CN106288502A - Semiconductor refrigerating heat pipe-type freezer and refrigerating method - Google Patents
Semiconductor refrigerating heat pipe-type freezer and refrigerating method Download PDFInfo
- Publication number
- CN106288502A CN106288502A CN201610976000.4A CN201610976000A CN106288502A CN 106288502 A CN106288502 A CN 106288502A CN 201610976000 A CN201610976000 A CN 201610976000A CN 106288502 A CN106288502 A CN 106288502A
- Authority
- CN
- China
- Prior art keywords
- water
- heat
- heat pipe
- heat exchange
- cushion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D13/00—Stationary devices, e.g. cold-rooms
Abstract
The invention discloses a kind of semiconductor refrigerating heat pipe-type freezer and refrigerating method.Semiconductor refrigerating heat pipe-type freezer, including heat room, machine room, semiconductor cooler and water-cooled module, water-cooled module includes main water box, the first water pump, Multi-layer exchanging heat water cushion and air pump, multiple support air bag is distributed in heat exchange water cushion, heat exchange water cushion has water inlet and water return outlet, water inlet and the first water pump connect, water return outlet is connected with main water box, first water pump is connected with main water box, the bottom of heat exchange water cushion is provided with multiple air spring, air spring and support air bag are connected with air pump by corresponding electromagnetic valve respectively, and Multi-layer exchanging heat water cushion is stacked；The cold end of semiconductor cooler is provided with the first heat pipe, and the first heat pipe is inserted in main water box, and semiconductor cooler, main water box, the first water pump and air pump are positioned in machine room, and heat exchange water cushion is positioned in material storage room.Realize improving refrigeration and the storage security of semiconductor refrigerating heat pipe-type freezer.
Description
Technical field
The present invention relates to cold chain refrigeration plant, particularly relate to a kind of semiconductor refrigerating heat pipe-type freezer and refrigerating method.
Background technology
At present, the transport of goods and storage generally have certain requirement to temperature, and some goods need relatively low freezing
Temperature (such as: frozen product), and some goods need refrigerated storage temperature (such as: veterinary antibiotics etc.).In prior art, cold chain
Transport relates to transporting heat room and freezer, and the equipment carrying out freezing for goods in transport or storing process generally uses wind
Cold or direct-cooled mode, such as: as a example by freezer, is typically employed on heat room configuration refrigeration system, and refrigeration system produces
Freezed in the way of cold wind or direct cooling in heat room inside by cold.But, in actual use, heat-preservation warehouse body
There is the phenomenon of skewness in interior temperature；Meanwhile, in cold chain storing process, by the article of cold preservation also easily because of carrying
Piling and be damaged.How to design a kind of good refrigeration effect and the high semiconductor refrigerating heat pipe-type freezer of storage security is this
Invent technical problem to be solved.
Summary of the invention
The technical problem to be solved is: provide a kind of semiconductor refrigerating heat pipe-type freezer and refrigerating method, real
Now improve refrigeration and the storage security of semiconductor refrigerating heat pipe-type freezer.
The technical scheme that the present invention provides is, a kind of semiconductor refrigerating heat pipe-type freezer, including heat room, machine room, water-cooled
Module and semiconductor cooler, described water-cooled module includes main water box, the first water pump, Multi-layer exchanging heat water cushion and air pump, described in change
Multiple support air bag is distributed in hot water mat, and described heat exchange water cushion has water inlet and water return outlet, and described water inlet is by correspondence
Electromagnetic valve be connected with described first water pump, described water return outlet is connected with described main water box by corresponding electromagnetic valve, described the
One water pump is connected with described main water box, and the bottom of described heat exchange water cushion is provided with multiple air spring, described air spring and institute
Stating support air bag to be connected with described air pump by corresponding electromagnetic valve respectively, described in multilamellar, heat exchange water cushion is stacked；Described
The cold end of semiconductor cooler is provided with the first heat pipe, and described first heat pipe is inserted in described main water box, described quasiconductor system
Cooler, described main water box, described first water pump and described air pump are positioned in described machine room, and described heat exchange water cushion is positioned at described storing
In room.
The present invention also provides for the refrigerating method of a kind of semiconductor refrigerating heat pipe-type freezer, uses above-mentioned semiconductor refrigerating heat pipe
Formula freezer；Described refrigerating method is:
Step 1, air pump start, and inflate support air bag and air spring so that form storage between adjacent two layers heat exchange water cushion
Object space；
Step 2, the first starting mode of pump, be delivered to the water freezed by semiconductor cooler in main water box in heat exchange water cushion follow
Ring.
Step 3, article to be transported are put between adjacent two-layer heat exchange water cushion, and regulate adjacent two layers heat-exchanging water
The air pressure of the air spring between pad so that article clip is between two-layer heat exchange water cushion.
Compared with prior art, advantages of the present invention and good effect are: the semiconductor refrigerating heat pipe-type that the present invention provides
Freezer and refrigerating method, by using water-cooled module to freeze the article in heat room, semiconductor cooler passes through first
After water in main water box is freezed by heat pipe, the water in main water box is delivered in each layer heat exchange water cushion via the first water pump, profit
It is attached to article with adjacent two layers heat exchange water cushion directly freeze, it is possible to effectively improve refrigerating efficiency, meanwhile, in heat exchange water cushion
Water circulate so that in heat exchange water cushion, distribution of water temperature everywhere is uniform, improves refrigeration；Further, since article are two
Place between layer heat exchange water cushion, during piling is deposited, can effectively reduce and be damaged because of collision, improve storage peace
Quan Xing.And heat exchange water cushion struts self by support air bag, on the one hand it is easy to water and flows in heat exchange water cushion, on the other hand guarantee
The article that heat exchange water cushion is placed on which provide enough support forces to serve as the function of shelf, and, between two-layer heat exchange water cushion
Air spring can control the distance between two-layer heat exchange water cushion so that the heat exchange water cushion on upper strata can abut on article,
Obtain more refrigeration.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is this
Some bright embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the structural representation of semiconductor refrigerating heat pipe-type freezer embodiment of the present invention；
Fig. 2 is the structural representation one of heat exchange water cushion in semiconductor refrigerating heat pipe-type freezer embodiment of the present invention；
Fig. 3 is the structural representation two of heat exchange water cushion in semiconductor refrigerating heat pipe-type freezer embodiment of the present invention；
Fig. 4 is the structural representation of water pocket in semiconductor refrigerating heat pipe-type freezer embodiment of the present invention；
Fig. 5 is the schematic diagram of dehumidification module in semiconductor refrigerating heat pipe-type freezer embodiment of the present invention；
Fig. 6 is the schematic diagram of water-cooled module in semiconductor refrigerating heat pipe-type freezer embodiment of the present invention；
Fig. 7 is the front view of membrane type liquid dehumidifier in semiconductor refrigerating heat pipe-type freezer embodiment of the present invention；
Fig. 8 is the side view of membrane type liquid dehumidifier in semiconductor refrigerating heat pipe-type freezer embodiment of the present invention；
Fig. 9 is the close-up schematic view of a-quadrant in Fig. 8.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
The a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under not making creative work premise, broadly falls into the scope of protection of the invention.
As shown in Figure 1, Figure 2, shown in Fig. 5 and Fig. 6, the present embodiment semiconductor refrigerating heat pipe-type freezer, including heat room 1, machine room
11, semiconductor cooler 2 and water-cooled module 3, described water-cooled module 3 includes main water box the 31, first water pump 32, Multi-layer exchanging heat water cushion
33 and air pump (not shown), multiple support air bag 35 is distributed in described heat exchange water cushion 33, described heat exchange water cushion 33 has into water
Mouth (unmarked) and water return outlet (unmarked), described water inlet is connected with described first water pump 32 by corresponding electromagnetic valve, institute
Stating water return outlet to be connected with described main water box 31 by corresponding electromagnetic valve, described first water pump 32 is connected with described main water box 31,
The bottom of described heat exchange water cushion 33 is provided with multiple air spring 36, and described air spring 36 and described support air bag 35 are led to respectively
The electromagnetic valve crossing correspondence is connected with described air pump, and described in multilamellar, heat exchange water cushion 33 is stacked；Described semiconductor cooler 2
Cold end seals and is embedded in described main water box 31, semiconductor cooler 2 described in heat room 1, described main water box 31, described first
Water pump 32 and described air pump are positioned in described machine room 11, and described heat exchange water cushion 33 is positioned in described heat room 1.
Specifically, the present embodiment semiconductor refrigerating heat pipe-type freezer arranges heat exchange water cushion 33, heat-exchanging water in heat room 1
The function serving as rack is used for holding article article the most on which and freezes by pad 33 cooperation air spring 36.Specifically
Process be: produce cold by the first heat pipe 21 to the refrigeration in main water box 31 by cold end in semiconductor cooler 2
Solution freezes, and the refrigerant solution in main water box 31 is injected in different heat exchange water cushions 33 via the first water pump 32, refrigeration
Solution carries out flowing back in main water box 31 after the article in heat room 1 are freezed by heat exchange in heat exchange water cushion 33；And change
The internal cavity of heat exchange water cushion 33 is strutted by the support air bag 35 in hot water mat 33 by inflation is easy to refrigerant solution flowing, meanwhile,
Support air bag 35 can support the article placed on heat exchange water cushion 33, and air spring 36 is by two adjacent heat exchange water cushions 33
Support spaced apart, thus between two adjacent heat exchange water cushions 33 formed storage space, article two-layer heat exchange water cushion 33 it
Between place, and by control air spring 36 atmospheric pressure value, regulate the height of air spring 36, to regulate two-layer heat exchange water cushion
Distance between 33 so that the heat exchange water cushion 33 on upper strata can abut on article so that article are directly caught a cold up and down uniformly,
Obtain more refrigeration.Wherein, refrigerant solution is selected not according to the storage temperature difference of the article of institute's storing in heat room 1
Same liquid refrigerating medium, such as: the refrigerating medium such as water or cold-producing medium, the present embodiment refrigerant solution to holding in main water box 31 is not
Limit.And a machine room 11 can be that multiple heat room 1 provides cold, thus realize one and drag many effects.It addition, quasiconductor
Hot junction portion in refrigerator 2 produces heat, can dispel the heat by configuring radiator, and the specific constructive form of radiator is not done
Limit.
Further, use versatility and convenience are provided, as Figure 3-Figure 4, described in every layer for more convenient use
Heat exchange water cushion 33 includes that multiple separate water pocket 331, each described water pocket 331 are configured with described support air bag 35 and described
Air spring 36, multiple described water pockets 331 are fixed together the most side by side, and the two side of described water pocket 331 is provided with props up
Support gas column 332, described support gas column 332 is connected with described air pump by corresponding electromagnetic valve.Concrete, in actually used process
In, different according to the number of articles stored, the size of regulation heat exchange water cushion 33, i.e. need the support to water pocket 331 according to storing
Air bag 35 and air spring 36 are inflated, and fill refrigerant solution without whole heat exchange water cushion 33 is full of gas, on the one hand can
To use heat exchange water cushion 33 to provide the refrigerating capacity of specified quantitative to article more flexibly, on the other hand energy can be effectively reduced
Consumption.Preferably, so that the uniformity of temperature profile of heat exchange water cushion 33, it is provided that refrigeration, a sidepiece of described water pocket 331 is
Intake tunnel 3311, the other side is backwater channel 3312, and the middle part of described water pocket 331 is heat transmitting member 3313；Described water inlet
Passage 3311 has described water inlet, and described backwater channel 3312 has a described water return outlet, described intake tunnel 3311 and described
Backwater channel 3312 respectively and forms multiple permeable gap 3310 between described heat transmitting member 3313.The system of the first water pump 32 output
Cold soln enters into heat transmitting member 3313 by intake tunnel 3311 and carries out heat exchange, and the water in heat transmitting member 3313 carries out heat
It flow back into main water box 31 by backwater channel 3312 again after exchange and realize the circulation of water, and permeable gap 3310 can effectively make
Water in heat transmitting member 3313 must be entered into be uniformly distributed in various piece, it is preferred that multiple described permeable gap 3310 is along current
Flow direction is progressively longer, owing to the hydraulic pressure of intake tunnel 3311 water inlet is relatively big, along with the flowing hydraulic pressure of water will subtract
Little, and the permeable gap 3310 of graded profile can be distributed more uniformly and is flowed at heat transmitting member 3313 different parts
Water so that the uniformity of temperature profile of heat transmitting member 3313.And in order to preferably improve temperature distribution evenness, described support air bag
35 entirety are strip structure and are arranged between described intake tunnel 3311 and described backwater channel 3312, described support air bag 35
Both sides be respectively formed with multiple turbulent flow gas tooth 351, between adjacent two described support air bag 35 formed connect described water inlet lead to
Road 3311 and the turbulent runner of described backwater channel 3312, under the effect of turbulent flow runner, it is possible to more uniform distribution heat passes
Pass the water distribution at each position in portion 3313, it is ensured that the temperature homogeneity of each position, it addition, turbulent flow gas tooth 351 can be right
Current play the effect of buffering so that current can sufficiently pass through heat transmitting member 3313 cold scattering.Preferably, described gas column supports
Air bag 35 is fixed on the inwall of water pocket 331, and described turbulent flow gas tooth 351 is suspended in described water pocket 331.
Further, in order to regulate the humidity in heat room 1, to meet the storage request of special article, such as Fig. 5, figure
7, shown in Fig. 8 and Fig. 9, described semiconductor refrigerating heat pipe-type freezer also includes that dehumidification module, described dehumidification module include two films
Formula liquid dehumidifier 22, Intermediate Heat Exchanger 23 and two solution pumps 24, described Intermediate Heat Exchanger 23 includes the of mutual heat exchange
One heat exchanger channels (unmarked) and the second heat exchanger channels (unmarked)；Described membrane type liquid dehumidifier 22 include the second heat pipe 221,
Protecting film 222 and add based Dehumidification Membranes 223, described second heat pipe 221 is wrapped with described protecting film 222, the outsourcing of described protecting film 222
Based Dehumidification Membranes 223 is added, described protecting film 222 and described add formation solution channel 220 between based Dehumidification Membranes 223 described in being wrapped with；Described in one
The outlet with the import of described first heat exchanger channels and described second heat exchanger channels respectively of the two-port of solution channel 220 is connected,
The two-port of another described solution channel 220 respectively with outlet and the entering of described second heat exchanger channels of described first heat exchanger channels
Mouth connects；It is respectively arranged with described solution pump 24 on described first heat exchanger channels and described second heat exchanger channels.Concrete, in reality
During border uses, the second heat pipe 221 of membrane type liquid dehumidifier 22 passes with semiconductor cooler 2 cold end and hot junction portion respectively
Thermally coupled, and the solution channel 220 in two membrane type liquid dehumidifiers 22 is for flowing for solution, protecting film 222 will completely cut off molten
The surface contact of liquid and the second heat pipe 221, to protect the second heat pipe 221 from the corrosion of solution, and adds based Dehumidification Membranes 223 and ensures sky
Steam in gas can free in and out solution channel 220, and solution cannot be by adding based Dehumidification Membranes 223.Second heat pipe 221 1 aspect
For carrying out heat exchange with semiconductor cooler 2, on the other hand the second heat pipe 221 utilizes the cold of its heat transfer or heat with outer
Solution in the solution channel 220 in portion carries out heat exchange, as required the solution in solution channel 220 is freezed or heating,
To realize the function of regulating environmental humidity, and, owing to the second heat pipe 221 can be rapidly performed by heat exchange with solution, thus
Can effectively improve the regulation efficiency of humidity, membrane type liquid dehumidifier 22 is integrated with solution dehumidification function；Preferably, the second heat
Being additionally provided with fin 224 on pipe 221, fin 224 offers multiple tube expansion hole 225, and the second heat pipe 221 is arranged on described tube expansion hole
In 225, described protecting film 222 and the described based Dehumidification Membranes 223 that adds also are located in described tube expansion hole 225, the edge in described tube expansion hole 225
It is provided with the breach 226 for passing for described solution flow channel 20, concrete, can be at solution channel in order to ensure solution
Flowing smoothly in 220, the tube expansion hole 225 of fin 224 is additionally provided with breach 226, breach 226 is formed for solution channel 220
The space passed, after the second heat pipe 221 tube expansion is arranged in tube expansion hole 225, the solution in solution channel 220 still can lead to
Cross breach 226 smooth outflow.Wherein, membrane type liquid dehumidifier 22, based on dissolving-diffusion mechanism, mainly utilizes the concentration of solution
Realize dehumidifying and humidification, and add based Dehumidification Membranes 223 and organic high molecular polymer film, inoranic membrane, liquid film etc. can be used to have water steaming
Gas, through the film of function, utilizes the high temperature and low temperature coolant produced in semiconductor cooler 2, for cold with semiconductor cooler 2
The solution of solution channel 220 on the second heat pipe 221 that end connects is used for absorbing moisture and dehumidifies, and for quasiconductor
The solution of the solution channel 220 on the second heat pipe 221 that refrigerator 2 hot junction portion connects is used for discharging moisture and humidifies.And
During actually used, the humidity in usual material storage room can be excessive and produce frost phenomenon, then will the described membrane type liquid of refrigeration
Dehumidifier 22 is arranged in material storage room, by described membrane type liquid dehumidifier 22, described Intermediate Heat Exchanger 25 and two institutes of heating
State solution pump 26 to be arranged in described cabin 11.
The present invention also provides for the refrigerating method of a kind of semiconductor refrigerating heat pipe-type freezer, uses above-mentioned semiconductor refrigerating heat pipe
Formula freezer；Described refrigerating method is:
Step 1, air pump start, and inflate support air bag and air spring so that form storage between adjacent two layers heat exchange water cushion
Object space；
Step 2, the first starting mode of pump, be delivered to the water freezed by semiconductor cooler in main water box in heat exchange water cushion follow
Ring.
Step 3, article to be transported are put between adjacent two-layer heat exchange water cushion, and regulate adjacent two layers heat-exchanging water
The air pressure of the air spring between pad so that article clip is between two-layer heat exchange water cushion.
Last it is noted that above example is only in order to illustrate technical scheme, it is not intended to limit；Although
With reference to previous embodiment, the present invention is described in detail, it will be understood by those within the art that: it still may be used
So that the technical scheme described in foregoing embodiments to be modified, or wherein portion of techniques feature is carried out equivalent；
And these amendment or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and
Scope.
Claims (10)
1. a semiconductor refrigerating heat pipe-type freezer, including heat room and machine room, it is characterised in that also include water-cooled module and half
Conductor refrigerator, described water-cooled module includes main water box, the first water pump, Multi-layer exchanging heat water cushion and air pump, in described heat exchange water cushion
Multiple support air bag is distributed, and described heat exchange water cushion has water inlet and water return outlet, and described water inlet is by corresponding electromagnetic valve
Being connected with described first water pump, described water return outlet is connected with described main water box by corresponding electromagnetic valve, described first water pump and
Described main water box connects, and the bottom of described heat exchange water cushion is provided with multiple air spring, described air spring and described support gas
Capsule is connected with described air pump by corresponding electromagnetic valve respectively, and described in multilamellar, heat exchange water cushion is stacked；Described quasiconductor system
The cold end of cooler is provided with the first heat pipe, and described first heat pipe is inserted in described main water box, described semiconductor cooler, described
Main water box, described first water pump and described air pump are positioned in described machine room, and described heat exchange water cushion is positioned in described material storage room.
Semiconductor refrigerating heat pipe-type freezer the most according to claim 1, it is characterised in that every layer of described heat exchange water cushion includes
Multiple separate water pockets, each described water pocket is configured with described support air bag and described air spring, multiple described water pockets
Being fixed together the most side by side, the two side of described water pocket is provided with support gas column, and described support gas column is by correspondence
Electromagnetic valve is connected with described air pump.
Semiconductor refrigerating heat pipe-type freezer the most according to claim 2 a, it is characterised in that sidepiece of described water pocket is for entering
Aquaporin, the other side is backwater channel, and the middle part of described water pocket is heat transmitting member；Described intake tunnel has described water inlet
Mouthful, described backwater channel have described water return outlet, described intake tunnel and described backwater channel respectively with described heat transmitting member it
Between form multiple permeable gap.
Semiconductor refrigerating heat pipe-type freezer the most according to claim 3, it is characterised in that multiple described permeable gap Yan Shui
Stream flow direction is progressively longer.
Semiconductor refrigerating heat pipe-type freezer the most according to claim 3, it is characterised in that described support air bag is overall in bar
Shape structure is also arranged between described intake tunnel and described backwater channel, and the both sides of described support air bag are respectively formed with multiple
Turbulent flow gas tooth, is formed between adjacent two described support air bag and connects described intake tunnel and the more turbulent flow of described backwater channel
Road.
Semiconductor refrigerating heat pipe-type freezer the most according to claim 5, it is characterised in that described support air bag is fixed on institute
Stating on the inwall of water pocket, described turbulent flow gas tooth is suspended in described water pocket.
Semiconductor refrigerating heat pipe-type freezer the most according to claim 1, it is characterised in that described semiconductor refrigerating heat pipe-type
Freezer also includes that dehumidification module, described dehumidification module include two membrane type liquid dehumidifiers, Intermediate Heat Exchanger and two solution pumps,
Described Intermediate Heat Exchanger includes the first heat exchanger channels and second heat exchanger channels of mutual heat exchange；Described membrane type liquid dehumidifier bag
Including the second heat pipe, protecting film and add based Dehumidification Membranes, described second heat pipe is wrapped with described protecting film, and described protecting film is wrapped with
The described based Dehumidification Membranes that adds, described protecting film and described adding, form solution channel between based Dehumidification Membranes；Wherein two of solution channel described in
Port outlet with the import of described first heat exchanger channels and described second heat exchanger channels respectively is connected, another described solution channel
Two-port be connected with outlet and the import of described second heat exchanger channels of described first heat exchanger channels respectively；Described first heat exchange
It is respectively arranged with described solution pump on passage and described second heat exchanger channels；Wherein the second heat pipe described in is arranged on and described partly leads
The cold end of chiller is also positioned in described material storage room, and another described second heat pipe is arranged on the heat of described semiconductor cooler
End；It is arranged on described second heat pipe in the hot junction portion of described semiconductor cooler, described Intermediate Heat Exchanger, two described solution
Pump is positioned in described machine room.
Semiconductor refrigerating heat pipe-type freezer the most according to claim 7, it is characterised in that also set up on described second heat pipe
Having fin, described fin to be provided with tube expansion hole, described second heat pipe is arranged in described tube expansion hole, described protecting film and described add
Based Dehumidification Membranes is positioned in described tube expansion hole, and the edge in described tube expansion hole is provided with the breach for passing for described solution channel.
Semiconductor refrigerating heat pipe-type freezer the most according to claim 1, it is characterised in that described semiconductor refrigerating heat pipe-type
Freezer includes multiple described heat room, is provided with described heat exchange water cushion in each described heat room.
10. the refrigerating method of a semiconductor refrigerating heat pipe-type freezer, it is characterised in that use institute as arbitrary in claim 1-9
The semiconductor refrigerating heat pipe-type freezer stated；Described refrigerating method is:
Step 1, air pump start, and inflate support air bag and air spring so that form storage between adjacent two layers heat exchange water cushion
Object space；
Step 2, the first starting mode of pump, be delivered to the water freezed by semiconductor cooler in main water box in heat exchange water cushion follow
Ring；
Step 3, article to be transported are put between adjacent two-layer heat exchange water cushion, and regulate adjacent two layers heat exchange water cushion it
Between the air pressure of air spring so that article clip is between two-layer heat exchange water cushion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610976000.4A CN106288502A (en) | 2016-11-07 | 2016-11-07 | Semiconductor refrigerating heat pipe-type freezer and refrigerating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610976000.4A CN106288502A (en) | 2016-11-07 | 2016-11-07 | Semiconductor refrigerating heat pipe-type freezer and refrigerating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106288502A true CN106288502A (en) | 2017-01-04 |
Family
ID=57721158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610976000.4A Pending CN106288502A (en) | 2016-11-07 | 2016-11-07 | Semiconductor refrigerating heat pipe-type freezer and refrigerating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106288502A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111365894A (en) * | 2020-03-08 | 2020-07-03 | 浙江大学 | Active heat-preservation semiconductor refrigerating device for full-sea-depth sampling |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1351245A (en) * | 2001-06-19 | 2002-05-29 | 沈康明 | Cold-heat exchanged heating or refrigerating unit with semiconductor refrigerating element and its making method |
| CN1428564A (en) * | 2001-12-27 | 2003-07-09 | 袁一军 | Air conditioning method for simultaneously removing humidity and cooling and its equipment |
| CN1554920A (en) * | 2003-12-27 | 2004-12-15 | 尹学军 | Heat pipe cold guide device and cold storage body and freezer with said device |
| CN201015121Y (en) * | 2007-02-05 | 2008-01-30 | 黄龙 | Water-cooling heat radiator of semiconductor refrigeration system |
| CN201178871Y (en) * | 2008-04-09 | 2009-01-14 | 梁盛权 | Circulation type semiconductor refrigeration heating pad |
| CN101344344A (en) * | 2008-08-25 | 2009-01-14 | 南京大学 | Heat pipe semiconductor refrigeration and cold accumulation system |
| CN102374804A (en) * | 2011-09-28 | 2012-03-14 | 江苏科技大学 | Heat pipe cold accumulation device |
| CN202598733U (en) * | 2012-05-18 | 2012-12-12 | 程刚 | Closed water circulation semiconductor refrigeration dehumidification air conditioning device |
| JP2013124841A (en) * | 2011-12-16 | 2013-06-24 | Toyota Motor Corp | Cooling device and method of manufacturing the same |
| CN104534777A (en) * | 2014-12-18 | 2015-04-22 | 重庆欣泰发食品有限公司 | Contact type freezing device |
| CN105310816A (en) * | 2014-07-18 | 2016-02-10 | 西安蓝茗医疗科技有限公司 | Medical semiconductor cold and hot compress machine and cold and hot compress technology thereof |
-
2016
- 2016-11-07 CN CN201610976000.4A patent/CN106288502A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1351245A (en) * | 2001-06-19 | 2002-05-29 | 沈康明 | Cold-heat exchanged heating or refrigerating unit with semiconductor refrigerating element and its making method |
| CN1428564A (en) * | 2001-12-27 | 2003-07-09 | 袁一军 | Air conditioning method for simultaneously removing humidity and cooling and its equipment |
| CN1554920A (en) * | 2003-12-27 | 2004-12-15 | 尹学军 | Heat pipe cold guide device and cold storage body and freezer with said device |
| CN201015121Y (en) * | 2007-02-05 | 2008-01-30 | 黄龙 | Water-cooling heat radiator of semiconductor refrigeration system |
| CN201178871Y (en) * | 2008-04-09 | 2009-01-14 | 梁盛权 | Circulation type semiconductor refrigeration heating pad |
| CN101344344A (en) * | 2008-08-25 | 2009-01-14 | 南京大学 | Heat pipe semiconductor refrigeration and cold accumulation system |
| CN102374804A (en) * | 2011-09-28 | 2012-03-14 | 江苏科技大学 | Heat pipe cold accumulation device |
| JP2013124841A (en) * | 2011-12-16 | 2013-06-24 | Toyota Motor Corp | Cooling device and method of manufacturing the same |
| CN202598733U (en) * | 2012-05-18 | 2012-12-12 | 程刚 | Closed water circulation semiconductor refrigeration dehumidification air conditioning device |
| CN105310816A (en) * | 2014-07-18 | 2016-02-10 | 西安蓝茗医疗科技有限公司 | Medical semiconductor cold and hot compress machine and cold and hot compress technology thereof |
| CN104534777A (en) * | 2014-12-18 | 2015-04-22 | 重庆欣泰发食品有限公司 | Contact type freezing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111365894A (en) * | 2020-03-08 | 2020-07-03 | 浙江大学 | Active heat-preservation semiconductor refrigerating device for full-sea-depth sampling |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106025438B (en) | Vehicle lithium battery humidity control system and its control method | |
| TWI600867B (en) | Refrigerator | |
| CN104748580B (en) | The indirect dry cooling tower of multilamellar cooling sector and antifreeze method thereof | |
| CN106288502A (en) | Semiconductor refrigerating heat pipe-type freezer and refrigerating method | |
| CN104943508B (en) | Car room register and its method for regulating temperature | |
| CN202569634U (en) | Gas condensing and backheating device | |
| CN106274631A (en) | Semiconductor refrigerating heat pipe-type cold chain transport vehicle and refrigerating method | |
| CN106477198A (en) | Semiconductor refrigerating heat pipe-type container and refrigerating method | |
| CN107031490A (en) | Refrigerating transport vehicle and refrigerating method | |
| CN106314253A (en) | Thermoelectric cooling type cold chain transport vehicle and cooling method thereof | |
| CN106099245B (en) | A kind of Intelligent lithium battery temperature control system and its control method | |
| CN107934229A (en) | A kind of fresh food hutch that energy is filled using semiconductor refrigerating and vortex tube refrigeration | |
| CN106347884A (en) | Semiconductor refrigeration type container and refrigeration method | |
| CN106440485A (en) | Magnetic refrigeration type cold chain transporting car and refrigerating method | |
| CN106524563A (en) | Semiconductor refrigeration heat-pipe type electric refrigerated truck and refrigeration method | |
| CN106482386A (en) | The electronic refrigerator car of environmental protection and refrigerating method | |
| CN106627046A (en) | Magnetic refrigeration type electric refrigerator car and refrigeration method | |
| CN106524562A (en) | Magnetic refrigeration-type container and refrigeration method | |
| CN203704455U (en) | Evaporator and ice temperature storehouse using same | |
| CN207778871U (en) | Heat-exchanger rig and water dispenser with it | |
| CN106524564A (en) | Semiconductor refrigeration type refrigeration warehouse and refrigeration method | |
| CN106374160B (en) | Vehicle lithium battery operating mode manages system and its control method | |
| CN106369868A (en) | Magnetic refrigeration type refrigeration house and refrigeration method | |
| CN106025140B (en) | A kind of Intelligent lithium battery humidity control system and its control method | |
| CN106494293A (en) | Cold chain transportation car and refrigerating method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |