CN106298619A - A kind of silicon chip places fixed mechanism - Google Patents

A kind of silicon chip places fixed mechanism Download PDF

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Publication number
CN106298619A
CN106298619A CN201610709923.3A CN201610709923A CN106298619A CN 106298619 A CN106298619 A CN 106298619A CN 201610709923 A CN201610709923 A CN 201610709923A CN 106298619 A CN106298619 A CN 106298619A
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CN
China
Prior art keywords
translation
sleeve
silicon chip
sides
fixed mechanism
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Granted
Application number
CN201610709923.3A
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Chinese (zh)
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CN106298619B (en
Inventor
屠明州
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Nantong Hualong microelectronics Limited by Share Ltd
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屠明州
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Priority to CN201810912484.5A priority Critical patent/CN109037400A/en
Priority to CN201610709923.3A priority patent/CN106298619B/en
Priority to CN201811028022.3A priority patent/CN109390269A/en
Priority to CN201810912493.4A priority patent/CN109087972B/en
Publication of CN106298619A publication Critical patent/CN106298619A/en
Application granted granted Critical
Publication of CN106298619B publication Critical patent/CN106298619B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a kind of silicon chip and place fixed mechanism, belong to photovoltaic processing mechanical apparatus field.This invention includes translating sleeve, translation plates, translation hydraulic cylinder, regulating sleeve, adjustable plate and fixed mechanism, translation hydraulic cylinder is horizontally set on the downside of translation sleeve, translation hydraulic cylinder both sides outfan is fixed with being connected on the downside of the translation plates of translation sleeve both sides respectively, it is respectively symmetrically on the upside of the translation plates of translation sleeve both sides and is provided with fixed mechanism, piece translation two ends, sleeve side have been horizontally disposed with regulating sleeve respectively, another root translation two ends, sleeve side are horizontally disposed with the adjustable plate suitable with regulating sleeve respectively, lock plunger it is vertically arranged with between regulating sleeve and adjustable plate.Present configuration is reasonable in design, can be placed smoothly by the silicon chip of sizes specification, and can be firmly fixed by silicon chip, improves the production and processing efficiency of silicon chip, meets the needs of production and application.

Description

A kind of silicon chip places fixed mechanism
Technical field
The invention belongs to photovoltaic processing mechanical apparatus field, particularly relate to a kind of silicon chip and place fixed mechanism.
Background technology
Photovoltaic generation is the abbreviation of solar photovoltaic generation system, is a kind of photovoltaic utilizing solar cell semi-conducting material Effect, can be converted directly into a kind of new power generating system of electric energy by solar radiation, has independent operating and is incorporated into the power networks two kinds, Existing photovoltaic generation material is mainly silicon chip, in the production process of crystal-silicon solar cell, needs silicon chip according to technique The order of processing sequentially passes through the processing technique such as making herbs into wool, High temperature diffusion and etching, in these production technology courses of processing, all needs Be fixed by silicon chip, existing silicon chip places fixed mechanism structure complexity and troublesome poeration, it is impossible to by sizes specification Silicon chip place smoothly, and by silicon chip place after, it is difficult to accurately firmly silicon chip is fixed so that silicon chip In process of manufacture, often produce skew, affect crudy and the efficiency of silicon chip, and silicon chip is in placement process, Silicon chip surface often produces friction with placement mechanism, causes silicon chip surface to produce cut, reduces the quality of production of silicon chip, it is impossible to Meet the needs of production and processing.
Summary of the invention
The technical problem to be solved is to overcome the above-mentioned deficiency in the presence of prior art, and provides a kind of knot Structure is reasonable in design, can be placed smoothly by the silicon chip of sizes specification, and can firmly carry out silicon chip compressing admittedly Fixed silicon chip places fixed mechanism.
In order to solve above-mentioned technical problem, the technical solution adopted in the present invention is: a kind of silicon chip places fixed mechanism, its Be characterised by: described silicon chip place fixed mechanism include translate sleeve, translation plates, translation hydraulic cylinder, regulating sleeve, adjustable plate and Fixed mechanism, described translation sleeve is provided with two, has been horizontally disposed with translation passage respectively, translates sleeve in two translation sleeves Both sides horizontal symmetry respectively is provided with the translation plates suitable with translating passage, and translation hydraulic cylinder is horizontally set under translation sleeve Side, translation hydraulic cylinder is hydraulic cylinder with double piston rods, translation hydraulic cylinder both sides outfan respectively with the translation plates of translation sleeve both sides Downside connects fixing, is respectively symmetrically and is provided with fixed mechanism on the upside of the translation plates of translation sleeve both sides, described two translation sleeves In translation two ends, sleeve side be horizontally disposed with regulating sleeve respectively, another root translation two ends, sleeve side respectively level It is provided with the adjustable plate suitable with regulating sleeve, regulating sleeve is evenly arranged with multiple installing hole the most successively, Lock plunger it is vertically arranged with between regulating sleeve and adjustable plate；Described fixed mechanism includes firm banking, swinging mounting, compression gas Cylinder, fixed support and clamping screw, firm banking is horizontally set on the upside of translation plates, and swinging mounting is L-type support, swinging mounting Both sides, middle part are hinged respectively and are connected at the upper side of firm banking, and fixed support tilts upward and is arranged on above firm banking another Side, fixed support upper end is provided with connecting plate, and in the middle part of connecting plate, both sides are hinged respectively and are connected on the upside of fixed support, and compression cylinder sets Putting in connecting plate side, compression cylinder outfan is hinged and is connected to swinging mounting upper end, and swinging mounting opposite side is vertically arranged with pressure Tight screw mandrel, the most threaded on the clamping screw of the upper and lower both sides of swinging mounting have fixing nut, and clamping screw lower end is provided with Compact heap, the translation plates on the downside of described compact heap has been horizontally disposed with stock supporting plate.
Further, described translation sleeve upper horizontal is provided with soft rubber layer.
Further, two translation hydraulic cylinders on the downside of described two translation sleeves use same road binders road parallel drive.
The present invention compared with prior art, has the following advantages and effect: present configuration is simple, by translation sleeve two Side horizontal symmetry respectively is provided with the translation plates suitable with translating passage, and translation hydraulic cylinder is horizontally set under translation sleeve Side, translation hydraulic cylinder both sides outfan is fixed with being connected on the downside of the translation plates of translation sleeve both sides respectively, is utilized translation hydraulic cylinder Synchronize to drive two pieces of translation plates so that two pieces of translation plates can synchronize to move in opposite directions according to the dimensions level of silicon chip accurately Dynamic, utilize translation two ends, sleeve side in two translation sleeves to be horizontally disposed with regulating sleeve respectively, another root translates Two ends, sleeve side are horizontally disposed with the adjustable plate suitable with regulating sleeve respectively, vertically set between regulating sleeve and adjustable plate It is equipped with lock plunger, enables and accurately regulate the spacing between two translation sleeves according to the dimensions of silicon chip, by translation sleeve It is respectively symmetrically on the upside of the translation plates of both sides and is provided with fixed mechanism, utilize compression cylinder to drive swinging mounting so that compact heap energy Enough being firmly fixed by silicon chip, utilizing the most threaded on the clamping screw of the upper and lower both sides of swinging mounting has fixing spiral shell Female so that clamping screw can vertically be adjusted according to the thickness of silicon chip and fix, utilize water on the upside of translation sleeve Put down and be provided with soft rubber layer, make to be avoided that silicon chip produces cut in placement process, it is ensured that silicon chip can the most firmly enter Row is fixed, and improves efficiency and the quality of silicon chip processing, meets the needs of production and application.
Accompanying drawing explanation
Fig. 1 is the front view that a kind of silicon chip of the present invention places fixed mechanism.
Fig. 2 is the top view that a kind of silicon chip of the present invention places fixed mechanism.
In figure: 1. translation sleeve, 2. translation plates, 3. translation hydraulic cylinder, 4. regulating sleeve, 5. adjustable plate, 6. translation passage, 7. installing hole, 8. lock plunger, 9. firm banking, 10. swinging mounting, 11. compression cylinders, 12. fixed supports, 13. clamping screws, 14. connecting plates, 15. fix nut, 16. compact heaps, 17. stock supporting plates, 18. soft rubber layers.
Detailed description of the invention
In order to further describe the present invention, a kind of silicon chip is expanded on further below in conjunction with the accompanying drawings and places the concrete of fixed mechanism Embodiment, following example are explanation of the invention and the invention is not limited in following example.
As shown in Figure 1 and Figure 2, one silicon chip of the present invention places fixed mechanism, including translation sleeve 1, translation plates 2, translation liquid Cylinder pressure 3, regulating sleeve 4, adjustable plate 5 and fixed mechanism, translation sleeve 1 is provided with two, difference level in two translation sleeves 1 Being provided with translation passage 6, translation sleeve 1 both sides horizontal symmetry respectively is provided with the translation plates 2 suitable with translating passage 6, flat Moving hydraulic cylinder 3 and be horizontally set on the downside of translation sleeve 1, translation hydraulic cylinder 3 is hydraulic cylinder with double piston rods, translates hydraulic cylinder 3 both sides Outfan is fixed with being connected on the downside of the translation plates 2 of translation sleeve 1 both sides respectively, on the upside of the translation plates 2 of translation sleeve 1 both sides respectively Being symmetrically arranged with fixed mechanism, translation two ends, sleeve 1 side in two translation sleeves 1 have been horizontally disposed with regulation set respectively Cylinder 4, another root translation two ends, sleeve 1 side are horizontally disposed with the adjustable plate 5 suitable with regulating sleeve 4, regulating sleeve 4 respectively On be evenly arranged with multiple installing hole 7 the most successively, be vertically arranged with lock plunger between regulating sleeve 4 and adjustable plate 5 8。
The fixed mechanism of the present invention includes firm banking 9, swinging mounting 10, compression cylinder 11, fixed support 12 and compresses Screw mandrel 13, firm banking 9 is horizontally set on the upside of translation plates 2, and swinging mounting 10 is L-type support, both sides in the middle part of swinging mounting 10 Being hinged respectively is connected at the upper side of firm banking 9, and fixed support 12 tilts upward and is arranged on opposite side above firm banking 9, Gu Fixed rack 12 upper end is provided with connecting plate 14, and in the middle part of connecting plate 14, both sides are hinged respectively and are connected on the upside of fixed support 12, compresses gas Cylinder 11 is arranged on connecting plate 14 side, and compression cylinder 11 outfan is hinged and is connected to swinging mounting 10 upper end, swinging mounting 10 another Side is vertically arranged with clamping screw 13, and the most threaded on the clamping screw 13 of swinging mounting about 10 both sides have fixing nut 15, clamping screw 13 lower end is provided with compact heap 16, and the translation plates 2 on the downside of compact heap 16 has been horizontally disposed with stock supporting plate 17.
Translation sleeve 1 upper horizontal of the present invention is provided with soft rubber layer 18, makes to be avoided that silicon chip is in placement process Produce cut.Two translation hydraulic cylinders 3 on the downside of two translation sleeves 1 of the present invention use same road binders road parallel drive, make The translation plates 2 of two translation sleeve 1 both sides can synchronize to translate, it is ensured that silicon chip can the carrying out of exactly be placed.
Using technique scheme, one silicon chip of the present invention places fixed mechanism when in use, by translation sleeve 1 Both sides horizontal symmetry respectively is provided with the translation plates 2 suitable with translating passage 6, and translation hydraulic cylinder 3 is horizontally set on translation set On the downside of cylinder 1, translation hydraulic cylinder 3 both sides outfan is fixed with being connected on the downside of the translation plates 2 of translation sleeve 1 both sides respectively, utilizes flat Move hydraulic cylinder 3 to synchronize to drive two pieces of translation plates 2 so that two pieces of translation plates 2 can according to the dimensions level of silicon chip accurately Synchronization moves towards, and utilizes translation two ends, sleeve 1 side in two translation sleeves 1 to be horizontally disposed with regulating sleeve respectively 4, another root translation two ends, sleeve 1 side are horizontally disposed with the adjustable plate 5 suitable with regulating sleeve 4 respectively, regulating sleeve 4 with It is vertically arranged with lock plunger 8 between adjustable plate 5, enables and accurately regulate between two translation sleeves 1 according to the dimensions of silicon chip Spacing, be respectively symmetrically and be provided with fixed mechanism on the upside of the translation plates 2 by translation sleeve 1 both sides, utilize compression cylinder 11 to drive Dynamic swinging mounting 10 so that silicon chip can be firmly fixed by compact heap 16, utilizes the pressure of swinging mounting about 10 both sides The most threaded on tight screw mandrel 13 have fixing nut 15 so that clamping screw 13 can according to the thickness of silicon chip vertically It is adjusted and fixes, utilizing translation sleeve 1 upper horizontal to be provided with soft rubber layer 18, make to be avoided that silicon chip is in placement process Middle generation cut, it is ensured that silicon chip can the most firmly be fixed.By such structure, present configuration design is closed Reason, can place the silicon chip of sizes specification smoothly, and can be firmly fixed by silicon chip, improve The production and processing efficiency of silicon chip, meets the needs of production and application.
Above content described in this specification is only illustration made for the present invention.Technology belonging to the present invention Described specific embodiment can be made various amendment or supplements or use similar mode by the technical staff in field Substitute, without departing from the content of description of the invention or surmount scope defined in the claims, all should be belonged to this The protection domain of invention.

Claims (3)

1. a silicon chip places fixed mechanism, it is characterised in that: described silicon chip is placed fixed mechanism and is included translating sleeve, translation Plate, translation hydraulic cylinder, regulating sleeve, adjustable plate and fixed mechanism, described translation sleeve is provided with two, in two translation sleeves Being horizontally disposed with translation passage respectively, translation sleeve both sides horizontal symmetry respectively is provided with the translation suitable with translating passage Plate, translation hydraulic cylinder is horizontally set on the downside of translation sleeve, and translation hydraulic cylinder is hydraulic cylinder with double piston rods, translates hydraulic cylinder both sides Outfan is fixed with being connected on the downside of the translation plates of translation sleeve both sides respectively, is respectively symmetrically on the upside of the translation plates of translation sleeve both sides Being provided with fixed mechanism, translation two ends, sleeve side in described two translation sleeves have been horizontally disposed with regulation set respectively Cylinder, another root translation two ends, sleeve side are horizontally disposed with the adjustable plate suitable with regulating sleeve respectively, edge on regulating sleeve Horizontal direction is evenly arranged with multiple installing hole successively, is vertically arranged with lock plunger between regulating sleeve and adjustable plate；Described solid Determining mechanism and include firm banking, swinging mounting, compression cylinder, fixed support and clamping screw, firm banking is horizontally set on flat Moving on the upside of plate, swinging mounting is L-type support, and in the middle part of swinging mounting, both sides are hinged respectively and are connected at the upper side of firm banking, fixing Riding sets up opposite side above firm banking, and fixed support upper end is provided with connecting plate, both sides in the middle part of connecting plate Being hinged respectively is connected on the upside of fixed support, and compression cylinder is arranged on connecting plate side, and compression cylinder outfan is hinged and is connected to rotate Pedestal upper end, swinging mounting opposite side is vertically arranged with clamping screw, difference spiral shell on the clamping screw of the upper and lower both sides of swinging mounting Stricture of vagina connects has fixing nut, clamping screw lower end to be provided with compact heap, and the translation plates on the downside of described compact heap has been horizontally disposed with Stock supporting plate.
A kind of silicon chip the most according to claim 1 places fixed mechanism, it is characterised in that: described translation sleeve upper horizontal It is provided with soft rubber layer.
A kind of silicon chip the most according to claim 1 places fixed mechanism, it is characterised in that: on the downside of described two translation sleeves Two translation hydraulic cylinders use same road binders road parallel drives.
CN201610709923.3A 2016-08-24 2016-08-24 A kind of silicon chip placement fixed mechanism Active CN106298619B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201810912484.5A CN109037400A (en) 2016-08-24 2016-08-24 A kind of crystal-silicon solar cell production silicon wafer placement fixed mechanism
CN201610709923.3A CN106298619B (en) 2016-08-24 2016-08-24 A kind of silicon chip placement fixed mechanism
CN201811028022.3A CN109390269A (en) 2016-08-24 2016-08-24 A kind of silicon wafer placement fixed mechanism improving processing efficiency
CN201810912493.4A CN109087972B (en) 2016-08-24 2016-08-24 Working method of silicon wafer placing and fixing mechanism for crystalline silicon solar cell production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610709923.3A CN106298619B (en) 2016-08-24 2016-08-24 A kind of silicon chip placement fixed mechanism

Related Child Applications (3)

Application Number Title Priority Date Filing Date
CN201811028022.3A Division CN109390269A (en) 2016-08-24 2016-08-24 A kind of silicon wafer placement fixed mechanism improving processing efficiency
CN201810912484.5A Division CN109037400A (en) 2016-08-24 2016-08-24 A kind of crystal-silicon solar cell production silicon wafer placement fixed mechanism
CN201810912493.4A Division CN109087972B (en) 2016-08-24 2016-08-24 Working method of silicon wafer placing and fixing mechanism for crystalline silicon solar cell production

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CN106298619A true CN106298619A (en) 2017-01-04
CN106298619B CN106298619B (en) 2018-09-28

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CN201810912484.5A Pending CN109037400A (en) 2016-08-24 2016-08-24 A kind of crystal-silicon solar cell production silicon wafer placement fixed mechanism
CN201610709923.3A Active CN106298619B (en) 2016-08-24 2016-08-24 A kind of silicon chip placement fixed mechanism
CN201810912493.4A Expired - Fee Related CN109087972B (en) 2016-08-24 2016-08-24 Working method of silicon wafer placing and fixing mechanism for crystalline silicon solar cell production
CN201811028022.3A Withdrawn CN109390269A (en) 2016-08-24 2016-08-24 A kind of silicon wafer placement fixed mechanism improving processing efficiency

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CN201810912493.4A Expired - Fee Related CN109087972B (en) 2016-08-24 2016-08-24 Working method of silicon wafer placing and fixing mechanism for crystalline silicon solar cell production
CN201811028022.3A Withdrawn CN109390269A (en) 2016-08-24 2016-08-24 A kind of silicon wafer placement fixed mechanism improving processing efficiency

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CN109087972A (en) 2018-12-25
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CN109390269A (en) 2019-02-26
CN109087972B (en) 2020-03-17

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