CN106272747B - A kind of method and glued board preparation method improving wood materials bonding strength - Google Patents
A kind of method and glued board preparation method improving wood materials bonding strength Download PDFInfo
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- CN106272747B CN106272747B CN201610657893.6A CN201610657893A CN106272747B CN 106272747 B CN106272747 B CN 106272747B CN 201610657893 A CN201610657893 A CN 201610657893A CN 106272747 B CN106272747 B CN 106272747B
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- slab
- glued board
- electrostatic
- wood materials
- adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
- B27D1/08—Manufacture of shaped articles; Presses specially designed therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/10—Butting blanks of veneer; Joining same along edges; Preparatory processing of edges, e.g. cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D5/00—Other working of veneer or plywood specially adapted to veneer or plywood
- B27D5/006—Trimming, chamfering or bevelling edgings, e.g. lists
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27G—ACCESSORY MACHINES OR APPARATUS FOR WORKING WOOD OR SIMILAR MATERIALS; TOOLS FOR WORKING WOOD OR SIMILAR MATERIALS; SAFETY DEVICES FOR WOOD WORKING MACHINES OR TOOLS
- B27G11/00—Applying adhesives or glue to surfaces of wood to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
- B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
- B27K5/001—Heating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09J161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
- C09J161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
Abstract
The invention discloses a kind of methods and glued board preparation method improving wood materials bonding strength, belong to wood materials production preparation field.The present invention in pressure process by utilizing high-voltage electrostatic field to handle the wood materials of gluing, the both sides of wood materials are made to form powerful electrostatic potential, the bonding strength of wood materials fully meets requirement after processing, bonding strength is more than doubled compared with the wooden glueing material prepared using common gluing method, and the viscosity that the present invention solves adhesive is low, molar ratio is low, strike-through amount caused by wood porosity is big, the bonding strengths of wood materials are low and the technical problems such as Form aldehyde release.
Description
Technical field
The present invention relates to a kind of method improving bonding strength, more particularly to a kind of side for improving wood materials bonding strength
Method and glued board preparation method.
Background technology
Custom plywood manufacturing process include log block, boiling, rotary-cut or slicing, drying, be glued, mat formation, hot pressing,
It is cooling, the processes such as cut and sort.Wherein adhesive plays an important role to bonding strength.Considering production cost and glue
Under the factor for closing intensity, plywood production generally uses urea-formaldehyde resin adhesive.Due to the influence of Lauxite performance itself, such as
The factors such as low mole prop0rtion, low-free formaldehyde resin and lower solid content can all lead to the poor water resistance and bonding strength of glued board
The decline of (wet strength).It is not high according to the viscosity of adhesive meanwhile in manufacturing processes customary, especially non-dehydrated glue stick,
Adhesive is readily permeable in Wooden veneer, and timber is porous material, apparent so as to cause the gluing dosage at glue-line
It reduces, is unfavorable for gluing.
On the other hand, hot setting adhesive is usually in hot pressing, originally as temperature improves, adhesive viscosity drop
Low, X.Lu and A.Pizzi are pointed out：When glue-line temperature reaches 60-80 DEG C, viscosity is minimum, and dispersibility reaches maximum, later gluing
Agent viscosity sharply increases.Viscosity, which reduces, to be increased adhesive and passes through wood radiaftive rays in timber or crack infiltration [reference：X.Lu and
A.Pizzi,Substrate Influence on TTT and CHT Curing Diagrams of Wood Adhesives,
Holz als Roh-und Werkstoff.56(5)(1998):339-346], cause glue performance to significantly reduce.
Some studies at home and abroad show that, such as [author is money person of outstanding talent, and name of document is：《At the beginning of electric field is to poplar Bondibility
It visits》, come from《Zhejiang Forestry College》, 1999,16 (2)：109-113；Author is money person of outstanding talent etc., and name of document is：《Electric field is to poplar
The wooden Bondibility is visited again》, come from《Zhejiang Forestry College》, 1999,16 (2)：293-296], research uses lower pressure
Glued board is prepared, and adhesive is polyvinyl acetate emulsion, be the non-universal adhesive for preparing glued board, and the gluing of glued board
Strength-enhancing effect is not apparent；Be not fully solved simultaneously yet adhesive existing in the prior art viscosity is low, molar ratio
The problems such as strike-through amount caused by low, wood porosity is big, and the bonding strength of wooden glueing material is not high, and burst size of methanal is high；Especially
Its adhesive used for the country is without dehydration, and the above problem is more serious.
Invention content
1. technical problems to be solved by the inivention
For adhesive existing in the prior art viscosity it is low, molar ratio is low, strike-through amount caused by wood porosity is big,
The bonding strength of wooden glueing material is low, burst size of methanal and working environment whether the technical problems such as safety, the invention discloses
A kind of method and glued board preparation method improving wood materials bonding strength, by utilizing high-voltage electrostatic field in hot pressing
The wood materials after gluing are handled, the both sides of wood materials is made to form powerful electrostatic potential, even if the adhesive used is not
By (solid content is equal to or less than 50%) of dehydration, the bonding strength of wooden glueing material fully meets requirement after processing,
Bonding strength is more than doubled compared with the wooden glueing material prepared using common gluing method.
2. technical solution
Inventive principle：Based on Coulomb's law, electrostatic theory Vanutian rules and gather principle, if on small charged particle
When being mixed with the big particle of reversed polarity, agglomeration speed can be made to accelerate.In wood materials gluing procedures, cold pressing or hot pressing are carried out, when it
When temperature reaches 60 DEG C~80 DEG C, the viscosity of adhesive reaches minimum, and add high pressure electrostatic, under the action of high-voltage electrostatic field, first
Aldehyde is further perfect (see Fig. 3) with urea reaction, is obtained by infared spectrum：In lower wave number section, 1500-1575cm-1For amide Ι
Ι bands, characteristic peak gradually shift to lower wave number, illustrate that response intensity becomes larger, and reaction is more complete；In 985-1035cm-1It is interior, wave crest
Intensity gradually increases, and illustrates that methylol group content increases, the adhesive crosslink density after solidification is made to increase.In addition, quiet in high pressure
Under electric condition, adhesive molecular polarityization and orientationization increase the anti-of urea and formaldehyde to obtain more chemical bonds
Answer probability.Finally, aggregation phenomenon occurs for adhesive, and is agglomerated on wood materials splicing face, to improve the glue of wood materials
Intensity is closed, burst size of methanal is reduced；And low voltage electrostatic can not promote adhesive orientationization and gather, and be not fully solved existing
The viscosity of adhesive present in technology is low, molar ratio is low, the glue of big, the wooden glueing material of strike-through amount caused by wood porosity
The problems such as closing not high intensity and burst size of methanal；The adhesive used particularly with the country is without dehydration, the above problem
It is more serious.Therefore, bonding strength is not acted on significantly.
In order to solve the above technical problems, the present invention is realized by following embodiments：
A method of wood materials bonding strength being improved, step includes：
Wood materials after gluing add high pressure electrostatic to the wood materials both sides after gluing in its pressure process, are formed
Final wooden glueing material.
Preferably in pressure process, the wood materials after gluing are increased along the both sides in hot pressing direction in hot pressing
Press electrostatic.
Preferred high-pressure electrostatic, that is, after connecing electricity, the voltage difference of the wood materials both sides after gluing is at least 1kV.Such as, pass through
HV generator connects negative plate on the upside of the wood materials after gluing, and negative pressure is at least 1kV (kilovolt) or more；It is grounded pole plate
On the downside of the wood materials for being 0kV after gluing.
It preferably adds high pressure electrostatic to the wood materials both sides after gluing, processing time is at least 200s or more；And it is logical
It crosses HV generator and connects negative plate on the upside of the wood materials after gluing, under wood materials of the ground connection pole plate after gluing
Side.
The moisture content of preferred wood materials is 8 ± 3%；High-pressure electrostatic processing time is 300s to 500s.
Wood materials after the preferred gluing, the adhesive used are without dehydration, and solid content is equal to or small
In 50%.
A kind of glued board preparation method, includes the following steps：
(1) by timber rotary-cut or slicing at Wooden veneer；
(2) to treated in step (1), Wooden veneer is dried；
(3) to treated in step (2), Wooden veneer carries out covering with paint adhesive, and curing agent chlorine is added in adhesive
Change ammonium；
(4) to treated in step (3), Wooden veneer carries out assembly；
(5) hot pressing is carried out to treated in step (4) slab, added high pressure electrostatic to slab both sides along hot pressing direction, it will
HV generator connects negative plate on the upside of slab, and negative pressure is 1-15kV or more；Ground connection pole plate is 0kV on the downside of slab；
(6) to the slab handled in step (5), electrostatic is closed immediately after reaching the electrostatic treatment time；
(7) to treated in step (6) slab, after reaching hot pressing time, release, cooling, cutting edge and sanding processing, system
Obtain glued board.
Preferably, the thickness of Wooden veneer is 2.6-2.8mm in the step (1)；The drying of the step (2),
It is carried out in drying box, drying temperature is 50 DEG C, time 12h, and whole moisture content is 8 ± 3%.
Preferably, adhesive described at the step (3) is Lauxite, and without dehydration, solid content is
Less than or equal to 50%, the molar ratio of formaldehyde and urea is 1.5, and ammonium chloride is the 0.5-1.5% of the weight of Lauxite, two-sided to apply
Glue amount is 200-300g/m2。
Preferably, slab described in step (4) is vertical, and-cross-indulges three layers or odd-level assemble pattern, hot pressing condition 95
DEG C -110 DEG C, unit pressure 1MPa, hot pressing time 20-60s/mm；Step (6) high-pressure electrostatic processing time is 300s-500s.
3. advantageous effect
It is glued by using high-voltage electrostatic field processing wood materials, distribution, orientation and the movement of adhesive are influenced, to make
The adhesives of wood materials both sides generates aggregation phenomenon, solve low mole prop0rtion adhesive for wood materials glue performance difference and
The problem of poor water resistance, and reduce the influence of timber itself porosity defect, obtain wooden glueing material bonding strength
The effect of multiplication greatly reduces adhesive and timber itself to the adverse effect of wooden glueing material, considerably improves glue
Intensity is closed, high performance wooden glueing material has been obtained.
Simultaneously using the wood materials in high-pressure electrostatic condition processing hot pressing, the glue of wooden glueing material is not only improved
Intensity is closed, and high-pressure electrostatic method consumption power is small, to realize the preparation of low cost, the wooden glueing material of high-performance.
Description of the drawings：
Fig. 1 (a) is microcosmic at glued board vertical and horizontal veneer (the no crack degree) bonding layer for not adding electrostatic treatment to prepare
Structural map, wherein 1-longitudinal veneer, 2-bonding layers, 3-lateral veneers；
Fig. 1 (b) is the glue at glued board vertical and horizontal veneer (the no crack degree) bonding layer for not adding electrostatic treatment to prepare
The microtexture figure (being free of Timber sections) of glutinous agent distribution in two veneers, wherein white portion is the distribution shape of adhesive
State, picture background are black；
At glued board vertical and horizontal veneer (no crack degree) bonding layer prepared after being electrostatic treatment 500s Fig. 2 (a)
Microtexture figure, wherein 1-longitudinal veneer, 2-bonding layers, 3-lateral veneers；
At glued board vertical and horizontal veneer (no crack degree) bonding layer prepared after being electrostatic treatment 500s Fig. 2 (b)
Adhesive distribution in two veneers microtexture figure (be free of Timber sections), wherein white portion is point of adhesive
Cloth form, picture background are black；
Fig. 3 (a) is micro- at glued board vertical and horizontal veneer (the crack degree 38%) bonding layer for not adding electrostatic treatment to prepare
See structural map, wherein 1-longitudinal veneer, 2-bonding layers, 3-lateral veneers；
Fig. 3 (b) is not plus at glued board vertical and horizontal veneer (crack degree 38%) bonding layer of electrostatic treatment preparation
The microtexture figure (being free of Timber sections) of adhesive distribution in two veneers, wherein white portion is the distribution of adhesive
Form, picture background are black；
Glued board vertical and horizontal veneer (crack degree 38%) bonding layer prepared after being electrostatic treatment 500s Fig. 4 (a)
Locate microtexture figure, wherein 1-longitudinal veneer, 2-bonding layers, 3-lateral veneers；
Glued board vertical and horizontal veneer (crack degree 38%) bonding layer prepared after being electrostatic treatment 500s Fig. 4 (b)
The microtexture figure (being free of Timber sections) of the adhesive at place distribution in two veneers, wherein white portion is adhesive
Distributional pattern, picture background are black；
Fig. 5 is the Lauxite in the glued board (crack degree 38%) prepared not plus after electrostatic treatment and electrostatic treatment 500s
Fourier transform infrared spectroscopy figure.
Specific implementation mode：
Embodiment 1：
A kind of manufacturing method efficiently being improved wooden glueing material bonding strength using high-pressure electrostatic, is included the following steps：
1) slicing：The good southern loose veneer of slicing (no crack degree), thickness is the Wooden veneer of 2.6-2.8mm, dry
It is carried out in dry case, drying temperature is 50 DEG C, time 12h, and whole moisture content is 7%.
2) gluing：Wooden veneer after drying is subjected to covering with paint adhesive, and curing agent ammonium chloride is added in adhesive,
Adhesive is Lauxite, and formaldehyde is F/U=1.5 with urea mol ratio, and ammonium chloride is the 1% of Lauxite weight, two-sided to apply
Glue amount is 300g/m2, solid content 50%.
3) assembly：It is-horizontal-according to the vertical of glued board to indulge three layers of assemble pattern, prepare the slab of three-decker glued board.
4) hot pressing and the electrostatic that adds high pressure：After slab is put into press, HV generator is connect into negative plate on slab
Side, negative pressure 10kV；It is 0kV on the downside of the slab to be grounded pole plate, opens HV generator, electrostatic treatment time difference immediately
For 0s (untreated), 200s, 300s and 500s.Hot pressing condition is 110 DEG C, and slab pressure is 1.0MPa, hot pressing time 60s/mm
(every millimeter of second).
5) electrostatic generator is closed：Electrostatic generator is closed after reaching high-pressure electrostatic processing time.
6) release：After reaching hot pressing time, hot pressing terminates, and slab is taken out in release, then cooling, cutting edge and sanding processing,
The glued board of system.
According to the glued board detection data (GB/T 17657-2013) for the wood materials that the process of embodiment 1 obtains, such as table
1 and table 2 shown in；Fig. 1 (a) is microtexture figure at the glued board vertical and horizontal veneer bonding layer for not adding electrostatic treatment to prepare,
Wherein, longitudinal veneer 1, bonding layer 2, lateral veneer 3；And Fig. 1 (b) is not plus the glued board of electrostatic treatment preparation is longitudinal and horizontal
To the microtexture figure (being free of Timber sections) of the distribution in two veneers of the adhesive at veneer bonding layer, wherein white portion
It is divided into the distributional pattern of adhesive, picture background is black.And glued board prepared after being electrostatic treatment 500s Fig. 2 (a) is vertical
To with microtexture figure at lateral veneer bonding layer, wherein longitudinal veneer 1, bonding layer 2, lateral veneer 3；Fig. 2 (b) is electrostatic
Handle the adhesive at prepared glued board vertical and horizontal veneer bonding layer after 500s in two veneers distribution it is micro-
Structural map (being free of Timber sections) is seen, wherein white portion is the distributional pattern of adhesive, and picture background is black.From above-mentioned figure
In reflect glued by using high-voltage electrostatic field processing wood materials, distribution, orientation and the movement of adhesive are influenced, to make
The adhesives of wood materials both sides generates aggregation phenomenon, solve low mole prop0rtion adhesive for wood materials glue performance difference and
The problem of poor water resistance, and reduce the influence of timber itself porosity defect, obtain wooden glueing material bonding strength
The effect of multiplication greatly reduces adhesive and timber itself to the adverse effect of wooden glueing material, considerably improves glue
Close intensity.
The bonding strength detection data of 1 wood materials glued board of table
The glued board burst size of methanal detection data of 2 wood materials of table
| The electrostatic treatment time (s) | Burst size of methanal (mg/L) |
| 0 | 3 |
| 500 | 2.7 |
Embodiment 2：
A kind of manufacturing method efficiently being improved wooden glueing material bonding strength using high-pressure electrostatic, is included the following steps：
With embodiment 1, difference is implementation steps,
1) rotary-cut：The good Wooden veneer of rotary-cut (crack degree 38%), thickness are the veneer of 2.6-2.8mm, and moisture content is
7%.
2) gluing：Adhesive is Lauxite, and formaldehyde is F/U=1.5 with urea mol ratio, and ammonium chloride is Lauxite weight
The 1.5% of amount, two-sided resin added are 300g/m2, solid content 47%.
3) assembly：According to the assemble pattern of glued board, three-decker glued board is prepared.
4) hot pressing and the electrostatic that adds high pressure：HV generator is connect into negative plate on the upside of slab, negative pressure 10kV；Ground connection
Pole plate is 0kV on the downside of slab.After slab is put into press, open electrostatic generator immediately, the electrostatic treatment time be respectively 0s,
300s and 500s.Hot pressing condition is 110 DEG C, and slab pressure is 1.0MPa, hot pressing time 60s/mm.
5) electrostatic generator is closed：Electrostatic generator is closed after reaching high-pressure electrostatic processing time
6) release：After hot pressing, slab is taken out in release, then cooling, cutting edge, sanding processing, the glued board of system.
According to the detection data (GB/T 17657-2013) for the wood materials glued board that the process of embodiment 2 obtains, such as table
Shown in 3；Fig. 3 (a) is microtexture figure at the glued board vertical and horizontal veneer bonding layer for not adding electrostatic treatment to prepare, wherein
Longitudinal veneer 1, bonding layer 2, lateral veneer 3；Fig. 3 (b) is the glued board vertical and horizontal veneer glue for not adding electrostatic treatment to prepare
The microtexture figure (being free of Timber sections) of the distribution in two veneers of the adhesive at layer is connect, wherein white portion is gluing
The distributional pattern of agent, picture background are black.Glued board vertical and horizontal list prepared after being electrostatic treatment 500s Fig. 4 (a)
Microtexture figure at plate bonding layer, wherein longitudinal veneer 1, bonding layer 2, lateral veneer 3；After Fig. 4 (b) is electrostatic treatment 500s
The microtexture figure of adhesive distribution in two veneers at prepared glued board vertical and horizontal veneer bonding layer is (no
Containing Timber sections), wherein white portion is the distributional pattern of adhesive, and picture background is black；Fig. 5 be not plus electrostatic treatment and
The Fourier transform infrared spectroscopy figure of Lauxite in the glued board prepared after electrostatic treatment 500s.Reflect from above-mentioned figure
Go out, under the conditions of high-pressure electrostatic, adhesive molecular polarityization and orientationization increase urine to obtain more chemical bonds
The reaction probabilities of element and formaldehyde.Finally, aggregation phenomenon occurs for adhesive, and is agglomerated on wood materials splicing face, to improve
The bonding strength of wood materials.It is obtained by infared spectrum：Under the action of high-voltage electrostatic field, formaldehyde is further complete with urea reaction
It is kind, in lower wave number section, 1500-1575cm-1For amide Ι Ι bands, characteristic peak gradually shifts to lower wave number, illustrates that response intensity becomes
Greatly, react more complete；In 985-1035cm-1Interior, peak intensity gradually increases, and illustrates that methylol group content increases, makes solidification
Adhesive crosslink density afterwards rises.
The bonding strength detection data of 3 wood materials glued board of table
What it is due to the veneer selection in the table 1 of embodiment 1 is southern loose veneer, i.e., without crack degree；And the plate in embodiment 2
Base material selection is rotary cut venner, and it is 38% to have crack degree, crack degree.A part of adhesive can be retained in crack, therefore
Bonding strength increase rate can reduce, but all be higher than existing test data.
Embodiment 3：
Step is carried out with embodiment 2 in drying box, and drying temperature is 50 DEG C, time 12h, and whole moisture content is
8%.Difference lies in the solid content 50% of adhesive, formaldehyde is F/U=1.5 with urea mol ratio, and ammonium chloride is Lauxite weight
The 0.5% of amount, two-sided resin added are 200g/m2。
According to the detection data (GB/T 17657-2013) for the wood materials that the process of embodiment 3 obtains, as shown in table 4：
The bonding strength detection data of 4 wood materials glued board of table
Embodiment 4：
Step is with embodiment 2, and difference lies in the solid content 50% of adhesive, formaldehyde is F/U=1.5 with urea mol ratio,
Ammonium chloride is the 1% of Lauxite weight, and hot pressing temperature is 95 DEG C.
According to the detection data (GB/T 17657-2013) for the wood materials that the process of embodiment 4 obtains, as shown in table 5：
The bonding strength detection data of 5 wood materials glued board of table
Embodiment 5：
Step is carried out with embodiment 2 in drying box, and drying temperature is 50 DEG C, time 12h, and whole moisture content is
5%.Difference lies in the solid content 50% of adhesive, formaldehyde is F/U=1.5 with urea mol ratio, and ammonium chloride is Lauxite weight
The 1% of amount, odd-level assemble pattern are five-layer structure glued board, and hot pressing temperature is 100 DEG C.
According to the detection data (GB/T 17657-2013) for the wood materials that the process of embodiment 5 obtains, as shown in table 6：
The bonding strength detection data of 6 wood materials glued board of table
Embodiment 6：
Step is with embodiment 2, and difference lies in the solid content 50% of adhesive, HV generator connects negative plate in slab
Upside, negative pressure 1kV；Ground connection pole plate is 0kV on the downside of slab.Obtained slab is examined according to GB/T17657-2013
It surveys.The bonding strength of high-pressure electrostatic treated glued board is not higher than plus the slab rigidity of electrostatic, and treated for high-pressure electrostatic
Glued board bonding strength is met the requirements of the standard.
Embodiment 7：
With embodiment 2, difference lies in carry out, drying temperature is 50 DEG C, and time 12h contains eventually step in drying box
Water rate is 11%.The solid content 50% of adhesive, HV generator connect negative plate on the upside of slab, negative pressure 15kV；It connects
Ground pole plate is 0kV on the downside of slab.Obtained slab is detected according to GB/T 17657-2013.After high-pressure electrostatic processing
Glued board bonding strength higher than not plus the slab rigidity of electrostatic, and treated that glued board bonding strength accords with for high-pressure electrostatic
Standardization requirement.
Embodiment 8：
Step is with embodiment 2, and difference lies in the solid content of adhesive is 50%, is pressurizeed to slab left side, right side, high pressure
Electrostatic generator connects negative plate on the left of slab, connects negative plate and slab right side.Obtained slab is according to GB/T 17657-
2013 are detected.The bonding strength of high-pressure electrostatic treated glued board is not higher than plus the slab rigidity of electrostatic, and high pressure is quiet
Glued board bonding strength after electric treatment is met the requirements of the standard.
Embodiment 9：
Step is with embodiment 2, and difference lies in the solid content of adhesive is 30%, and obtained slab is according to GB/T
17657-2013 is detected.The bonding strength of high-pressure electrostatic treated glued board higher than not plus the slab rigidity of electrostatic, and
Treated that glued board bonding strength is met the requirements of the standard for high-pressure electrostatic.
Embodiment 10：
Step is with embodiment 2, and difference lies in the solid content of adhesive is 40%, and obtained slab is according to GB/
T17657-2013 is detected.The bonding strength of high-pressure electrostatic treated glued board higher than not plus the slab rigidity of electrostatic, and
Treated that glued board bonding strength is met the requirements of the standard for high-pressure electrostatic.
Embodiment 11：
A kind of manufacturing method efficiently being improved wood materials bonding strength using high-pressure electrostatic, is included the following steps：
1) rotary-cut：The good Wooden veneer of rotary-cut (crack degree 38%), thickness are the veneer of 2.6-2.8mm, and moisture content is
7%.
2) gluing：Adhesive is phenolic resin, and solid content 50%, two-sided resin added is 250g/m2。
3) assembly：According to the assemble pattern of laminated veneer lumber, nine layers of structural veneer laminated timber are prepared.
4) hot pressing and the electrostatic that adds high pressure：HV generator is connect into negative plate on the upside of slab, negative pressure 10kV；Ground connection
Pole plate is 0kV on the downside of slab.After slab is put into press, electrostatic generator is opened immediately.Hot pressing condition is 145 DEG C, slab
Unit pressure is 1.0MPa, hot pressing time 60s/mm.
5) electrostatic generator is closed：Electrostatic generator is closed after reaching high-pressure electrostatic processing time
6) release：After hot pressing, slab, then cooling, cutting edge, sorting are taken out in release.
According to the detection data (GB/T 20241-2006) for the wood materials that the process of embodiment 11 obtains, such as 7 institute of table
Show：
The dipping and stripping rate detection data of 7 wood materials of table
Embodiment 12：
The manufacturing method for improving wood materials laminated wood bonding strength, includes the following steps：
1) saw lumber：The Southern Pine sawn timber made is sawed, thickness and width is respectively 16mm and 140mm, moisture content 10%.
2) gluing：Adhesive is resorcinol-phenol-formaldehyde copolymer resins, and solid content 50%, two-sided resin added is
250g/m2。
3) assembly：According to the assemble pattern of laminated wood, the slab of three-decker laminated wood is prepared.
4) hot pressing and the electrostatic that adds high pressure：HV generator is connect into negative plate on the upside of slab, negative pressure 10kV；Ground connection
Pole plate is 0kV on the downside of slab.After slab is put into press, electrostatic generator is opened immediately.Hot pressing condition is 145 DEG C, slab
Unit pressure is 1.0MPa, hot pressing time 60s/mm.
5) electrostatic generator is closed：Electrostatic generator is closed after reaching high-pressure electrostatic processing time
6) release：After hot pressing, material is taken out in release, and it is glued to prepare three-decker for then cooling, cutting edge and sorting
Wood.
According to the detection data (GB/T 26899-2011) for the wood materials that the process of embodiment 12 obtains.High-pressure electrostatic
The bonding strength of treated wood materials laminated wood is not higher than plus the laminated wood intensity of electrostatic, and high-pressure electrostatic treated glue
Intensity is closed to meet the requirements of the standard.
Claims (4)
1. a kind of glued board preparation method, includes the following steps：
（1）By timber rotary-cut or slicing at Wooden veneer；
（2）To step（1）In treated that Wooden veneer is dried；
（3）To step（2）In treated Wooden veneer carries out covering with paint adhesive, and curing agent chlorination is added in adhesive
Ammonium；
（4）To step（3）In treated Wooden veneer carry out assembly；
（5）To step（4）In treated slab carry out hot pressing, add high pressure electrostatic to slab both sides along hot pressing direction, by high pressure
Electrostatic generator connects negative plate on the upside of slab, and negative pressure is 1-15kV or more；Ground connection pole plate is 0kV on the downside of slab；
（6）To step（5）In treated slab, close electrostatic immediately after reaching the electrostatic treatment time；
（7）To step（6）In treated slab, after reaching hot pressing time, release, cooling, cutting edge and sanding processing are made most
Whole glued board.
2. glued board preparation method according to claim 1, which is characterized in that the step（1）Middle Wooden veneer
Thickness is 2.6-2.8mm；The step（2）Drying, carried out in drying box, drying temperature be 50 DEG C, time 12h,
Whole moisture content is 8 ± 3%.
3. glued board preparation method according to claim 1, which is characterized in that the step（3）Locate the gluing
Agent is Lauxite, and without dehydration, solid content is less than or equal to 50%, and the molar ratio of formaldehyde and urea is 1.5, chlorination
Ammonium is the 0.5-1.5% of the weight of Lauxite, and two-sided resin added is 200-300g/m2。
4. glued board preparation method according to claim 1, which is characterized in that step（4）It is odd-level to locate the slab
Assemble pattern, hot pressing condition are 95 DEG C -110 DEG C, unit pressure 1MPa, hot pressing time 20-60s/mm；Step（6）High pressure
The electrostatic treatment time is 300s-500s.
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