CN106281221B - Grinding-material, composition for polishing and Ginding process - Google Patents
Grinding-material, composition for polishing and Ginding process Download PDFInfo
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- CN106281221B CN106281221B CN201610663520.XA CN201610663520A CN106281221B CN 106281221 B CN106281221 B CN 106281221B CN 201610663520 A CN201610663520 A CN 201610663520A CN 106281221 B CN106281221 B CN 106281221B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/18—Other polishing compositions based on non-waxy substances on other substances
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- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention provides a kind of grinding-material, composition for polishing and the Ginding process of the minute surface that can be ground with sufficient grinding rate to the surface of alloy, metal oxide and result in high-quality.The grinding-material contain alpha-transformation degree be more than 80% and the accumulation particle diameter distribution of volume reference in 50% particle diameter be more than 0.15 μm and less than 0.35 μm aluminum oxide.Composition for polishing contains the grinding-material and pH is less than 7.The grinding-material and composition for polishing are used for the grinding of the grinding object thing containing at least one of alloy and metal oxide.
Description
Technical field
The present invention relates to grinding-material, composition for polishing and Ginding process.
Background technology
All the time, finished, smoothly using the minute surface on grinding progress alloy, its anodic oxide coating, the surface of ceramics
Change.But, for conventional Ginding process, the minute surface of higher quality can not be effectively obtained sometimes.
For example in the case of alloy, because the element and the element different from principal component hardness of principal component are mixed,
Therefore the surface of alloy sometimes after grinding produces the various defects such as projection, depression, cut.Therefore, grinding pair is not easily passed through
The minute surface that alloy carries out height is finished (referring to patent document 1,2).
In addition, in the case of anodic oxide coating, if using the existing grinding that colloidal silica is used as to abrasive particle
Finishing grinding is carried out with composition, then can not obtain sufficient grinding rate sometimes (referring to patent document 3).
In addition, in order to the surface to the metal oxide as hard brittle material is ground and carry out minute surface finishing, it is flat
Cunningization, uses the composition for polishing containing diamond abrasive grain in the past, but there are the following problems：Grinding containing diamond abrasive grain
It is expensive with composition, and easily produce cut, it is difficult to obtain the minute surface of high-quality.In addition, for colloidal silica is used
Make the existing composition for polishing of abrasive particle, though not producing cut, sufficient grinding rate can not be obtained sometimes (referring to patent
Document 4,5).
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 01-246068 publications
Patent document 2：Japanese Unexamined Patent Publication 11-010492 publications
Patent document 3：Japanese Unexamined Patent Publication 7-52030 publications
Patent document 4：Japanese Unexamined Patent Publication 7-179848 publications
Patent document 5：Japanese Unexamined Patent Publication 2008-44078 publications
The content of the invention
Problems to be solved by the invention
Therefore, in order to solve the problem of prior art as described above has, problem of the invention is that there is provided can be with
Sufficient grinding rate is ground and resulted in the grinding material of the minute surface of high-quality to the surface of alloy, metal oxide
Material, composition for polishing and Ginding process.
The solution used to solve the problem
In order to solve aforementioned problems, the main points of the grinding-material of an embodiment of the invention are, for containing alloy
With the grinding of the grinding object thing of at least one of metal oxide, the grinding-material contains alpha-transformation degree for more than 80% and body
50% particle diameter in the accumulation particle diameter distribution of product benchmark is more than 0.15 μm and less than 0.35 μm of aluminum oxide.
In addition, the purport of the composition for polishing of the other manner of the present invention is to contain grinding for said one embodiment
Material is ground, and pH is less than 7.
In addition, the main points of the Ginding process of the other manner of the present invention are, combined using the grinding of above-mentioned other manner
Thing is ground to the grinding object thing containing at least one of alloy and metal oxide.
The effect of invention
In accordance with the invention it is possible to be ground with sufficient grinding rate to the surface of alloy, metal oxide, it can obtain
Obtain the minute surface of high-quality.
Embodiment
An embodiment of the invention is described in detail.It should be noted that following embodiment is shown
The example of the present invention, the present invention is not limited to present embodiment.Furthermore it is possible to carry out various become to following embodiment
More or improvement, it is this to have carried out various changes or the modes of improvement be comprising in the present invention.
The grinding-material of present embodiment is used for the grinding object thing containing at least one of alloy and metal oxide
Grinding, the grinding-material contain alpha-transformation degree be more than 80% and the accumulation particle diameter distribution of volume reference in 50% particle diameter be
More than 0.15 μm and less than 0.35 μm of aluminum oxide.In addition, the composition for polishing of present embodiment contains present embodiment
Grinding-material and pH are less than 7.
The grinding-material and composition for polishing of such present embodiment can be used for containing alloy and metal oxide
At least one of grinding object thing grinding.If moreover, using the grinding-material of present embodiment, composition for polishing pair
Grinding object thing is ground, then the surface of alloy, metal oxide can be ground with sufficient grinding rate, can
Obtain the minute surface of high-quality.Specifically, if using the grinding-material of present embodiment, composition for polishing to grinding object thing
Be ground, then can be with sufficient grinding rate to the grinding object thing containing at least one of alloy and metal oxide
Surface be ground, and the flatness on grinding object thing surface is improved, so as to obtain the defects such as high glaze and cut
The minute surface of few high-quality.
Hereinafter, the grinding-material and composition for polishing of present embodiment are described in detail.It should be noted that
The measure of various operations, physical property for following explanation, is then in (more than 20 DEG C and 25 DEG C of room temperature as long as no being particularly limited to
Below), carried out under conditions of relative humidity more than 40% and less than 50%.
1. on grinding object thing
1-1 is on alloy
The grinding-material and composition for polishing of present embodiment can be used for carrying out the grinding object thing containing alloy
The purposes of grinding.Alloy contains metal species as the metal species of principal component and different from the metal species of principal component.It is right
The quantity of metal species is not particularly limited, and can be 2 kinds, or more than 3 kinds.In addition, not having to the method for manufacturing alloy
It is particularly limited to, for example, can uses casting, forging or roll.
The metal species of principal component in alloy in contained metal species be preferably selected from by aluminium, titanium, magnesium, iron, nickel,
Wantonly a kind in the group of copper composition.Preferred alloy is that the metal species of principal component are aluminium, titanium, magnesium or iron, further preferred
Alloy is that the metal species of principal component are aluminium or iron.Alloy is named based on the metal species of principal component.Therefore, as conjunction
Gold, such as can include aluminium alloy, titanium alloy, magnesium alloy, ferroalloy (such as stainless steel), nickel alloy, copper alloy.
Aluminium alloy is using aluminium as principal component, as the metal species different from the metal species of principal component, such as also containing choosing
From at least one kind of in silicon, iron, copper, manganese, magnesium, zinc and chromium.The content of the metal species in addition to aluminium in aluminium alloy is, for example,
More than 0.1 mass %, more specifically more than 0.1 mass % and below 10 mass %.As the example of aluminium alloy, it can enumerate
Go out JIS (JIS) H4000：2006、H4040：2006 and H4100：Alloy numbering 2000 described in 2006 is
Row, 3000 series, 4000 series, 5000 series, 6000 series, 7000 series, the alloy of 8000 series.
Titanium alloy is using titanium as principal component, as the metal species different from the metal species of principal component, such as also containing choosing
From at least one kind of in aluminium, iron and vanadium.The content of metal species than titanium in titanium alloy is, for example, more than 3.5 mass %
And 30 below mass %.As the example of titanium alloy, JIS (JIS) H4600 can be included：Kind described in 2012
11~23 kinds, 50 kinds, 60 kinds, 61 kinds and 80 kinds of alloy in class.
Magnesium alloy is using magnesium as principal component, as the metal species different from the metal species of principal component, such as also containing choosing
From at least one kind of in aluminium, zinc, manganese, zirconium and rare earth element.The content of the metal species beyond demagging in magnesium alloy is, for example,
More than 0.3 mass % and below 10 mass %.As the example of magnesium alloy, JIS (JIS) H4201 can be included：
2011、H4203：2011 and H4204：AZ10,31,61,63,80,81,91,92 described in 2011 etc..
Ferroalloy (such as stainless steel) is using iron as principal component, as the metal species different from the metal species of principal component,
For example also containing at least one kind of in chromium, nickel, molybdenum and manganese.The content of the metal species in addition to iron in ferroalloy is for example
For more than 10 mass % and below 50 mass %.As the example of stainless steel, JIS (JIS) G4303 can be included：
SUS201 in the symbol of species described in 2005,303,303Se, 304,304L, 304NI, 305,305JI, 309S,
310S、316、316L、321、347、384、XM7、303F、303C、430、430F、434、410、416、420J1、420J2、
420F, 420C, 631J1 etc..
Nickel alloy is using nickel as principal component, as the metal species different from the metal species of principal component, such as also containing choosing
From at least one kind of in iron, chromium, molybdenum and cobalt.The content of the metal species in addition to nickel in nickel alloy be, for example, 20 mass % with
Upper and below 75 mass %.As the example of nickel alloy, JIS (JIS) H4551 can be included：Described in 2000
NCF600 in alloy numbering, 601,625,750,800,800H, 825, NW0276,4400,6002,6022 etc..
Copper alloy is using copper as principal component, as the metal species different from the metal species of principal component, such as also containing choosing
From at least one kind of in iron, lead, zinc and tin.The content of the metal species beyond copper removal in copper alloy is, for example, more than 3 mass %
And 50 below mass %.As the example of copper alloy, JIS (JIS) H3100 can be included：Conjunction described in 2006
Gold numbering in C2100,2200,2300,2400,2600,2680,2720,2801,3560,3561,3710,3713,4250,
4430th, 4621,4640,6140,6161,6280,6301,7060,7150,1401,2051,6711,6712 etc..
1-2 is on metal oxide
The grinding-material and composition for polishing of present embodiment can be used for the grinding object containing metal oxide
The purposes that thing is ground.Metal oxide is metal or semimetallic oxide or their composite oxides, for example, can
Include more than a kind metal or semimetallic oxide of the 3rd, 4,13 race's elements selected from the periodic table of elements or answering for they
Close oxide.Specifically, except silica (silica), aluminum oxide (alumina), titanium oxide (titania), zirconium oxide
(zirconia), beyond gallium oxide, yittrium oxide (yttria), germanium oxide, their composite oxides can also be included.At these
In metal oxide, particularly silica, aluminum oxide (corundum etc.), zirconium oxide, yittrium oxide are suitable.
It should be noted that the metal oxide that grinding object thing contains can be various metals or semimetallic oxide
Mixture, can be a variety of composite oxides mixture, or metal or semimetallic oxide and combined oxidation
The mixture of thing.In addition, the metal oxide that grinding object thing contains can be metal or semimetallic oxide or composite oxygen
Compound and the composite of the material (such as metal, carbon, ceramics) of the species in addition to it.
In addition, the metal oxide that grinding object thing contains can be the forms such as monocrystalline, polycrystalline, sintered body (ceramics).
In the case that metal oxide is such form, the thing that grinding object thing can be formed using its entirety by metal oxide
Matter.Or, the metal oxide that grinding object thing contains can be by carrying out anodic scale film process to simple metal, alloy
Formed by anodic oxide coating form.That is, the metal oxide that grinding object thing contains can be such as simple metal, alloy
Anodic oxide coating oxide like that obtained from metallic surface formation, the metal autoxidation.
In the case that metal oxide is such form, grinding object thing can also be aoxidized using one part by metal
The material that thing formation and other parts are formed by other materials.In the case that metal oxide is anodic oxide coating, grinding pair
As the part including its surface of thing is formed by metal oxide, other parts are formed by simple metal or alloy.
As the example of anodic oxide coating, the skin being made up of aluminum oxide, titanium oxide, magnesia or zirconium oxide can be included
Film.
Furthermore it is possible to logical with the surface of the base material of the different types of material of metal oxide (such as metal, carbon, ceramics)
Epithelium crossing spraying plating (such as plasma spraying, flame coating), plating, chemical vapor deposition (CVD), physical vapor deposition (PVD) is handled
Epithelium is formed, thus grinding object thing is constituted.
As the example of the epithelium formed by spraying plating, the gold being made up of aluminum oxide, zirconium oxide or yittrium oxide can be included
Belong to oxide epithelium.
As the example of the epithelium formed by plating, it can include by zinc, nickel, chromium, tin, copper or their alloy structure
Into metal epithelium.
As the example of the epithelium formed by chemical vapor deposition, it can include and be made up of silica, aluminum oxide or silicon nitride
Ceramic epithelium.
As the example of the epithelium formed by physical vapor deposition, can include by copper, chromium, titanium, copper alloy, nickel alloy or
The metal epithelium that ferroalloy is constituted.
2. on grinding-material
The grinding-material of present embodiment contains aluminum oxide.Have in aluminum oxide Alpha-alumina, beta-alumina, gama-alumina,
The different aluminum oxide of the crystal habits such as θ-aluminum oxide, in addition, also there is the aluminium compound referred to as hydrated alumina.From grinding speed
From the viewpoint of degree, preferably by the particle using Alpha-alumina as principal component as grinding-material (abrasive particle), using containing the grinding
The composition for polishing of material is ground the grinding of object.
The alpha-transformation degree of aluminum oxide can be set to more than 70%, be preferably set to more than 80%, be more preferably set to more than 90%.Oxygen
Changing the alpha-transformation degree of aluminium can be obtained by the integrated intensity ratio of (113) face diffracted ray by X-ray diffraction measure.
In addition, the BET specific surface area of aluminum oxide can be set to 5m2/ more than g and 50m2/ below g, is preferably set to 15m2/ g with
Upper and 25m2/ below g.If the BET specific surface area of aluminum oxide is too small, ripple can not be removed by having, it is impossible to obtain smooth face
Worry, if excessive, there is the worry that can not obtain sufficient grinding rate.The BET specific surface area of aluminum oxide can be used
Micromeritics company systems " Flow Sorb II2300 " are measured.Oxidation is adsorbed in during as measurement the specific area
The gas of aluminium, can include nitrogen, argon gas, Krypton etc..
In addition, as in the accumulation particle diameter distribution of the volume reference of the average aggregate particle size of aluminum oxide 50% particle diameter (with
Under be also denoted as sometimes " D50 ") be more than 0.15 μm and less than 0.35 μm, it is preferably more than 0.16 μm and less than 0.31 μm, more excellent
Elect more than 0.25 μm and less than 0.29 μm, more preferably more than 0.26 μm and less than 0.27 μm as.
In addition, 10% particle diameter (being also denoted as sometimes below " D10 ") in the accumulation particle diameter distribution of the volume reference of aluminum oxide
Less than 50% particle diameter and for more than 0.10 μm and less than 0.25 μm, preferably smaller than 50% particle diameter and be more than 0.13 μm and
Less than 0.23 μm, more preferably less than 50% particle diameter and for more than 0.18 μm and less than 0.20 μm is further preferably no larger than 50%
Particle diameter and for more than 0.19 μm and less than 0.20 μm.
In addition, 90% particle diameter (below otherwise referred to as " D90 ") in the accumulation particle diameter distribution of the volume reference of aluminum oxide
More than 50% particle diameter and for more than 0.18 μm and less than 0.45 μm, preferably greater than 50% particle diameter and be more than 0.20 μm and
Less than 0.42 μm, more preferably greater than 50% particle diameter and for more than 0.35 μm and less than 0.39 μm, further preferably greater than 50%
Particle diameter and for more than 0.36 μm and less than 0.37 μm.
If the above-mentioned particle diameter of aluminum oxide is too small, there is the worry that can not obtain sufficient grinding rate, if excessive, have not
Ripple can be removed, the worry in smooth face can not be obtained.
In addition, ratios (D90/D50) of the D90 relative to D50 can be set to more than 1.1 and less than 2.5, preferably 1.1 with
Upper and less than 1.7, more preferably more than 1.2 and less than 1.5.
And then, ratios (D90/D10) of the D90 relative to D10 can be set to more than 1.2 and less than 6.5, preferably 1.3 with
Upper and less than 2.5, more preferably more than 1.7 and less than 2.1.
And then, ratios (D50/D10) of the D50 relative to D10 can be set to more than 1.1 and less than 2.0, preferably 1.1 with
Upper and less than 1.8, more preferably more than 1.2 and less than 1.6.
If these ratios are too small, the situation that the manufacturing cost for having aluminum oxide is uprised, if excessive, has in grinding object thing
Surface produce cut worry.
It should be noted that D10, D50, D90 refer in the accumulation particle diameter distribution of volume reference from small particle side
Cumulative frequency is respectively 10%, 50%, 90% particle diameter.Described D10, D50, D90 can use laser diffraction/scattering formula particle diameter
Distribution measurement device (" LA-950 " of such as Horiba Ltd) is measured.
In addition, the content of the grinding-material in the composition for polishing of present embodiment can be set to more than 0.5 mass %
And 40 below mass %, preferably more than 1 mass % and below 20 mass %.If the content of grinding-material is very few, having can not
The worry of sufficient grinding rate is obtained, if excessively, thering is composition for polishing to be changed into the worry of high cost.
3. on composition for polishing
The composition for polishing of present embodiment contains the grinding-material of above-mentioned present embodiment and its pH is less than 7.This
The composition for polishing of embodiment can also contain liquid medium, additive in addition to grinding-material according to expectation.
3-1 is on liquid medium
The composition for polishing of present embodiment can contain as make grinding-material scattered and by other compositions it is scattered or
The decentralized medium of dissolving or the liquid medium of solvent and in pulp-like.As liquid medium, preferably water, from suppressing to other compositions
Effect obstruction from the viewpoint of, the water of impurity is not preferably contained as far as possible.Specifically, preferably removed with ion exchange resin
After foreign ion, the pure water, ultra-pure water or distilled water of foreign matter are eliminated by filter.
3-2 is on pH and pH adjusting agent
The pH of the composition for polishing of present embodiment is less than 7.0, preferably less than 4.0.In addition, present embodiment
The pH of composition for polishing is preferably more than 2.0.PH within the above range in the case of, grinding rate is excellent.In addition, by
In the safe of the composition for polishing of pH within the above range, therefore, it is possible to safely handle.
The pH of the composition for polishing of present embodiment regulation can be by carrying out as the pH adjusting agent of additive.pH
The pH of composition for polishing is adjusted conditioning agent, thereby, it is possible to control the grinding rate of grinding object thing, grinding-material
Dispersiveness etc..PH adjusting agent can be used alone, and can also be mixed with two or more.
As pH adjusting agent, known acid, alkali or their salt can be used.It is used as the acid that may be used as pH adjusting agent
Concrete example, can include：The nothings such as hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, boric acid, carbonic acid, ortho phosphorous acid, phosphorous acid and phosphoric acid
Machine acid；Formic acid, acetic acid, propionic acid, butyric acid, valeric acid, 2-Methyl Butyric Acid, n-caproic acid, 3,3- acid dimethyls, 2 Ethylbutanoic acid, 4-
Methylvaleric acid, positive enanthic acid, 2 methyl caproic acid, caprylic acid, 2 ethyl hexanoic acid, benzoic acid, glycolic, salicylic acid, glyceric acid, grass
Acid, malonic acid, butanedioic acid, glutaric acid, adipic acid, pimelic acid, maleic acid, phthalic acid, malic acid, tartaric acid, citric acid,
Lactic acid, diethyl alkyd, pyromucic acid, 2,5- furan dicarboxylic acids, 3- furancarboxylic acids, 2- tetrahydrofurans carboxylic acid, methoxyacetic acid,
The organic acid such as methoxyphenyl acetic acid and phenoxyacetic acid.
In the case of using inorganic acid as pH adjusting agent, from the viewpoint of grinding rate raising, preferably sulfuric acid, nitre
Acid, hydrochloric acid, phosphoric acid etc., using organic acid as pH adjusting agent in the case of, preferred alcohol acid, butanedioic acid, maleic acid, lemon
Acid, tartaric acid, malic acid, gluconic acid and itaconic acid etc..
As the salt that can act as pH adjusting agent, it can include：The amine such as aliphatic amine, aromatic amine；Quaternary ammonium hydroxide etc.
Organic base；The hydroxide of the alkali metal such as potassium hydroxide；The hydroxide of alkaline-earth metal；And ammonia etc..In these alkali, from obtaining
Obtain easiness to set out, preferably potassium hydroxide, ammonia.
Alternatively, it is also possible to replace foregoing acid using salt such as foregoing sour ammonium salt, alkali metal salts or be applied in combination with foregoing acid
It is used as pH adjusting agent.Particularly salt, the salt or weak acid of strong acid and weak base and weak base using weak acid and highly basic salt situation
Under, can expect pH cushioning effect, and then in the case of using the salt of strong acid and highly basic, can with adjust on a small quantity pH and
Electrical conductivity.
The addition of pH adjusting agent is not particularly limited, if suitable adjustment make composition for polishing for desired pH i.e.
Can.
3-3 is on other additives
For the composition for polishing of present embodiment, in order to improve its performance, pH regulations can also be contained as needed
Additive beyond agent.For example, composition for polishing can have further raising containing complexing agent, etchant, oxidant etc.
The additive of the effect of grinding rate.In addition, composition for polishing can also contain the surface to grinding object thing, grinding-material
The water-soluble polymer (can be copolymer, its salt, derivative) that works of surface.And then, composition for polishing can also
Containing make grinding-material dispersiveness improve dispersant, make grinding-material aggregation the easy dispersing aid of redisperse it
The additive of class.And then, composition for polishing can also the known additive containing preservative, mould inhibitor, antirust agent etc.
The various additives are in most patent document etc. as can generally add in composition for polishing
Material is known, and species and addition to additive are not particularly limited.It is wherein, overall relative to composition for polishing,
Addition when adding these additives is preferably respectively smaller than 1 mass %, is more preferably respectively smaller than 0.5 mass %.These additions
Agent can be used singly or in combination of two or more.
As the example of complexing agent, inorganic acid, organic acid, amino acid, nitrile compound and chelating agent etc. can be included.As
The concrete example of inorganic acid, can include sulfuric acid, nitric acid, boric acid, carbonic acid etc., as the concrete example of organic acid, can include：First
Acid, acetic acid, propionic acid, butyric acid, valeric acid, 2-Methyl Butyric Acid, n-caproic acid, 3,3- acid dimethyls, 2 Ethylbutanoic acid, 4- methylpents
Sour, positive enanthic acid, 2 methyl caproic acid, caprylic acid, 2 ethyl hexanoic acid, benzoic acid, glycolic, salicylic acid, glyceric acid, oxalic acid, the third two
Acid, butanedioic acid, glutaric acid, adipic acid, pimelic acid, maleic acid, phthalic acid, malic acid, tartaric acid, citric acid, lactic acid etc..
Organic sulfuric acid such as methanesulfonic acid, ethyl sulfonic acid and isethionic acid can also be used.The alkali gold of inorganic acid or organic acid can also be used
The salt such as category salt replace inorganic acid or organic acid or are applied in combination with inorganic acid or organic acid.It is preferably sweet among these complexing agents
Propylhomoserin, alanine, malic acid, tartaric acid, citric acid, glycolic, isethionic acid or their salt.
As the example of chelating agent, the carboxylic serials chelating agent such as gluconic acid can be included；Ethylenediamine, diethylenetriamines, three
The amine system chelating agent such as tetramine；Ethylenediamine tetra-acetic acid, NTA, Oxyethylethylenediaminetriacetic acid, triethylene
The polyamino polycarboxylic acid such as four hexaacetic acids, diethylene-triamine pentaacetic acid system chelating agent.Alternatively, it is also possible to enumerate 2- amino-ethyls
Phosphonic acids, 1- hydroxy ethylidene base -1,1- di 2 ethylhexyl phosphonic acids, amino three (methylene phosphonic acid), EDTMP, diethylidene
Triamine five (methylene phosphonic acid), ethane -1,1- di 2 ethylhexyl phosphonic acids, ethane -1,1,2- tri methylene phosphonic acids, methane hydroxyethylidene diphosphonic acid, 1- phosphinylidyne butanes -
The organic phospho acid such as 2,3,4- tricarboxylic acids system chelating agent, phenol derivatives, 1,3- diketone etc. as chelating agent example.
As the example of etchant, it can include：The inorganic acids such as nitric acid, sulfuric acid, hydrochloric acid, phosphoric acid, hydrofluoric acid；Acetic acid, lemon
The organic acids such as lemon acid, tartaric acid, methanesulfonic acid；The inorganic bases such as potassium hydroxide, sodium hydroxide, ammonia；Amine, quaternary ammonium hydroxide etc. are organic
Alkali etc..
As the example of oxidant, it can include：Hydrogen peroxide, peracetic acid, percarbonate, urea peroxide, perchlorate,
Persulfate, nitric acid, potassium permanganate etc..
As the example of water-soluble polymer (can be copolymer, its salt, derivative), polyacrylate can be also included
Deng polycarboxylic acids；Polyphosphonic acid；The polysulfonates such as polystyrolsulfon acid acid；The polysaccharides such as xanthans, mosanom；Hydroxyethyl cellulose, carboxylic first
The cellulose derivatives such as base cellulose.Alternatively, it is also possible to enumerate polyethylene glycol, polyvinyl alcohol, polyvinylpyrrolidone, sorbose
Alcohol acid anhydride monoleate, oxyalkylene based polymer with one or more oxyalkylene units etc. as water-soluble polymer example
Son.
As the example of dispersing aid, condensed phosphates such as pyrophosphate, hexametaphosphate etc. can be included.It is used as anti-corrosion
The example of agent, can include sodium hypochlorite etc.., can Lie Ju Chu oxazolidines -2,5- diketone Deng oxazolines as the example of mould inhibitor
Deng.
As the example of anticorrosive, surfactant, alcohols, macromolecule, resin, amine, pyridines, four can be included
Benzene base phosphonium salt, benzotriazole, triazole type, four azoles, benzoic acid etc..
As surfactant, nonionic surfactant, anionic surfactant, cationic can be included
Surfactant, amphoteric surfactant.As nonionic surfactant, ether type, Etheric ester type can be included, ester type, contained
Nitrogen type, as anionic surfactant, can include carboxylate, sulfonate, sulfuric acid, phosphate ester salt.In addition, conduct
Cationic surfactant, can include aliphatic amine salt, aliphatic quaternary ammonium salt, benzalkonium chloride, benzethonium chloride, pyridine
Salt, imidazole salts, as amphoteric surfactant, can include carboxy betaine type, aminocarboxylate, imidazolinium betaine,
Lecithin, alkyl amine oxide.
As the example of preservative, sodium hypochlorite etc. can be included.In addition, as the example of mould inhibitor, can Lie Ju Chu Evil
Oxazolidine -2,5- diketone Deng oxazolines etc..
4. the manufacture method on composition for polishing
Manufacture method to the composition for polishing of present embodiment is not particularly limited, can be by by aluminum oxide and root
The various additives added according to expectation stir in the liquid solvents such as water, mix to be manufactured.For example, can be by by oxygen
Change the various additives such as aluminium and pH adjusting agent to stir in water, mix to manufacture.It is not special to temperature when mixing each composition
Limit, preferably more than 10 DEG C and less than 40 DEG C, can be heated to improve dissolution velocity.In addition, to incorporation time
It is not particularly limited.
The composition for polishing of present embodiment can be multicomponent more than one-pack type or two-component-type
Type.In addition, when being ground the grinding of object using the lapping device of the feed path with multiple composition for polishing, can
To be ground as follows.I.e., it is possible to the feedstock composition of previously prepared a variety of raw materials as composition for polishing, will be described
Plurality of raw materials composition is supplied to lapping device by feed path, is mixed the plurality of raw materials composition in lapping device
Close to form composition for polishing, so as to be ground.
The composition for polishing of present embodiment can be prepared by the way that the stoste of composition for polishing is diluted with water.Grinding
In the case that mill is bi-component with composition, the mixing and dilution of two kinds of feedstock compositions of the raw material of composition for polishing are used as
Order be arbitrary.For example, after a kind of feedstock composition can be diluted with water, mixed with another feedstock composition,
The mixing and the dilution using water of two kinds of feedstock compositions can be carried out simultaneously, or can also be mixed by two kinds of feedstock compositions
It is diluted after conjunction with water.
5. on lapping device and Ginding process
The composition for polishing of present embodiment for example can the Crystallization by metal oxide grinding object thing
Grinding in use under usually used lapping device and grinding condition.As lapping device, common one side can be used to grind
Mill apparatus, double-side polishing apparatus.In the case where being ground using single-sided grinding device, with referred to as microscope carrier (carrier)
Holding instrument keep grinding object thing, side supply composition for polishing, while the flat board for being pasted with grinding pad is pressed against into grinding
The one side of object, and flat board is rotated, thus the one side of grinding object thing is ground.Enter using double-side polishing apparatus
In the case of row grinding, grinding object thing, side supply composition for polishing are kept using microscope carrier, while the flat of grinding pad will be pasted with
Plate is pressed against the two-sided of grinding object thing, and grinding pad and grinding object thing is rotated round about, thus to grinding object
The two-sided of thing is ground.When using any lapping device, by by grinding pad and composition for polishing and grinding object
The physical action and composition for polishing that friction between thing is produced come to grinding pair to the chemical action that grinding object thing is brought
As thing is ground.
It is not particularly limited for the grinding load (pressure loaded in grinding to grinding object thing) in grinding condition,
Generally grinding load is bigger, and the frictional force between grinding-material and grinding object thing is higher.As a result machining characteristics are improved, and are ground
Speed is ground to rise.It is preferably 2kPa (20gf/cm to grind load2) more than and 98kPa (1000gf/cm2) below, more preferably
3kPa(30gf/cm2) more than and 78kPa (800gf/cm2) below, more preferably 3kPa (30gf/cm2) more than and 59kPa
(600gf/cm2) below.When grinding load within the above range, very high grinding rate is not only played, and can reduce
The breakage of grinding object thing, the generation of surface defect.
In addition, the linear velocity (relative velocity of grinding pad and grinding object thing during grinding) in grinding condition is generally ground
Grind the influence of rotating speed, the rotating speed of microscope carrier, the size of grinding object thing, the quantity of grinding object thing of pad etc..When linear velocity is big, by
The frequency for touching grinding object thing in grinding-material is uprised, therefore rubbing of being worked between grinding object thing and grinding-material
Wipe power and become big, the mechanical abrasive action to grinding object thing becomes big.In addition, the heat produced by friction is improved by grinding sometimes
The chemical grinding effect brought with composition.
Linear velocity is not particularly limited, more than preferably 10m/ minutes and 300m/ minutes following, more preferably 30m/ points
More than clock and 250m/ minutes following.Linear velocity within the above range when, very high grinding rate can not only be reached, and
The frictional force of appropriateness can be assigned to grinding object thing.On the other hand, due to directly being produced between grinding pad and grinding object thing
Raw friction does not contribute to grinding, therefore preferably minimum.
In addition, the feed speed of the composition for polishing in grinding condition depends on the species of grinding object thing, grinding dress
The species put, other grinding conditions, are supplied uniformly across to grinding object thing and grinding pad preferably for by composition for polishing
Generally sufficient feed speed.
Species to grinding pad is not particularly limited, and can use the various grindings that the physical property such as material, thickness, hardness are different
Pad.The grinding pad of various materials such as can use polyurethane-type, non-woven fabric type, suede type.Alternatively, it is also possible to using containing
There is any number of grinding pad of the grinding pad of abrasive particle, grinding pad without abrasive particle.
In addition, the composition for polishing of present embodiment can be reclaimed in the grinding of grinding object thing after use,
And reused in the grinding of grinding object thing.As one of the method for reusing composition for polishing, it can include
During the complete composition for polishing of the use discharged from lapping device is recycled into container, make it out of container again to lapping device
Interior circulation and the method used in grinding.If recycling composition for polishing, it can reduce what is discharged as waste liquid
The amount of composition for polishing, therefore, it is possible to reduce environmental pressure.Further, since the composition for polishing used can be reduced
Amount, the manufacturing cost needed for grinding therefore, it is possible to suppress grinding object thing.
When reusing the composition for polishing of present embodiment, it can will consume, lose because being used in grinding
Grinding-material, additive etc. part or all added as composition conditioning agent after reuse.Can be by with any
Mixture obtained from blending ratio mixed grinding material, additive etc. be used as composition conditioning agent, can also by grinding-material, add
Plus agent etc. is directly used alone as constituting conditioning agent.Conditioning agent is constituted by additional addition, composition for polishing can be adjusted to
It is adapted to the composition reused, appropriate grinding can be carried out.Constitute the grinding-material contained in conditioning agent, the concentration of additive
It is arbitrary, is not particularly limited, is suitably adjusted according to the size of container, grinding condition.
(embodiment)
Embodiment described below and comparative example, more specifically the present invention will be described.
First, it is alumina particle, pH adjusting agent (citric acid), water-soluble polymer (Sodium Polyacrylate) and pure water is mixed
Close, manufacture 13 kinds of composition for polishing.As described in Table 1, surplus is pure water to the content of each composition in composition for polishing.Make
For alumina particle, different any of 7 kinds of character (alpha-transformation degree, D10, D50, D90, specific surface area) are used.Aluminium oxide granule
Grain alpha-transformation degree, D10, D50, D90, specific surface area as described in Table 1.In addition, the pH of each composition for polishing is as described in Table 1.
[table 1]
It should be noted that the alpha-transformation degree of alumina particle using Rigaku Corporation X-ray diffraction by being filled
The integrated intensity ratio for (113) face diffracted ray that Ultima IV are determined is put to calculate.In addition, D10, D50, D90 of alumina particle
Determined using laser diffraction/scattering formula particle size distribution analyzer LA-950 of Horiba Ltd.In addition, oxygen
The BET specific surface area for changing alumina particles uses the specific area measuring device Flow Sorb II of Micromeritics company systems
2300 determine.
Then, it is ground the grinding of object using 13 kinds of composition for polishing, determines grinding rate, surface to be polished
Surface roughness Rz and surface to be polished mist degree.Grinding object thing using 7000 series alloys substrate (one side 32mm's
Square shape), substrate (one side 60mm square shape), the SUS304 substrate of aluminum with anodic oxide coating
Any of (diameter 25mm's is round-shaped), SUS316L substrate (one side 45mm square shape).Grinding group
The combination of the species of compound and substrate is as shown in table 1.
Grinding condition is as follows.
<The grinding condition of the substrate of 7000 series alloys>
Lapping device：Single-sided grinding device (the diameter of flat board：380mm)
Grinding pad：Polyurethane grinding pad
Grind load：17.1kPa(175gf/cm2)
The rotating speed of flat board：90min-1
Grinding rate (linear velocity)：71.5m/ minutes
Milling time：15 minutes
The feed speed of composition for polishing：26mL/ minutes
<The grinding condition of the substrate of aluminum with anodic oxide coating>
Lapping device：Single-sided grinding device (the diameter of flat board：65mm)
Grinding pad：Polyurethane grinding pad
Grind load：3.7kPa(38gf/cm2)
The rotating speed of flat board：1000min-1
Grinding rate (linear velocity)：108m/ minutes
Milling time：5 minutes
The feed speed of composition for polishing：15mL/ minutes
<The grinding condition of SUS304 substrate>
Lapping device：Single-sided grinding device (the diameter of flat board：380mm)
Grinding pad：The fabric grinding pad of nonwoven
Grind load：16.7kPa(170gf/cm2)
The rotating speed of flat board：90min-1
Grinding rate (linear velocity)：71.5m/ minutes
Milling time：5 minutes
The feed speed of composition for polishing：17mL/ minutes
<The grinding condition of SUS316L substrate>
Lapping device：Single-sided grinding device (the diameter of flat board：380mm)
Grinding pad：The fabric grinding pad of nonwoven
Grind load：27.9kPa(285gf/cm2)
The rotating speed of flat board：72min-1
Grinding rate (linear velocity)：57.3m/ minutes
Milling time：10 minutes
The feed speed of composition for polishing：35mL/ minutes
The assay method of the mist degree of grinding rate, the surface roughness Rz of surface to be polished and surface to be polished is as follows.For grinding
Speed is ground, the quality of the substrate before and after grinding is determined and is calculated by its difference.
For the surface roughness Rz of the surface to be polished of grinding object thing, for 7000 series alloys substrate and
SUS304 substrate, is surveyed with Zygo Corporation surface shape measuring instrument ZYGO New View 5032
It is fixed, for the substrate of the aluminum with anodic oxide coating, with the contact pin type surface roughness shape of Tokyo Seimitsu Co., Ltd
Shape analyzer SURFCOM 1500DX are measured, for SUS316L substrate, the surface manufactured with Co., Ltd.'s Keyemce
Profile measuring machine VK-X200 is measured.
For the mist degree of the surface to be polished of grinding object thing, with the substrate after visually confirmation grinding under fluorescent lighting,
10% situation that the part for generating gonorrhoea defect is less than substrate surface area is evaluated as " without mist degree ", will be generated white
The part of turbid defect is evaluated as " having mist degree " for more than 10% situation of substrate surface area.
Show the result in table 1.It should be noted that the substrate of the substrate and SUS304 for 7000 series alloys
With SUS316L substrate, 3 substrates are ground respectively, grinding rate and the result that surface roughness Rz is 3 substrates
Average value and be shown in table 1.For the substrate of the aluminum with anodic oxide coating, 1 substrate is ground, by the substrate
Grinding rate and surface roughness Rz be shown in table 1.
Result as shown in Table 1 understands that embodiment 1~4 has ground the surface of substrate, and table with sufficient grinding rate
Surface roughness Rz and mist degree are also good.In addition, though embodiment 5 is the example that pH is more than 7.0, but with sufficient grinding rate pair
Ground on the surface of substrate.On the other hand, although the grinding rate of comparative example 1~8 is abundant, surface roughness Rz and mist degree
One or both of it is bad.
Claims (6)
1. a kind of grinding-material, it is used for the grinding of the grinding object thing containing at least one of alloy and metal oxide,
The grinding-material contain alpha-transformation degree be more than 80% and the accumulation particle diameter distribution of volume reference in 50% particle diameter be 0.15 μm with
Upper and less than 0.27 μm of aluminum oxide,
90% particle diameter in the accumulation particle diameter distribution of the volume reference of the aluminum oxide relative to 10% particle diameter ratio for 1.7 with
It is upper and less than 2.1,
The BET specific surface area of the aluminum oxide is 15m2/ more than g and 25m2/ below g.
2. grinding-material according to claim 1, wherein, the grinding object thing is formed by aluminium alloy or ferroalloy, or
Its surface of person is formed by aluminum oxide and other parts are formed by aluminium.
3. grinding-material according to claim 1 or 2, wherein, the accumulation particle diameter distribution of the volume reference of the aluminum oxide
In 10% particle diameter be less than 50% particle diameter and for more than 0.10 μm and less than 0.25 μm.
4. grinding-material according to claim 1 or 2, wherein, the accumulation particle diameter distribution of the volume reference of the aluminum oxide
In 90% particle diameter be more than 50% particle diameter and for more than 0.20 μm and less than 0.45 μm.
5. a kind of composition for polishing, it contains grinding-material according to any one of claims 1 to 4, and pH is less than 7.
6. a kind of Ginding process, the composition for polishing described in its usage right requirement 5 is to containing in alloy and metal oxide
The grinding object thing of at least one be ground.
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| CN107552164A (en) * | 2017-09-04 | 2018-01-09 | 无锡普爱德环保科技有限公司 | A kind of molecular sieve nano-milling process |
| CN107529518B (en) * | 2017-10-13 | 2019-05-31 | 浙江爱科新材料有限公司 | A kind of preparation method of superfine alumina powder |
| JP7084176B2 (en) * | 2018-03-28 | 2022-06-14 | 株式会社フジミインコーポレーテッド | Polishing composition |
| CN109233644B (en) * | 2018-09-19 | 2021-03-12 | 广州亦盛环保科技有限公司 | Fine polishing solution and preparation method thereof |
| CN110373195A (en) * | 2019-06-26 | 2019-10-25 | 中国电子科技集团公司第十一研究所 | Corrosive liquid and the method for removing gallium antimonide substrate from two class superlattices epitaxial thin-film layers |
| JP7398304B2 (en) * | 2020-03-19 | 2023-12-14 | 株式会社フジミインコーポレーテッド | Polishing composition, polishing method, and semiconductor substrate manufacturing method |
| CN111234706A (en) * | 2020-03-26 | 2020-06-05 | 新乡学院 | Water-based grinding composition and preparation method thereof |
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