CN106298117A - Resistive element and resistance method for trimming thereof - Google Patents
Resistive element and resistance method for trimming thereof Download PDFInfo
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- CN106298117A CN106298117A CN201510318917.0A CN201510318917A CN106298117A CN 106298117 A CN106298117 A CN 106298117A CN 201510318917 A CN201510318917 A CN 201510318917A CN 106298117 A CN106298117 A CN 106298117A
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- main body
- resistor main
- resistance
- resistive element
- hollow
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Abstract
The present invention provides a kind of resistive element and resistance method for trimming thereof, this resistive element has the first electrode and the second electrode, and one be located at the resistor main body between the first electrode and the second electrode, resistor main body surface spraying has photoresist layer, the photoresist layer sprayed is reserved one hollow-out parts supplying to be etched processing, by spraying photoresist layer in advance in resistor main body, and reserve a hollow-out parts, it is available for being etched processing accurately, reach the purpose that resistive element resistance adjusts, reduce resistive element spoilage in the course of processing simultaneously, can stably produce high accuracy and the product of low error rate.
Description
Technical field
The present invention relates to a kind of resistive element and resistance method for trimming thereof.
Background technology
In response to portability, the development trend of miniaturization of various electronic products, be frequently used in circuit for
Measure the resistor of two ends potential difference, the most increasingly tend to miniaturization, therefore to reduce measurement error
With improve the current value of detection, usual resistor needs the resistance value possessing in rated range or specified allows
The low-resistance high-power characteristic of power, and it must is fulfilled for reducing the requirement of temperature-coefficient of electrical resistance (TCR).
If Fig. 1, existing resistive element A are that the laser utilizing electricity and heat energy machining type repaiies resistance machine B, send focusing
Become the pulse laser beam of the least luminous point, reach appropriate energy density and resistive element A is cut, make
Resistance part is melted, evaporation, and then changes effective conductive area of resistance or effective conductive lengths, to reach
Adjust the purpose of resistive element A resistance.
But, during finishing resistance value, need that the factor controlled is many (such as power, rate of cutting, prolongs
Time etc. late), therefore machining machine and tool is directly when resistive element A carries out resistance finishing, its required precision high phase
To the most more difficulty in finishing, this also results in the reduction of qualification rate, increases manufacturing cost.
Summary of the invention
The main object of the present invention is in that, it is provided that a kind of resistive element resistance method for trimming, by resistance
Body sprays photoresist layer, and a reserved working (finishing) area in advance, it is possible to decrease resistive element damage in the course of processing
Bad rate, can stably produce high accuracy and the product of low error rate.
For reaching above-mentioned purpose, the resistive element of the present invention has the first electrode and the second electrode, and one is located at
Resistor main body between first electrode and the second electrode, resistor main body surface spraying has photoresist layer, and this institute sprays
Photoresist layer be reserved one hollow-out parts being etched for resistor main body.
Aforesaid resistive element, the hollow-out parts that this resistor main body surface light resistance layer is reserved is for according to resistor main body
Measured resistance size and reserved required etching area.
Aforesaid resistive element, the hollow-out parts that this resistor main body surface light resistance layer is reserved, is reserved erosion
The working (finishing) area carved, and after resistor main body is etched processing, resistor main body can be in exposing shape at hollow-out parts
Become a recess.
Aforesaid resistive element, wherein these a plurality of resistor main body being coated with photoresist layer are etched adding simultaneously
Work, allows each resistor main body form a recess at hollow-out parts in exposing, and the recess of a plurality of resistor main body has
The same degree of depth.
For reaching above-mentioned purpose, the resistive element resistance method for trimming of the present invention, its step comprises:
A: the resistance of detection resistor main body；
B a: detected resistance is fed back to processor and obtains a difference resistance to compare computing with a preset resistive value
Value；
C: resistor main body spraying is formed photoresist layer, and reserved working (finishing) area；
D: be etched fabrication process at its reserved working (finishing) area of institute according to difference resistance measured by resistor main body
Form recess.
Compared with prior art, the invention have the advantages that: resistor main body can be reduced in processing
During spoilage, with can stably produce high accuracy and the product of low error rate.
Accompanying drawing explanation
Fig. 1 show existing resistive element schematic diagram；
Fig. 2 show resistive element schematic diagram one of the present invention；
Fig. 3 show resistive element schematic diagram two of the present invention；
Fig. 4 A-Fig. 4 I show and shows that resistive element of the present invention is according to the shape after the etch process of its different resistances
State schematic diagram；
Fig. 5 show the flow chart of steps of resistance method for trimming.
Description of reference numerals: 1-the first electrode；2-the second electrode；3-resistor main body；4-photoresist layer；41-hollow out
Portion；5-recess；A-resistive element；B-laser repaiies resistance machine.
Detailed description of the invention
Detailed description for the present invention and technology contents, be described as follows graphic for cooperation:
The present invention, about a kind of resistive element and resistance method for trimming thereof, refers to Fig. 2 to Fig. 4 A-Fig. 4 I institute
Show.In an embodiment, resistive element has the first electrode 1 and the second electrode 2, and one is located at the first electricity
Resistor main body 3 between pole 1 and the second electrode 2, resistor main body 3 surface spraying has photoresist layer 4, is sprayed
Photoresist layer 4 be reserved one for being etched the hollow-out parts 41 of processing, this photoresist layer 4 can provide and be covered
Resistor main body 3 is etched processing procedure, and hollow-out parts 41 is to measure institute after its resistance for each resistor main body 3
Stay in advance, the hollow-out parts 41 size also different (ginsengs reserved according to each resistor main body 3 resistance difference
Read shown in Fig. 4 A-Fig. 4 I).
Refer to again shown in Fig. 2 and Fig. 3, in the present embodiment, after the resistance by detection resistor main body 3,
One detected resistance is fed back to processor and obtains a difference resistance, now to compare computing with a preset resistive value
Just can calculate each resistor main body 3 resistance and compensate numerical value, the most also determine sprayed photoresist layer 4
The size of hollow-out parts 41 area need to be reserved；This hollow-out parts 41 can repair formation recess 5 in etch process,
To reach to adjust the necessary predetermined resistance of each resistor main body 3.
Additionally, the present invention repairs resistance determines finishing mainly by the size of reserved hollow-out parts 41 area
Area, therefore, a plurality of resistor main body 3 being coated with photoresist layer 4 can be etched processing simultaneously, allows each
Resistor main body 3 forms a recess 5 in exposing at hollow-out parts 41, and the recess 5 of a plurality of resistor main body 3 has
There is the same degree of depth.
The present invention more about a kind of resistive element and resistance method for trimming thereof, refer to Fig. 2, Fig. 3 and Fig. 5 institute
Showing, its step comprises:
S10: detect the resistance of each resistor main body 3.
S20: detected resistance is fed back to processor and obtains a difference resistance to compare computing with a preset resistive value
Value, to determine the etch process size of each resistor main body 3.
S30: resistor main body 3 spraying is formed photoresist layer 4, and the hollow-out parts 41 of reserved working (finishing) area.
S40: it is reserved the hollow-out parts 41 that need to process according to difference resistance measured by each resistor main body 3
It is etched fabrication process and forms recess 5；The reserved hollow out of photoresist layer 4 due to the spraying of each resistor main body 3
Portion 41 obtains a difference resistance according to the computing after measuring resistance, and determines the big of reserved hollow-out parts 41 area
Little, therefore when etch process, recess 5 depth value cut in hollow-out parts 41 is fixing.And,
After forming recess 5 through etch process process, removing photoresistance layer 4 can be removed further.
By above-mentioned detailed description of the invention, can clearly learn, the photoresistance that the present invention sprays in resistor main body 3
Layer 4 can be precisely controlled etching size, by the degree of depth in fixing etch process, in reserved hollow-out parts
Precisely cut the recess 5 of formation at 41, reach the purpose that resistor main body 3 resistance adjusts；Resistance can be reduced
The body 3 spoilage in the course of processing, can stably produce high accuracy and the product of low error rate.
Described above it is merely exemplary for the purpose of the present invention, and nonrestrictive, ordinary skill people
Member understand, in the case of the spirit and scope limited without departing from claim, can many modifications may be made,
Change or equivalence, but within falling within protection scope of the present invention.
Claims (5)
1. a resistive element, has the first electrode and the second electrode, and one is located at the first electrode and the second electricity
Resistor main body between pole, it is characterised in that: resistor main body surface spraying has photoresist layer, this light sprayed
Resistance layer reserves a hollow-out parts being etched for resistor main body.
Resistive element the most according to claim 1, it is characterised in that: this resistor main body surface light resistance layer institute
Reserved hollow-out parts is to reserve required etching area according to the resistance size measured by resistor main body.
Resistive element the most according to claim 1, it is characterised in that: this resistor main body surface light resistance layer institute
Reserved hollow-out parts, is the reserved working (finishing) area being etched, and after resistor main body is etched processing,
Resistor main body can form a recess exposing at hollow-out parts.
Resistive element the most according to claim 1, it is characterised in that: these are a plurality of is coated with photoresist layer
Resistor main body is etched processing simultaneously, allows each resistor main body form a recess at hollow-out parts in exposing, and multiple
The recess of several resistor main body has the same degree of depth.
5. a resistive element resistance method for trimming, it is characterised in that its step comprises:
A: the resistance of detection resistor main body；
B a: detected resistance is fed back to processor and obtains a difference resistance to compare computing with a preset resistive value
Value；
C: resistor main body spraying is formed photoresist layer, and reserved working (finishing) area；
D: be etched fabrication process at its reserved working (finishing) area of institute according to difference resistance measured by resistor main body
Form recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510318917.0A CN106298117A (en) | 2015-06-11 | 2015-06-11 | Resistive element and resistance method for trimming thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510318917.0A CN106298117A (en) | 2015-06-11 | 2015-06-11 | Resistive element and resistance method for trimming thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106298117A true CN106298117A (en) | 2017-01-04 |
Family
ID=57659658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510318917.0A Pending CN106298117A (en) | 2015-06-11 | 2015-06-11 | Resistive element and resistance method for trimming thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106298117A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134331A (en) * | 2017-04-27 | 2017-09-05 | 广东风华高新科技股份有限公司 | Thermistor resistance trimming method |
| CN109712768A (en) * | 2019-03-27 | 2019-05-03 | 常州市伟宏动力技术有限公司 | A kind of automatic resistance trimming work station and resistance trimming principle of automobile sensor |
| CN112585751A (en) * | 2019-04-01 | 2021-03-30 | 新唐科技日本株式会社 | Resistance element and power amplification circuit |
Citations (5)
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| CN1192039A (en) * | 1997-02-27 | 1998-09-02 | 松下电子工业株式会社 | Method of manufacturing semiconductor device |
| CN1409329A (en) * | 2001-09-28 | 2003-04-09 | 石塚电子株式会社 | Thin film thermosensitive resistor and tis resistance valve regulating method |
| CN1822250A (en) * | 2006-03-06 | 2006-08-23 | 华新科技股份有限公司 | Method for producing wafer resistor |
| CN101826384A (en) * | 2009-03-02 | 2010-09-08 | 昆山厚声电子工业有限公司 | Method for manufacturing arrayed chip resistor |
| CN104091664A (en) * | 2014-06-12 | 2014-10-08 | 北京锋速精密设备有限公司 | Novel function curve following resistor trimming method |
-
2015
- 2015-06-11 CN CN201510318917.0A patent/CN106298117A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1192039A (en) * | 1997-02-27 | 1998-09-02 | 松下电子工业株式会社 | Method of manufacturing semiconductor device |
| CN1409329A (en) * | 2001-09-28 | 2003-04-09 | 石塚电子株式会社 | Thin film thermosensitive resistor and tis resistance valve regulating method |
| CN1822250A (en) * | 2006-03-06 | 2006-08-23 | 华新科技股份有限公司 | Method for producing wafer resistor |
| CN101826384A (en) * | 2009-03-02 | 2010-09-08 | 昆山厚声电子工业有限公司 | Method for manufacturing arrayed chip resistor |
| CN104091664A (en) * | 2014-06-12 | 2014-10-08 | 北京锋速精密设备有限公司 | Novel function curve following resistor trimming method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134331A (en) * | 2017-04-27 | 2017-09-05 | 广东风华高新科技股份有限公司 | Thermistor resistance trimming method |
| CN107134331B (en) * | 2017-04-27 | 2019-08-16 | 广东风华高新科技股份有限公司 | Thermistor resistance trimming method |
| CN109712768A (en) * | 2019-03-27 | 2019-05-03 | 常州市伟宏动力技术有限公司 | A kind of automatic resistance trimming work station and resistance trimming principle of automobile sensor |
| CN112585751A (en) * | 2019-04-01 | 2021-03-30 | 新唐科技日本株式会社 | Resistance element and power amplification circuit |
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Application publication date: 20170104 |