CN109015954B - Method for improving weather resistance and mechanical property of bamboo plywood - Google Patents
Method for improving weather resistance and mechanical property of bamboo plywood Download PDFInfo
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- CN109015954B CN109015954B CN201810826905.2A CN201810826905A CN109015954B CN 109015954 B CN109015954 B CN 109015954B CN 201810826905 A CN201810826905 A CN 201810826905A CN 109015954 B CN109015954 B CN 109015954B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
- B27D1/08—Manufacture of shaped articles; Presses specially designed therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D5/00—Other working of veneer or plywood specially adapted to veneer or plywood
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09J161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
- C09J161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
Abstract
The invention discloses a method for improving the weather resistance and mechanical property of a bamboo plywood, and belongs to the field of bamboo wood processing technology. The method for improving the weather resistance of the bamboo plywood comprises the following steps: assembling the bamboo chips coated with the adhesive and hot-pressing, and applying a high-voltage electric field while hot-pressing, wherein the direction of the electric field is the same as the pressurizing direction of the hot-pressing. Further comprising the steps of: drying the bamboo chips; coating the treated bamboo chips with an adhesive; assembling the bamboo chips; and (4) hot pressing and applying a high-voltage electric field, closing the high-voltage electric field after the hot pressing time is reached, relieving the pressure, cooling, and processing and forming for later use. The invention can solve the problems of poor weather resistance, poor gluing property and poor mechanical property of the bamboo plywood, and has the advantages of low cost and high production efficiency.
Description
Technical Field
The invention belongs to the field of bamboo board manufacturing process, and particularly relates to a method for improving weather resistance and mechanical property of a bamboo plywood.
Background
China has abundant bamboo resources, and bamboo is used as a renewable biomass material and is made into various bamboo board materials, is widely applied to the fields of buildings, transportation, engineering decoration and the like, and is one of ideal processing materials for replacing steel, wood and the like. In the utilization process of the bamboo wood-based panel, due to unreasonable processing technology, backward production technology, dry-wet change of environment and different attributes from wood materials, phenomena such as panel edge damage, delamination, glue failure and the like often occur to the bamboo plywood, so that the performance of a glue layer is unstable and non-uniform; on the other hand, in the bamboo plywood material, there are three different interface combination modes, including the combination mode of the bamboo green and the bamboo green, the bamboo green and the bamboo yellow surface, because of the natural wax layer on the surface of the bamboo green and the dense fiber bundle tissue structure near the bamboo green, and the low lignin content and insufficient active group in the bamboo yellow, the phenomena of difficult gluing and glue failure on the surface of the bamboo can be caused, the gluing strength of the bamboo board material is seriously influenced, and the gluing strength, the glue layer weather resistance and the mechanical property of the bamboo plywood can be reduced by improper production process and quality control means, so that the characteristics of high strength and high rigidity of the bamboo board can not be exerted.
The weather resistance of the bamboo plywood is mainly determined by various factors, and the weather resistance is better if the gluing characteristics are less affected by environmental changes. Therefore, the method for improving the weather resistance and the mechanical property of the bamboo plywood in the field mainly comprises the modification of the bamboo surface, the modification of the adhesive and the optimization of process parameters.
For the modification of the bamboo surface, plasma treatment, ultrasonic treatment and corona treatment methods are often adopted, so that the surface activity of the bamboo can be improved, the permeation of an adhesive is facilitated, and the bonding strength of the bamboo is improved. The modification of the bamboo surface at the present stage belongs to the category of chemical pretreatment, and the bonding strength of the bamboo plywood can be increased by improving the activity of the bamboo surface and the compatibility of the interface thereof. The chemical pretreatment method improves the chemical reaction between the bamboo wood and the adhesive, and improves the penetration degree of the adhesive in the bamboo wood. However, the chemical pretreatment of the plasma is time-efficient, and the surface modification methods can damage the surface appearance and chemical components of the bamboo, the adhesive can excessively and inefficiently penetrate the interface of the bamboo, and a continuous and uniform compact adhesive layer cannot be formed at the gluing interface of the bamboo, so that the bamboo plywood with high strength, mechanical property and good weather resistance cannot be obtained. Therefore, the problems of weather resistance and mechanical property of the bamboo plywood are solved by modifying the surface of the bamboo wood, and the effect is often poor.
In the modification selection of the adhesive, if the high-performance adhesive such as isocyanate is adopted to prepare the bamboo plywood, the manufacturing cost is obviously increased, and toxic substances are generated during the curing of the isocyanate, so that the health is harmed; the urea-formaldehyde resin and the surface groups of the bamboo wood have weaker chemical reaction capability, and cannot form a stable and uniform glue layer, so that the bamboo plywood is easy to be split, and the gluing strength, the mechanical strength and the weather resistance are reduced. In addition, the increase of the molar ratio of the adhesive can lead to the improvement of the formaldehyde emission, thereby causing environmental pollution; the reduction of the molar ratio can lead to the reduction of chemical reaction and bonding capability of the adhesive, thereby causing the reduction of the bonding strength and the mechanical strength of the plate.
In the prior art, different technological parameters are optimized, such as hot pressing time is increased, hot pressing temperature or hot pressing pressure is increased, production efficiency can be improved undoubtedly, but to a certain extent, due to the fact that overlarge compression rate, core surface layer temperature difference and variability are easy to generate, glue line characteristics of the bamboo plywood can be obviously reduced, and when the bamboo plywood is used under the condition that environmental temperature and humidity change is large, stripping, deformation and cracking phenomena can be generated. Therefore, the process parameters or the optimized process and technical means cannot avoid the influence on the production benefit and the product performance due to the influence of factors such as bamboo wood or environment and the like, such as the reduction of the utilization rate of the bamboo wood and the quality of the bamboo plywood.
Chinese patent, publication number: CN100999092A, published: in 2007, 7-18.7, a method for manufacturing bamboo skin laminated material is disclosed. The raw materials are made of bamboo splits or thick bamboo splits subjected to sewing treatment, or appropriate amount of single-board strips or wood bundles subjected to rolling and carding; drying the raw materials until the water content is 8-15%; the glue for impregnation is phenolic resin or other adhesives with equivalent performance, and the glue impregnation amount is 3-8% (the ratio of the absolute dry weight of the resin to the absolute dry weight of the bamboo skin); and drying or aging to water content of 8-12%; the method comprises the following steps of (1) forming a plate blank in the thickness direction in a non-layered and same-direction manner by adding a glue-containing bamboo skin or a thick bamboo skin subjected to seam processing or adding a proper amount of unit materials such as veneer strips, wood bundles and the like which are soaked in glue and dried at low temperature; and placing the plate blank between electrodes of a bidirectional high-frequency press for pressing and high-frequency heating gluing. The advantages are that: the phenomenon of poor gluing caused by brittleness of the surface layer adhesive due to excessive curing or uncured core layer adhesive is avoided; the low pressure is used to achieve good gluing quality, and the molding gluing pressure of the bamboo skin laminated material is less than or equal to 9 MPa. The hot-press gluing period is short. The scheme has the following advantages: the phenomenon of poor gluing caused by brittleness of the surface layer adhesive due to excessive curing or uncured core layer adhesive is avoided; the low pressure is used to achieve good gluing quality, and the molding gluing pressure of the bamboo skin laminated material is less than or equal to 9 MPa. The hot-press gluing period is short. But has the following disadvantages: the urea-formaldehyde resin with poor bamboo gluing property is not used as the main adhesive, but the phenolic resin with good gluing property is used, so that the superiority of the bamboo gluing property influenced by a high-frequency press cannot be highlighted; the high-frequency pressurized voltage is low voltage, which is only beneficial to the water in the adhesive of the core layer to move and evaporate, the core layer gluing efficiency is improved, broken chemical bonds and more crosslinking reactions are not generated at the gluing interface, the ineffective permeation of the adhesive is too much, the gluing strength and the mechanical strength cannot be effectively improved, and the production cost is increased.
Chinese patent, publication number: CN1931534A, published: on 21 d 3.2007, a method of curing artificial wood is disclosed. A working die with insulating plates is stuck on two surfaces of an artificial wood assembly in parallel with a glue coating layer, then a steel frame is used for pressing outside the working die, finally a fastening screw is used for tensioning the steel frame plates at two ends, a high-frequency electric field is applied to the two surfaces of the artificial wood assembly for heating, and demoulding is carried out after pressure maintaining and storage, wherein the high-frequency electric field is parallel to the glue coating layer of the artificial wood assembly. The high-frequency electric field is parallel to the gluing layer of the artificial wood assembly, energy directly acts on glue adhesive molecules, the glue adhesive molecules are easier to polarize, heat and solidify than water molecules under the high-frequency electric field, the probability of damage to wood carbonized color-changing wood is reduced, the energy utilization rate is high, the heating and storage time is shortened, the solidification time is greatly shortened, the production efficiency is improved, and the operation and the control are convenient. But has the following disadvantages: the high-frequency pressurization only accelerates the movement of moisture and the curing of the adhesive and does not generate new broken chemical bonds and more crosslinking reactions, so that the bonding strength and the mechanical property of the material are not obviously improved; the whole pressurizing process is completed in a vacuum environment, and the vacuum process can generate a large amount of energy consumption and increase the production cost.
Chinese patent, publication number: CN106272747A, published: 2017, 1 month and 4 days, and discloses a method for improving the bonding strength of a wood material and a method for preparing a plywood. According to the invention, the glued wood material is treated by using the high-voltage electrostatic field in the pressurizing process, so that strong electrostatic voltage is formed on two sides of the wood material, the gluing strength of the treated wood material completely meets the requirement, the gluing strength is improved by more than one time compared with the wood gluing material prepared by adopting a common gluing method, and the technical problems of low viscosity, low molar ratio, large glue permeation amount caused by wood porosity, low gluing strength of the wood material, formaldehyde release and the like of the adhesive are solved. But has the following disadvantages: the high-voltage electric field voltage in the preparation process of the wood material is 1kV to 10kV, the weather resistance of the bamboo plywood cannot be improved in the voltage range, and the reasons may be the chemical activity of fat and wax layers on the surface of the bamboo and the like, such as simplicity, but the problem of gluing the surface of the bamboo cannot be solved, and the gluing strength of the bamboo composite material cannot be improved; on the other hand, the wood material is soft, and the tissue structures such as wood cell walls and the like can be damaged by the voltage of more than 10kV, so that the strength of the wood is reduced, and the bonding strength of the wood bonding material is reduced. The mechanical property of the plywood material cannot be effectively improved by utilizing a high-voltage electric field.
Disclosure of Invention
1. Technical problem to be solved by the invention
Aiming at the phenomena that the glue layer of the bamboo plywood is easy to crack, delaminate and the like caused by various influence factors such as unreasonable processing technological parameters, incomplete surface modification methods, environmental dry and wet changes, fat and wax layers contained on the surface of bamboo wood and the like, and factors influencing the weather resistance, mechanical property and production cost of the plywood in the adhesive type and molar ratio and the like, the invention discloses a method for improving the weather resistance and mechanical property of the bamboo plywood, so that the gluing property, mechanical property and weather resistance of the bamboo plywood are improved.
2. Technical scheme
In the process of preparing and modifying the bamboo material, free electrons in an excited state collide with chemical groups on the surface of the material under the action of an electric field, so that broken chemical bonds and new free electrons are formed on the surface of the material, and therefore the polarization degree and the surface free energy of the surface of the material are obviously improved. According to the dynamic phenomenon and the motion equation of the charged particles in the electric field, the coulomb force can be obtained to contribute to the condensation motion of the charged particles.
In order to solve the technical problems in the prior art, the invention is realized by the following scheme:
a method for improving the weather resistance and the mechanical property of a bamboo plywood comprises the following steps: the bamboo chip assembly coated with the adhesive is hot-pressed, a high-voltage electric field is applied while the hot pressing is conducted, the direction of the electric field is the same as the pressurizing direction of the hot pressing, the negative electrode of a generator of the high-voltage electric field is connected to the upper side metal conductive base plate of the bamboo plywood coated with the adhesive, the ground wire is connected to the lower side conductive base plate of the bamboo plywood coated with the adhesive, and the negative electrode voltage is 20-60 kV.
The adhesive is urea-formaldehyde resin.
The viscosity of the urea-formaldehyde resin is 200-230 mPas, the molar ratio (F/U) is 2: 1-1.5: 1, the solid content is 50-55%, and the double-sided glue coating amount is 200-2。
A method for improving the weather resistance and the mechanical property of a bamboo plywood further comprises the following steps:
(1) drying the bamboo chips;
(2) coating the bamboo chips treated in the step (1) with an adhesive;
(3) assembling the bamboo chips obtained in the step (2);
(4) and (4) after the hot pressing time is reached, closing the high-voltage electric field, releasing the pressure, cooling, and processing and forming for later use.
And (2) sanding the dried bamboo chips in the step (1) until the quantity of the sanded light is 0.3-0.5 mm.
The hot pressing temperature is 110-120 ℃, the hot pressing time is 10-15 min, and the plate surface pressure during hot pressing is 0.8-1.2 MPa.
5% zinc chloride solution is added into the urea-formaldehyde resin adhesive.
5% of nano-cellulose is added into the urea-formaldehyde resin adhesive.
And (3) assembling the bamboo chips in the step (2) into a blank, wherein the blank comprises a bamboo green surface and a bamboo green surface, a bamboo green surface and a bamboo yellow surface or a bamboo yellow surface and a bamboo yellow surface.
In the step (1), the final water content of the dried bamboo chips is 8 +/-3%.
The manufacturing method of the bamboo skin laminated material disclosed in the Chinese patent with the publication number of CN100999092A adopts phenolic resin with good gluing property, so that the superiority of the high-frequency press influencing the gluing property of the bamboo cannot be highlighted; in addition, the high-frequency pressurized voltage is low voltage, which is only beneficial to the movement and evaporation of water in the adhesive of the core layer and improves the bonding efficiency of the core layer, but no broken chemical bond and more crosslinking reactions are generated at the bonding interface, so that the ineffective permeation of the adhesive is too much, the bonding strength and the mechanical strength cannot be effectively improved, and the production cost is increased.
In the method for curing artificial wood disclosed in the chinese patent publication No. CN1931534A, high frequency pressurization only accelerates moisture movement and adhesive curing, and does not generate new broken chemical bonds and more crosslinking reactions, so that the bonding strength and the mechanical properties of the material are not significantly improved; the whole pressurizing process is completed in a vacuum environment, and the vacuum process can generate a large amount of energy consumption and increase the production cost.
The invention patent of the china with the publication number of CN106272747A discloses a method for improving the bonding strength of a wooden material and a method for preparing a plywood, wherein the voltage of a high-voltage electric field in the process of preparing the wooden material is 1kV to 10kV, and because the surface of bamboo contains fat and chemical activity of a wax layer, the voltage range cannot improve the weather resistance of the bamboo plywood, cannot solve the bonding problem of the surface of bamboo, and cannot improve the bonding strength of a bamboo composite material; on the other hand, the wood material is soft, and the tissue structures such as wood cell walls and the like can be damaged by the voltage of more than 10kV, so that the strength of the wood is reduced, the bonding strength of the wood bonding material is reduced, and the requirements on the voltage in the bonding process of the wood material and the bamboo material are completely different.
3. Advantageous effects
(1) According to the invention, a high-voltage electric field in the range of 20kV to 60kV is applied in the preparation process of the bamboo plywood, namely, a high-voltage electric field in the range of 20kV to 60kV is applied in the hot pressing direction of the bamboo chip assembly in the hot pressing process, so that the chemical activity of the surface of the bamboo is improved, the number of free electrons and broken chemical bonds in the surface of the bamboo and an adhesive is increased, conditions are provided for increasing more chemical reaction sites for the reaction between the surface of the bamboo and the adhesive, the ineffective penetration of the adhesive is reduced, and the density of a gluing interface is increased, so that the gluing strength and the mechanical property of the bamboo plywood are improved, and the weather resistance of the bamboo plywood;
(2) compared with the cost problem of the common adhesives in the prior art, such as phenolic resin, isocyanate and other adhesives, the invention adopts the urea-formaldehyde resin with poor self-gluing property and low solid content as the adhesive, thereby reducing the production cost and simultaneously ensuring the gluing strength and the mechanical strength of the bamboo plywood;
(3) according to the invention, the hot-pressing time is shortened and the hot-pressing temperature and pressure are reduced by applying the high-voltage electric field in the hot-pressing process of the bamboo chip assembly, so that the problems of overlarge compression rate, large variability of a glue layer, easiness in cracking and the like in the prior art are solved;
(4) the invention solves the problem of timeliness in methods such as plasma surface treatment, corona treatment, chemical treatment and the like, simultaneously saves the time of surface pretreatment, saves the production steps of the bamboo plywood and further improves the production efficiency;
(5) the method solves the problems of pretreatment of natural fat and wax layers on the surface of the bamboo wood, low surface activity and the like, and the problems of difficult gluing, glue failure and the like caused by the pretreatment, and further polarizes the surface of the material through a high-voltage electric field, increases chemical bonds broken on the surface, and improves the surface activity and the cross-linking reaction of the surface activity and the adhesive, thereby improving the gluing strength and the mechanical strength of the bamboo plywood with various interface combination modes;
(6) the high-voltage electric field treatment method has low power consumption, and realizes the preparation of the low-cost and high-performance bamboo plywood.
Description of the drawings:
FIG. 1 is a schematic view of a bamboo plywood structure formed by combining a green bamboo surface and a green bamboo surface;
FIG. 2 is a schematic view of a bamboo plywood structure formed by combining a surf green surface and a surf yellow surface;
FIG. 3 is a schematic view of a bamboo plywood structure formed by combining a tabasheer surface and a tabasheer surface;
in the figure: 1-tabasheer surface, 2-bamboo green surface and 3-adhesive layer.
The specific implementation mode is as follows:
the invention is described in detail below with reference to the figures and specific embodiments.
Detailed description of the preferred embodiment 1
Example 1 and comparative example 1 were set up in this specific embodiment.
The method for improving the weather resistance and the mechanical property of the bamboo plywood in the embodiment 1 comprises the following steps:
(1) drying the flattened bamboo chips in a 70 ℃ oven for 48h to obtain the final water content of 10%, sanding the front and back surfaces of the flattened bamboo chips for 0.3mm, and enabling the dimensions of the flattened bamboo chips to be 50mm multiplied by 20mm multiplied by 7.5 mm.
(2) Coating adhesive on one side of bamboo green, wherein the adhesive is urea formaldehyde resin, the viscosity is 200 mPa.s (the room temperature is 23 ℃), the molar ratio (F/U) is 2:1, the solid content is 50%, and the double-sided adhesive coating amount is 300g/m2。
(3) As shown in fig. 1, the green bamboo surface and the green bamboo surface are opposite to each other.
(4) Putting into a hot press, applying a high-voltage electric field while hot pressing, connecting the negative electrode of the high-voltage electric field generator to the upper metal backing plate of the glued bamboo plywood, connecting the ground wire to the lower backing plate of the glued bamboo plywood, wherein the direction of the high-voltage electric field is the same as the pressing direction, the voltage is 60kV (negative), and the processing time is 15 min. Wherein the hot pressing temperature is 120 ℃, the hot pressing time is 15min, and the pressure during hot pressing is 1 MPa.
(5) And after the treatment is finished, closing the high-voltage electric field generator, releasing the pressure, taking out the bamboo plywood, cooling the bamboo plywood prepared by hot pressing to room temperature, and sawing the bamboo plywood into a certain size for later use.
The preparation method of the bamboo plywood of the comparative example 1 is the same as the preparation method of the bamboo plywood of the example 1, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared in example 1 and comparative example 1 is tested according to the test methods of the bonding strength, the dipping and peeling, and the mechanical property of the type I plywood in the standard GB/T17657-2013, and the results are shown in tables 1 and 2; as shown in fig. 1, the green faces of the bamboos are oppositely stacked and assembled. The data analysis shows that the performance of the bamboo plywood treated by the high-voltage electric field is remarkably improved, compared with the bamboo plywood not treated by the high-voltage electric field, the invalid penetration depth of the glue layer of the bamboo plywood prepared by the steps is lower by 65 percent, the density of the central layer is increased by 27 percent, so that the gluing strength and the wood breakage rate are respectively improved by 35 percent and 71 percent, the weather resistance of the bamboo plywood is further improved, the boiling stripping rate is reduced to 5 percent, and the elastic modulus and the static bending strength are respectively improved by 30 percent and 20 percent.
TABLE 1 bonding Performance parameters of bamboo plywood made of green surface and green surface
TABLE 2 mechanical Properties of bamboo plywood made of green surface and green surface
Detailed description of the preferred embodiment 2
Example 2 and comparative example 2 were set up in this specific embodiment.
The method for improving the weather resistance and the mechanical property of the bamboo plywood in the embodiment 2 is the same as the embodiment 1 in implementation steps, and is characterized in that: the green bamboo surface and the yellow bamboo surface are opposite after being coated with the adhesive, and are mutually overlapped in pairs.
The preparation method of the bamboo plywood of the comparative example 2 is the same as the preparation method of the bamboo plywood of the example 2, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared in the example 2 and the comparative example 2 is tested according to the method for testing the bonding strength, the impregnation stripping and the mechanical property of the type I plywood in the standard GB/T17657-2013, and the results are shown in tables 3 and 4; as shown in fig. 1, in this embodiment, the green surface of the flattened bamboo chips and the yellow surface of the flattened bamboo chips are stacked and assembled oppositely. The data analysis shows that the performance of the bamboo plywood treated by the high-voltage electric field is obviously improved, the ineffective penetration depth of the glue layer of the bamboo plywood is lower by 52 percent, the density of the central layer is increased by 32 percent, so that the gluing strength and the wood breakage rate are respectively improved by 29 percent and 75 percent, the weather resistance of the bamboo plywood is further improved, the boiling stripping rate is reduced to 6 percent, and the elastic modulus and the static bending strength are respectively improved by 28 percent and 17 percent.
TABLE 3 bonding performance parameters of bamboo plywood composed of green surface and yellow surface
TABLE 4 bamboo plywood with green and yellow surfaces
Detailed description of preferred embodiments 3
Example 3 and comparative example 3 were set in this embodiment.
The preparation method of the bamboo plywood in the embodiment 3 is the same as the embodiment 1 except that: the tabasheer surface and the tabasheer surface are opposite after being coated with the adhesive, and are mutually overlapped in pairs.
The preparation method of the bamboo plywood of the comparative example 3 is the same as the preparation method of the bamboo plywood of the example 3, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared in the example 3 and the comparative example 3 is tested according to the method for testing the bonding strength, the impregnation stripping and the mechanical property of the type I plywood in the standard GB/T17657-2013, and the results are shown in tables 5 and 6; as shown in fig. 1, the present embodiment is formed by stacking and assembling the bamboo yellow surface of one flattened bamboo strip opposite to the bamboo yellow surface of another flattened bamboo strip. The data analysis shows that the performance of the bamboo plywood treated by the high-voltage electric field is obviously improved, the invalid penetration depth of the glue layer of the bamboo plywood is reduced by 50 percent, the density of the central layer is increased by 26 percent, so that the gluing strength and the wood breakage rate are respectively improved by 26 percent and 70 percent, the weather resistance of the bamboo plywood is further improved, the boiling stripping rate is reduced to 6 percent, and the elastic modulus and the static bending strength are respectively improved by 26 percent and 15 percent.
Therefore, the high-voltage electric field treatment can be applied to different interface combinations of the bamboo glued material to improve the gluing strength and the mechanical strength of the bamboo material.
TABLE 5 bamboo plywood bonding performance parameters composed of tabasheer surface and tabasheer surface
TABLE 6 bamboo plywood with bamboo yellow surface and bamboo yellow surface
Detailed description of preferred embodiments 4
Example 4 and comparative example 4 were set in this embodiment.
The method for preparing the bamboo plywood of the embodiment 4 comprises the following steps:
(1) drying the flattened bamboo chips in a 60 ℃ oven for 60h to obtain the final water content of 8%, sanding the front and back surfaces of the flattened bamboo chips for 0.3mm, wherein the dimension of the flattened bamboo chips is 50mm multiplied by 20mm multiplied by 7.5 mm.
(2) Coating an adhesive on one side close to the bamboo green, wherein the adhesive is urea-formaldehyde resin, the viscosity is 220 mPa.s (the room temperature is 23 ℃), the molar ratio (F/U) is 1.8:1, the solid content is 52 percent, and the double-sided adhesive coating amount is 250g/m2。
(3) And (5) stacking and assembling every two of the bamboo green surfaces, wherein the bamboo green surfaces are opposite to the bamboo green surfaces.
(4) Putting into a hot press, applying high voltage electric field while hot pressing, connecting the negative electrode of the high voltage electric field generator to the upper metal backing plate of the glued bamboo plywood, connecting the ground wire to the lower backing plate of the glued bamboo plywood, wherein the direction of the high voltage electric field is the same as the pressing direction, the voltage is 40kV (negative), and the processing time is 8 min. Wherein the hot pressing temperature is 115 ℃, the hot pressing time is 12min, and the plate surface pressure during hot pressing is 0.8 MPa.
(5) And after the treatment is finished, closing the high-voltage electric field generator, releasing the pressure, taking out the bamboo plywood, cooling the bamboo plywood prepared by hot pressing to room temperature, and sawing the bamboo plywood into a certain size for later use.
The preparation method of the bamboo plywood of the comparative example 4 is the same as the preparation method of the bamboo plywood of the example 4, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared by the method for preparing the bamboo plywood of example 4 and comparative example 4 was tested according to the method for testing the bonding strength, the impregnation peeling and the mechanical properties of the type I plywood in the standard GB/T17657-2013, and the results are shown in tables 7 and 8. The data analysis shows that the performance of the bamboo plywood treated by the high-voltage electric field is obviously improved, the ineffective penetration depth of the glue layer of the bamboo plywood is reduced by 56 percent, the density of the central layer is increased by 22 percent, so that the gluing strength and the wood breakage rate are respectively improved by 30 percent and 57 percent, the weather resistance of the bamboo plywood is further improved, the boiling stripping rate is reduced to 6 percent, and the elastic modulus and the static bending strength are respectively improved by 32 percent and 21 percent.
Therefore, when the hot pressing temperature, the hot pressing time, the hot pressing pressure, the gluing amount, the time and the voltage of the high-voltage electric field treatment are reduced, the bonding strength and the mechanical property of the bamboo composite material can be still obviously improved after the hot pressing and the high-voltage electric field treatment.
TABLE 7 bamboo plywood bonding performance parameters composed of green bamboo surfaces and green bamboo surfaces
TABLE 8 mechanical Properties of bamboo plywood made of green surface and green surface
Best mode for carrying out the invention
Example 5 and comparative example 5 were set in this embodiment.
The method of making the bamboo plywood of example 5 includes the steps of:
(1) drying the flattened bamboo chips in a 50 ℃ oven for 72h to obtain the final water content of 11%, sanding the front and back surfaces of the flattened bamboo chips for 0.5mm, wherein the dimension of the flattened bamboo chips is 50mm multiplied by 20mm multiplied by 7.5 mm.
(2) Coating adhesive on the side close to the bamboo green, wherein the adhesive is urea-formaldehyde resin, the viscosity is 230 mPa.s (room temperature is 23 ℃), the molar ratio (F/U) is 1.5:1, the solid content is 55%, and the double-sided adhesive coating amount is 200g/m2。
(3) And (5) stacking and assembling every two of the bamboo green surfaces, wherein the bamboo green surfaces are opposite to the bamboo green surfaces.
(4) Putting into a hot press, applying a high-voltage electric field while hot pressing, connecting the negative electrode of the high-voltage electric field generator to the upper metal backing plate of the glued bamboo plywood, connecting the ground wire to the lower backing plate of the glued bamboo plywood, wherein the direction of the high-voltage electric field is the same as the pressing direction, the voltage is 20kV (negative), and the processing time is 2 min. Wherein the hot pressing temperature is 110 ℃, the hot pressing time is 10min, and the plate surface pressure during hot pressing is 1.2 MPa.
(5) And after the treatment is finished, closing the high-voltage electric field generator, releasing the pressure, taking out the bamboo plywood, cooling the bamboo plywood prepared by hot pressing to room temperature, and sawing the bamboo plywood into a certain size for later use.
The preparation method of the bamboo plywood of the comparative example 5 is the same as the preparation method of the bamboo plywood of the example 5, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared in example 5 and comparative example 5 was tested according to the method for testing the bonding strength, the impregnation stripping and the mechanical properties of the type I plywood in the standard GB/T17657-2013, and the results are shown in tables 9 and 10. The data analysis shows that the performance of the bamboo plywood treated by the high-voltage electric field is remarkably improved, the invalid penetration depth of the glue layer of the bamboo plywood is lower by 61 percent, the density of the central layer is increased by 25 percent, so that the gluing strength and the wood breakage rate are respectively improved by 30 percent and 57 percent, the weather resistance of the bamboo plywood is further improved, the boiling stripping rate is reduced to 6 percent, and the elastic modulus and the static bending strength are respectively improved by 28 percent and 16 percent.
Therefore, when the hot pressing time, the hot pressing temperature, the glue coating amount, the high-voltage electric field treatment time and the treatment voltage are reduced, the bonding strength and the mechanical property of the bamboo composite material can be still obviously improved after the hot pressing is finished.
TABLE 9 bamboo plywood bonding performance parameters composed of green bamboo surface and green bamboo surface
TABLE 10 mechanical Properties of bamboo plywood made of green and blue surfaces
Detailed description of preferred embodiments 6
The preparation method of the bamboo plywood of the embodiment 6 is the same as the embodiment 1 except that: in the step (4), the voltage of the high-voltage electric field is 30kV, and the processing time is 4 min.
The preparation method of the bamboo plywood of the comparative example 6 is the same as the preparation method of the bamboo plywood of the example 6, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared in example 6 and comparative example 6 was tested according to the method for testing the bonding strength, the impregnation stripping and the mechanical properties of the type I plywood in the standard GB/T17657-2013, and the results are shown in tables 11 and 12. The data analysis shows that the performance of the bamboo plywood treated by the high-voltage electric field is obviously improved, the invalid penetration depth of the glue layer of the bamboo plywood is reduced by 60 percent, the density of the central layer is increased by 24 percent, so that the gluing strength and the wood breakage rate are respectively improved by 28 percent and 57 percent, the weather resistance of the bamboo plywood is further improved, the boiling stripping rate is reduced to 7 percent, and the elastic modulus and the static bending strength are respectively improved by 26 percent and 15 percent.
Therefore, the voltage and the processing time of the high-voltage electric field are reduced, but the voltage and the processing time are not less than 20kV, and the bonding strength and the mechanical property of the bamboo composite material can still be obviously improved after the hot pressing and the high-voltage electric field processing are finished; and the improvement rate of the gluing strength and the mechanical property is increased along with the increase of the voltage during the high-voltage electric field treatment.
TABLE 11 bamboo plywood bonding performance parameters composed of green bamboo surface and green bamboo surface
TABLE 12 mechanical Properties of bamboo plywood made of green and blue surfaces
Best mode for carrying out the invention
The preparation method of the bamboo plywood of the embodiment 7 is the same as the embodiment 1 except that: the bamboo plywood has three layers, when the bamboo plywood is stacked and assembled, one gluing interface is that the tabasheer surface is opposite to the surf green surface, the other gluing interface is that the surf green surface is opposite to the surf green surface, and the hot pressing time is 22 min.
The preparation method of the bamboo plywood of the comparative example 7 is the same as the preparation method of the bamboo plywood of the example 7, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared in example 7 and comparative example 7 was tested according to the method for testing the bonding strength, the impregnation stripping and the mechanical properties of the type I plywood in the standard GB/T17657-2013, and the results are shown in tables 13 and 14, and the data analysis showed that the performance of the bamboo plywood treated by the high-voltage electric field was significantly improved, the ineffective penetration depth at the glue layer of the bamboo plywood was 51% lower, and the density of the center layer was 22% higher, so that the bonding strength and the wood breakage rate were respectively improved by 23% and 71%, and the weather resistance of the bamboo plywood was improved, and the boiling stripping rate was reduced to 6%, and the elastic modulus and the static bending strength were respectively improved by 26% and 21%.
Therefore, the number of the single layers of the bamboo plywood composite material is increased, and the bonding strength and the mechanical strength of the composite material can be still obviously improved after the high-voltage electric field treatment is utilized.
TABLE 13 bonding Performance parameters of three-ply bamboo plywood
TABLE 14 mechanical Properties of three-ply bamboo plywood
Best mode for carrying out the invention
The preparation method of the bamboo plywood in the embodiment 8 is the same as the embodiment 1 except that: the bamboo plywood has five layers, and when the bamboo plywood is stacked and assembled, the outermost gluing interface is that the bamboo green surface is opposite to the bamboo green surface, the other gluing interfaces are that the tabasheer surface is opposite to the bamboo green surface, and the hot pressing time is 38 min.
The preparation method of the bamboo plywood of the comparative example 8 is the same as the preparation method of the bamboo plywood of the example 8, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared in example 8 and comparative example 8 was tested according to the method for testing the bonding strength, the impregnation stripping and the mechanical properties of the type I plywood in the standard GB/T17657-2013, and the results are shown in tables 15 and 16, and the data analysis shows that the performance of the bamboo plywood treated by the high-voltage electric field is remarkably improved. The ineffective penetration depth of the glue layer of the bamboo plywood is lower by 61 percent, the density of the central layer is increased by 26 percent, so that the gluing strength and the wood breakage rate are respectively improved by 25 percent and 57 percent, the weather resistance of the bamboo plywood is further improved, the boiling stripping rate is reduced to 5 percent, and the elastic modulus and the static bending strength are respectively improved by 22 percent and 18 percent.
Therefore, the number of the single-board layers of the bamboo composite material is increased, and the bonding strength and the mechanical strength of the composite material can be still obviously improved after the high-voltage electric field treatment.
TABLE 15 five-layer bamboo plywood gluing performance parameters
TABLE 16 five-layer bamboo plywood mechanical property parameters
Best mode for carrying out the invention
The preparation method of the bamboo plywood of the embodiment 9 is the same as the embodiment 1 except that: and (3) adding 5% of zinc chloride solution (mass ratio) into the urea-formaldehyde resin adhesive adopted in the step (2), uniformly mixing, and then gluing and assembling.
The preparation method of the bamboo plywood of comparative example 9-1 was the same as the preparation method of the bamboo plywood of example 9, except that: and (4) applying no high-voltage electric field, and adding no zinc chloride solution into the urea-formaldehyde resin adhesive adopted in the step (2).
The preparation method of the bamboo plywood of the comparative example 9-2 is the same as the preparation method of the bamboo plywood of the example 9, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared in example 9 and comparative example 9-1 and comparative example 9-2 was tested according to the method for testing the bonding strength, the impregnation peeling and the mechanical properties of the type I plywood in the standard GB/T17657-2013, and the results are shown in Table 17. The data analysis shows that the metal ions in the adhesive added with the zinc chloride solution improve the reaction capacity of the urea-formaldehyde resin and the surface chemical groups of the bamboo wood, so that the bonding strength is improved by 14 percent, the wood breakage rate is improved by 43 percent, the boiling stripping rate is reduced to 8 percent, and the elastic modulus and the static bending strength are respectively improved by 20 percent and 11 percent (the change rate is 1). Meanwhile, the performance of the bamboo plywood treated by the urea-formaldehyde resin added with the metal ion solution and the high-voltage electric field is further remarkably improved. The bonding strength of the bamboo plywood is improved by 43 percent, the wood breakage rate is improved by 86 percent, the boiling stripping rate is reduced to 3 percent, and the elastic modulus and the static bending strength are respectively improved by 41 percent and 22 percent (the change rate is 2).
Therefore, the bonding strength and the mechanical property of the composite material modified by adding the metal ion solution can be further improved by utilizing the high-voltage electric field treatment.
TABLE 17 bamboo plywood performance parameters of the combination of the green surface and the green surface
In tables 1 and 2: the change rate 1 refers to the change of the performance of the plywood when zinc chloride is added into the urea-formaldehyde resin adhesive under the condition of no high-voltage electric field treatment relative to the performance of the plywood when the zinc chloride is not added into the urea-formaldehyde resin adhesive; the rate of change 2 refers to the change in the performance of the plywood treated with the high voltage electric field and the zinc chloride added to the urea-formaldehyde resin adhesive as per the procedure of this example relative to the performance of the plywood treated without the high voltage electric field and without the zinc chloride added to the urea-formaldehyde resin adhesive.
Best mode for carrying out the invention
The preparation method of the bamboo plywood in the embodiment 10 is the same as the embodiment 1 except that: and (3) adding 5% of nano cellulose (mass ratio) into the urea-formaldehyde resin adhesive adopted in the step (2), uniformly mixing, and then gluing and assembling.
The preparation method of the bamboo plywood of comparative example 10-1 was the same as the preparation method of the bamboo plywood of example 10, except that: and (4) applying no high-voltage electric field, and adding no nano cellulose in the urea resin adhesive adopted in the step (2).
The preparation method of the bamboo plywood of comparative example 10-2 was the same as the preparation method of the bamboo plywood of example 10, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared in example 10 and comparative example 10-1 and comparative example 10-2 was tested according to the method for testing the bonding strength, the impregnation peeling and the mechanical properties of the type I plywood in the standard GB/T17657-2013, and the results are shown in Table 18. The urea-formaldehyde resin adhesive added with the nanocellulose can improve the crosslinking degree and the chemical reaction degree of adhesive groups and bamboo surface groups, so that the bonding strength is improved by 27%, the wood breaking rate is improved by 57%, the boiling stripping rate is reduced to 6%, and the elastic modulus and the static bending strength are respectively improved by 23% and 8% (the change rate is 1). Meanwhile, the performance of the bamboo plywood treated by the urea-formaldehyde resin added with the nano-cellulose and the high-voltage electric field is further remarkably improved, the bonding strength of the bamboo plywood is improved by 40 percent, the wood breakage rate is improved by 86 percent, the boiling stripping rate is reduced to 3 percent, and the elastic modulus and the static bending strength are respectively improved by 49 percent and 22 percent (the change rate is 2).
Therefore, the bonding strength and the mechanical property of the composite material modified by adding the nano-cellulose can be further improved by utilizing the high-voltage electric field treatment.
TABLE 18 bamboo plywood Performance parameters of the combination of Green bamboo surface and Green bamboo surface
Note: the change rate 1 refers to the performance change of the plywood with and without the added nano-cellulose under the condition of no high-pressure treatment; the change rate 2 refers to the change of the performance of the plywood processed by high pressure and added with the nano-cellulose and the performance of the plywood processed by no high pressure and added with the nano-cellulose.
Best mode for carrying out the invention
The method for manufacturing bamboo plywood of example 11 is the same as example 1 except that: and (3) directly coating adhesive and assembling the flattened bamboo chips, wherein the water content of the flattened bamboo chips is 14 +/-3%.
The preparation method of the bamboo plywood of the comparative example 11 is the same as the preparation method of the bamboo plywood of the example 11, except that: and (4) applying no high-voltage electric field.
The bamboo plywood prepared in example 11 and comparative example 11 was tested according to the method for testing the bonding strength, the impregnation stripping and the mechanical properties of the type I plywood in the standard GB/T17657-2013, and the results are shown in tables 19 and 20, and the data analysis showed that the performance of the bamboo plywood treated by the high-voltage electric field was significantly improved, the ineffective penetration depth at the glue layer of the bamboo plywood was 52% lower, and the density of the center layer was 22% higher, so that the bonding strength and the wood breakage rate were respectively improved by 30% and 57%, and the weather resistance of the bamboo plywood was improved, and the boiling stripping rate was reduced to 7%, and the elastic modulus and the static bending strength were respectively improved by 27% and 14%.
Therefore, the bamboo plywood can omit the process of surface pretreatment of flattened bamboo chips, the bonding strength and the mechanical property are also obviously improved after the treatment of a high-voltage electric field, and the production efficiency of the bamboo plywood material is also improved.
TABLE 19 bamboo plywood bonding performance parameters of combination of green bamboo surface and green bamboo surface
TABLE 20 mechanical Properties of bamboo plywood made of green surface and green surface
Best mode for carrying out the invention
The method for manufacturing bamboo plywood of example 12 is the same as example 1 except that: the adhesive adopted in the step (2) is urea-formaldehyde resin adhesive, and the viscosity is 230 mPa.s (the room temperature is 23 ℃).
The preparation method of the bamboo plywood of comparative example 12-1 was carried out in the same manner as in the preparation method of the bamboo plywood of example 12, except that: the adhesive used in the step (2) is isocyanate adhesive, the viscosity is 230 mPa.s (the room temperature is 23 ℃), and a high-voltage electric field is not applied in the step (4).
The preparation method of the bamboo plywood of comparative example 12-2 was the same as the preparation method of the bamboo plywood of example 12, except that: the adhesive adopted in the step (2) is urea-formaldehyde resin adhesive, the viscosity is 230 mPa.s (the room temperature is 23 ℃), and a high-voltage electric field is not applied in the step (4).
The bamboo plywood prepared in example 12 and comparative example 12-1 and comparative example 12-2 was tested according to the method for testing the bonding strength, the impregnation peeling and the mechanical properties of the type I plywood in the standard GB/T17657-2013, and the results are shown in tables 21 and 22, and the data analysis shows that: the performance of the bamboo plywood treated by the high-voltage electric field is obviously improved. The ineffective penetration depth of the glue layer of the bamboo plywood is lower by 52 percent, the density of the central layer is increased by 32 percent, so that the gluing strength and the wood breakage rate are respectively improved by 29 percent and 75 percent, the weather resistance of the bamboo plywood is further improved, the boiling stripping rate is reduced to 6 percent, and the elastic modulus and the static bending strength are respectively improved by 28 percent and 17 percent.
Therefore, after the treatment of the high-voltage electric field, the bonding strength and the mechanical strength of the bamboo composite material prepared from the urea-formaldehyde resin are obviously increased, and the bonding strength and the mechanical strength of the composite material (untreated) prepared from the isocyanate adhesive can be achieved, so that the production cost of the bamboo bonding material is reduced to a certain extent, and the technical upgrade is realized.
TABLE 21 bamboo plywood gluing performance parameters of combination of surf green surface and surf green surface
TABLE 22 mechanical property parameters of bamboo plywood composed of green surface and green surface
Claims (10)
1. A method for improving the weather resistance and the mechanical property of a bamboo plywood comprises the following steps: assembling the bamboo chips coated with the adhesive and hot-pressing, and is characterized in that: the hot pressing is carried out while a high-voltage electric field is applied, the direction of the electric field is the same as the pressurizing direction of the hot pressing, the negative electrode of a generator of the high-voltage electric field is connected to the upper metal conductive base plate of the bamboo plywood coated with the adhesive, the ground wire is connected to the lower metal conductive base plate of the bamboo plywood coated with the adhesive, and the negative electrode voltage is 20-60 kV.
2. The method for improving the weather resistance and the mechanical property of the bamboo plywood as claimed in claim 1, wherein: the adhesive is urea-formaldehyde resin.
3. The method for improving the weather resistance and the mechanical property of the bamboo plywood as claimed in claim 2, wherein: the viscosity of the urea-formaldehyde resin is 200-230 mPa.s, the molar ratio (F/U) is 2: 1-1.5: 1, the solid content is 50-55%, and the double-sided glue coating amount is 200-300g/m 2.
4. The method for improving the weather resistance and the mechanical property of the bamboo plywood as claimed in claim 1, wherein: further comprising the steps of:
(1) drying the bamboo chips;
(2) coating the bamboo chips treated in the step (1) with an adhesive;
(3) assembling the bamboo chips obtained in the step (2) and hot-pressing;
(4) and (4) after the hot pressing time is reached, closing the high-voltage electric field, releasing the pressure, cooling, and processing and forming for later use.
5. The method for improving the weather resistance and the mechanical property of the bamboo plywood as claimed in claim 4, wherein: and (2) sanding the dried bamboo chips in the step (1) until the quantity of the sanded light is 0.3-0.5 mm.
6. The method for improving the weather resistance and the mechanical property of the bamboo plywood as claimed in claim 1, wherein: the hot pressing temperature is 110-120 ℃, the hot pressing time is 10-15 min, and the plate surface pressure during hot pressing is 0.8-1.2 MPa.
7. The method for improving the weather resistance and the mechanical property of the bamboo plywood as claimed in claim 2, wherein: 5% zinc chloride solution is added into the urea-formaldehyde resin adhesive.
8. The method for improving the weather resistance and the mechanical property of the bamboo plywood as claimed in claim 2, wherein: 5% of nano-cellulose is added into the urea-formaldehyde resin adhesive.
9. The method for improving the weather resistance and the mechanical property of the bamboo plywood as claimed in claim 4, wherein: and (3) assembling the bamboo chips in the step (2) into a blank, wherein the blank comprises a bamboo green surface and a bamboo green surface, a bamboo green surface and a bamboo yellow surface or a bamboo yellow surface and a bamboo yellow surface.
10. The method for improving the weather resistance and the mechanical property of the bamboo plywood as claimed in claim 4, wherein: in the step (1), the final water content of the dried bamboo chips is 8 +/-3%.
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| CN114683361B (en) * | 2022-04-27 | 2022-09-23 | 浙江味老大工贸有限公司 | Formaldehyde-free anti-cracking flattened bamboo chopping board and preparation method thereof |
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