CN106274631B - Semiconductor refrigerating heat pipe-type cold chain transport vehicle and refrigerating method - Google Patents
Semiconductor refrigerating heat pipe-type cold chain transport vehicle and refrigerating method Download PDFInfo
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- CN106274631B CN106274631B CN201610975395.6A CN201610975395A CN106274631B CN 106274631 B CN106274631 B CN 106274631B CN 201610975395 A CN201610975395 A CN 201610975395A CN 106274631 B CN106274631 B CN 106274631B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60P—VEHICLES ADAPTED FOR LOAD TRANSPORTATION OR TO TRANSPORT, TO CARRY, OR TO COMPRISE SPECIAL LOADS OR OBJECTS
- B60P3/00—Vehicles adapted to transport, to carry or to comprise special loads or objects
- B60P3/20—Refrigerated goods vehicles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating [HVAC] devices
- B60H1/32—Cooling devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60P—VEHICLES ADAPTED FOR LOAD TRANSPORTATION OR TO TRANSPORT, TO CARRY, OR TO COMPRISE SPECIAL LOADS OR OBJECTS
- B60P7/00—Securing or covering of load on vehicles
- B60P7/06—Securing of load
- B60P7/16—Protecting against shocks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Transportation (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a kind of semiconductor refrigerating heat pipe-type cold chain transport vehicle and refrigerating methods.Transport vehicle includes car body, semiconductor cooler and water-cooled module, water-cooled module includes main water box, the first water pump, Multi-layer exchanging heat water cushion and air pump, multiple support air bags are distributed in heat exchange water cushion, the water cushion that exchanges heat has water inlet and water return outlet, water inlet is connected with the first water pump, water return outlet is connected with main water box, first water pump is connected with main water box, the lower part of heat exchange water cushion is provided with multiple air springs, air spring and support air bag are connected respectively by corresponding solenoid valve with air pump, and Multi-layer exchanging heat water cushion is stacked；The first heat pipe of cold end of semiconductor cooler, the first heat pipe are inserted in main water box, and car body is provided with cabin and container, and semiconductor cooler, main water box, the first water pump and air pump are located in cabin, and heat exchange water cushion is located in container.Realize the refrigeration effect and storage security for improving semiconductor refrigerating heat pipe-type cold chain transport vehicle.
Description
Technical field
The present invention relates to cold chain refrigeration equipment more particularly to a kind of semiconductor refrigerating heat pipe-type cold chain transport vehicle and refrigeration sides
Method.
Background technology
At present, cargo transport and storage usually have certain requirement to temperature, some cargos need relatively low freezing
Temperature（Such as：Frozen product）, and some cargos need refrigerated storage temperature（Such as：Veterinary antibiotics etc.）.In the prior art, cold chain
Transport is related to transport vehicle and freezer, and the equipment generally use freezed in transport or storing process for cargo it is air-cooled or
Direct-cooled mode, such as：It by taking cargo transport as an example, is typically employed in transport vehicle and is transported, be configured on transport vehicle with system
The container of cooling system, the cold that evaporator generates in refrigeration system cooled down by cold wind or directly in a manner of to container interior system
It is cold.But in actual use, there is the phenomenon that being unevenly distributed in the temperature in container；At the same time, in cold chain transportation mistake
Cheng Zhong, the article refrigerated are also easily damaged due to vibrations.How to design a kind of good refrigeration effect and storage security is high
Semiconductor refrigerating heat pipe-type cold chain transport vehicle be the technical problems to be solved by the invention.
The content of the invention
The technical problems to be solved by the invention are：A kind of semiconductor refrigerating heat pipe-type cold chain transport vehicle and refrigeration side are provided
Method realizes the refrigeration effect and storage security for improving semiconductor refrigerating heat pipe-type cold chain transport vehicle.
Technical solution provided by the invention is a kind of semiconductor refrigerating heat pipe-type cold chain transport vehicle, including car body, the vehicle
Body is provided with cabin and container, further includes water-cooled module and semiconductor cooler, and the water-cooled module includes main water box, the first water
Multiple support air bags are distributed in the heat exchange water cushion in pump, Multi-layer exchanging heat water cushion and air pump, and the heat exchange water cushion has water inlet
And water return outlet, the water inlet are connected by corresponding solenoid valve with first water pump, the water return outlet passes through corresponding electricity
Magnet valve is connected with the main water box, and first water pump is connected with the main water box, and the lower part for exchanging heat water cushion is provided with more
A air spring, the air spring and the support air bag are connected respectively by corresponding solenoid valve with the air pump, multilayer
The heat exchange water cushion is stacked；The cold end of the semiconductor cooler is provided with the first heat pipe, and first heat pipe is inserted
In the main water box, the semiconductor cooler, the main water box, first water pump and the air pump are located at the cabin
In, the heat exchange water cushion is located in the container.
The present invention also provides a kind of refrigerating method of semiconductor refrigerating heat pipe-type cold chain transport vehicle, using above-mentioned semiconductor system
Cold and hot tubular type cold chain transportation vehicle；The refrigerating method is：
Step 1, air pump start, and support air bag and air spring are inflated so that the shape between adjacent two layers exchange heat water cushion
Into storage space；
Step 2, the first starting mode of pump, will in main water box by semiconductor cooler freeze water be delivered to heat exchange water cushion in into
Row Xun Huan.
Article to be transported is put between two layers adjacent of heat exchange water cushion, and adjusts adjacent two layers heat-exchanging water by step 3
The air pressure of air spring between pad so that article is clipped between two layers of heat exchange water cushion.
Compared with prior art, the advantages and positive effects of the present invention are：Semiconductor refrigerating heat pipe-type provided by the invention
Cold chain transportation vehicle and refrigerating method freeze to the article in car body by using water-cooled module, and semiconductor cooler passes through
After first heat pipe freezes to the water in main water box, the water in main water box is delivered to each layer heat exchange water cushion via the first water pump
In, it is attached to article using adjacent two layers heat exchange water cushion and directly freezes, can effectively improve refrigerating efficiency, meanwhile, heat exchange
Water in water cushion circulates so that the distribution of water temperature in heat exchange water cushion everywhere is uniform, improves refrigeration effect；Further, since object
Product are placed between two layers of water cushion that exchanges heat, and in transportational process, can effectively be reduced and are damaged due to collision, improve storage
Security.And the water cushion that exchanges heat is strutted self by support air bag, is on the one hand flowed convenient for water in the water cushion that exchanges heat, on the other hand really
It is responsible to replace hot water mat and enough support forces, also, the air spring energy between two layers of heat exchange water cushion is provided the article placed thereon
Enough control two layers of the distance between water cushion that exchanges heat so that the heat exchange water cushion on upper strata can be sticked on article, more made
Cold effect.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structure diagram of semiconductor refrigerating heat pipe-type cold chain transport vehicle embodiment of the present invention；
Fig. 2 is the structure diagram one of heat exchange water cushion in semiconductor refrigerating heat pipe-type cold chain transport vehicle embodiment of the present invention；
Fig. 3 is the structure diagram two of heat exchange water cushion in semiconductor refrigerating heat pipe-type cold chain transport vehicle embodiment of the present invention；
Fig. 4 is the structure diagram of water pocket in semiconductor refrigerating heat pipe-type cold chain transport vehicle embodiment of the present invention；
Fig. 5 is the schematic diagram of dehumidification module in semiconductor refrigerating heat pipe-type cold chain transport vehicle embodiment of the present invention；
Fig. 6 is the schematic diagram of water-cooled module in semiconductor refrigerating heat pipe-type cold chain transport vehicle embodiment of the present invention；
Fig. 7 is the front view of membrane type liquid dehumidifier in semiconductor refrigerating heat pipe-type cold chain transport vehicle embodiment of the present invention；
Fig. 8 is the side view of membrane type liquid dehumidifier in semiconductor refrigerating heat pipe-type cold chain transport vehicle embodiment of the present invention；
Fig. 9 is the close-up schematic view of a-quadrant in Fig. 8.
Specific embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
All other embodiments obtained without creative efforts belong to the scope of protection of the invention.
As shown in Figure 1, Figure 2, shown in Fig. 5 and Fig. 6, the present embodiment semiconductor refrigerating heat pipe-type cold chain transport vehicle, including car body 1,
The car body 1 is provided with cabin 11 and container 12, further includes semiconductor cooler 2 and water-cooled module 3, and the water-cooled module 3 is wrapped
Main water box 31, the first water pump 32, Multi-layer exchanging heat water cushion 33 and air pump (not shown) are included, is distributed in the heat exchange water cushion 33 multiple
Support air bag 35, the heat exchange water cushion 33 have water inlet (unmarked) and water return outlet (unmarked), and it is right that the water inlet passes through
The solenoid valve answered is connected with first water pump 32, and the water return outlet is connected by corresponding solenoid valve with the main water box 31,
First water pump 32 is connected with the main water box 31, and the lower part of the heat exchange water cushion 33 is provided with multiple air springs 36, institute
It states air spring 36 and the support air bag 35 to be connected with the air pump by corresponding solenoid valve respectively, heat-exchanging water described in multilayer
Pad 33 is stacked；The cold end sealing of the semiconductor cooler 2 is embedded in the main water box 31, the semiconductor system
Cooler 2, the main water box 31, first water pump 32 and the air pump are located in the cabin 11, the heat exchange water cushion 33
In the container 12.
Specifically, the present embodiment semiconductor refrigerating heat pipe-type cold chain transport vehicle passes through the cold end in semiconductor cooler 2
Portion generates cold by the first heat pipe 21 and freezes to the refrigerant solution in main water box 31, the refrigerant solution warp in main water box 31
It is injected by the first water pump 32 in different heat exchange water cushions 33, refrigerant solution carries out heat exchange to container 12 in the water cushion 33 that exchanges heat
In article freezed after flow back into main water box 31；And the support air bag 35 in the water cushion 33 that exchanges heat will inflate the water cushion that will exchange heat
33 internal cavity struts to be flowed convenient for refrigerant solution, meanwhile, support air bag 35 can support what is placed on heat exchange water cushion 33
Article, and air spring 36 adjacent two heat exchange water cushions 33 are supported it is spaced apart, so as in two adjacent heat exchange water cushions 33
Between form storage space, article is placed between two layers of water cushion 33 that exchanges heat, and passes through the atmospheric pressure value for controlling air spring 36, is come
The height of air spring 36 is adjusted, to adjust two layers of the distance between water cushion 33 that exchanges heat so that the heat exchange water cushion 33 on upper strata can
It sticks on article so that article is uniformly directly cooled up and down, obtains more refrigeration effect.Wherein, refrigerant solution according to
The different liquid refrigerating medium of the different selections of the storage temperature of the article of institute's storing in container 12, such as：The loads such as water or refrigerant
Cryogen, the present embodiment are not limited the refrigerant solution held in main water box 31.In addition, the hot junction portion in semiconductor cooler 2
Heat is generated, can be radiated by configuring radiator, the specific constructive form of radiator is not limited.
Further, in order to be more convenient to use versatility and convenience using offer, as Figure 3-Figure 4, described in every layer
The water cushion 33 that exchanges heat includes multiple mutually independent water pockets 331, and each water pocket 331 is configured with the support air bag 35 and described
Air spring 36, multiple water pockets 331 are fixed together side by side successively, and the two side of the water pocket 331 is provided with branch
Air column 332 is supportted, the support air column 332 is connected by corresponding solenoid valve with the air pump.Specifically, in actual use process
In, it is different according to the number of articles of storage, the size of heat exchange water cushion 33 is adjusted, i.e., the support to water pocket 331 is needed according to storing
Air bag 35 and air spring 36 are inflated, and without entire heat exchange water cushion 33 is filled refrigerant solution full of gas, on the one hand may be used
With more flexible using refrigerating capacity of the water cushion 33 to article offer specified quantitative that exchange heat, energy on the other hand can be effectively reduced
Consumption.Preferably, in order to enable the uniformity of temperature profile of heat exchange water cushion 33, provides refrigeration effect, a side of the water pocket 331 is
Intake tunnel 3311, the other side are backwater channel 3312, and the middle part of the water pocket 331 is heat transmitting member 3313；The water inlet
Passage 3311 has the water inlet, and the backwater channel 3312 has the water return outlet, the intake tunnel 3311 and described
Backwater channel 3312 forms multiple permeable gaps 3310 between the heat transmitting member 3313 respectively.The system of first water pump 32 output
Cold soln enters heat transmitting member 3313 by intake tunnel 3311 and carries out heat exchange, and the water in heat transmitting member 3313 carries out heat
It flow back into the cycling of the realization water of main water box 31 after exchange by backwater channel 3312 again, and permeable gap 3310 can effectively make
Water in heat transmitting member 3313 must be entered to be uniformly distributed in various pieces, it is preferred that multiple permeable gaps 3310 are along current
Flow direction is progressively longer, since the hydraulic pressure of 3311 water inlet of intake tunnel is larger, will be subtracted with the flowing hydraulic pressure of dampening
It is small, and the permeable gap 3310 of graded profile can be distributed more uniformly and is flowed at 3313 different parts of heat transmitting member
Water so that the uniformity of temperature profile of heat transmitting member 3313.And temperature distribution evenness in order to better improve, the support air bag
35 entirety are in strip structure and are arranged between the intake tunnel 3311 and the backwater channel 3312, the support air bag 35
Both sides be respectively formed with multiple turbulent gas teeth 351, it is logical that the connection water inlet is formed between the two neighboring support air bag 35
The turbulent runner in road 3311 and the backwater channel 3312 under the action of turbulent runner, can more uniformly distribute hot biography
Pass the water distribution at each position in portion 3313, it is ensured that the temperature uniformity of each position, in addition, turbulent gas tooth 351 can be right
Current play the role of buffering so that current can sufficiently pass through 3313 cold scattering of heat transmitting member.Preferably, the air column support
Air bag 35 is fixed on the inner wall of water pocket 331, and the turbulent flow gas tooth 351 is suspended in the water pocket 331.
Further, in order to adjust the humidity in heat room 1, to meet the storage request of special article, such as Fig. 5, figure
7th, shown in Fig. 8 and Fig. 9, the semiconductor refrigeration type freezer further includes dehumidification module, and the dehumidification module includes two membrane type liquid
Body dehumidifier 22, Intermediate Heat Exchanger 23 and two solution pumps 24, the Intermediate Heat Exchanger 23 include first changing for mutual heat exchange
The passage of heat（It is unmarked）With the second heat exchanger channels（It is unmarked）；The membrane type liquid dehumidifier 22 includes the second heat pipe 221, protection
Film 222 and plus based Dehumidification Membranes 223, second heat pipe 221 is wrapped with the protective film 222, and the protective film 222 is wrapped with
Described plus based Dehumidification Membranes 223 form solution channel 220 between the protective film 222 and described plus based Dehumidification Membranes 223；One solution
The two-port of passage 220 is connected respectively with the import of first heat exchanger channels and the outlet of second heat exchanger channels, another
The two-port of the solution channel 220 connects respectively with the outlet of first heat exchanger channels and the import of second heat exchanger channels
It connects；The solution pump 24 is respectively arranged on first heat exchanger channels and second heat exchanger channels.Specifically, actually make
With in the process, the second heat pipe 221 of membrane type liquid dehumidifier 22 connects respectively with 2 cold end of semiconductor cooler and the heat transfer of hot junction portion
Connect, and the solution channel 220 in two membrane type liquid dehumidifiers 22 be used for for solution flow, protective film 222 will completely cut off solution with
The surface contact of second heat pipe 221, to protect the second heat pipe 221 from the corrosion of solution, and adds based Dehumidification Membranes 223 to ensure in air
Vapor can free in and out solution channel 220, and solution can not be by adding based Dehumidification Membranes 223.Second heat pipe, 221 one side is used for
Heat exchange is carried out with semiconductor cooler 2, on the other hand the second heat pipe 221 utilizes the cold or heat of its heat transfer and outside
Solution in solution channel 220 carries out heat exchange, to freeze to the solution in solution channel 220 or heat as needed, with reality
The function of existing regulating environmental humidity, also, since the second heat pipe 221 and solution can be rapidly performed by heat exchange, so as to
The effective adjusting efficiency for improving humidity, membrane type liquid dehumidifier 22 are integrated with solution dehumidification function；Preferably, the second heat pipe
Fin 224 is additionally provided on 221, fin 224 offers multiple tube expansion holes 225, and the second heat pipe 221 is arranged on the tube expansion hole
In 225, the protective film 222 and described plus based Dehumidification Membranes 223 also are located in the tube expansion hole 225, the edge in the tube expansion hole 225
The notch 226 for being passed through for the solution flow channel 20 is provided with, specifically, in order to ensure solution can be in solution channel
It is smoothly flowed in 220, notch 226 is additionally provided on the tube expansion hole 225 of fin 224, notch 226 is formed for solution channel 220
The space passed through, after 221 tube expansion of the second heat pipe is mounted in tube expansion hole 225, the solution in solution channel 220 can still lead to
Cross 226 smooth outflow of notch.Wherein, membrane type liquid dehumidifier 22 be based on dissolving-diffusion mechanism, mainly using the concentration of solution come
It realizes dehumidifying and humidification, and adds based Dehumidification Membranes 223 that organic high molecular polymer film, inoranic membrane, liquid film etc. may be employed and steamed with water
Gas penetrates the film of function, using the high temperature and low temperature refrigerant generated in semiconductor cooler 2, for cold with semiconductor cooler 2
The solution of solution channel 220 on second heat pipe 221 of end connection dehumidifies for absorbing moisture, and for semiconductor
The solution of solution channel 220 on second heat pipe 221 of 2 hot junction portion of refrigerator connection is humidified for discharging moisture.And
In actual use, the indoor humidity of usual storing can be excessive and generates frost phenomenon, then by the membrane type liquid of refrigeration
Dehumidifier 22 is arranged in material storage room, by the membrane type liquid dehumidifier 22, the Intermediate Heat Exchanger 25 and two institutes of heating
Solution pump 26 is stated to be arranged in the cabin 11.
The present invention also provides a kind of refrigerating method of semiconductor refrigerating heat pipe-type cold chain transport vehicle, using above-mentioned semiconductor system
Cold and hot tubular type cold chain transportation vehicle；The refrigerating method is：
Step 1, air pump start, and support air bag and air spring are inflated so that the shape between adjacent two layers exchange heat water cushion
Into storage space；
Step 2, the first starting mode of pump, will in main water box by semiconductor cooler freeze water be delivered to heat exchange water cushion in into
Row Xun Huan.
Article to be transported is put between two layers adjacent of heat exchange water cushion, and adjusts adjacent two layers heat-exchanging water by step 3
The air pressure of air spring between pad so that article is clipped between two layers of heat exchange water cushion.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
To modify to the technical solution recorded in foregoing embodiments or carry out equivalent substitution to which part technical characteristic；
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical solution spirit and
Scope.
Claims (9)
1. a kind of semiconductor refrigerating heat pipe-type cold chain transport vehicle, including car body, the car body is provided with cabin and container, feature
It is, further include water-cooled module and semiconductor cooler, the water-cooled module includes main water box, the first water pump, Multi-layer exchanging heat water
Multiple support air bags are distributed in the heat exchange water cushion in pad and air pump, and the heat exchange water cushion has water inlet and water return outlet, described
Water inlet is connected by corresponding solenoid valve with first water pump, and the water return outlet passes through corresponding solenoid valve and the main water
Case connects, and first water pump is connected with the main water box, and the lower part of the heat exchange water cushion is provided with multiple air springs, described
Air spring and the support air bag are connected respectively by corresponding solenoid valve with the air pump, and the water cushion that exchanges heat described in multilayer stacks
Together；The cold end of the semiconductor cooler is provided with the first heat pipe, and first heat pipe is inserted in the main water box, institute
It states semiconductor cooler, the main water box, first water pump and the air pump to be located in the cabin, the heat exchange water cushion position
In the container.
2. semiconductor refrigerating heat pipe-type cold chain transport vehicle according to claim 1, which is characterized in that every layer of heat-exchanging water
Pad includes multiple mutually independent water pockets, and each water pocket is configured with the support air bag and the air spring, Duo Gesuo
It states water pocket to be fixed together side by side successively, the two side of the water pocket is provided with support air column, and the support air column passes through
Corresponding solenoid valve is connected with the air pump.
3. semiconductor refrigerating heat pipe-type cold chain transport vehicle according to claim 2, which is characterized in that the one side of the water pocket
Portion is intake tunnel, and the other side is backwater channel, and the middle part of the water pocket is heat transmitting member；The intake tunnel has described
Water inlet, the backwater channel have a water return outlet, the intake tunnel and the backwater channel respectively with the heat transfer
Multiple permeable gaps are formed between portion.
4. semiconductor refrigerating heat pipe-type cold chain transport vehicle according to claim 3, which is characterized in that multiple permeable seams
Gap is progressively longer along current flow direction.
5. semiconductor refrigerating heat pipe-type cold chain transport vehicle according to claim 3, which is characterized in that the support air bag is whole
Body is in strip structure and is arranged between the intake tunnel and the backwater channel, and the both sides of the support air bag are respectively formed
There are multiple turbulent gas teeth, formed between the two neighboring support air bag and connect the disorderly of the intake tunnel and the backwater channel
Flow runner.
6. semiconductor refrigerating heat pipe-type cold chain transport vehicle according to claim 5, which is characterized in that the support air bag is consolidated
It is scheduled on the inner wall of the water pocket, the turbulent flow gas tooth is suspended in the water pocket.
7. semiconductor refrigerating heat pipe-type cold chain transport vehicle according to claim 1, which is characterized in that the semiconductor refrigerating
Heat pipe-type cold chain transport vehicle further includes dehumidification module, and the dehumidification module includes two membrane type liquid dehumidifiers, Intermediate Heat Exchangers
With two solution pumps, the Intermediate Heat Exchanger includes the first heat exchanger channels and the second heat exchanger channels of mutual heat exchange；The film
Formula liquid dehumidifier includes the second heat pipe, protective film and adds based Dehumidification Membranes, and second heat pipe is wrapped with the protective film, described
Protective film is wrapped with described plus based Dehumidification Membranes, and solution channel is formed between the protective film and described plus based Dehumidification Membranes；Wherein one institute
The two-port for stating solution channel is connected respectively with the import of first heat exchanger channels and the outlet of second heat exchanger channels, separately
The two-port of one solution channel connects respectively with the outlet of first heat exchanger channels and the import of second heat exchanger channels
It connects；The solution pump is respectively arranged on first heat exchanger channels and second heat exchanger channels；Second heat pipe is arranged on institute
State the cold end of semiconductor cooler and in the container, another second heat pipe is arranged on the semiconductor cooler
Hot junction portion；It is arranged on second heat pipe in the hot junction portion of the semiconductor cooler, the Intermediate Heat Exchanger, described in two
Solution pump is located in the cabin.
8. semiconductor refrigerating heat pipe-type cold chain transport vehicle according to claim 7, which is characterized in that on second heat pipe
Be additionally provided with fin, the fin is provided with tube expansion hole, and second heat pipe is arranged in the tube expansion hole, the protective film and
Described plus based Dehumidification Membranes are located in the tube expansion hole, and the edge in the tube expansion hole is provided with to be lacked for what is passed through for the solution channel
Mouthful.
9. a kind of refrigerating method of semiconductor refrigerating heat pipe-type cold chain transport vehicle, which is characterized in that appointed using such as claim 1-8
Semiconductor refrigerating heat pipe-type cold chain transport vehicle described in one；The refrigerating method is：
Step 1, air pump start, and support air bag and air spring are inflated so that form storage between adjacent two layers exchange heat water cushion
Object space；
Step 2, the first starting mode of pump are followed being delivered in main water box by the water that semiconductor cooler freezes in heat exchange water cushion
Ring；
Step 3, between article to be transported is put into adjacent two layers of heat exchange water cushion, and adjust adjacent two layers heat exchange water cushion it
Between air spring air pressure so that article is clipped between two layers of heat exchange water cushion.
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| CN201610975395.6A CN106274631B (en) | 2016-11-07 | 2016-11-07 | Semiconductor refrigerating heat pipe-type cold chain transport vehicle and refrigerating method |
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| CN201610975395.6A CN106274631B (en) | 2016-11-07 | 2016-11-07 | Semiconductor refrigerating heat pipe-type cold chain transport vehicle and refrigerating method |
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| CN106274631B true CN106274631B (en) | 2018-05-29 |
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| CN201178871Y (en) * | 2008-04-09 | 2009-01-14 | 梁盛权 | Circulation type semiconductor refrigeration heating pad |
| US20110138820A1 (en) * | 2009-12-16 | 2011-06-16 | Weeth Frederic R | Transportable Product Cooling Apparatus and Method |
| CN102350933A (en) * | 2011-05-16 | 2012-02-15 | 哈尔滨商业大学 | Water-cooling thermoelectricity refrigeration automotive air conditioning |
| CN202986940U (en) * | 2012-10-30 | 2013-06-12 | 中国人民解放军总后勤部军需装备研究所 | Decompressed refrigeration truck |
| US9303905B2 (en) * | 2014-05-15 | 2016-04-05 | Reflect Scientific Inc. | Self generating power generator for cryogenic systems |
| CN203893485U (en) * | 2014-06-13 | 2014-10-22 | 苏州海派特热能设备有限公司 | Heat pipe type efficient semiconductor refrigeration device |
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