CN106272747A - A kind of method improving wood materials bonding strength and plywood preparation method - Google Patents

A kind of method improving wood materials bonding strength and plywood preparation method Download PDF

Info

Publication number
CN106272747A
CN106272747A CN201610657893.6A CN201610657893A CN106272747A CN 106272747 A CN106272747 A CN 106272747A CN 201610657893 A CN201610657893 A CN 201610657893A CN 106272747 A CN106272747 A CN 106272747A
Authority
CN
China
Prior art keywords
wood materials
electrostatic
bonding strength
gluing
slab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610657893.6A
Other languages
Chinese (zh)
Other versions
CN106272747B (en
Inventor
卢晓宁
何倩
张海洋
鞠泽辉
王志强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Forestry University
Original Assignee
Nanjing Forestry University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Forestry University filed Critical Nanjing Forestry University
Priority to CN201810863116.6A priority Critical patent/CN109571661B/en
Priority to CN201610657893.6A priority patent/CN106272747B/en
Publication of CN106272747A publication Critical patent/CN106272747A/en
Application granted granted Critical
Publication of CN106272747B publication Critical patent/CN106272747B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27DWORKING VENEER OR PLYWOOD
    • B27D1/00Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B27D1/04Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
    • B27D1/08Manufacture of shaped articles; Presses specially designed therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27DWORKING VENEER OR PLYWOOD
    • B27D1/00Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B27D1/10Butting blanks of veneer; Joining same along edges; Preparatory processing of edges, e.g. cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27DWORKING VENEER OR PLYWOOD
    • B27D5/00Other working of veneer or plywood specially adapted to veneer or plywood
    • B27D5/006Trimming, chamfering or bevelling edgings, e.g. lists
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27GACCESSORY MACHINES OR APPARATUS FOR WORKING WOOD OR SIMILAR MATERIALS; TOOLS FOR WORKING WOOD OR SIMILAR MATERIALS; SAFETY DEVICES FOR WOOD WORKING MACHINES OR TOOLS
    • B27G11/00Applying adhesives or glue to surfaces of wood to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27KPROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K5/00Treating of wood not provided for in groups B27K1/00, B27K3/00
    • B27K5/001Heating
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/22Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C09J161/24Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea

Abstract

The invention discloses a kind of method improving wood materials bonding strength and plywood preparation method, belong to wood materials and produce preparation field.The present invention processes the wood materials of gluing by utilizing high-voltage electrostatic field in pressure process, the both sides making wood materials form powerful electrostatic potential, after process, the bonding strength of wood materials fully meets requirement, bonding strength is more than doubled compared with using the collose condensation material prepared of common gluing method, and the present invention solves that the strike-through amount that viscosity is low, mol ratio is low, wood porosity the causes bonding strength big, wood materials of adhesive is low and the technical problem such as Form aldehyde release.

Description

A kind of method improving wood materials bonding strength and plywood preparation method
Technical field
The present invention relates to a kind of method improving bonding strength, particularly to a kind of side improving wood materials bonding strength Method and plywood preparation method.
Background technology
Custom plywood manufacturing process include log block, steaming and decocting, rotary-cut or slicing, be dried, applying glue, mat formation, hot pressing, Cooling, cut and the operation such as sorting.Wherein bonding strength is played an important role by adhesive.Considering production cost and glue Closing under the factor of intensity, plywood production generally uses urea-formaldehyde resin adhesive.Due to the impact of the performance of Lauxite own, as The factors such as low mole prop0rtion, low-free formaldehyde resin and relatively low solid content all can cause poor water resistance and the bonding strength of plywood The decline of (wet strength).Meanwhile, in manufacturing processes customary, the viscosity according to adhesive is the highest, especially non-dehydrated glue stick, Adhesive is readily permeable in Wooden veneer, and timber is porous material, thus causes the gluing dosage at glue-line obvious Reduce, be unfavorable for gluing.
On the other hand, hot setting adhesive, generally in hot pressing, originally improves along with temperature, adhesive viscosity drop Low, X.Lu and A.Pizzi points out: when glue-line temperature reaches 60-80 DEG C, and viscosity is minimum, and dispersibility reaches maximum, the most gluing Agent viscosity sharply increases.Viscosity reduces increasing adhesive by the xylem ray in timber or crack infiltration [reference: X.Lu and A.Pizzi,Substrate Influence on TTT and CHT Curing Diagrams of Wood Adhesives, Holz als Roh-und Werkstoff.56 (5) (1998): 339-346], cause glue performance to significantly reduce.
Some researchs both at home and abroad show, as [author is Qian Jun etc., and name of document is: " at the beginning of electric field is to poplar Bondibility Visit ", from " Zhejiang Forestry College ", 1999,16 (2): 109-113;Author is Qian Jun etc., and name of document is: " electric field is to poplar Wood the visiting again of Bondibility ", from " Zhejiang Forestry College ", 1999,16 (2): 293-296], its research uses lower pressure Prepare plywood, and adhesive is polyvinyl acetate emulsion, be the non-universal adhesive of preparing plywood, and the gluing of plywood Strength-enhancing effect is not clearly;It is not fully solved that the viscosity of adhesive present in prior art is low, mol ratio simultaneously yet The problems such as the strike-through amount that low, wood porosity causes is big, and the bonding strength of collose condensation material is the highest, and burst size of methanal is high;Especially Its for domestic employing adhesive without dehydration, the problems referred to above are more serious.
Summary of the invention
1. invention to solve the technical problem that
Big for the strike-through amount that viscosity is low, mol ratio is low, wood porosity causes of adhesive present in prior art, The technical problems such as the bonding strength of collose condensation material is low, burst size of methanal and working environment whether safety, the invention discloses A kind of method improving wood materials bonding strength and plywood preparation method, by utilizing high-voltage electrostatic field in hot pressing Process the wood materials after gluing, make the both sides of wood materials form powerful electrostatic potential, even if the adhesive used is not Through (solid content is equal to or less than 50%) of dehydration, after process, the bonding strength of collose condensation material fully meets requirement, Bonding strength is more than doubled compared with the collose condensation material using common gluing method to prepare.
2. technical scheme
Inventive principle: based on Coulomb's law, electrostatic theory Vanutian is regular and gathers principle, if on small charged particle When being mixed with the big particle of reversed polarity, cohesion speed can be made to accelerate.At wood materials gluing procedures, carry out colding pressing or hot pressing, when it When temperature reaches 60 DEG C~80 DEG C, the viscosity of adhesive reaches minimum, and add high pressure electrostatic, under the effect of high-voltage electrostatic field, and first Aldehyde and urea reaction the most perfect (see Fig. 3), drawn by infared spectrum: at lower wave number section, 1500-1575cm-1For amide Ι Ι carries, and its characteristic peak gradually shifts to lower wave number, illustrates that response strength becomes big, reacts more complete;At 985-1035cm-1In, crest Intensity gradually strengthens, and illustrates that methylol group content increases, and makes the adhesive crosslink density after solidification increase.In addition, quiet at high pressure Under the conditions of electricity, adhesive molecular polarityization and orientationization, thus obtain more chemical bond, add the anti-of carbamide and formaldehyde Answer probability.Finally, adhesive generation aggregation phenomenon, and condense on wood materials splicing face, thus improve the glue of wood materials Close intensity, reduce burst size of methanal;And low voltage electrostatic cannot promote adhesive orientationization and gather, and it is not fully solved existing The strike-through amount that present in technology, the viscosity of adhesive is low, mol ratio is low, wood porosity causes is big, the glue of collose condensation material Close that intensity is the highest and the problem such as burst size of methanal;Particularly with domestic employing adhesive without dehydration, the problems referred to above More serious.Therefore, bonding strength is the most significantly acted on.
For solving above-mentioned technical problem, the present invention is realized by following embodiment:
A kind of method improving wood materials bonding strength, its step includes:
Wood materials after gluing is in its pressure process, and add high pressure electrostatic to the wood materials both sides after gluing, is formed Final collose condensation material.
Preferably in pressure process, in hot pressing, the wood materials after gluing is increased along the both sides in hot pressing direction Pressure electrostatic.
Preferably high-pressure electrostatic, after i.e. connecing electricity, the voltage difference of the wood materials both sides after gluing is at least 1kV.As, pass through HV generator connects on the upside of negative plate wood materials after gluing, and negative pressure is more than at least 1kV (kilovolt);Ground connection pole plate On the downside of 0kV wood materials after gluing.
Preferably add high pressure electrostatic to the wood materials both sides after gluing, and its process time is at least more than 200s;And it is logical Cross HV generator and connect on the upside of negative plate wood materials after gluing, under ground connection pole plate wood materials after gluing Side.
Preferably the moisture content of wood materials is 8 ± 3%;The high-pressure electrostatic process time is 300s to 500s.
Wood materials after preferred described gluing, its adhesive used is equal to or little without dehydration, solid content In 50%.
A kind of plywood preparation method, comprises the following steps:
(1) timber rotary-cut or slicing are become Wooden veneer;
(2) Wooden veneer after processing in step (1) is dried;
(3) Wooden veneer after processing in step (2) carries out covering with paint, lacquer, colour wash, etc. adhesive, and in adhesive, add firming agent chlorine Change ammonium;
(4) Wooden veneer after processing in step (3) is carried out assembly;
(5) slab after processing in step (4) being carried out hot pressing, add high pressure to slab both sides electrostatic along hot pressing direction, will HV generator connects negative plate on the upside of slab, and negative pressure is more than 1-15kV;Ground connection pole plate is that 0kV is on the downside of slab;
(6) to the slab processed in step (5), electrostatic after reaching the Electrostatic Treatment time, is closed immediately;
(7) to the slab after processing in step (6), after reaching hot pressing time, release, cooling, cutting edge and sanding process, system Obtain plywood.
Preferably, in described step (1), the thickness of Wooden veneer is 2.6-2.8mm;Being dried of described step (2), Carrying out in drying baker, baking temperature is 50 DEG C, and the time is 12h, and whole moisture content is 8 ± 3%.
Preferably, the described adhesive described in step (3) place is Lauxite, and without processed, solid content is Less than or equal to 50%, the mol ratio of formaldehyde and carbamide is 1.5, and ammonium chloride is the 0.5-1.5% of the weight of Lauxite, two-sided executes Glue amount is 200-300g/m2
Preferably, slab described in step (4) is vertical-horizontal-vertical three layers or odd-level assemble pattern, and its hot pressing condition is 95 DEG C-110 DEG C, unit pressure is 1MPa, hot pressing time 20-60s/mm;Step (6) the high-pressure electrostatic process time is 300s-500s.
3. beneficial effect
Glued by utilizing high-voltage electrostatic field to process wood materials, affect the distribution of adhesive, orient and move, so that The adhesive of wood materials both sides produces aggregation phenomenon, solve low mole prop0rtion adhesive for wood materials glue performance difference and The problem of poor water resistance, and decrease the impact of timber self porous defect, it is thus achieved that collose condensation material bonding strength The effect of multiplication, greatly reduces adhesive and the timber adverse effect to collose condensation material itself, considerably improves glue Close intensity, obtain high performance collose condensation material.
Utilize high-pressure electrostatic condition to process the wood materials in hot pressing simultaneously, not only improve the glue of collose condensation material Close intensity, and high-pressure electrostatic method power consumption is little, it is achieved thereby that low cost, the preparation of high-performance collose condensation material.
Accompanying drawing illustrates:
Fig. 1 (a) is not for add microcosmic at plywood vertical and horizontal veneer (without crack degree) bonding layer prepared by Electrostatic Treatment Structural map, wherein, 1 longitudinal veneer, 2 bonding layers, 3 horizontal veneers;
Fig. 1 (b) is not for add the glue at plywood vertical and horizontal veneer (without crack degree) bonding layer prepared by Electrostatic Treatment The microtexture figure (without Timber sections) of glutinous agent distribution in two veneers, wherein white portion is the distribution shape of adhesive State, picture background is black;
Fig. 2 (a) is at plywood vertical and horizontal veneer (without crack degree) bonding layer prepared after Electrostatic Treatment 500s Microtexture figure, wherein, 1 longitudinal veneer, 2 bonding layers, 3 horizontal veneers;
Fig. 2 (b) is at plywood vertical and horizontal veneer (without crack degree) bonding layer prepared after Electrostatic Treatment 500s The microtexture figure (without Timber sections) of adhesive distribution in two veneers, wherein white portion be adhesive point Cloth form, picture background is black;
Fig. 3 (a) is micro-for not adding at plywood vertical and horizontal veneer (crack degree 38%) bonding layer prepared by Electrostatic Treatment See structural map, wherein, 1 longitudinal veneer, 2 bonding layers, 3 horizontal veneers;
Fig. 3 (b) is not for add at plywood vertical and horizontal veneer (crack degree 38%) bonding layer prepared by Electrostatic Treatment The microtexture figure (without Timber sections) of adhesive distribution in two veneers, wherein white portion is the distribution of adhesive Form, picture background is black;
Fig. 4 (a) is plywood vertical and horizontal veneer (crack degree 38%) bonding layer prepared after Electrostatic Treatment 500s Place's microtexture figure, wherein, 1 longitudinal veneer, 2 bonding layers, 3 horizontal veneers;
Fig. 4 (b) is plywood vertical and horizontal veneer (crack degree 38%) bonding layer prepared after Electrostatic Treatment 500s The microtexture figure (without Timber sections) of adhesive distribution in two veneers at place, wherein white portion is adhesive Distributional pattern, picture background is black;
Fig. 5 is the Lauxite not added after Electrostatic Treatment and Electrostatic Treatment 500s in the plywood (crack degree 38%) of preparation Fourier transform infrared spectroscopy figure.
Detailed description of the invention:
Embodiment 1:
A kind of manufacture method utilizing high-pressure electrostatic efficiently to improve collose condensation material bonding strength, comprises the steps:
1) slicing: the Southern Pine veneer (without crack degree) that slicing is good, its thickness is the Wooden veneer of 2.6-2.8mm, dry Carrying out in dry case, baking temperature is 50 DEG C, and the time is 12h, and whole moisture content is 7%.
2) gluing: dried Wooden veneer carries out covering with paint, lacquer, colour wash, etc. adhesive, and adds firming agent ammonium chloride in adhesive, Adhesive is Lauxite, and formaldehyde and urea mol ratio are F/U=1.5, and ammonium chloride is the 1% of Lauxite weight, two-sided executes Glue amount is 300g/m2, solid content is 50%.
3) assembly: according to vertical-horizontal-vertical three layers of assemble pattern of plywood, the slab of preparation three-decker plywood.
4) hot pressing the electrostatic that adds high pressure: after slab is put into press, connects negative plate on slab by HV generator Side, negative pressure is 10kV;Ground connection pole plate be 0kV on the downside of slab, open HV generator immediately, the Electrostatic Treatment time is respectively For 0s (untreated), 200s, 300s and 500s.Hot pressing condition is 110 DEG C, and slab pressure is 1.0MPa, hot pressing time 60s/mm (second every millimeter).
5) electrostatic generator is closed: after reaching the high-pressure electrostatic process time, close electrostatic generator.
6) release: after reaching hot pressing time, hot pressing terminates, and slab is taken out in release, and then cooling, cutting edge and sanding process, The plywood of system.
According to plywood detection data (GB/T 17657-2013) of the wood materials that the operation of embodiment 1 obtains, such as table 1 and table 2 shown in;Fig. 1 (a) for not add microtexture figure at plywood vertical and horizontal veneer bonding layer prepared by Electrostatic Treatment, Wherein, longitudinal veneer 1, bonding layer 2, horizontal veneer 3;And Fig. 1 (b) is that not add plywood prepared by Electrostatic Treatment longitudinal and horizontal The microtexture figure (without Timber sections) of the distribution in two veneers of the adhesive at veneer bonding layer, wherein white portion Being divided into the distributional pattern of adhesive, picture background is black.And Fig. 2 (a) to be plywood prepared after Electrostatic Treatment 500s indulge To with horizontal veneer bonding layer at microtexture figure, wherein, longitudinal veneer 1, bonding layer 2, horizontal veneer 3;Fig. 2 (b) is electrostatic Process distribution micro-in two veneers of the adhesive at plywood vertical and horizontal veneer bonding layer prepared after 500s Seeing structural map (without Timber sections), wherein white portion is the distributional pattern of adhesive, and picture background is black.From above-mentioned figure In reflect by utilizing high-voltage electrostatic field to process wood materials glued, affect the distribution of adhesive, orient and move so that The adhesive of wood materials both sides produces aggregation phenomenon, solve low mole prop0rtion adhesive for wood materials glue performance difference and The problem of poor water resistance, and decrease the impact of timber self porous defect, it is thus achieved that collose condensation material bonding strength The effect of multiplication, greatly reduces adhesive and the timber adverse effect to collose condensation material itself, considerably improves glue Close intensity.
The bonding strength detection data of table 1 wood materials plywood
The plywood burst size of methanal detection data of table 2 wood materials
Electrostatic Treatment time (s) Burst size of methanal (mg/L)
0 3
500 2.7
Embodiment 2:
A kind of manufacture method utilizing high-pressure electrostatic efficiently to improve collose condensation material bonding strength, comprises the steps: Enforcement step is with embodiment 1, and difference is,
1) rotary-cut: the Wooden veneer (crack degree 38%) that rotary-cut is good, its thickness is the veneer of 2.6-2.8mm, and moisture content is 7%.
2) gluing: adhesive is Lauxite, formaldehyde and urea mol ratio are F/U=1.5, and ammonium chloride is Lauxite weight The 1.5% of amount, two-sided resin added is 300g/m2, solid content is 47%.
3) assembly: according to the assemble pattern of plywood, prepares three-decker plywood.
4) hot pressing the electrostatic that adds high pressure: HV generator connecing negative plate on the upside of slab, negative pressure is 10kV;Ground connection Pole plate is that 0kV is on the downside of slab.After slab is put into press, open electrostatic generator immediately, the Electrostatic Treatment time be respectively 0s, 300s and 500s.Hot pressing condition is 110 DEG C, and slab pressure is 1.0MPa, hot pressing time 60s/mm.
5) electrostatic generator is closed: after reaching the high-pressure electrostatic process time, close electrostatic generator
6) release: after hot pressing terminates, slab, then cooling, cutting edge, sanding process, the plywood of system are taken out in release.
According to the detection data (GB/T 17657-2013) of the wood materials plywood that the operation of embodiment 2 obtains, such as table Shown in 3;Fig. 3 (a) is not for add microtexture figure at plywood vertical and horizontal veneer bonding layer prepared by Electrostatic Treatment, wherein, Longitudinal veneer 1, bonding layer 2, horizontal veneer 3;Fig. 3 (b) is not for add plywood vertical and horizontal veneer glue prepared by Electrostatic Treatment Connecing the microtexture figure (without Timber sections) of the distribution in two veneers of the adhesive at layer, wherein white portion is gluing The distributional pattern of agent, picture background is black.Fig. 4 (a) is plywood vertical and horizontal list prepared after Electrostatic Treatment 500s Microtexture figure at plate bonding layer, wherein, longitudinal veneer 1, bonding layer 2, horizontal veneer 3;After Fig. 4 (b) is Electrostatic Treatment 500s The microtexture figure of distribution is (no in two veneers for the prepared adhesive at plywood vertical and horizontal veneer bonding layer Containing Timber sections), wherein white portion is the distributional pattern of adhesive, and picture background is black;Fig. 5 for do not add Electrostatic Treatment and The Fourier transform infrared spectroscopy figure of the Lauxite in the plywood of preparation after Electrostatic Treatment 500s.Reflect from above-mentioned figure Go out, under the conditions of high-pressure electrostatic, adhesive molecular polarityization and orientationization, thus obtain more chemical bond, add urine Element and the reaction probabilities of formaldehyde.Finally, adhesive generation aggregation phenomenon, and condense on wood materials splicing face, thus improve The bonding strength of wood materials.Drawn by infared spectrum: under the effect of high-voltage electrostatic field, formaldehyde is the completeest with urea reaction Kind, at lower wave number section, 1500-1575cm-1Carrying for amide Ι Ι, its characteristic peak is gradually shifted to lower wave number, is illustrated that response strength becomes Greatly, reaction is more complete;At 985-1035cm-1In, peak intensity gradually strengthens, and illustrates that methylol group content increases, makes solidification After adhesive crosslink density rise.
The bonding strength detection data of table 3 wood materials plywood
Due to the veneer selection in the table 1 of embodiment 1 is Southern Pine veneer, i.e. without crack degree;And the plate in embodiment 2 Base material selection is rotary cut venner, and having crack degree, crack degree is 38%.A part of adhesive can be retained in crack, therefore Bonding strength increase rate can reduce, but is all higher than existing test data.
Embodiment 3:
Step, with embodiment 2, is carried out in drying baker, and baking temperature is 50 DEG C, and the time is 12h, and whole moisture content is 8%.Difference is the solid content 50% of adhesive, and formaldehyde and urea mol ratio are F/U=1.5, and ammonium chloride is Lauxite weight The 0.5% of amount, two-sided resin added is 200g/m2
According to the detection data (GB/T 17657-2013) of the wood materials that the operation of embodiment 3 obtains, as shown in table 4:
The bonding strength detection data of table 4 wood materials plywood
Embodiment 4:
Step is with embodiment 2, and difference is the solid content 50% of adhesive, and formaldehyde and urea mol ratio are F/U=1.5, Ammonium chloride is the 1% of Lauxite weight, and hot pressing temperature is 95 DEG C.
According to the detection data (GB/T 17657-2013) of the wood materials that the operation of embodiment 4 obtains, as shown in table 5:
The bonding strength detection data of table 5 wood materials plywood
Embodiment 5:
Step, with embodiment 2, is carried out in drying baker, and baking temperature is 50 DEG C, and the time is 12h, and whole moisture content is 5%.Difference is the solid content 50% of adhesive, and formaldehyde and urea mol ratio are F/U=1.5, and ammonium chloride is Lauxite weight The 1% of amount, odd-level assemble pattern is five-layer structure plywood, and hot pressing temperature is 100 DEG C.
According to the detection data (GB/T 17657-2013) of the wood materials that the operation of embodiment 5 obtains, as shown in table 6:
The bonding strength detection data of table 6 wood materials plywood
Embodiment 6:
Step is the solid content 50% of adhesive with embodiment 2, difference, and HV generator connects negative plate in slab Upside, negative pressure is 1kV;Ground connection pole plate is that 0kV is on the downside of slab.The slab obtained all is examined according to GB/T17657-2013 Survey.After the bonding strength of the plywood after high-pressure electrostatic process is higher than the slab rigidity not adding electrostatic, and high-pressure electrostatic process The equal conformance with standard requirement of plywood bonding strength.
Embodiment 7:
Step is with embodiment 2, and difference is, carries out in drying baker, and baking temperature is 50 DEG C, and the time is 12h, contains eventually Water rate is 11%.The solid content 50% of adhesive, HV generator connects negative plate on the upside of slab, and negative pressure is 15kV;Connect Ground pole plate is that 0kV is on the downside of slab.The slab obtained all detects according to GB/T 17657-2013.After high-pressure electrostatic processes The bonding strength of plywood higher than not adding the slab rigidity of electrostatic, and high-pressure electrostatic process after plywood bonding strength all accord with Standardization requirement.
Embodiment 8:
Step is with embodiment 2, and difference is, the solid content of adhesive is 50%, on the left of slab, right side pressurization, high pressure Electrostatic generator connects negative plate on the left of slab, connects on the right side of negative plate and slab.The slab obtained is all according to GB/T 17657- 2013 detect.The bonding strength of the plywood after high-pressure electrostatic process is higher than the slab rigidity not adding electrostatic, and high pressure is quiet Plywood bonding strength equal conformance with standard requirement after electric treatment.
Embodiment 9:
Step is with embodiment 2, and difference is, the solid content of adhesive is 30%, and the slab obtained is all according to GB/T 17657-2013 detects.The bonding strength of the plywood after high-pressure electrostatic process is higher than the slab rigidity not adding electrostatic, and Plywood bonding strength equal conformance with standard requirement after high-pressure electrostatic process.
Embodiment 10:
Step is with embodiment 2, and difference is, the solid content of adhesive is 40%, and the slab obtained is all according to GB/ T17657-2013 detects.The bonding strength of the plywood after high-pressure electrostatic process is higher than the slab rigidity not adding electrostatic, and Plywood bonding strength equal conformance with standard requirement after high-pressure electrostatic process.
Embodiment 11:
A kind of manufacture method utilizing high-pressure electrostatic efficiently to improve wood materials bonding strength, comprises the steps:
1) rotary-cut: the Wooden veneer (crack degree 38%) that rotary-cut is good, its thickness is the veneer of 2.6-2.8mm, and moisture content is 7%.
2) gluing: adhesive is phenolic resin, solid content 50%, two-sided resin added is 250g/m2
3) assembly: according to the assemble pattern of laminated veneer lumber, prepares nine Rotating fields laminated veneer lumbers.
4) hot pressing the electrostatic that adds high pressure: HV generator connecing negative plate on the upside of slab, negative pressure is 10kV;Ground connection Pole plate is that 0kV is on the downside of slab.After slab is put into press, open electrostatic generator immediately.Hot pressing condition is 145 DEG C, slab Unit pressure is 1.0MPa, hot pressing time 60s/mm.
5) electrostatic generator is closed: after reaching the high-pressure electrostatic process time, close electrostatic generator
6) release: after hot pressing terminates, slab, then cooling, cutting edge, sorting are taken out in release.
According to the detection data (GB/T 20241-2006) of the wood materials that the operation of embodiment 11 obtains, such as table 7 institute Show:
The dipping and stripping rate detection data of table 7 wood materials
Embodiment 12:
Improve the manufacture method of wood materials laminated wood bonding strength, comprise the steps:
1) saw lumber: saw the Southern Pine sawn timber made, its thickness and width are respectively 16mm and 140mm, and moisture content is 10%.
2) gluing: adhesive is resorcinol-P-F copolymer resins, solid content 50%, and two-sided resin added is 250g/m2
3) assembly: according to the assemble pattern of laminated wood, the slab of preparation three-decker laminated wood.
4) hot pressing the electrostatic that adds high pressure: HV generator connecing negative plate on the upside of slab, negative pressure is 10kV;Ground connection Pole plate is that 0kV is on the downside of slab.After slab is put into press, open electrostatic generator immediately.Hot pressing condition is 145 DEG C, slab Unit pressure is 1.0MPa, hot pressing time 60s/mm.
5) electrostatic generator is closed: after reaching the high-pressure electrostatic process time, close electrostatic generator
6) release: after hot pressing terminates, material, then cooling, cutting edge and sorting, preparation three-decker gluing are taken out in release Wood.
Detection data (GB/T 26899-2011) according to the wood materials that the operation of embodiment 12 obtains.High-pressure electrostatic The bonding strength of the wood materials laminated wood after process is higher than the glue after the laminated wood intensity not adding electrostatic, and high-pressure electrostatic process Close intensity equal conformance with standard requirement.

Claims (10)

1. the method improving wood materials bonding strength, its step includes:
Wood materials after gluing is in its pressure process, and add high pressure electrostatic to the wood materials both sides after gluing, is formed final Collose condensation material.
The method of raising wood materials bonding strength the most according to claim 1, it is characterised in that described in pressure process In, add high pressure along the both sides in hot pressing direction in hot pressing electrostatic to the wood materials after gluing.
The method of raising wood materials bonding strength the most according to claim 1, it is characterised in that described high-pressure electrostatic, After i.e. connecing electricity, the voltage difference of the wood materials both sides after gluing is at least 1kV.
The method of raising wood materials bonding strength the most according to claim 1, it is characterised in that described to gluing after Wood materials both sides add high pressure electrostatic, and its process time is at least more than 200s;By HV generator connect negative plate in On the upside of wood materials after gluing, on the downside of ground connection pole plate wood materials after gluing.
The method of raising wood materials bonding strength the most according to claim 4, it is characterised in that described wood materials Moisture content is 8 ± 3%;The high-pressure electrostatic process time is 300s to 500s.
The method of raising wood materials bonding strength the most according to claim 1, it is characterised in that the wood after described gluing Material, its adhesive used is less than or equal to 50% without dehydration, solid content.
7. a plywood preparation method, comprises the following steps:
(1) timber rotary-cut or slicing are become Wooden veneer;
(2) Wooden veneer after processing in step (1) is dried;
(3) Wooden veneer after processing in step (2) carries out covering with paint, lacquer, colour wash, etc. adhesive, and in adhesive, add firming agent chlorination Ammonium;
(4) Wooden veneer after processing in step (3) is carried out assembly;
(5) slab after processing in step (4) being carried out hot pressing, add high pressure to slab both sides electrostatic along hot pressing direction, by high pressure Electrostatic generator connects negative plate on the upside of slab, and negative pressure is more than 1-15kV;Ground connection pole plate is that 0kV is on the downside of slab;
(6) to the slab after processing in step (5), electrostatic after reaching the Electrostatic Treatment time, is closed immediately;
(7) to the slab after processing in step (6), after reaching hot pressing time, release, cooling, cutting edge and sanding process, and prepare Whole plywood.
Plywood preparation method the most according to claim 7, it is characterised in that Wooden veneer in described step (1) Thickness is 2.6-2.8mm;Being dried of described step (2), is carried out in drying baker, and baking temperature is 50 DEG C, and the time is 12h, Whole moisture content is 8 ± 3%.
Plywood preparation method the most according to claim 7, it is characterised in that the described gluing described in step (3) place Agent is Lauxite, and without processed, solid content is less than or equal to 50%, and formaldehyde is 1.5 with the mol ratio of carbamide, chlorination Ammonium is the 0.5-1.5% of the weight of Lauxite, and two-sided resin added is 200-300g/m2
Plywood preparation method the most according to claim 6, it is characterised in that slab described in step (4) place for vertical-horizontal- Vertical three layers or odd-level assemble pattern, its hot pressing condition is 95 DEG C-110 DEG C, and unit pressure is 1MPa, hot pressing time 20-60s/ Mm (second/millimeter);Step (6) the high-pressure electrostatic process time is 300s-500s.
CN201610657893.6A 2016-08-11 2016-08-11 A kind of method and glued board preparation method improving wood materials bonding strength Active CN106272747B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201810863116.6A CN109571661B (en) 2016-08-11 2016-08-11 Method for enhancing wood bonding strength and wood board preparation method
CN201610657893.6A CN106272747B (en) 2016-08-11 2016-08-11 A kind of method and glued board preparation method improving wood materials bonding strength

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610657893.6A CN106272747B (en) 2016-08-11 2016-08-11 A kind of method and glued board preparation method improving wood materials bonding strength

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201810863116.6A Division CN109571661B (en) 2016-08-11 2016-08-11 Method for enhancing wood bonding strength and wood board preparation method

Publications (2)

Publication Number Publication Date
CN106272747A true CN106272747A (en) 2017-01-04
CN106272747B CN106272747B (en) 2018-09-18

Family

ID=57669021

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201610657893.6A Active CN106272747B (en) 2016-08-11 2016-08-11 A kind of method and glued board preparation method improving wood materials bonding strength
CN201810863116.6A Active CN109571661B (en) 2016-08-11 2016-08-11 Method for enhancing wood bonding strength and wood board preparation method

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201810863116.6A Active CN109571661B (en) 2016-08-11 2016-08-11 Method for enhancing wood bonding strength and wood board preparation method

Country Status (1)

Country Link
CN (2) CN106272747B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109015954A (en) * 2018-07-25 2018-12-18 南京林业大学 A method of improving bamboo plywood weatherability and mechanical property
WO2020237917A1 (en) * 2019-05-30 2020-12-03 南京林业大学 Bamboo and wood material modification method, and bamboo and wood plate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102250572A (en) * 2011-06-17 2011-11-23 江苏赛奥生化有限公司 Preparation method of oxidized pueraria starch adhesive
CN103737678A (en) * 2013-12-11 2014-04-23 中南林业科技大学 Veneer densified glueing method
CN104629662A (en) * 2015-02-03 2015-05-20 北华大学 Ultralow-formaldehyde-release urea-formaldehyde resin adhesive and preparation process thereof
CN104647559A (en) * 2015-03-06 2015-05-27 江苏苏林木业有限公司 Manufacturing technology of electrostatic adhesive applying fiber board
CN104745128A (en) * 2015-04-10 2015-07-01 徐伟鹏 Urea resin adhesive and application thereof in plywood
CN104774588A (en) * 2014-01-13 2015-07-15 阎肖华 Protein-based wood adhesive, and preparation method and application and use method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06218885A (en) * 1993-01-21 1994-08-09 Kooken:Kk Building industry product made of organic polymer material
CN201009311Y (en) * 2007-01-05 2008-01-23 中国林业科学研究院木材工业研究所 Veneer with electromagnetic shielding function
CN102390069B (en) * 2011-10-28 2014-06-04 南京林业大学 Atmospheric-pressure and low-temperature plasma continuous treatment device of wooden thin plates
CN102837349B (en) * 2012-09-04 2015-07-15 浙江晨峰模板有限公司 Phenolic resin bamboo plywood manufacturing process
CN104314279B (en) * 2014-11-18 2017-05-03 大亚(江苏)地板有限公司 Cryptomeria fortunei three-layer solid wood composite floor and preparation method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102250572A (en) * 2011-06-17 2011-11-23 江苏赛奥生化有限公司 Preparation method of oxidized pueraria starch adhesive
CN103737678A (en) * 2013-12-11 2014-04-23 中南林业科技大学 Veneer densified glueing method
CN104774588A (en) * 2014-01-13 2015-07-15 阎肖华 Protein-based wood adhesive, and preparation method and application and use method thereof
CN104629662A (en) * 2015-02-03 2015-05-20 北华大学 Ultralow-formaldehyde-release urea-formaldehyde resin adhesive and preparation process thereof
CN104647559A (en) * 2015-03-06 2015-05-27 江苏苏林木业有限公司 Manufacturing technology of electrostatic adhesive applying fiber board
CN104745128A (en) * 2015-04-10 2015-07-01 徐伟鹏 Urea resin adhesive and application thereof in plywood

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
王恺: "《木材工业实用大全 人造板表面装饰卷》", 31 July 2002 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109015954A (en) * 2018-07-25 2018-12-18 南京林业大学 A method of improving bamboo plywood weatherability and mechanical property
WO2020237917A1 (en) * 2019-05-30 2020-12-03 南京林业大学 Bamboo and wood material modification method, and bamboo and wood plate

Also Published As

Publication number Publication date
CN109571661A (en) 2019-04-05
CN109571661B (en) 2021-05-25
CN106272747B (en) 2018-09-18

Similar Documents

Publication Publication Date Title
CN102107447B (en) Wood sectional material and manufacturing method thereof
US9796107B2 (en) Wood-based composite panel with reduced top surface edge flare
CN104772795B (en) A kind of battenboard and production method thereof
CN101524857B (en) Aldehyde-free veneer and producing method thereof
Maulana et al. Effects of steam treatment on physical and mechanical properties of bamboo oriented strand board
WO2010094237A1 (en) Non-formaldehyde recombinant material and manufacturing method thereof
CN109591122B (en) Method for vacuum compression and densification of wood material
CN106272747A (en) A kind of method improving wood materials bonding strength and plywood preparation method
CN110587749A (en) Complexing wood shavings, complexing shaving board and manufacturing method thereof
CN203427401U (en) Multilayer composite board
CN105965616B (en) The manufacturing method of veneer base composite board
CN201800094U (en) High-strength blockboard
Colak et al. Utilization potential of waste from window joints for particleboard
Aydin Effects of veneer drying at high temperature and chemical treatments on equilibrium moisture content of plywood
AU2017250624B2 (en) A method for the manufacture of a wet glued wood article
CN205767845U (en) A kind of formaldehyde-free plywood
US3713943A (en) Wood treating process
RU2518728C2 (en) Production of veneer sheet
US20040101705A1 (en) Adhesive for wood, woody material
CN106047186B (en) A kind of production technology of aldehyde-free artificial board
CN204869122U (en) Compound container of flattening -out bamboo wood plywood for bottom plate
JPS5811102A (en) Manufacture of plywood
Roh et al. Bonding properties and resin exudation characteristics of Pitch Pine
Ong et al. PRELIMINARY EVALUATION OF BONDING PERFORMANCE OF HEAT-TREATED MERPAUH AND RUBBERWOOD
CN201132344Y (en) Laminated wood for Chinese fir veneer

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant