device for silicon piece
It includes and reels sleeve 12 and reel bar 13.It reels 12 one end of sleeve and is vertically set on 1 side of extension sleeve, reeling sleeve 12 has receipts
Draw space.It reels 13 one end of bar and is vertically set on another 1 side of extension sleeve, reel the setting of 13 other end of bar and reeling space
In.The distance of two extension sleeves 1 is pulled open or shunk first, so that reeling bar 13 is bonded the side for reeling space for reeling sleeve 12
Wall carries out telescopic moving, and further driving reels bar 13 and synchronizes stable telescopic moving towards relative direction, to adapt to silicon
The width dimensions of piece.Meanwhile the distance between adjusting two extension sleeves 1 and silicon wafer a part is made not have support effect, it is
Silicon wafer provides part processing space, expands the range of work.
More specifically, as shown in Figure 7,8, storage space has a channel, channel connection is extraneous.Radio frequency plasma etching is used
Fixing device for silicon piece further includes pulling pressure main body 16, rotor, casting die 19.It pulls the pressure connection of main body 16 and reels sleeve 12, pull pressure main body
16 have a hole.Hole communicating passage.Pressure main body 16 is pulled in rotor flexible connection.Casting die 19 is arranged in hole, casting die 19
Relative position is in rotor.Rotary motion part 17 depresses casting die 19, so that receipts are fixed in the extruding of elastic layer 193 of casting die 19
Pull rod 13 allows reeling bar 13 and can not move in reeling sleeve 12, has further locked the distance of two extension sleeves 1.It is anti-
Only two extension sleeves 1 are mobile, can not adapt to the silicon wafer of various specifications.
More specifically, radio frequency plasma etching fixing device for silicon piece further includes pull piece 18, pull piece 18 connect rotor with
Pull pressure 16 junction of main body.Pull piece 18 is pulled to achieve the purpose that control rotor, wherein pull piece 18 extends the power of rotor
Arm is conducive to laborsaving.
More specifically, casting die 19 has return springs 192.Return springs 192 are spring, without locking telescopic
In the case where 1 distance of cylinder, rotary motion part 17, so that rotating member 17 is no longer contacted with casting die 19, at this point, return springs 192
Casting die 19 is resetted using elasticity, casting die 19 is promoted to unlock far from reeling bar 13.
More specifically, casting die 19 has elastic layer 193.Elastic layer 193 is soft rubber layer, and elastic layer 193, which is located at, to be reeled
The relative position of bar 13.When casting die 19 promotes elastic layer 193 to push down to reel bar 13, with the lasting pressure of casting die 19, elasticity
Layer 193 will be deformed to be extended to the surface for reeling bar 13, is increased and is reeled the contact area of bar 13, prevent from reeling bar 13 in external force
It is moved under factor, can not further lock the distance of two extension sleeves 1, the silicon wafer of various specifications can not be adapted to
More specifically, casting die 19 has arc groove 191, arc groove 191 and rotation shape are adapted.The arc of casting die 19
The engaging to a certain extent of slot 191 or fitting rotating member 17, the wall surface of arc groove 191 equally also block oneself of rotating member 17
Rotation has certain self-locking, and rotating member 17 is prevented to be detached from casting die 19, lead to not two extension sleeves 1 of locking away from
From the silicon wafer of various specifications can not be adapted to.
Specifically, as shown in figs9-12, radio frequency plasma etching fixing device for silicon piece further includes elastic portion 10, elastic portion
10 both ends are separately connected the other end in clamping portion 9 Yu force section 8, and the opposing end surface shape of clamping portion 9 and force section 8 is arc,
Clamping portion 9 is located at the force application movement direction of force section 8.First, force section 8 is when exerting a force for the first time to clamping portion 9, because of rotation
It is clamped, the sub-fraction of 11 end face of compressed part compresses silicon wafer first.It persistently exerted a force later to clamping portion 9 in force section 8
Cheng Zhong, because compressed part 11 is stopped by silicon wafer, so clamping portion 9 gradually becomes concordantly, 11 end face of compressed part is to silicon wafer by range
Degree gradually becomes uniformly firm.Second, during force section 8 continues to exert a force to clamping portion 9, because 8 direction of rotation of force section is
So that force section 8 and 9 distance of clamping portion shortened, by observing the position in clamping portion 9 or observing force section 8 and clamping portion 9
Contact area determine the firmness of fixed silicon wafer, have and visually indicate effect, preventing force section 8 from persistently exerting a force leads to silicon wafer
Damage.Third, needed for judging silicon wafer in the case where firmness mistake, force section 8 persistently exerts a force to clamping portion 9,
So that force section 8 and the contact area in clamping portion 9 are smaller and smaller, until force section 8 is detached from clamping portion 9, so that force section 8 can not
It exerts a force to clamping portion 9, plays the role of protecting silicon wafer.Wherein, elastic portion 10 is right after force section 8 is detached from clamping portion 9
Clamping portion 9 is buffered, and prevents clamping portion 9 from launching the integrity degree for endangering worker safety and equipment.
Specifically, clamping portion 9 is bonded force section 8.
Specifically, driving means 6 is hydraulic cylinder.
The beneficial effects of the present invention are:
First, the present invention use manually rotation swivel 5 with reach control 2 synchronization telescope of telescopic rod, avoid using fluid cylinder,
The automation equipments such as cylinder, electric cylinders are because of the distance that telescopic rod 2 relatively moves caused by various factors (details please refer to background technique)
There is it is uncontrollable, the distance for driving telescopic rod 2 opposite that needs to make repeated attempts reach adapt to various specifications silicon wafer.
Second, the present invention using gear by the way of synchronize transmission, because the thickness of the tooth of gear is very high, and because of gear
The relative wall of tooth there is certain tilt angle, have it is certain unload power effect, so gear is difficult to wear, in long-time
The distance that telescopic rod 2 relatively moves is controlled in work would not have uncontrollable phenomenon, and being also just not necessarily to make repeated attempts, it is flexible to drive
The opposite distance of bar 2, which reaches, adapts to various specifications silicon wafer.
Third, the present invention use rotation manually to turn 5 to reach control 2 synchronization telescope of telescopic rod, it is anti-to be not necessarily to staff
It is multiple to adapt to prevent from needing the driving that makes repeated attempts with the stretching speed of the automation equipments such as fluid cylinder, cylinder, electric cylinders driving telescopic rod 2
The opposite distance of telescopic rod 2, which reaches, adapts to various specifications silicon wafer.
4th, the present invention using swivel 5 manual actuation telescopic rod, 2 synchronization telescope, turn 5 relative to fluid cylinder, cylinder, electricity
Cost is extremely low for the automation equipments such as cylinder, has very big promotional value.
5th, the present invention turns 5 volume relative to fluid cylinder, gas using swivel 5 manual actuation telescopic rod, 2 synchronization telescope
Cost is minimum for the automation equipments such as cylinder, electric cylinders, interior in a limited space can process, adaptation range is wider.
6th, the present invention turns 5 volume relative to fluid cylinder, gas using swivel 5 manual actuation telescopic rod, 2 synchronization telescope
Cost is minimum for the automation equipments such as cylinder, electric cylinders, hardly influences radio frequency plasma etching and is put with fixing device for silicon piece
The degree of balance is conducive to silicon wafer processing.
7th, the present invention is using swivel 5 manual actuation telescopic rod, 2 synchronization telescope, certainly relative to fluid cylinder, cylinder, electric cylinders etc.
It is operated for dynamicization equipment and its simple, is conducive to operate, save the operating time.
8th, the present invention is using swivel 5 manual actuation telescopic rod, 2 synchronization telescope, certainly relative to fluid cylinder, cylinder, electric cylinders etc.
Almost cost is not only saved, also helps and reduces the working time without being safeguarded to it for dynamicization equipment.
9th, the present invention is using swivel 5 manual actuation telescopic rod, 2 synchronization telescope, certainly relative to fluid cylinder, cylinder, electric cylinders etc.
Severe working environment is suitable for for dynamicization equipment.
Tenth, the present invention is using swivel 5 manual actuation telescopic rod, 2 synchronization telescope, certainly relative to fluid cylinder, cylinder, electric cylinders etc.
Structure and its simple for dynamicization equipment, is conducive to installing and dismounting, production and processing can be put within the shortest time.
A kind of silicon wafer fixing means, comprising the following steps:
Telescopic adjustment, according to the dimensions of silicon wafer, rotation swivel 5, the gear driving rack 21 for turning 5 synchronizes shifting
Dynamic, the side wall for promoting telescopic rod 2 to be bonded the extendable room of extension sleeve 1 carries out telescopic moving, further drive telescopic rod 2 towards
Relative direction synchronizes stable telescopic moving.
Locking, rotation lock main part 15, so that the elastic locking unit 151 of swivel 5 avoids the position of 5 direction of rotation of swivel
Swivel 5 is squeezed, swivel 5 is locked.
It places, silicon wafer is placed on extension sleeve 1 and plummer 4.
It is fixed, start driving means 6, driving means 6 pushes force section 8 to be rotated, and force section 8 carries out clamping portion 9
Rotation force promotes the compressed part 11 in clamping portion 9 to compress silicon wafer and is fixed.
Specifically, after telescopic adjustment step, also have and reel regulating step, the specific steps are as follows: reel adjusting, root
According to the width dimensions of silicon wafer, the distance of two extension sleeves 1 is pulled open or shunk first, so that reeling the fitting of bar 13 reels sleeve 12
The side wall for reeling space carry out telescopic moving, further driving reel bar 13 synchronized towards relative direction it is stable flexible
It is mobile.
More specifically, also there is lock step after reeling adjusting, the specific steps are as follows: pull piece 18 is pulled in locking,
Promote rotating member 17 to depress casting die 19 so that the extruding of elastic layer 193 of casting die 19 is fixed and reels bar 13, allow reel bar 13 can not
It is moved in reeling sleeve 12, has further locked the distance of two extension sleeves 1.
More specifically, in lock step, the engaging to a certain extent of the arc groove 191 of casting die 19 or fitting rotating member
17, the wall surface of arc groove 191 equally also blocks the spinning of rotating member 17.
Specifically, in fixation procedure, force section 8 is when exerting a force for the first time to clamping portion 9, because rotation is clamped,
The sub-fraction of 11 end face of compressed part compresses silicon wafer first.Later during force section 8 persistently exerts a force to clamping portion 9, because of pressure
Tight portion 11 is stopped by silicon wafer, so clamping portion 9 gradually becomes concordantly, 11 end face of compressed part gradually becomes the stress degree of silicon wafer
It is uniformly firm.Finally during force section 8 continues to exert a force to clamping portion 9, because 8 direction of rotation of force section is so that force section 8
It shortens with 9 distance of clamping portion, it is true by the position in observation clamping portion 9 or observation force section 8 and the contact area in clamping portion 9
Surely the firmness of fixed silicon wafer.Needed for judging silicon wafer in the case where firmness mistake, force section 8 is persistently to clamping portion
9 exert a force, so that force section 8 and the contact area in clamping portion 9 are smaller and smaller, until force section 8 is detached from clamping portion 9.
More specifically, elastic portion 10 is detached from clamping portion in force section 8 during force section 8 exerts a force to clamping portion 9
Clamping portion 9 is buffered after 9.
Although the illustrative specific embodiment of the present invention is described above, in order to the technology of the art
Personnel are it will be appreciated that the present invention, but the present invention is not limited only to the range of specific embodiment, to the common skill of the art
For art personnel, as long as long as various change the attached claims limit and determine spirit and scope of the invention in, one
The innovation and creation using present inventive concept are cut in the column of protection.
Claims (10)
1. a kind of radio frequency plasma etching fixing device for silicon piece, wherein include:
Extension sleeve, the extension sleeve have extendable room；
Telescopic rod, the telescopic rod have rack gear, and the rack gear is arranged in the extendable room；
Swivel, the swivel have gear, and the gear engages the rack gear, and the rack gear is located at the opposite position of the gear
It sets；
Driving means；
Fixed part, described fixed part one end connect the driving means, and the fixed part other end connects the telescopic rod；
Force section, the driving means connect one end of the force section；
The other end in clamping portion, the force section drives the clamping portion to be moved；
Compressed part, the compressed part connect the clamping portion；
Plummer, the plummer connect the telescopic rod, and the plummer is located at the compressed part relative position.
2. radio frequency plasma etching fixing device for silicon piece according to claim 1, wherein the extension sleeve outer surface one
Side has elastic surface.
3. radio frequency plasma etching fixing device for silicon piece according to claim 1, wherein the plummer has elasticity.
4. radio frequency plasma etching fixing device for silicon piece according to claim 1, wherein the extension sleeve also has recessed
Slot.
5. radio frequency plasma etching fixing device for silicon piece according to claim 1, wherein the radio frequency plasma etching is used
Fixing device for silicon piece further include:
Main part is locked, the latch fitting body normal is arranged in the swivel side, and the locking main part includes
Elastic locking unit, the elastic locking unit have a notch, and the notch geometry and the swivel are adapted, described
Notch and the swivel have certain distance.
6. radio frequency plasma etching fixing device for silicon piece according to claim 1, wherein the extension sleeve has two
It is a.
7. radio frequency plasma etching fixing device for silicon piece according to claim 1, wherein the radio frequency plasma etching is used
Fixing device for silicon piece further include:
Reel sleeve, the described sleeve one end that reels is vertically set on the extension sleeve side, it is described reel sleeve and have reel
Space；
Bar is reeled, the described bar one end that reels is vertically set on another extension sleeve side, described to reel the setting of the bar other end
It is reeled in space described.
8. radio frequency plasma etching fixing device for silicon piece according to claim 7, wherein the storage space has one to lead to
Road, the channel connection are extraneous.
9. radio frequency plasma etching fixing device for silicon piece according to claim 7, wherein the radio frequency plasma etching is used
Fixing device for silicon piece further include:
Pressure main body is pulled, described pull reels sleeve described in pressure main body connection, the pressure main body of pulling has a hole；
Rotor, the rotor be flexibly connected described in pull pressure main body；
Casting die, the casting die are arranged in described hole, and the casting die and the rotor are in relative position.
10. radio frequency plasma etching fixing device for silicon piece according to claim 9, wherein the radio frequency plasma etching
It further include pull piece with fixing device for silicon piece, the pull piece connects the rotor and described pull presses main body junction.
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| CN201910050960.1A CN109559970A (en) | 2019-01-21 | 2019-01-21 | A kind of radio frequency plasma etching fixing device for silicon piece and method |
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| CN201910050960.1A CN109559970A (en) | 2019-01-21 | 2019-01-21 | A kind of radio frequency plasma etching fixing device for silicon piece and method |
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