CN106280528A - 带有磨料的3d打印耗材 - Google Patents
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- 238000010146 3D printing Methods 0.000 title claims abstract description 26
- 239000003082 abrasive agent Substances 0.000 title claims description 55
- 239000002245 particle Substances 0.000 claims abstract description 32
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000000919 ceramic Substances 0.000 claims abstract description 14
- 229920001661 Chitosan Polymers 0.000 claims abstract description 11
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 11
- 239000012188 paraffin wax Substances 0.000 claims abstract description 11
- 239000007767 bonding agent Substances 0.000 claims description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 14
- 229910001651 emery Inorganic materials 0.000 claims description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- 239000000395 magnesium oxide Substances 0.000 claims description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 5
- 241000863929 Naxa Species 0.000 claims description 3
- 238000003763 carbonization Methods 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 239000010431 corundum Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- RBZGEUJLKTVORU-UHFFFAOYSA-N 12014-84-5 Chemical compound [Ce]#[Si] RBZGEUJLKTVORU-UHFFFAOYSA-N 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910021418 black silicon Inorganic materials 0.000 claims description 2
- 239000004568 cement Substances 0.000 claims description 2
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 239000011230 binding agent Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000013178 mathematical model Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
本发明公开了一种带有磨料的3D打印耗材,按重量比,包括如下组分:磨料,5至10份;结合剂,7至10份;碳酸钙,1至2份;荧光粉,1至2份;草木灰,0.05至0.1份;壳聚糖颗粒,1份至2份;石蜡颗粒,1份至2份;空心陶瓷颗粒,1份至10份。本发明的耗材,制造成本低,且具有一定的荧光效果。
Description
技术领域
本发明涉及3D打印耗材,尤其涉及一种带有磨料的3D打印耗材。
背景技术
3D打印(3DP)即快速成型技术的一种,它是一种以数字模型文件为基础,运用粉末状金属或塑料等可粘合材料,通过逐层打印的方式来构造物体的技术。3D打印通常是采用数字技术材料打印机来实现的。常在模具制造、工业设计等领域被用于制造模型,后逐渐用于一些产品的直接制造,已经有使用这种技术打印而成的零部件。该技术在珠宝、鞋类、工业设计、建筑、工程和施工(AEC)、汽车,航空航天、牙科和医疗产业、教育、地理信息系统、土木工程、枪支以及其他领域都有所应用。
然而,现有的3D打印材料不具有磨料组分,在3D打印砂轮等产品时,缺乏相应的耗材,该问题亟待解决。
发明内容
本发明的目的在于克服上述现有技术之不足而提供一种带有磨料的3D打印耗材。
为实现上述目的,本发明提供一种带有磨料的3D打印耗材,按重量比,包括如下组分:
磨料,5至10份;
结合剂,7至10份;
碳酸钙,1至2份;
荧光粉,1至2份;
草木灰,0.05至0.1份;
壳聚糖颗粒,1份至2份;
石蜡颗粒,1份至2份;
空心陶瓷颗粒,1份至10份。
优选的,所述磨料为天然刚玉。
优选的,所述磨料为石英。
优选的,所述磨料为碳化矽。
优选的,所述磨料为氧化铝或者氧化铬或者氧化镁或者氧化铁。
优选的,所述磨料为人造的刚玉磨料或者碳化硅磨料。
优选的,所述磨料为棕刚玉磨料、白刚玉磨料、单晶刚玉磨料、黑碳化硅磨料、绿碳化硅磨料、立方碳化硅磨料、铈碳化硅磨料中的一种或多种组合。
优选的,所述结合剂为陶瓷结合剂或者金属结合剂或者菱苦土结合剂或者树脂结合剂或者橡胶结合剂。
优选的,所述结合剂为电镀结合剂。
优选的,按重量比,包括如下组分:
磨料,6.5份;
结合剂,7.8份;
碳酸钙,1.5份;
荧光粉,1.5份;
草木灰,0.08份;
壳聚糖颗粒,1.8份;
石蜡颗粒,1.5份;
空心陶瓷颗粒,3份。
本发明的有益效果是:本发明通过提供带有磨料的3D打印耗材,可以用这种耗材打印砂轮等产品,用以对工件进行抛光、打磨等,改变现有的砂轮制造工艺,而采用3D打印机进行打印砂轮,制备得到的砂轮,其性能更佳。通过设置空心陶瓷颗粒,其密度更低。本发明的耗材,制造成本低,且具有一定的荧光效果。
具体实施方式
实施例一:
本发明提供一种带有磨料的3D打印耗材,按重量比,包括如下组分:磨料,5至10份;结合剂,7至10份;碳酸钙,1至2份;荧光粉,1至2份;草木灰,0.05至0.1份;壳聚糖颗粒,1份至2份;石蜡颗粒,1份至2份;空心陶瓷颗粒,1份至10份。
上述实施例主要提供一种组方,其中磨料可以采用现有的磨料。
实施例二:一种带有磨料的3D打印耗材的制备方法
包括如下步骤:
S201,将实施例一中的材料按重量配比称取,再加入10份水;
S202,用搅拌器混匀,10分钟;
S203,制成颗粒状;
S204,烘干。
实施例三
本发明提供一种带有磨料的3D打印耗材,按重量比,包括如下组分:磨料,6.5份;结合剂,7.8份;碳酸钙,1.5份;荧光粉,1.5份;草木灰,0.08份;壳聚糖颗粒,1.8份;石蜡颗粒,1.5份;空心陶瓷颗粒,3份。
实施例四
本发明提供一种带有磨料的3D打印耗材,按重量比,包括如下组分:天然刚玉,6.5份;陶瓷结合剂,7.8份;碳酸钙,1.5份;荧光粉,1.5份;草木灰,0.08份;壳聚糖颗粒,1.8份;石蜡颗粒,1.5份;空心陶瓷颗粒,3份。
实施例五
本发明提供一种带有磨料的3D打印耗材,按重量比,包括如下组分:石英,7份;陶瓷结合剂,8份;碳酸钙,1.5份;荧光粉,1.5份;草木灰,0.08份;壳聚糖颗粒,1.8份;石蜡颗粒,1.5份;空心陶瓷颗粒,3份。
实施例六
本发明提供一种带有磨料的3D打印耗材,按重量比,包括如下组分:氧化铝,8份;电镀结合剂,7份;碳酸钙,1.5份;荧光粉,1.5份;草木灰,0.08份;壳聚糖颗粒,1.8份;石蜡颗粒,1.5份;空心陶瓷颗粒,3份。
实施例七
本发明提供一种带有磨料的3D打印耗材,按重量比,包括如下组分:碳化矽颗粒,7份;菱苦土结合剂,8份;碳酸钙,1.5份;荧光粉,1.5份;草木灰,0.08份;壳聚糖颗粒,1.8份;石蜡颗粒,1.5份;空心陶瓷颗粒,3份。
综上所述,本发明通过提供带有磨料的3D打印耗材,可以用这种耗材打印砂轮等产品,用以对工件进行抛光、打磨等,改变现有的砂轮制造工艺,而采用3D打印机进行打印砂轮,制备得到的砂轮,其性能更佳。通过设置空心陶瓷颗粒,其密度更低。
尽管上面已经示出和描述了本发明的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本发明的限制,本领域的普通技术人员在不脱离本发明的原理和宗旨的情况下在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。
Claims (10)
1.一种带有磨料的3D打印耗材,其特征在于,按重量比,包括如下组分:
磨料,5至10份;
结合剂,7至10份;
碳酸钙,1至2份;
荧光粉,1至2份;
草木灰,0.05至0.1份;
壳聚糖颗粒,1份至2份;
石蜡颗粒,1份至2份;
空心陶瓷颗粒,1份至10份。
2.根据权利要求1所述的带有磨料的3D打印耗材,其特征在于,所述磨料为天然刚玉。
3.根据权利要求1所述的带有磨料的3D打印耗材,其特征在于,所述磨料为石英。
4.根据权利要求1所述的带有磨料的3D打印耗材,其特征在于,所述磨料为碳化矽。
5.根据权利要求1所述的带有磨料的3D打印耗材,其特征在于,所述磨料为氧化铝或者氧化铬或者氧化镁或者氧化铁。
6.根据权利要求1所述的带有磨料的3D打印耗材,其特征在于,所述磨料为人造的刚玉磨料或者碳化硅磨料。
7.根据权利要求6所述的带有磨料的3D打印耗材,其特征在于,所述磨料为棕刚玉磨料、白刚玉磨料、单晶刚玉磨料、黑碳化硅磨料、绿碳化硅磨料、立方碳化硅磨料、铈碳化硅磨料中的一种或多种组合。
8.根据权利要求1所述的带有磨料的3D打印耗材,其特征在于,所述结合剂为陶瓷结合剂或者金属结合剂或者菱苦土结合剂或者树脂结合剂或者橡胶结合剂。
9.根据权利要求8所述的带有磨料的3D打印耗材,其特征在于,所述结合剂为电镀结合剂。
10.根据权利要求1所述的带有磨料的3D打印耗材,按重量比,包括如下组分:
磨料,6.5份;
结合剂,7.8份;
碳酸钙,1.5份;
荧光粉,1.5份;
草木灰,0.08份;
壳聚糖颗粒,1.8份;
石蜡颗粒,1.5份;
空心陶瓷颗粒,3份。
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Cited By (1)
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CN111195833A (zh) * | 2020-01-21 | 2020-05-26 | 韩瑞来 | 一种针对金钱石石雕打磨的抛光方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1232419A (zh) * | 1996-10-09 | 1999-10-20 | 诺顿公司 | 碳化硅砂轮 |
CN105440664A (zh) * | 2015-10-30 | 2016-03-30 | 福建易达纳米材料科技有限公司 | 一种带有磨料的3d打印耗材及其制作方法 |
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CN1232419A (zh) * | 1996-10-09 | 1999-10-20 | 诺顿公司 | 碳化硅砂轮 |
CN105440664A (zh) * | 2015-10-30 | 2016-03-30 | 福建易达纳米材料科技有限公司 | 一种带有磨料的3d打印耗材及其制作方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111195833A (zh) * | 2020-01-21 | 2020-05-26 | 韩瑞来 | 一种针对金钱石石雕打磨的抛光方法 |
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