CN106347884A - Semiconductor refrigeration type container and refrigeration method - Google Patents
Semiconductor refrigeration type container and refrigeration method Download PDFInfo
- Publication number
- CN106347884A CN106347884A CN201610975515.2A CN201610975515A CN106347884A CN 106347884 A CN106347884 A CN 106347884A CN 201610975515 A CN201610975515 A CN 201610975515A CN 106347884 A CN106347884 A CN 106347884A
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- Prior art keywords
- water
- heat exchange
- pump
- type container
- cushion
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D88/00—Large containers
- B65D88/74—Large containers having means for heating, cooling, aerating or other conditioning of contents
- B65D88/744—Large containers having means for heating, cooling, aerating or other conditioning of contents heating or cooling through the walls or internal parts of the container, e.g. circulation of fluid inside the walls
Abstract
The invention discloses a semiconductor refrigeration type container and a refrigeration method. The semiconductor refrigeration type container comprises a container, a semiconductor refrigerator and a water cooling module group; the water cooling module group comprises a main water tank, a first water pump, multiple layers of heat exchange water cushions and an air pump; a plurality of supporting air bags are distributed in each heat exchange water cushion; each heat exchange water cushion is provided with a water inlet and a water return hole; each water inlet is connected with the first water pump through a corresponding electromagnetic valve; each water return hole is connected with the main water tank through a corresponding electromagnetic valve; the first water pump is connected with the main water tank; a plurality of air springs are arranged at the lower part of each heat exchange water cushion; the air springs and the supporting air bags are connected with the air pump through corresponding electromagnetic valves; the multiple layers of heat exchange water cushions are stacked together; the cold end part of the semiconductor refrigerator is embedded into the main water tank; the container is provided with a machine cabin and a storage chamber; the semiconductor refrigerator, the main water tank, the first water pump and the air pump are arranged in the machine cabin; and the heat exchange water cushions are arranged in the storage chamber. With adoption of the semiconductor refrigeration type container and the refrigeration method, the refrigeration effect and the storage safety of the semiconductor refrigeration type container are improved.
Description
Technical field
The present invention relates to cold chain refrigeration plant, more particularly, to a kind of semiconductor refrigeration type container and refrigerating method.
Background technology
At present, the transport of goods and storage generally have certain requirement to temperature, and some goods need relatively low freezing
Temperature (for example: frozen product), and some goods need refrigerated storage temperature (for example: veterinary antibiotics etc.).In prior art, cold chain
Transport is related to transport container and freezer, and is directed to the equipment that goods freezed in transport or storing process and generally adopts wind
Cold or direct-cooled mode, for example: taking cargo transport as a example, be typically employed in configuration refrigeration system on container, refrigeration system is produced
Raw cold is freezed to internal container in the way of cold wind or direct cooling.But, in actual use, packaging
There is the phenomenon of skewness in the temperature in casing；Meanwhile, in cold chain transportation or storing process, by the article of cold preservation
Easily it is damaged because of vibrations.How to design a kind of good refrigeration effect and the high semiconductor refrigeration type container of storage security
It is the technical problem to be solved.
Content of the invention
The technical problem to be solved is: provides a kind of semiconductor refrigeration type container and refrigerating method, realizes
Improve refrigeration and the storage security of semiconductor refrigeration type container.
The technical scheme that the present invention provides is that a kind of semiconductor refrigeration type container, including container, water-cooled module and half
Conductor refrigerator, described water-cooled module includes main water box, the first water pump, Multi-layer exchanging heat water cushion and air pump, in described heat exchange water cushion
Multiple support air bag are distributed with, described heat exchange water cushion has water inlet and water return outlet, described water inlet passes through corresponding electromagnetic valve
Be connected with described first water pump, described water return outlet is connected with described main water box by corresponding electromagnetic valve, described first water pump with
Described main water box connects, and the bottom of described heat exchange water cushion is provided with multiple air springs, described air spring and described support gas
Capsule is connected with described air pump by corresponding electromagnetic valve respectively, and described in multilamellar, heat exchange water cushion is stacked；Described quasiconductor system
The cold end sealing of cooler is embedded in described main water box, and described container is provided with cabin and material storage room, described quasiconductor system
Cooler, described main water box, described first water pump and described air pump are located in described cabin, and described heat exchange water cushion is located at described storing
In room.
The present invention also provides a kind of refrigerating method of semiconductor refrigeration type container, using above-mentioned semiconductor refrigeration type packaging
Case；Described refrigerating method is:
Step 1, air pump start, to support air bag and air spring inflation so that forming storage between adjacent two layers heat exchange water cushion
Object space；
Step 2, the first starting mode of pump, the water being freezed by semiconductor cooler are delivered in heat exchange water cushion are followed in main water box
Ring.
Step 3, article to be transported are put between adjacent two-layer heat exchange water cushion, and adjust adjacent two layers heat-exchanging water
The air pressure of the air spring between pad is so that article clip is between two-layer heat exchange water cushion.
Compared with prior art, advantages of the present invention and good effect are: the semiconductor refrigeration type packaging that the present invention provides
Case and refrigerating method, by being freezed to the article in container using water-cooled module, semiconductor cooler is in main water box
Water freezed after, the water in main water box is delivered in each layer heat exchange water cushion via the first water pump, using adjacent two layers heat exchange
Water cushion is attached to article and is directly freezed, and can effectively improve refrigerating efficiency, and meanwhile, the water circulation in heat exchange water cushion flows,
Distribution of water temperature everywhere in heat exchange water cushion is made uniformly, to improve refrigeration；Further, since article are between two-layer heat exchange water cushion
Place, during transport is deposited, can effectively reduce and be damaged because of collision, improve storage security.And heat-exchanging water
Pad struts self by support air bag, is on the one hand easy to water and flows in heat exchange water cushion, on the other hand guarantees heat exchange water cushion to it
The article of upper placement provide enough support forces, and, the air spring between two-layer heat exchange water cushion can control two-layer heat exchange
The distance between water cushion, so that the heat exchange water cushion on upper strata can abut on article, obtains more refrigeration.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Have technology description in required use accompanying drawing be briefly described it should be apparent that, drawings in the following description are these
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, acceptable
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of semiconductor refrigeration type container embodiment of the present invention；
Fig. 2 is the structural representation one of heat exchange water cushion in semiconductor refrigeration type container embodiment of the present invention；
Fig. 3 is the structural representation two of heat exchange water cushion in semiconductor refrigeration type container embodiment of the present invention；
Fig. 4 is the structural representation of water pocket in semiconductor refrigeration type container embodiment of the present invention；
Fig. 5 is the schematic diagram of dehumidification module in semiconductor refrigeration type container embodiment of the present invention；
Fig. 6 is the schematic diagram of water-cooled module in semiconductor refrigeration type container embodiment of the present invention；
Fig. 7 is the front view of membrane type liquid dehumidifier in semiconductor refrigeration type container embodiment of the present invention；
Fig. 8 is the side view of membrane type liquid dehumidifier in semiconductor refrigeration type container embodiment of the present invention；
Fig. 9 is the close-up schematic view in a region in Fig. 8.
Specific embodiment
Purpose, technical scheme and advantage for making the embodiment of the present invention are clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described it is clear that described embodiment is
The a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment being obtained under the premise of not making creative work, broadly falls into the scope of protection of the invention.
As shown in Figure 1, Figure 2, shown in Fig. 5 and Fig. 6, the present embodiment semiconductor refrigeration type container, including container 1, quasiconductor
Refrigerator 2 and water-cooled module 3, described water-cooled module 3 includes main water box 31, the first water pump 32, Multi-layer exchanging heat water cushion 33 and air pump
(not shown), is distributed with multiple support air bag 35 in described heat exchange water cushion 33, described heat exchange water cushion 33 has water inlet and (do not mark
Note) and water return outlet (unmarked), described water inlet is connected with described first water pump 32 by corresponding electromagnetic valve, described water return outlet
It is connected with described main water box 31 by corresponding electromagnetic valve, described first water pump 32 is connected with described main water box 31, described heat exchange
The bottom of water cushion 33 is provided with multiple air springs 36, and described air spring 36 and described support air bag 35 are respectively by corresponding
Electromagnetic valve is connected with described air pump, and described in multilamellar, heat exchange water cushion 33 is stacked；The cold end of described semiconductor cooler 2 is close
Envelope is embedded in described main water box 31, and described container 1 is provided with cabin 11 and material storage room 12, described semiconductor cooler 2, institute
State main water box 31, described first water pump 32 and described air pump to be located in described cabin 11, described heat exchange water cushion 33 is located at described storage
In thing room 12.
Specifically, the cold end 21 that the present embodiment semiconductor refrigeration type container passes through in semiconductor cooler 2 produces
Cold freezes to the refrigerant solution in main water box 31, and the refrigerant solution in main water box 31 is injected into not via the first water pump 32
With heat exchange water cushion 33 in, refrigerant solution carries out after heat exchange freezes to the article in material storage room 12 in heat exchange water cushion 33
It flow back in main water box 31；And the internal cavity of heat exchange water cushion 33 is strutted just by the support air bag 35 in heat exchange water cushion 33 by inflation
In refrigerant solution flowing, meanwhile, support air bag 35 can support the article placed on heat exchange water cushion 33, and air spring 36 will
Two adjacent heat exchange water cushions 33 support and are spaced apart, thus forming storage space, thing between two adjacent heat exchange water cushions 33
Product are placed between two-layer heat exchange water cushion 33, and by controlling the atmospheric pressure value of air spring 36, to adjust the height of air spring 36
Degree, to adjust the distance between two-layer heat exchange water cushion 33 so that the heat exchange water cushion 33 on upper strata can abut on article so that thing
Product are uniformly directly caught a cold up and down, obtain more refrigeration.Wherein, refrigerant solution is according to the thing of institute's storing in material storage room 12
The storage temperature of product is different to select different liquid refrigerating media, for example: the refrigerating medium such as water or cold-producing medium, the present embodiment is to main water
The refrigerant solution holding in case 31 is not limited.
Further, in order to be more convenient to use versatility and convenience using offer, as Figure 3-Figure 4, described in every layer
Heat exchange water cushion 33 includes multiple separate water pockets 331, and each described water pocket 331 is configured with described support air bag 35 and described
Air spring 36, multiple described water pockets 331 are fixed together successively side by side, and the two side of described water pocket 331 is provided with props up
Support gas column 332, described support gas column 332 is connected with described air pump by corresponding electromagnetic valve.Specifically, in actually used process
In, different according to the number of articles of storage, adjust the size of heat exchange water cushion 33, the support to water pocket 331 is needed according to storing
Air bag 35 and air spring 36 are inflated, and full of gas, whole heat exchange water cushion 33 need not be filled refrigerant solution, on the one hand may be used
So that more flexibly article are provided using heat exchange water cushion 33 with the refrigerating capacity of specified quantitative, energy on the other hand can be effectively reduced
Consumption.Preferably, so that the uniformity of temperature profile of heat exchange water cushion 33, provide refrigeration, a sidepiece of described water pocket 331 is
Intake tunnel 3311, the other side is backwater channel 3312, and the middle part of described water pocket 331 is heat transmitting member 3313；Described water inlet
Passage 3311 has described water inlet, and described backwater channel 3312 has a described water return outlet, described intake tunnel 3311 and described
Backwater channel 3312 forms multiple permeable gaps 3310 respectively and described heat transmitting member 3313 between.The system of the first water pump 32 output
Cold soln enters into heat transmitting member 3313 by intake tunnel 3311 and carries out heat exchange, and the water in heat transmitting member 3313 carries out heat
Again the circulation that main water box 31 realizes water is flow back into by backwater channel 3312 after exchange, and permeable gap 3310 can effectively make
Water must be entered in heat transmitting member 3313 be uniformly distributed it is preferred that multiple described permeable gap 3310 is along current in various pieces
Flow direction is progressively longer, and because the hydraulic pressure of intake tunnel 3311 water inlet is larger, the flowing hydraulic pressure with water will subtract
Little, and the permeable gap 3310 of graded profile can more uniformly be distributed and is flowed at heat transmitting member 3313 different parts
Water is so that the uniformity of temperature profile of heat transmitting member 3313.And in order to preferably improve temperature distribution evenness, described support air bag
35 entirety are in strip structure and are arranged between described intake tunnel 3311 and described backwater channel 3312, described support air bag 35
Both sides be respectively formed with multiple turbulent flow gas teeth 351, form between two neighboring described support air bag 35 that to connect described water inlet logical
Road 3311 and the turbulent runner of described backwater channel 3312, in the presence of turbulent runner, can more uniformly distribute heat biography
Pass the water distribution at each position in portion 3313 it is ensured that the temperature homogeneity of each position, in addition, turbulent gas tooth 351 can be right
Current play the effect of buffering so that current can sufficiently pass through heat transmitting member 3313 cold scattering.Preferably, described gas column supports
Air bag 35 is fixed on the inwall of water pocket 331, and described turbulent flow gas tooth 351 is suspended in described water pocket 331.
Further, in order to adjust the humidity in material storage room 12, to meet the storage request of special article, such as Fig. 5, figure
7th, shown in Fig. 8 and Fig. 9, the hot junction portion 22 of semiconductor cooler 2 is connected with auxiliary water tank 34；And described semiconductor refrigeration type collection
Vanning also includes dehumidification module, and described dehumidification module includes two membrane type liquid dehumidifiers 23 and 24, Intermediate Heat Exchanger 25, second
Water pump 27 and two solution pumps 26, described Intermediate Heat Exchanger 25 includes first heat exchanger channels (unmarked) and of mutual heat exchange
Two heat exchanger channels (unmarked)；Described membrane type liquid dehumidifier 23 and 24 includes heat dissipation pipe 251, protecting film 252 and plus dehumidifying
Film 253, described heat dissipation pipe 251 is wrapped with described protecting film 252, and described protecting film 252 is wrapped with described plus based Dehumidification Membranes
253, form solution channel 250 between described protecting film 252 and described plus based Dehumidification Membranes 253；The radiating of membrane type liquid dehumidifier 24
Water pipe is connected with described main water box 31 by corresponding described second water pump 27, the heat dissipation pipe 251 of membrane type liquid dehumidifier 23
It is connected with described auxiliary water tank 34 by corresponding described second water pump 27；The described solution channel of membrane type liquid dehumidifier 24
250 two-port is connected with the import of described first heat exchanger channels and the outlet of described second heat exchanger channels respectively, membrane type liquid
The two-port of the described solution channel 250 of dehumidifier 23 is led to the outlet of described first heat exchanger channels and described second heat exchange respectively
The import in road connects；It is respectively arranged with described solution pump 26 on described first heat exchanger channels and described second heat exchanger channels.Specifically
, in actual use, the heat dissipation pipe of two membrane type liquid dehumidifiers 23 and 24 respectively with auxiliary water tank 34 and main water
Case 31 connects formation coolant flow circuits, and the solution channel 250 in two membrane type liquid dehumidifiers 23 and 24 is used for supplying solution
Flowing, protecting film 252 is contacted completely cutting off solution with the surface of heat dissipation pipe 251, to protect heat dissipation pipe 251 from the corruption of solution
Erosion, and add based Dehumidification Membranes 253 and ensure that the vapor of in the air can free in and out solution channel 250, and solution cannot be by adding dehumidifying
Film 253.Heat dissipation pipe 251 1 aspect is used for the heat exchange of coolant, and another aspect heat dissipation pipe 251 utilizes the cold of its internal flow
Matchmaker carries out heat exchange with the solution in outside solution channel 250, freezing to the solution in solution channel 250 as needed or
Heating, to realize the function of regulating environmental humidity, and, because coolant and solution can be rapidly performed by heat exchange, thus can
With the effective regulation efficiency improving humidity, membrane type liquid dehumidifier 23 and 24 is while realizing coolant heat exchange, also integrated
There is solution dehumidification function；Preferably, heat dissipation pipe 251 is additionally provided with fin 254, fin 254 offers multiple tube expansion holes
255, heat dissipation pipe 251 is arranged in described tube expansion hole 255, and described protecting film 252 and described plus based Dehumidification Membranes 253 also are located at described
In tube expansion hole 255, the edge in described tube expansion hole 255 is provided with the breach 256 for passing through for described solution flow channel 20, tool
Body, in order to ensure solution smoothly can flow in solution channel 250, the tube expansion hole 255 of fin 254 is additionally provided with scarce
Mouth 256, the space that breach 256 formation passes through for solution channel 250, it is arranged in tube expansion hole 255 in heat dissipation pipe 251 tube expansion
Afterwards, the solution in solution channel 250 still can pass through breach 256 smooth outflow.Wherein, membrane type liquid dehumidifier 23 and 24 bases
In dissolving-diffusion mechanism, mainly realize dehumidifying using the concentration of solution and humidify, and plus based Dehumidification Membranes 253 can adopt organic
Polymer membrane, inoranic membrane, liquid film etc. have the film that vapor passes through function, using produce in semiconductor cooler 2
High temperature and low temperature refrigerant, the solution for the solution channel 250 in the membrane type liquid dehumidifier 23 and 24 flowing into low temperature refrigerant is used
Dehumidified in absorbing moisture, and for the solution channel 250 in the membrane type liquid dehumidifier 23 and 24 flowing into high temperature refrigerant
Solution is used for discharging moisture and is humidified.And in actual use, the indoor humidity of usual storing can be excessive and produce frost
Freeze phenomenon, then the described membrane type liquid dehumidifier 23 and 24 of refrigeration is arranged in material storage room, by the described membrane type liquid of heating
Dehumidifier 23 and 24, described Intermediate Heat Exchanger 25, described second water pump 27 and two described solution pumps 26 are arranged on described cabin
In.
The present invention also provides a kind of refrigerating method of semiconductor refrigeration type container, using above-mentioned semiconductor refrigeration type packaging
Case；Described refrigerating method is:
Step 1, air pump start, to support air bag and air spring inflation so that forming storage between adjacent two layers heat exchange water cushion
Object space；
Step 2, the first starting mode of pump, the water being freezed by semiconductor cooler are delivered in heat exchange water cushion are followed in main water box
Ring.
Step 3, article to be transported are put between adjacent two-layer heat exchange water cushion, and adjust adjacent two layers heat-exchanging water
The air pressure of the air spring between pad is so that article clip is between two-layer heat exchange water cushion.
Finally it is noted that above example, only in order to technical scheme to be described, is not intended to limit；Although
With reference to the foregoing embodiments the present invention is described in detail, it will be understood by those within the art that: it still may be used
To modify to the technical scheme described in foregoing embodiments, or equivalent is carried out to wherein some technical characteristics；
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and
Scope.
Claims (9)
1. a kind of semiconductor refrigeration type container, including container it is characterised in that also including water-cooled module and semiconductor refrigerating
Device, described water-cooled module includes main water box, the first water pump, Multi-layer exchanging heat water cushion and air pump, is distributed with many in described heat exchange water cushion
Individual support air bag, described heat exchange water cushion has water inlet and water return outlet, and described water inlet passes through corresponding electromagnetic valve and described the
One water pump connects, and described water return outlet is connected with described main water box by corresponding electromagnetic valve, described first water pump and described main water
Case connects, and the bottom of described heat exchange water cushion is provided with multiple air springs, and described air spring and described support air bag are led to respectively
Cross corresponding electromagnetic valve to be connected with described air pump, described in multilamellar, heat exchange water cushion is stacked；Described semiconductor cooler cold
End seal is embedded in described main water box, and described container is provided with cabin and material storage room, described semiconductor cooler, described
Main water box, described first water pump and described air pump are located in described cabin, and described heat exchange water cushion is located in described material storage room.
2. semiconductor refrigeration type container according to claim 1 it is characterised in that every layer of described heat exchange water cushion include many
Individual separate water pocket, each described water pocket is configured with described support air bag and described air spring, multiple described water pockets according to
Secondary be fixed together side by side, the two side of described water pocket is provided with support gas column, described support gas column pass through corresponding electricity
Magnet valve is connected with described air pump.
3. semiconductor refrigeration type container according to claim 2 is it is characterised in that a sidepiece of described water pocket is water inlet
Passage, the other side is backwater channel, and the middle part of described water pocket is heat transmitting member；Described intake tunnel has described water inlet,
Described backwater channel has described water return outlet, described intake tunnel and described backwater channel shape and described heat transmitting member between respectively
Become multiple permeable gaps.
4. semiconductor refrigeration type container according to claim 3 is it is characterised in that multiple described permeable gap is along current
Flow direction is progressively longer.
5. semiconductor refrigeration type container according to claim 3 is it is characterised in that described support air bag is in integrally bar shaped
Structure is simultaneously arranged between described intake tunnel and described backwater channel, and the both sides of described support air bag are respectively formed with multiple disorderly
Gas tooth, forms the turbulent runner connecting described intake tunnel and described backwater channel between two neighboring described support air bag.
6. semiconductor refrigeration type container according to claim 5 it is characterised in that described support air bag be fixed on described
On the inwall of water pocket, described turbulent flow gas tooth is suspended in described water pocket.
7. semiconductor refrigeration type container according to claim 1 is it is characterised in that the hot junction of described semiconductor cooler
Auxiliary water tank is provided with portion；Described semiconductor refrigeration type container also includes dehumidification module, and described dehumidification module includes two
Membrane type liquid dehumidifier, Intermediate Heat Exchanger, two solution pumps and two the second water pumps, described Intermediate Heat Exchanger includes mutually hot friendship
The first heat exchanger channels changing and the second heat exchanger channels；Described membrane type liquid dehumidifier includes heat dissipation pipe, protecting film and plus dehumidifying
Film, described heat dissipation pipe is wrapped with described protecting film, and described protecting film is wrapped with described plus based Dehumidification Membranes, described protecting film and
Form solution channel between described plus based Dehumidification Membranes；Wherein described in one, heat dissipation pipe passes through corresponding described second water pump and described master
Water tank connects, and another described heat dissipation pipe is connected with described auxiliary water tank by corresponding described second water pump；Wherein described in one
The two-port of solution channel is connected with the import of described first heat exchanger channels and the outlet of described second heat exchanger channels respectively, another
The two-port of described solution channel is connected with the outlet of described first heat exchanger channels and the import of described second heat exchanger channels respectively；
It is respectively arranged with described solution pump on described first heat exchanger channels and described second heat exchanger channels；Wherein described in one, membrane type liquid removes
Wet device is located in described material storage room, another described membrane type liquid dehumidifier, described Intermediate Heat Exchanger, two described second water pumps,
Two described solution pumps are located in described cabin.
8. semiconductor refrigeration type container according to claim 7 is it is characterised in that be additionally provided with described heat dissipation pipe
Fin, described fin is provided with tube expansion hole, and described heat dissipation pipe is arranged in described tube expansion hole, described protecting film and described plus remove
Wet film is located in described tube expansion hole, and the edge in described tube expansion hole is provided with the breach for passing through for described solution channel.
9. a kind of refrigerating method of semiconductor refrigeration type container is it is characterised in that adopt as arbitrary in claim 1-8 described
Semiconductor refrigeration type container；Described refrigerating method is:
Step 1, air pump start, to support air bag and air spring inflation so that forming storage between adjacent two layers heat exchange water cushion
Object space；
Step 2, the first starting mode of pump, the water being freezed by semiconductor cooler are delivered in heat exchange water cushion are followed in main water box
Ring；
Step 3, article to be transported are put between adjacent two-layer heat exchange water cushion, and adjust adjacent two layers heat exchange water cushion it
Between air spring air pressure so that article clip is between two-layer heat exchange water cushion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610975515.2A CN106347884A (en) | 2016-11-07 | 2016-11-07 | Semiconductor refrigeration type container and refrigeration method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610975515.2A CN106347884A (en) | 2016-11-07 | 2016-11-07 | Semiconductor refrigeration type container and refrigeration method |
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| CN106347884A true CN106347884A (en) | 2017-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610975515.2A Pending CN106347884A (en) | 2016-11-07 | 2016-11-07 | Semiconductor refrigeration type container and refrigeration method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112626482A (en) * | 2020-12-15 | 2021-04-09 | 华能新能源股份有限公司 | Substrate temperature control device for vacuum evaporation |
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| CN201178871Y (en) * | 2008-04-09 | 2009-01-14 | 梁盛权 | Circulation type semiconductor refrigeration heating pad |
| CN101975421A (en) * | 2010-09-21 | 2011-02-16 | 华南理工大学 | Heat pump-driven membrane-type liquid dehumidification and energy storage device |
| CN104534777A (en) * | 2014-12-18 | 2015-04-22 | 重庆欣泰发食品有限公司 | Contact type freezing device |
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- 2016-11-07 CN CN201610975515.2A patent/CN106347884A/en active Pending
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|---|---|---|---|---|
| CN2460348Y (en) * | 2001-01-18 | 2001-11-21 | 梁进晓 | Cooling device for carriage of vehicle |
| CN1428564A (en) * | 2001-12-27 | 2003-07-09 | 袁一军 | Air conditioning method for simultaneously removing humidity and cooling and its equipment |
| CN1711452A (en) * | 2002-11-11 | 2005-12-21 | Bsh博施及西门子家用器具有限公司 | Rapid cooling method and device |
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| CN201178871Y (en) * | 2008-04-09 | 2009-01-14 | 梁盛权 | Circulation type semiconductor refrigeration heating pad |
| CN101975421A (en) * | 2010-09-21 | 2011-02-16 | 华南理工大学 | Heat pump-driven membrane-type liquid dehumidification and energy storage device |
| CN104534777A (en) * | 2014-12-18 | 2015-04-22 | 重庆欣泰发食品有限公司 | Contact type freezing device |
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| CN112626482A (en) * | 2020-12-15 | 2021-04-09 | 华能新能源股份有限公司 | Substrate temperature control device for vacuum evaporation |
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