CN106269585A - The instrument of defective crystal grain is selected by photographic head - Google Patents
The instrument of defective crystal grain is selected by photographic head Download PDFInfo
- Publication number
- CN106269585A CN106269585A CN201610555745.3A CN201610555745A CN106269585A CN 106269585 A CN106269585 A CN 106269585A CN 201610555745 A CN201610555745 A CN 201610555745A CN 106269585 A CN106269585 A CN 106269585A
- Authority
- CN
- China
- Prior art keywords
- crystal grain
- photographic head
- main workbench
- handle component
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
- B07C2501/0063—Using robots
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a kind of instrument being selected defective crystal grain by photographic head, including main workbench and auxiliary working platform；Main workbench can transversely move left and right by track；Long rails it is fixed with below auxiliary working platform；Long rails can move forward and backward by the orbital groove along described main workbench；It is provided with wafer on described main workbench and fixes groove；Also include longitudinal carrier；The horizontal support being perpendicular to described longitudinal carrier it is fixed with on described longitudinal carrier；Described horizontal support is provided with handle component moving up and down；The underface of described handle component is provided with a photographic head；It is fixed with handgrip in the lower sidewalls of described handle component.The invention discloses a kind of instrument selecting defective crystal grain, photographic head can be passed through, each crystal grain on wafer is shot, after the crystal grain capturing ink dot, just control handle component, defective crystal grain is picked out.The principle of the invention is simple, selects degree of accuracy high, can increase and select speed, increases crystal grain yield.
Description
Technical field
The present invention relates to semiconductor test field, be specifically related to a kind of instrument being selected defective crystal grain by photographic head.
Background technology
First semiconductor chip is produced on wafer (wafer), can cut chip afterwards, is cut into multiple
The crystal grain (die) not also being packaged, and test preliminary to crystal grain, if crystal grain is defective, then at next in preliminary test
Before step encapsulation, the most underproof crystal grain is picked out, the movement before not being packaged.
In the prior art, having a kind of method of testing to crystal grain is, after test finds defective crystal grain, not conform at this
An ink dot is put as defective mark on lattice crystal grain.Then this wafer tested can directly be transported to downstream encapsulation producer, envelope
Dress producer needs this defective crystal grain to pick out.
Summary of the invention
On the basis of existing technology, the invention discloses a kind of instrument being selected defective crystal grain by photographic head.
Technical scheme is as follows:
A kind of instrument being selected defective crystal grain by photographic head, including main workbench and auxiliary working platform；Described main work
Platform can transversely move left and right by track；It is fixed with long rails below described auxiliary working platform；Described long rails can be along described master
Orbital groove on workbench moves forward and backward；It is provided with wafer on described main workbench and fixes groove；Also include longitudinal carrier；Described
The horizontal support being perpendicular to described longitudinal carrier it is fixed with on longitudinal carrier；Described horizontal support is provided with moving up and down grabbing
Hand unit；The underface of described handle component is provided with a photographic head；It is fixed with handgrip in the lower sidewalls of described handle component.
The method have the benefit that:
The invention discloses a kind of instrument selecting defective crystal grain, photographic head can be passed through, brilliant to each on wafer
Grain shoots, and after the crystal grain capturing ink dot, just controls handle component, is picked out by defective crystal grain.This
Bright principle is simple, selects degree of accuracy high, can increase and select speed, increases crystal grain yield.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the present invention.
Detailed description of the invention
Fig. 1 is the schematic diagram of the present invention.As it is shown in figure 1, the present invention includes main workbench 2 and auxiliary working platform 4.Main workbench
2 can transversely move left and right by track 1.Long rails 2 it is fixed with below auxiliary working platform 4.Long rails 2 can be along main workbench 2
Orbital groove move forward and backward.It is provided with wafer on main workbench 2 and fixes groove 5.Also include longitudinal carrier 6.On longitudinal carrier 6 admittedly
Surely there is the horizontal support 7 being transversely to the machine direction support 6.Horizontal support 7 is provided with handle component 8 moving up and down.Handle component 8
Underface be provided with a photographic head 10.Handgrip 9 it is fixed with in the lower sidewalls of handle component 8.
The using method of the present invention is:
Step 1, crystal grain uncut on wafer is made a preliminary test, on the crystal grain of test failure, point one ink
Point is as defective labelling；
Step 2, the wafer having carried out defective labelling is placed on the wafer on main workbench 2 fixes on groove 5.
Step 3, the second step motor control auxiliary working platform 4 move to the first row crystal grain；
Step 4, the first main workbench of step motor control 2 transversely track 1 crystal grain the most one by one move, and often move
The position of one crystal grain, photographic head 10 shoots an image；And image is sent to monitoring equipment；Monitoring equipment is carried out at image binaryzation
Reason, if occurring large-area black level value in image, then the 3rd motor control handle component 8 moves down, and is chosen by this crystal grain
Remove；
Step 5, the second step motor control auxiliary working platform 4 from top to bottom move the height of a crystal grain；
Step 6, repetition step 4 and step 5, until all crystal grains checked out on this wafer.
Above-described is only the preferred embodiment of the present invention, the invention is not restricted to above example.It is appreciated that this
Skilled person the most directly derive or associate other improve and become
Change, within being all considered as being included in protection scope of the present invention.
Claims (1)
1. the instrument being selected defective crystal grain by photographic head, it is characterised in that: include main workbench (2) and auxiliary working platform
(4)；Described main workbench (2) can transversely move left and right by track (1)；Described auxiliary working platform (4) lower section is fixed with long rails
(2)；Described long rails (2) can move forward and backward by the orbital groove along described main workbench (2)；On described main workbench (2)
It is provided with wafer and fixes groove (5)；Also include longitudinal carrier (6)；It is fixed with on described longitudinal carrier (6) and is perpendicular to described longitudinal direction and props up
The horizontal support (7) of frame (6)；Described horizontal support (7) is provided with handle component moving up and down (8)；Described handle component
(8) underface is provided with a photographic head (10)；Handgrip (9) it is fixed with in the lower sidewalls of described handle component (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610555745.3A CN106269585A (en) | 2016-07-14 | 2016-07-14 | The instrument of defective crystal grain is selected by photographic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610555745.3A CN106269585A (en) | 2016-07-14 | 2016-07-14 | The instrument of defective crystal grain is selected by photographic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106269585A true CN106269585A (en) | 2017-01-04 |
Family
ID=57651566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610555745.3A Pending CN106269585A (en) | 2016-07-14 | 2016-07-14 | The instrument of defective crystal grain is selected by photographic head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106269585A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101579856A (en) * | 2008-05-16 | 2009-11-18 | 旺硅科技股份有限公司 | Bad crystal grain selector and method thereof |
| KR20100038650A (en) * | 2008-10-06 | 2010-04-15 | 한미반도체 주식회사 | Ingot inspection apparatus and method |
| CN101829658A (en) * | 2010-04-16 | 2010-09-15 | 致茂电子(苏州)有限公司 | Quick sorting and arranging machine of crystalline grain and quick sorting and arranging method of crystalline grain |
| CN201871496U (en) * | 2010-07-27 | 2011-06-22 | 威控自动化机械股份有限公司 | Crystalline grain sorting device of wafers |
| CN102983090A (en) * | 2011-09-06 | 2013-03-20 | 旺矽科技股份有限公司 | Crystal grain picking machine with multi-picking-and-placing-nozzle structure and alignment method thereof |
| CN103071627A (en) * | 2013-01-09 | 2013-05-01 | 广东志成华科光电设备有限公司 | Full automatic crystalline grain detection and sorting all-in-one machine |
| CN204792748U (en) * | 2015-07-09 | 2015-11-18 | 安徽三安光电有限公司 | Automatic grabbing device of crystalline grain |
-
2016
- 2016-07-14 CN CN201610555745.3A patent/CN106269585A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101579856A (en) * | 2008-05-16 | 2009-11-18 | 旺硅科技股份有限公司 | Bad crystal grain selector and method thereof |
| KR20100038650A (en) * | 2008-10-06 | 2010-04-15 | 한미반도체 주식회사 | Ingot inspection apparatus and method |
| CN101829658A (en) * | 2010-04-16 | 2010-09-15 | 致茂电子(苏州)有限公司 | Quick sorting and arranging machine of crystalline grain and quick sorting and arranging method of crystalline grain |
| CN201871496U (en) * | 2010-07-27 | 2011-06-22 | 威控自动化机械股份有限公司 | Crystalline grain sorting device of wafers |
| CN102983090A (en) * | 2011-09-06 | 2013-03-20 | 旺矽科技股份有限公司 | Crystal grain picking machine with multi-picking-and-placing-nozzle structure and alignment method thereof |
| CN103071627A (en) * | 2013-01-09 | 2013-05-01 | 广东志成华科光电设备有限公司 | Full automatic crystalline grain detection and sorting all-in-one machine |
| CN204792748U (en) * | 2015-07-09 | 2015-11-18 | 安徽三安光电有限公司 | Automatic grabbing device of crystalline grain |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103252320B (en) | Automatic chip on board (COB) optical assembly testing and sorting machine | |
| CN207320070U (en) | A kind of semiconductor packages automatic loading and unloading device and workpiece automatic grabbing device | |
| CN107303695A (en) | The method to set up of topping machanism | |
| US20160207145A1 (en) | Laser machining apparatus | |
| JP2016181540A (en) | Workpiece cutting method | |
| DE602005012838D1 (en) | SYSTEM FOR FILLING DURING THE FLIGHT, BOOM AND METHOD FOR EXTENDING A SERIES OF MOVEMENTS TO FILLING DURING THE FLIGHT | |
| CN109494173A (en) | The manufacturing method of chip attachment device and semiconductor devices | |
| CN104128831B (en) | High-speed motorized spindles automatic tool changer | |
| CN106179983B (en) | A kind of main button case ring automatic detecting machine of mobile phone | |
| KR100814284B1 (en) | Vision system for sawing & placement equipment | |
| CN106024666A (en) | Method of picking out unqualified dies through camera | |
| CN205184414U (en) | Numerical control plane drilling machine with on -line measuring device | |
| CN106269585A (en) | The instrument of defective crystal grain is selected by photographic head | |
| CN203993350U (en) | A kind of numerical control machining center that crashproof tool changing device is housed | |
| CN104960123B (en) | Integrated circuit packaging glue overflow removing equipment and method | |
| CN104191310A (en) | Numerical control machining center provided with anti-collision tool replacement device and usage method thereof | |
| CN103454576A (en) | Test machine for finished chips | |
| CN104716093A (en) | Package board division method | |
| CN108807230A (en) | Sorting machine suction nozzle working position accurate calibration method | |
| JP2016182651A (en) | Cutting device | |
| CN203265074U (en) | Automatic testing and sorting machine for COB (Chip On Board) optical component | |
| KR20230098510A (en) | Probe station | |
| CN109715332B (en) | Wire electric discharge machining system, wire electric discharge machining method, and workpiece measuring method | |
| KR101266583B1 (en) | Semiconductor chip pick-up apparatus | |
| KR20190083992A (en) | Processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170104 |
|
| WD01 | Invention patent application deemed withdrawn after publication |